High Speed Characterization Report LSEM-150-01-L-DH-A-N-TR Mates with LSEM-150-03.0-L-DV-A-N-TR Description: High Speed, Hermaphroditic Strip Surface Mount, 0.8mm (.0315") Centerline Right Angle to Vertical Orientation Samtec Inc. 520 Park East Blvd. New Albany IN 47151-1147 USA ©Samtec, Inc. 2005 WWW.SAMTEC.COM 1-800-SAMTEC-9 (US & Canada) [email protected] Phone: 812-944-6733 Fax: 812-948-5047 Report Revision: 3/16/2012 All Rights Reserved High Speed Characterization Report Series: LSEM Description: Board-to-Board, 0.8mm (.0315”) Pitch, Right Angle to Vertical Orientation Table of Contents Connector Overview ........................................................................................................ 1 Frequency Domain Data Summary ................................................................................. 3 Bandwidth Chart – Single-Ended & Differential Insertion Loss .................................... 5 Time Domain Data Summary .......................................................................................... 6 Characterization Details ................................................................................................ 10 Differential and Single-Ended Data............................................................................ 10 Connector Signal to Ground Ratio ............................................................................. 10 Frequency Domain Data ............................................................................................ 11 Time Domain Data ..................................................................................................... 12 Appendix A – Frequency Domain Response Graphs .................................................... 13 Single-Ended Application – Insertion Loss ................................................................ 13 Single-Ended Application – Return Loss ................................................................... 13 Single-Ended Application – NEXT Configurations ..................................................... 14 Single-Ended Application – FEXT Configurations ..................................................... 15 Differential Application – Insertion Loss ..................................................................... 16 Differential Application – Return Loss ........................................................................ 16 Differential Application – NEXT Configurations ......................................................... 17 Differential Application – FEXT Configurations .......................................................... 18 Appendix B – Time Domain Response Graphs ............................................................. 19 Single-Ended Application – Input Pulse ..................................................................... 19 Single-Ended Application – Impedance ..................................................................... 20 Single-Ended Application – Propagation Delay ......................................................... 21 Single-Ended Application – NEXT, Worst Case Configuration .................................. 22 Single-Ended Application – FEXT, Worst Case Configuration ................................... 23 Single-Ended Application – NEXT, Best Case Configuration .................................... 24 Single-Ended Application – FEXT, Best Case Configuration ..................................... 25 Single-Ended Application – NEXT, Across Row Configuration .................................. 26 Single-Ended Application – FEXT, Across Row Configuration .................................. 27 Differential Application – Input Pulse ......................................................................... 28 Differential Application – Impedance ......................................................................... 29 Differential Application – Propagation Delay .............................................................. 30 Differential Application – NEXT, Worst Case Configuration ....................................... 31 Differential Application – FEXT, Worst Case Configuration ....................................... 32 Differential Application – NEXT, Best Case Configuration ......................................... 33 Differential Application – FEXT, Best Case Configuration ......................................... 34 Differential Application – NEXT, Across Row Case Configuration ............................. 