High Speed Characterization Report FSI-1XX-03-X-X-XX Description: One Piece Board Stacking Interconnect, 1.0mm Pitch 3mm (0.118”) Body Height Samtec Inc. 520 Park East Blvd. New Albany IN 47151-1147 USA ©Samtec, Inc. 2005 WWW.SAMTEC.COM 1-800-SAMTEC-9 (US & Canada) [email protected] Phone: 812-944-6733 Fax: 812-948-5047 Report Revision: 5/10/2011 All Rights Reserved High Speed Characterization Report Series: FSI Series Description: One Piece Board Stacking Interconnect, 1.0mm Pitch, 3mm (0.118”) Body Height Table of Contents Connector Overview........................................................................................................ 1 Frequency Domain Data Summary ................................................................................. 2 Bandwidth Chart – Single-Ended & Differential Insertion Loss .................................... 3 Time Domain Data Summary .......................................................................................... 4 Characterization Details .................................................................................................. 6 Differential and Single-Ended Data.............................................................................. 6 Connector Signal to Ground Ratio ............................................................................... 6 Frequency Domain Data.............................................................................................. 8 Time Domain Data....................................................................................................... 8 Appendix A – Frequency Domain Response Graphs .................................................... 10 Single-Ended Application – Insertion Loss ................................................................ 10 Single-Ended Application – Return Loss ................................................................... 10 Single-Ended Application – NEXT Configurations ..................................................... 11 Single-Ended Application – FEXT Configurations ..................................................... 11 Differential Application – Insertion Loss..................................................................... 12 Differential Application – Return Loss........................................................................ 12 Differential Application – NEXT Configurations ......................................................... 13 Differential Application – FEXT Configurations .......................................................... 13 Appendix B – Time Domain Response Graphs............................................................. 14 Single-Ended Application – Input Pulse..................................................................... 14 Single-Ended Application – Impedance ..................................................................... 14 Single-Ended Application – Propagation Delay ......................................................... 15 Single-Ended Application – NEXT, Worst Case Configuration .................................. 15 Single-Ended Application – FEXT, Worst Case Configuration................................... 16 Single-Ended Application – NEXT, Best Case Configuration .................................... 16 Single-Ended Application – FEXT, Best Case Configuration..................................... 17 Single-Ended Application – NEXT, Across Row Configuration.................................. 17 Single-Ended Application – FEXT, Across Row Configuration .................................. 18 Differential Application – Input Pulse ......................................................................... 18 Differential Application – Impedance ......................................................................... 19 Differential Application – Propagation Delay.............................................................. 19 Differential Application – NEXT, Worst Case............................................................. 20 Differential Application – FEXT, Worst Case ............................................................. 20 Differential Application – NEXT, Best Case ............................................................... 21 Differential Application – FEXT, Best Case ............................................................... 21 Differential Application – NEXT, Across Row Case ................................................... 22 Differential Application – FEXT, Across Row Case.................................................... 22 Appendix C – Product and Test System Descriptions ................................................... 23 Samtec Inc. 520 Park East Blvd. New Albany IN 47151-1147 USA ©Samtec, Inc. 2005 WWW.SAMTEC.COM 1-800-SAMTEC-9 (US & Canada) [email protected] Page:ii Phone: 812-944-6733 Fax: 812-948-5047 Report Revision: 5/10/2011 All Rights Reserved High Speed Characterization Report Series: FSI Series Description: One Piece Board Stacking Interconnect, 1.0mm Pitch, 3mm (0.118”) Body Height Product Description ................................................................................................... 23 Test System Description............................................................................................ 23 PCB-103164-TST-XX Test Fixtures........................................................................... 23 PCB-103164-TST-XX PCB Layout Panel .................................................................. 24 PCB Fixtures ............................................................................................................. 24 Calibration Board ....................................................................................................... 26 Appendix D – Test and Measurement Setup................................................................. 28 N5230C Measurement Setup .................................................................................... 28 Test Instruments ........................................................................................................ 29 Test Cables & Adapters............................................................................................. 29 Appendix E - Frequency and Time Domain Measurements .......................................... 30 Frequency (S-Parameter) Domain Procedures ......................................................... 30 Time Domain Procedures .......................................................................................... 30 Impedance (TDR)................................................................................................... 30 Propagation Delay (TDT) ....................................................................................... 31 Near-End Crosstalk (TDT) & Far End Crosstalk (TDT) .......................................... 31 Appendix F – Glossary of Terms................................................................................... 32 Samtec Inc. 520 Park East Blvd. New Albany IN 47151-1147 USA ©Samtec, Inc. 2005 WWW.SAMTEC.COM 1-800-SAMTEC-9 (US & Canada) [email protected] Page:iii Phone: 812-944-6733 Fax: 812-948-5047 Report Revision: 5/10/2011 All Rights Reserved High Speed Characterization Report Series: FSI Series Description: One Piece Board Stacking Interconnect, 1.0mm Pitch, 3mm (0.118”) Body Height Connector Overview FSI 1.0 mm (.0394”) pitch interfaces are available with up to 100 I/Os (100 for double rows and 50 for single row) and with standard body height of 3mm (0.118"), 6mm (0.236"), and 10mm (0.394"). The data in this report is applicable only to the 3mm (0.118") body height version for both double rows and single row. Connector System Speed Rating One Piece Board Stacking Interconnect, 1.0mm Pitch, 3mm (0.118”) Body Height Signaling Speed Rating Single-Ended: 8GHz/ 16Gbps Differential: 12GHz/ 24Gbps The Speed Rating is based on the -3 dB insertion loss point of the connector system. The -3 dB point can be used to estimate usable system bandwidth in a typical, two-level signaling environment. To calculate the Speed Rating, the measured -3 dB point is rounded-up to the nearest half-GHz level. The up rounding corrects for a portion of the test board’s trace loss, since a short length of trace loss included in the loss data in this report. The resulting loss value is then doubled to determine the approximate maximum data rate in Gigabits per second (Gbps). For example, a connector with a -3 dB point of 7.8 GHz would have a Speed Rating of 8 GHz/ 16 Gbps. A connector with a -3 dB point of 7.2 GHz would have a Speed Rating of 7.5 GHz/ 15 Gbps. Samtec Inc. 520 Park East Blvd. New Albany IN 47151-1147 USA ©Samtec, Inc. 2005 WWW.SAMTEC.COM 1-800-SAMTEC-9 (US & Canada) [email protected] Page:1 Phone: 812-944-6733 Fax: 812-948-5047 Report Revision: 5/10/2011 All Rights Reserved High Speed Characterization Report Series: FSI Series Description: One Piece Board Stacking Interconnect, 1.0mm Pitch, 3mm (0.118”) Body Height Frequency Domain Data Summary Table 1 - Single-Ended Connector System Performance Test Parameter Insertion Loss Return Loss Near-End Crosstalk Far-End Crosstalk Configuration GSG GSG GAQG GAGQG Xrow, GAG to GQG GAQG GAGQG Xrow, GAG to GQG -3dB@ 7.90GHz -15.48dB@ 7.90GHz -13.93dB@ 7.90GHz -14.27dB@ 7.90GHz -21.84dB@ 7.90GHz -15.96dB@ 7.90GHz -14.76dB@ 7.90GHz -21.34dB@ 7.90GHz Table 2 - Differential Connector System Performance Test Parameter Insertion Loss Return Loss Near-End Crosstalk Far-End Crosstalk Samtec Inc. 520 Park East Blvd. New Albany IN 47151-1147 USA ©Samtec, Inc. 2005 Configuration GSSG GSSG GAAQQG GAAGQQG Xrow, GAAG to GQQG GAAQQG GAAGQQG Xrow, GAAG to GQQG WWW.SAMTEC.COM 1-800-SAMTEC-9 (US & Canada) [email protected] Page:2 -3dB@ 11.80GHz -3.78dB@ 11.80GHz -27.27dB@ 11.80GH -29.59dB@ 11.80GHz -34.42dB@ 11.80GHz -25.53 dB@ 11.80GHz -31.32 dB@ 11.80GHz -31.59 dB@ 11.80GHz Phone: 812-944-6733 Fax: 812-948-5047 Report Revision: 5/10/2011 All Rights Reserved High Speed Characterization Report Series: FSI Series Description: One Piece Board Stacking Interconnect, 1.0mm Pitch, 3mm (0.118”) Body Height Bandwidth Chart – Single-Ended & Differential Insertion Loss FSI Connector Series Single-Ended Application - Insertion Loss 0 Insertion Loss (dB) -2 -4 -6 -8 -10 0 2 4 6 8 10 12 14 16 18 20 18 20 Frequency (GHz) Differential Application - Insertion Loss 0 Insertion Loss (dB) -1 -2 -3 -4 -5 -6 0 2 4 6 8 10 12 14 16 Frequency (GHz) Samtec Inc. 520 Park East Blvd. New Albany IN 47151-1147 USA ©Samtec, Inc. 2005 WWW.SAMTEC.COM 1-800-SAMTEC-9 (US & Canada) [email protected] Page:3 Phone: 812-944-6733 Fax: 812-948-5047 Report Revision: 5/10/2011 All Rights Reserved High Speed Characterization Report Series: FSI Series Description: One