35 Differential Application – FEXT, Across Row Case Configuration ............................. 36 Appendix C – Product and Test System Descriptions ................................................... 37 Samtec Inc. 520 Park East Blvd. New Albany IN 47151-1147 USA ©Samtec, Inc. 2005 WWW.SAMTEC.COM 1-800-SAMTEC-9 (US & Canada) [email protected] Page:ii Phone: 812-944-6733 Fax: 812-948-5047 Report Revision: 3/16/2012 All Rights Reserved High Speed Characterization Report Series: LSEM Description: Board-to-Board, 0.8mm (.0315”) Pitch, Right Angle to Vertical Orientation Product Description ................................................................................................... 37 Test System Description ............................................................................................ 37 PCB-103257-TST-XX Test Fixture ............................................................................ 37 PCB-103257-TST-XX PCB Layout Panel .................................................................. 38 PCB Fixtures ............................................................................................................. 39 Calibration Board ....................................................................................................... 43 Appendix D – Test and Measurement Setup................................................................. 45 N5230C Measurement Setup .................................................................................... 45 Test Instruments ........................................................................................................ 45 Test Cables & Adapters ............................................................................................. 45 Appendix E - Frequency and Time Domain Measurements .......................................... 46 Frequency (S-Parameter) Domain Procedures ......................................................... 46 Time Domain Procedures .......................................................................................... 46 Impedance (TDR)................................................................................................... 46 Propagation Delay (TDT) ....................................................................................... 47 Near-End Crosstalk (TDT) & Far End Crosstalk (TDT) .......................................... 47 Appendix F – Glossary of Terms ................................................................................... 48 Samtec Inc. 520 Park East Blvd. New Albany IN 47151-1147 USA ©Samtec, Inc. 2005 WWW.SAMTEC.COM 1-800-SAMTEC-9 (US & Canada) [email protected] Page:iii Phone: 812-944-6733 Fax: 812-948-5047 Report Revision: 3/16/2012 All Rights Reserved High Speed Characterization Report Series: LSEM Description: Board-to-Board, 0.8mm (.0315”) Pitch, Right Angle to Vertical Orientation Connector Overview The LSEM series is a high-speed hermaphroditic design ideal for ruggedized applications. This interconnect features a slim row-to-row design and low cost blade & and beam contacts. LSEM is a double row contacts system available in 20, 30, 40, and 50 contacts per row. The data in this report is applicable only to the LSEM dual horizontal (right angle) row to vertical double row hermaphroditic interconnect system. The device is a two terminal type right angle connector with terminals having different physical lengths and geometry. Dependent on that length and geometry performance characteristics will vary. The terminology used in this report to define which connector terminal is as follows: *The short terminal of the connector is referred to as “Case 1” *The long terminal of the connector is referred to as “Case 2” This is illustrated in the following figure. Connector System Speed Rating LSEM-DH Hermaphroditic Series, Right Angle to Vertical Orientation Board-toBoard, 0.8mm Pitch Case 1 (Short) 2 (Long) Signaling Speed Rating Single-Ended: 9 GHz/ 18Gbps Differential: 10 GHz/ 20Gbps Single-Ended: 12 GHz/ 24Gbps Differential: 12.5 GHz/ 25Gbps The Speed Rating is based on the -3 dB insertion loss point of the connector system. The -3 dB point can be used to estimate usable system bandwidth in a typical, two-level Samtec Inc. 520 Park East Blvd. New Albany IN 47151-1147 USA ©Samtec, Inc. 2005 WWW.SAMTEC.COM 1-800-SAMTEC-9 (US & Canada) [email protected] Page:1 Phone: 812-944-6733 Fax: 812-948-5047 Report Revision: 3/16/2012 All Rights Reserved High Speed