Piece Board Stacking Interconnect, 1.0mm Pitch, 3mm (0.118”) Body Height Time Domain Data Summary Table 3 - Single-Ended Impedance (Ω) Signal Risetime Maximum Impedance Minimum Impedance 30 ps 50 ps 100 ps 250 ps 500 ps 60.7 54.4 51.0 50.7 50.6 36.0 40.1 45.5 48.4 49.4 Single-Ended Application - Impedance vs. Risetime 65 Impedance (Ohms) 60 55 50 45 40 35 0 50 100 150 200 250 300 350 400 450 500 Risetime (psec) Table 4 - Differential Impedance (Ω) Signal Risetime Maximum Impedance Minimum Impedance 30 ps 50 ps 100 ps 250 ps 500 ps 106.5 105.3 104.3 103.5 101.8 58.5 65.8 78.4 90.2 95.6 Differential Application - Impedance vs. Risetime 110 Impedance (Ohms) 100 90 80 70 60 50 0 50 100 150 200 250 300 350 400 450 500 Risetime (psec) Samtec Inc. 520 Park East Blvd. New Albany IN 47151-1147 USA ©Samtec, Inc. 2005 WWW.SAMTEC.COM 1-800-SAMTEC-9 (US & Canada) [email protected] Page:4 Phone: 812-944-6733 Fax: 812-948-5047 Report Revision: 5/10/2011 All Rights Reserved High Speed Characterization Report Series: FSI Series Description: One Piece Board Stacking Interconnect, 1.0mm Pitch, 3mm (0.118”) Body Height Table 5 - Single-Ended Crosstalk (%) Input(tr) NEXT FEXT GAQG GAGQG Xrow GAQG GAGQG Xrow 30ps 19.4 4.9 3.0 7.5 4.6 1.1 50 ps 16.5 4.1 1.6 4.9 3.6 0.5 100 ps 11.7 2.4 0.7 2.2 1.9 0.1 250 ps 5.7 1.0 0.3 0.9 0.7 <0.1 500 ps 2.9 0.5 0.1 0.4 0.4 <0.1 Table 6 - Differential Crosstalk (%) Input(tr) NEXT FEXT GAAQQG GAAGQQG Xrow GAAQQG GAAGQQG Xrow 30ps 5.5 0.9 0.7 2.2 0.7 0.5 50 ps 5.0 0.7 0.4 1.4 0.5 0.3 100 ps 3.9 0.4 0.2 0.8 0.2 0.2 250 ps 2.1 0.1 <0.1 0.3 <0.1 <0.1 500 ps 1.1 <0.1 <0.1 0.1 <0.1 <0.1 Table 7 - Propagation Delay (Mated Connector) 69 ps Single-Ended 65 ps Differential Samtec Inc. 520 Park East Blvd. New Albany IN 47151-1147 USA ©Samtec, Inc. 2005 WWW.SAMTEC.COM 1-800-SAMTEC-9 (US & Canada) [email protected] Page:5 Phone: 812-944-6733 Fax: 812-948-5047 Report Revision: 5/10/2011 All Rights Reserved High Speed Characterization Report Series: FSI Series Description: One Piece Board Stacking Interconnect, 1.0mm Pitch, 3mm (0.118”) Body Height Characterization Details This report presents data that characterizes the signal integrity response of a one piece connector in a controlled printed circuit board (PCB) environment. All efforts are made to reveal typical best-case responses inherent to the system under test (SUT). In this report, the SUT includes the connector and footprint effects on a typical multilayer PCB. PCB effects (trace loss) are de-embedded from test data. Board related effects, such as pad-to-ground capacitance, are included in the data presented in this report. Additionally, intermediate test signal connections can mask the connectors true performance. Such connection effects are minimized by using high performance test cables and adapters. Where appropriate, calibration and de-embedding routines are also used to reduce residual effects. Differential and Single-Ended Data Most Samtec connectors can be used successfully in both differential and single-ended applications. However, electrical performance will differ depending on the signal drive type. In this report, data is presented for both differential and single-ended drive scenarios. Connector Signal to Ground Ratio Samtec connectors are most often designed for generic applications and can be implemented using various signal and ground pin assignments. In high speed systems, provisions must be made in the interconnect for signal return currents. Such paths are often referred to as “ground”. In some connectors, a ground plane or blade, or an outer shield, is used as the signal return, while in others, connector pins are used as signal returns. Various combinations of signal pins, ground blades, and shields can also be utilized. Electrical performance can vary significantly depending upon the number and location of ground pins. In general, the more pins dedicated to ground, the better electrical performance will be. But dedicating pins to ground reduces signal density of a connector. Therefore, care must be taken when choosing signal/ground ratios in cost or density-sensitive applications. Samtec Inc. 520 Park East Blvd. New Albany IN 47151-1147 USA ©Samtec, Inc. 2005 WWW.SAMTEC.COM 1-800-SAMTEC-9 (US & Canada) [email protected] Page:6 Phone: 812-944-6733 Fax: 812-948-5047 Report Revision: 5/10/2011 All Rights Reserved High Speed Characterization Report Series: FSI Series Description: One Piece Board Stacking Interconnect, 1.0mm Pitch, 3mm (0.118”) Body Height For this connector, the following array configurations are evaluated: Single-Ended Impedance: • GSG (ground-signal-ground) Single-Ended Crosstalk: • Electrical “worst case”: GAQG (ground-active-quiet-ground) • Electrical “best case”: GAGQG (ground-active-ground-quiet-ground) • Across row: “xrow case”: GAG to GQG (from one row of terminals to the other row ) Differential Impedance: • GSSG (Ground-positive signal-negative signal-ground) Differential Crosstalk: •Electrical “worst case”: GAAQQG (ground-active-active-quiet-quiet-ground) • Electrical “best case”: GAAGQQG (ground-active-active-ground-quiet-quietground) • Across row: “xrow case”: GAAG to GQQG (from one row of terminals to the other row) Only one single-ended signal or differential pair was driven for crosstalk measurements. Other configurations can be evaluated upon request. Please contact [email protected] for more information. In a real system environment, active signals might be located at the outer edges of the signal contacts of concern, as opposed to the ground signals utilized in laboratory testing. For example, in a single-ended system, a pin-out of “SSSS”, or four adjacent single ended signals, might be encountered, as opposed to the “GSG” and “GSSG” configurations tested in the laboratory. Electrical characteristics in such applications could vary slightly from laboratory results. But in most applications, performance can safely be considered equivalent. Signal Edge Speed (Rise Time): In pulse signaling applications, the perceived performance of the interconnect can vary significantly depending on the edge rate or rise time of the exciting signal. For this report, the fastest rise time used was 30 ps. Generally, this should demonstrate worstcase performance. In many systems, the signal edge rate will be significantly slower at the connector than at the driver launch point. To estimate interconnect performance at other edge rates, data is provided for several rise times between 30 ps and 500 ps. For this report, measured rise times were at 10%-90% signal levels. Samtec Inc. 520 Park East Blvd. New Albany IN 47151-1147 USA ©Samtec, Inc. 2005 WWW.SAMTEC.COM 1-800-SAMTEC-9 (US & Canada) [email protected] Page:7 Phone: 812-944-6733 Fax: 812-948-5047 Report Revision: 5/10/2011 All Rights Reserved High Speed Characterization Report Series: FSI Series Description: One Piece Board Stacking Interconnect, 1.0mm Pitch, 3mm (0.118”) Body Height Frequency Domain Data Frequency Domain parameters are helpful in evaluating the connector system’s signal loss and crosstalk characteristics across a range of sinusoidal frequencies. In this report, parameters presented in the Frequency Domain are Insertion Loss, Return Loss, and Near-End and Far-End Crosstalk. Other parameters or formats, such as VSWR or S-Parameters, may be available upon request. Please contact our Signal Integrity Group at [email protected] for more information. Frequency performance characteristics for the SUT are generated directly from network analyzer measurements. Time Domain Data Time Domain parameters indicate Impedance mismatch versus length, signal propagation time, and crosstalk in a pulsed signal environment. The measured S-Parameters from the network analyzer are post-processed using Agilent Advanced Design System to obtain the time domain response. Time Domain procedure is provided in Appendix E of this report. Parameters or formats not included in this report may be available upon request. Please contact our Signal Integrity Group at [email protected] for more information. In this report, propagation delay is defined as the signal propagation time through the connector and connector footprint. It includes 30 mils of PCB trace on each end of the connector and 77 mils of the connected PCB. Delay is measured at 30 picoseconds signal risetime. Delay is calculated as the difference in time measured between the 50% amplitude levels of the input and output pulses. Crosstalk or coupled noise data is provided for various signal configurations. All measurements are single disturber. Crosstalk is calculated as a ratio of the input line voltage to the coupled line voltage. The input line is sometimes described as the active or drive line. The coupled line is sometimes described as the quiet or victim line. Crosstalk ratio is tabulated in this report as a percentage. Measurements are made at both the nearend and far-end of the SUT. Data for other configurations may be available. Please contact our Signal Integrity Group at [email protected] for further information. As a rule of thumb, 10% crosstalk levels are often used as a general first pass limit for determining acceptable interconnect performance. But modern system crosstalk tolerance can vary greatly. For advice on connector suitability for specific applications, please contact our Signal Integrity Group at [email protected]. Samtec Inc. 520 Park East Blvd. New Albany IN 47151-1147 USA ©Samtec, Inc. 2005 WWW.SAMTEC.COM 1-800-SAMTEC-9 (US & Canada) [email protected] Page:8 Phone: 812-944-6733 Fax: 812-948-5047 Report Revision: 5/10/2011 All Rights Reserved High Speed Characterization Report Series: FSI Series Description: One Piece Board Stacking Interconnect, 1.0mm Pitch, 3mm (0.118”) Body Height Additional information concerning test conditions and procedures is located in the appendices of this report. Further information may be obtained by contacting our Signal Integrity Group at [email protected] Samtec Inc. 520 Park East Blvd. New Albany IN 47151-1147 USA ©Samtec, Inc. 2005 WWW.SAMTEC.COM 1-800-SAMTEC-9 (US & Canada) [email protected] Page:9 Phone: 812-944-6733 Fax: 812-948-5047 Report Revision: 5/10/2011 All Rights Reserved High Speed Characterization Report Series: FSI Series Description: One Piece Board Stacking Interconnect, 1.0mm Pitch, 3mm (0.118”) Body Height Appendix A – Frequency Domain Response Graphs Single-Ended Application – Insertion Loss Single-Ended Application - Insertion Loss 0 Insertion Loss (dB) -2 -4 -6 -8 -10 0 2 4 6 8 10 12 14 16 18 20 18 20 Frequency (GHz) Single-Ended Application – Return Loss Single-Ended Application - Return Loss 0 Return Loss (dB) -10 -20 -30 -40 -50 -60 0 2 4 6 8 10 12 14 16 Frequency (GHz) Samtec Inc. 520 Park East Blvd. New Albany IN 47151-1147 USA ©Samtec, Inc. 2005 WWW.SAMTEC.COM 1-800-SAMTEC-9 (US & Canada) [email protected] Page:10 Phone: 812-944-6733 Fax: 812-948-5047 Report Revision: 5/10/2011 All Rights Reserved High Speed Characterization Report Series: FSI Series Description: One Piece Board Stacking Interconnect, 1.0mm Pitch, 3mm (0.118”) Body Height Single-Ended Application – NEXT Configurations Single-Ended Application - NEXT Near-End Crosstalk (dB) 0 -20 -40 -60 GAQG -80 GAGQG Xrow -100 0 2 4 6 8 10 12 14 16 18 20 Frequency (GHz) Single-Ended Application – FEXT Configurations Single-Ended Application - FEXT Far-End Crosstalk (dB) 0 -20 -40 -60 GAQG -80 GAGQG Xrow -100 0 2 4 6 8 10 12 14 16 18 20 Frequency (GHz) Samtec Inc. 520 Park East Blvd. New Albany IN 47151-1147 USA ©Samtec, Inc. 2005 WWW.SAMTEC.COM 1-800-SAMTEC-9 (US & Canada) [email protected] Page:11 Phone: 812-944-6733 Fax: 812-948-5047 Report Revision: 5/10/2011 All Rights Reserved High Speed Characterization Report Series: FSI Series Description: One Piece Board Stacking Interconnect, 1.0mm Pitch, 3mm (0.118”) Body Height Differential Application – Insertion Loss Differential Application - Insertion Loss 0 Insertion Loss (dB) -1 -2 -3 -4 -5 -6 0 2 4 6 8 10 12 14 16 18 20 18 20 Frequency (GHz) Differential Application – Return Loss Differential Application - Return Loss 0 Return Loss (dB) -10 -20 -30 -40 -50 0 2 4 6 8 10 12 14 16 Frequency (GHz) Samtec Inc. 520 Park East Blvd. New Albany IN 47151-1147 USA ©Samtec, Inc. 2005 WWW.SAMTEC.COM 1-800-SAMTEC-9 (US & Canada) [email protected] Page:12 Phone: 812-944-6733 Fax: 812-948-5047 Report Revision: 5/10/2011 All Rights Reserved High Speed Characterization Report Series: FSI Series Description: One Piece Board Stacking Interconnect, 1.0mm Pitch, 3mm (0.118”) Body Height Differential Application – NEXT Configurations Differential Application - NEXT Near-End Crosstalk (dB) 0 -20 -40 -60 GAAQQG GAAGQQG -80 Xrow -100 0 2 4 6 8 10 12 14 16 18 20 Frequency (GHz) Differential Application – FEXT Configurations Differential Application - FEXT Far-End Crosstalk (dB) 0 -20 -40 -60 GAAQQG GAAGQQG Xrow -80 -100 0 2 4 6 8 10 12 14 16 18 20 Frequency (GHz) Samtec Inc. 520 Park East Blvd. New Albany IN 47151-1147 USA ©Samtec, Inc. 2005 WWW.SAMTEC.COM 1-800-SAMTEC-9 (US & Canada) [email protected] Page:13 Phone: 812-944-6733 Fax: 812-948-5047 Report Revision: 5/10/2011 All Rights Reserved High Speed Characterization Report Series: FSI Series Description: One Piece Board Stacking Interconnect, 1.0mm Pitch, 3mm (0.118”) Body Height Appendix B – Time Domain Response Graphs Single-Ended Application – Input Pulse Single-Ended Application - Input Pulse 1.2 Amplitude (Volts) 1.0 0.8 0.6 30 psec 50 psec 0.4 100 psec 250 psec 500 psec 0.2 0.0 1.0 1.2 1.4 1.6 1.8 2.0 2.2 2.4 2.6 2.8 3.0 Time (nsec) Single-Ended Application – Impedance Single-Ended Application - Impedance 65 Impedance (ohms) 60 55 50 30 psec 50 psec 45 100 psec 250 psec 500 psec 40 35 1.0 1.5 2.0 2.5 3.0 Time (nsec) Samtec Inc. 520 Park East Blvd. New Albany IN 47151-1147 USA ©Samtec, Inc. 2005 WWW.SAMTEC.COM 1-800-SAMTEC-9 (US & Canada) [email protected] Page:14 Phone: 812-944-6733 Fax: 812-948-5047 Report Revision: 5/10/2011 All Rights Reserved High Speed Characterization Report Series: FSI Series Description: One Piece Board Stacking Interconnect, 1.0mm Pitch, 3mm (0.118”) Body Height Single-Ended Application – Propagation Delay Single-Ended Application - Propagation Delay 1.2 Amplitude (Volts) 1.0 0.8 0.6 0.4 0.2 Input Output 0.0 -0.2 1.5 1.6 1.7 1.8 1.9 2.0 2.1 2.2 2.3 Time (nsec) Single-Ended Application – NEXT, Worst Case Configuration Single-Ended Application - NEXT 20 30 psec 50 psec 100 psec Crosstalk (%) 15 250 psec 500 psec 10 5 0 -5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0 Time (nsec) Samtec Inc. 520 Park East Blvd. New Albany IN 47151-1147 USA ©Samtec, Inc. 2005 WWW.SAMTEC.COM 1-800-SAMTEC-9 (US & Canada) [email protected] Page:15 Phone: 812-944-6733 Fax: 812-948-5047 Report Revision: 5/10/2011 All Rights Reserved High Speed Characterization Report Series: FSI Series Description: One Piece Board Stacking Interconnect, 1.0mm Pitch, 3mm (0.118”) Body Height Single-Ended Application – FEXT, Worst Case Configuration Single-Ended Application - FEXT 4 Crosstalk (%) 2 0 -2 30 psec 50 psec -4 100 psec 250 psec 500 psec -6 -8 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0 Time (nsec) Single-Ended Application – NEXT, Best Case Configuration Single-Ended Application - NEXT 5 30 psec 50 psec 100 psec 4 Crosstalk (%) 3 250 psec 500 psec 2 1 0 -1 -2 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0 Time (nsec) Samtec Inc. 520 Park East Blvd. New Albany IN 47151-1147 USA ©Samtec, Inc. 2005 WWW.SAMTEC.COM 1-800-SAMTEC-9 (US & Canada) [email protected] Page:16 Phone: 812-944-6733 Fax: 812-948-5047 Report Revision: 5/10/2011 All Rights Reserved High Speed Characterization Report Series: FSI Series Description: One Piece Board Stacking Interconnect, 1.0mm Pitch, 3mm (0.118”) Body Height Single-Ended Application – FEXT, Best Case Configuration Single-Ended Application - FEXT 2 1 Crosstalk (%) 0 -1 -2 -3 30 psec 50 psec 100 psec -4 250 psec 500 psec -5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0 Time (nsec) Single-Ended Application – NEXT, Across Row Configuration Single-Ended Application - NEXT Crosstalk (%) 3 2 30 psec 50 psec 100 psec 1 250 psec 500 psec 0 -1 -2 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0 Time (nsec) Samtec Inc. 520 Park East Blvd. New Albany IN 47151-1147 USA ©Samtec, Inc. 2005 WWW.SAMTEC.COM 1-800-SAMTEC-9 (US & Canada) [email protected] Page:17 Phone: 812-944-6733 Fax: 812-948-5047 Report Revision: 5/10/2011 All Rights Reserved High Speed Characterization Report Series: FSI Series Description: One Piece Board Stacking Interconnect, 1.0mm Pitch, 3mm (0.118”) Body Height Single-Ended Application – FEXT, Across Row Configuration Single-Ended Application - FEXT 1.0 Crosstalk (%) 0.5 0.0 -0.5 30 psec 50 psec 100 psec -1.0 250 psec 500 psec -1.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0 Time (nsec) Differential Application – Input Pulse Differential Application - Input Pulse 0.8 Amplitude (Volts) 0.6 0.4 0.2 30 psec 50 psec 0.0 100 psec 250 psec 500 psec -0.2 -0.4 -0.6 -0.8 1.0 1.2 1.4 1.6 1.8 2.0 2.2 2.4 2.6 2.8 3.0 Time (nsec) Samtec Inc. 520 Park East Blvd. New Albany IN 47151-1147 USA ©Samtec, Inc. 2005 WWW.SAMTEC.COM 1-800-SAMTEC-9 (US & Canada) [email protected] Page:18 Phone: 812-944-6733 Fax: 812-948-5047 Report Revision: 5/10/2011 All Rights Reserved High Speed Characterization Report Series: FSI Series Description: One Piece Board Stacking Interconnect, 1.0mm Pitch, 3mm (0.118”) Body Height Differential Application – Impedance Differential Application - Impedance Impedance (ohms) 110 90 30 psec 50 psec 70 100 psec 250 psec 500 psec 50 1.00 1.25 1.50 1.75 2.00 2.25 2.50 2.75 3.00 Time (nsec) Differential Application – Propagation Delay Differential Application - Propagation Delay 1.2 Amplitude (Volts) 1.0 0.8 0.6 0.4 0.2 Input Output 0.0 -0.2 1.5 1.6 1.7 1.8 1.9 2.0 2.1 2.2 2.3 Time (nsec) Samtec Inc. 520 Park East Blvd. New Albany IN 47151-1147 USA ©Samtec, Inc. 2005 WWW.SAMTEC.COM 1-800-SAMTEC-9 (US & Canada) [email protected] Page:19 Phone: 812-944-6733 Fax: 812-948-5047 Report Revision: 5/10/2011 All Rights Reserved High Speed Characterization Report Series: FSI Series Description: One Piece Board Stacking Interconnect, 1.0mm Pitch, 3mm (0.118”) Body Height Differential Application – NEXT, Worst Case Differential Application - NEXT 1 0 Crosstalk (%) -1 -2 -3 30 psec 50 psec -4 100 psec 250 psec 500 psec -5 -6 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0 Time (nsec) Differential Application – FEXT, Worst Case Differential Application - FEXT 1.0 0.5 Crosstalk (%) 0.0 -0.5 -1.0 30 psec 50 psec 100 psec -1.5 250 psec 500 psec -2.0 -2.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0 Time (nsec) Samtec Inc. 520 Park East Blvd. New Albany IN 47151-1147 USA ©Samtec, Inc. 2005 WWW.SAMTEC.COM 1-800-SAMTEC-9 (US & Canada) [email protected] Page:20 Phone: 812-944-6733 Fax: 812-948-5047 Report Revision: 5/10/2011 All Rights Reserved High Speed Characterization Report Series: FSI Series Description: One Piece Board Stacking Interconnect, 1.0mm Pitch, 3mm (0.118”) Body Height Differential Application – NEXT, Best Case Differential Application - NEXT 0.4 0.2 Crosstalk (%) -0.0 -0.2 -0.4 30 psec 50 psec 100 psec -0.6 250 psec 500 psec -0.8 -1.0 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0 Time (nsec) Differential Application – FEXT, Best Case Differential Application - FEXT 0.8 30 psec 50 psec 100 psec 0.6 Crosstalk (%) 0.4 250 psec 500 psec 0.2 0.0 -0.2 -0.4 -0.6 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0 Time (nsec) Samtec Inc. 520 Park East Blvd. New Albany IN 47151-1147 USA ©Samtec, Inc. 2005 WWW.SAMTEC.COM 1-800-SAMTEC-9 (US & Canada) [email protected] Page:21 Phone: 812-944-6733 Fax: 812-948-5047 Report Revision: 5/10/2011 All Rights Reserved High Speed Characterization Report Series: FSI Series Description: One Piece Board Stacking Interconnect, 1.0mm Pitch, 3mm (0.118”) Body Height Differential Application – NEXT, Across Row Case Differential Application - NEXT Crosstalk (%) 0.8 0.6 30 psec 50 psec 100 psec 0.4 250 psec 500 psec 0.2 0.0 -0.2 -0.4 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0 Time (nsec) Differential Application – FEXT, Across Row Case Differential Application - FEXT 0.5 30 psec 50 psec 100 psec 0.4 Crosstalk (%) 0.3 250 psec 500 psec 0.2 0.1 -0.0 -0.1 -0.2 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0 Time (nsec) Samtec Inc. 520 Park East Blvd. New Albany IN 47151-1147 USA ©Samtec, Inc. 2005 WWW.SAMTEC.COM 1-800-SAMTEC-9 (US & Canada) [email protected] Page:22 Phone: 812-944-6733 Fax: 812-948-5047 Report Revision: 5/10/2011 All Rights Reserved High Speed Characterization Report Series: FSI Series Description: One Piece Board Stacking Interconnect, 1.0mm Pitch, 3mm (0.118”) Body Height Appendix C – Product and Test System Descriptions Product Description Product test samples are 3mm (0.118”) body height FSI Series connectors. The part number is FSI-150-03-G-D-AD. The FSI Series connector are surface mount products. The FSI Series connector has two rows or one row of contacts evenly spaced on a 1mm (0.0394”) pitch. A photo of the test articles mounted to SI test boards is shown below. Test System Description The test fixtures are composed of four-layer FR-4 material with 50Ω signal trace and pad configurations designed for the electrical characterization of Samtec high speed connector products. A PCB mount SMA connector is used to interface the VNA test cables to the test fixtures. Optimization of the SMA launch was performed using full wave simulation tools to minimize reflections. Six test fixtures are specific to the FSI Series connector set and identified by part numbers PCB-103164-TST-01 to PCB-103164TST-06. Calibration standards specific to the FSI Series are located on the calibration boards PCB-103164-TST-07 and PCB-103164-TST-08. To keep trace lengths short, three different test board sets were required to access the necessary signal pins. PCB-103164-TST-XX Test Fixtures Shown below is a photograph of one of the three test board sets. Samtec Inc. 520 Park East Blvd. New Albany IN 47151-1147 USA ©Samtec, Inc. 2005 WWW.SAMTEC.COM 1-800-SAMTEC-9 (US & Canada) [email protected] Page:23 Phone: 812-944-6733 Fax: 812-948-5047 Report Revision: 5/10/2011 All Rights Reserved High Speed Characterization Report Series: FSI Series Description: One Piece Board Stacking Interconnect, 1.0mm Pitch, 3mm (0.118”) Body Height PCB-103164-TST-XX PCB Layout Panel Artwork of the PCB design is shown below. PCB Fixtures The test fixtures used are as follows: PCB-103164-TST-01 Rev – FSI Series Test Board for worst-case crosstalk PCB-103164-TST-02 Rev – PCB Test Board for worst-case crosstalk PCB-103164-TST-03 Rev – FSI Series Test Board for best-case crosstalk PCB-103164-TST-04 Rev – PCB Test Board for best-case crosstalk PCB-103164-TST-05 Rev – FSI Series Test Board for cross row crosstalk PCB-103164-TST-06 Rev – PCB Test Board for cross row crosstalk Samtec Inc. 520 Park East Blvd. New Albany IN 47151-1147 USA ©Samtec, Inc. 2005 WWW.SAMTEC.COM 1-800-SAMTEC-9 (US & Canada) [email protected] Page:24 Phone: 812-944-6733 Fax: 812-948-5047 Report Revision: 5/10/2011 All Rights Reserved High Speed Characterization Report Series: FSI Series Description: One Piece Board Stacking Interconnect, 1.0mm Pitch, 3mm (0.118”) Body Height Samtec Inc. 520 Park East Blvd. New Albany IN 47151-1147 USA ©Samtec, Inc. 2005 WWW.SAMTEC.COM 1-800-SAMTEC-9 (US & Canada) [email protected] Page:25 Phone: 812-944-6733 Fax: 812-948-5047 Report Revision: 5/10/2011 All Rights Reserved High Speed Characterization Report Series: FSI Series Description: One Piece Board Stacking Interconnect, 1.0mm Pitch, 3mm (0.118”) Body Height Calibration Board Test fixture losses and test point reflections were removed from the data by use of TRL calibration. The calibration board is shown below. Prior to making any measurements, the calibration board is characterized to obtain parameters required to define the calibration kit. Once a cal kit is defined, calibration using the standards on the calibration board can be performed. Finally, the device can be measured and the test board effects are automatically removed. Thru line – 2800 mils Open Reflect – 1400 mils Line 1 – 6190 mils Line 2 – 3480 mils Line 3 – 2940 mils Match – 1400 mils Samtec Inc. 520 Park East Blvd. New Albany IN 47151-1147 USA ©Samtec, Inc. 2005 WWW.SAMTEC.COM 1-800-SAMTEC-9 (US & Canada) [email protected] Page:26 Phone: 812-944-6733 Fax: 812-948-5047 Report Revision: 5/10/2011 All Rights Reserved High Speed Characterization Report Series: FSI Series Description: One Piece Board Stacking Interconnect, 1.0mm Pitch, 3mm (0.118”) Body Height All traces on the test boards are length matched to 1.5” measured from the center of the pad to the SMA. The TRL calibration effectively removes 1.4” of test board trace effects. This means that 77 mils of test board trace length effects for the FSI connector side and 30 mils for the connected PCB are include in the measurement. The SParameter measurement includes for FSI connector and connected PCB side: ABCDE- The FSI Series connector set test board vias, pads (footprint effects) for FSI connector side. 77 mils of 16 mil wide microstrip trace. test board vias, pads (footprint effects) for connected PCB side. 30 mils of 16 mil wide microstrip trace. The figure below shows the location of the measurement reference planes. Measurement reference plane for the FSI connector side C B Measurement reference plane for the connected PCB side E D Samtec Inc. 520 Park East Blvd. New Albany IN 47151-1147 USA ©Samtec, Inc. 2005 WWW.SAMTEC.COM 1-800-SAMTEC-9 (US & Canada) [email protected] Page:27 Phone: 812-944-6733 Fax: 812-948-5047 Report Revision: 5/10/2011 All Rights Reserved High Speed Characterization Report Series: FSI Series Description: One Piece Board Stacking Interconnect, 1.0mm Pitch, 3mm (0.118”) Body Height Appendix D – Test and Measurement Setup The test instrument is the Agilent N5230C PNA-L network analyzer. Frequency domain data and graphs are obtained directly from the instrument. Post-processed time domain data and graphs are generated using convolution algorithms within Agilent ADS. The network analyzer is configured as follows: Start Frequency – 300 KHz Stop Frequency – 20 GHz Number of points -1601 IFBW – 1 KHz With these settings, the measurement time is approximately 20 seconds. N5230C Measurement Setup Samtec Inc. 520 Park East Blvd. New Albany IN 47151-1147 USA ©Samtec, Inc. 2005 WWW.SAMTEC.COM 1-800-SAMTEC-9 (US & Canada) [email protected] Page:28 Phone: 812-944-6733 Fax: 812-948-5047 Report Revision: 5/10/2011 All Rights Reserved High Speed Characterization Report Series: FSI Series Description: One Piece Board Stacking Interconnect, 1.0mm Pitch, 3mm (0.118”) Body Height Test Instruments QTY Description 1 Agilent N5230C PNA-L Network Analyzer (300 KHz to 20 GHz) 1 Agilent N4433A ecal module (300 KHz to 20 GHz) Test Cables & Adapters QTY Description 4 Megaphase CM26 (DC-26 GHz) Samtec Inc. 520 Park East Blvd. New Albany IN 47151-1147 USA ©Samtec, Inc. 2005 WWW.SAMTEC.COM 1-800-SAMTEC-9 (US & Canada) [email protected] Page:29 Phone: 812-944-6733 Fax: 812-948-5047 Report Revision: 5/10/2011 All Rights Reserved High Speed Characterization Report Series: FSI Series Description: One Piece Board Stacking Interconnect, 1.0mm Pitch, 3mm (0.118”) Body Height Appendix E - Frequency and Time Domain Measurements Frequency (S-Parameter) Domain Procedures The quality of any data taken with a network analyzer is directly related to the quality of the calibration standards and the use of proper test procedures. For this reason, extreme care is taken in the design of the LRM calibration standards, the SI test boards, and the selection of the PCB vendor. The measurement process begins with a measurement of the LRM calibration standards. A coaxial SOLT calibration is performed using an N4433A ecal module. This measurement is required in order to obtain precise values of the line standard offset delay and frequency bandwidths. Measurements of the reflect and 2x through line standard can be used to determine the maximum frequency for which the calibration standards are valid. For the FSI Series test boards, this is greater than 20 GHz. From the LRM calibration standard measurements, a user defined calibration kit is developed and stored in the network analyzer. Calibration is then performed on all 4 ports following the calibration wizard within the Agilent N5230C. This calibration is saved and can be recalled at any time. Calibration takes roughly 30 minutes to perform. Time Domain Procedures Mathematically, Frequency Domain data can be transformed to obtain a Time Domain response. Perfect transformation requires Frequency Domain data from DC to infinity Hz. Fortunately, a very accurate Time Domain response can be obtained with bandwidth-limited data, such as measured with modern network analyzer. The Time Domain responses were generated using Agilent ADS 2009 update 1. This tool has a transient convolution simulator which can generate a Time Domain response directly from measured S-Parameters. An example of a similar methodology is provided in the Samtec Technical Note on domain transformation http://www.samtec.com/Technical_Library/reference/articles/pdfs/tech-note_usingPLTS-for-time-domain-data_web.pdf Impedance (TDR) A step pulse is applied to the touchstone model of the connector and the reflected voltage is monitored. The reflected voltage is converted to a reflection coefficient and then transformed into an impedance profile. All ports of the Touchstone model are terminated in 50 ohms. Samtec Inc. 520 Park East Blvd. New Albany IN 47151-1147 USA ©Samtec, Inc. 2005 WWW.SAMTEC.COM 1-800-SAMTEC-9 (US & Canada) [email protected] Page:30 Phone: 812-944-6733 Fax: 812-948-5047 Report Revision: 5/10/2011 All Rights Reserved High Speed Characterization Report Series: FSI Series Description: One Piece Board Stacking Interconnect, 1.0mm Pitch, 3mm (0.118”) Body Height Propagation Delay (TDT) The Propagation Delay is a measure of the Time Domain delay through the connector and footprint. A step pulse is applied to the touchstone model of the connector and the transmitted voltage is monitored. The same pulse is also applied to a reference channel with zero loss, and the Time Domain pulses are plotted on the same graph. The difference in time, measured at the 50% point of the step voltage is the propagation delay. Near-End Crosstalk (TDT) & Far End Crosstalk (TDT) A step pulse is applied to the touchstone model of the connector and the coupled voltage is monitored. The amplitude of the peak-coupled voltage is recorded and reported as a percentage of the input pulse. Samtec Inc. 520 Park East Blvd. New Albany IN 47151-1147 USA ©Samtec, Inc. 2005 WWW.SAMTEC.COM 1-800-SAMTEC-9 (US & Canada) [email protected] Page:31 Phone: 812-944-6733 Fax: 812-948-5047 Report Revision: 5/10/2011 All Rights Reserved High Speed Characterization Report Series: FSI Series Description: One Piece Board Stacking Interconnect, 1.0mm Pitch, 3mm (0.118”) Body Height Appendix F – Glossary of Terms ADS – Advanced Design Systems BC – Best Case crosstalk configuration DUT – Device under test, term used for TDA IConnect & Propagation Delay waveforms FD – Frequency domain FEXT – Far-End Crosstalk GSG – Ground–Signal-Ground; geometric configuration GSSG - Ground–Signal-Signal-Ground; geometric configuration HDV – High Density Vertical NEXT – Near-End Crosstalk OV – Optimal Vertical OH – Optimal Horizontal PCB – Printed Circuit Board PPO – Pin Population Option SE – Single-Ended SI – Signal Integrity SUT – System Under Test S – Static (independent of PCB ground) SOLT – acronym used to define Short, Open, Load & Thru Calibration Standards TD – Time Domain TDA – Time Domain Analysis TDR – Time Domain Reflectometry TDT – Time Domain Transmission WC – Worst Case crosstalk configuration Z – Impedance (expressed in ohms) Samtec Inc. 520 Park East Blvd. New Albany IN 47151-1147 USA ©Samtec, Inc. 2005 WWW.SAMTEC.COM 1-800-SAMTEC-9 (US & Canada) [email protected] Page:32 Phone: 812-944-6733 Fax: 812-948-5047 Report Revision: 5/10/2011 All Rights Reserved