Characterization Report Series: LSEM Description: Board-to-Board, 0.8mm (.0315”) Pitch, Right Angle to Vertical Orientation signaling environment. To calculate the Speed Rating, the measured -3 dB point is rounded-up to the nearest half-GHz level. The up rounding corrects for a portion of the test board’s trace loss, since a short length of trace loss included in the loss data in this report. The resulting loss value is then doubled to determine the approximate maximum data rate in Gigabits per second (Gbps). For example, a connector with a -3 dB point of 7.8 GHz would have a Speed Rating of 8 GHz/ 16 Gbps. A connector with a -3 dB point of 7.2 GHz would have a Speed Rating of 7.5 GHz/ 15 Gbps. Samtec Inc. 520 Park East Blvd. New Albany IN 47151-1147 USA ©Samtec, Inc. 2005 WWW.SAMTEC.COM 1-800-SAMTEC-9 (US & Canada) [email protected] Page:2 Phone: 812-944-6733 Fax: 812-948-5047 Report Revision: 3/16/2012 All Rights Reserved High Speed Characterization Report Series: LSEM Description: Board-to-Board, 0.8mm (.0315”) Pitch, Right Angle to Vertical Orientation Frequency Domain Data Summary Table 1 - Single-Ended Connector System Performance Case Test Parameter Configuration Insertion Loss GSG 3dB @ 9.050 GHz Return Loss GSG >10dB to 5.925 GHz Near-End Crosstalk GAQG < -20dB to 0.738 GHz GAGQG < -20dB to 9.325 GHz Xrow, GAG to GQG < -20dB to 9.113 GHz GAQG < -20dB to 2.938 GHz GAGQG < -20dB to 8.575 GHz Xrow, GAG to GQG < -20dB to 9.125 GHz Insertion Loss GSG 3dB @ 11.938 GHz Return Loss GSG >10dB to 10.500 GHz Near-End Crosstalk GAQG < -20dB to 0.525 GHz GAGQG < -20dB to 6.238 GHz Xrow, GAG to GQG < -20dB to 9.113 GHz GAQG < -20dB to 5.988 GHz GAGQG < -20dB to 6.213 GHz Xrow, GAG to GQG < -20dB to 9.100 GHz 1 (Short) Far-End Crosstalk 2 (Long) Far-End Crosstalk Samtec Inc. 520 Park East Blvd. New Albany IN 47151-1147 USA ©Samtec, Inc. 2005 WWW.SAMTEC.COM 1-800-SAMTEC-9 (US & Canada) [email protected] Page:3 Phone: 812-944-6733 Fax: 812-948-5047 Report Revision: 3/16/2012 All Rights Reserved High Speed Characterization Report Series: LSEM Description: Board-to-Board, 0.8mm (.0315”) Pitch, Right Angle to Vertical Orientation Table 2 - Differential Connector System Performance Case Test Parameter Configuration Insertion Loss GSSG 3dB @ 9.813 GHz Return Loss GSSG >10dB to 7.200 GHz Near-End Crosstalk GAAQQG < -20dB to 14.438 GAAGQQG < -20dB to 18.950 Xrow, GAAG to GQQG < -20dB to 20.000 GAAQQG < -20dB to 14.325 GAAGQQG < -20dB to 17.913 Xrow, GAAG to GQQG < -20dB to 20.000 Insertion Loss GSSG 3dB @ 12.225 GHz Return Loss GSSG >10dB to 6.525 GHz Near-End Crosstalk GAAQQG < -20dB to 9.100 GHz GAAGQQG < -20dB to 20.000 Xrow, GAAG to GQQG < -20dB to 20.000 GAAQQG < -20dB to 20.000 GAAGQQG < -20dB to 20.000 Xrow, GAAG to GQQG < -20dB to 20.000 1 (Short) Far-End Crosstalk 2 (Long) Far-End Crosstalk Samtec Inc. 520 Park East Blvd. New Albany IN 47151-1147 USA ©Samtec, Inc. 2005 WWW.SAMTEC.COM 1-800-SAMTEC-9 (US & Canada) [email protected] Page:4 Phone: 812-944-6733 Fax: 812-948-5047 Report Revision: 3/16/2012 All Rights Reserved High Speed Characterization Report Series: LSEM Description: Board-to-Board, 0.8mm (.0315”) Pitch, Right Angle to Vertical Orientation Bandwidth Chart – Single-Ended & Differential Insertion Loss LSEM Connector Series Samtec Inc. 520 Park East Blvd. New Albany IN 47151-1147 USA ©Samtec, Inc. 2005 WWW.SAMTEC.COM 1-800-SAMTEC-9 (US & Canada) [email protected] Page:5 Phone: 812-944-6733 Fax: 812-948-5047 Report Revision: 3/16/2012 All Rights Reserved High Speed Characterization Report Series: LSEM Description: Board-to-Board, 0.8mm (.0315”) Pitch, Right Angle to Vertical Orientation Time Domain Data Summary Table 3 – Single-End Impedance () Case Signal Risetime 30 ps 50 ps 100 ps 250 ps 500 ps Maximum Impedance 65.2 60.4 53.6 51.6 51.1 Minimum Impedance 39.0 41.7 46.5 49.3 49.9 Maximum Impedance 61.0 57.2 53.8 52.4 51.3 Minimum Impedance 37.4 41.3 45.4 48.4 49.5 1 2 Samtec Inc. 520 Park East Blvd. New Albany IN 47151-1147 USA ©Samtec, Inc. 2005 WWW.SAMTEC.COM 1-800-SAMTEC-9 (US & Canada) [email protected] Page:6 Phone: 812-944-6733 Fax: 812-948-5047 Report Revision: 3/16/2012 All Rights Reserved High Speed Characterization Report Series: LSEM Description: Board-to-Board, 0.8mm (.0315”) Pitch, Right Angle to Vertical Orientation Table 4 - Differential Impedance () Cas e Signal Risetime 30 ps 50 ps 100 ps 250 ps 500 ps Maximum Impedance 102.8 101.8 101.0 100.2 100.2 Minimum Impedance 64.4 70.6 80.3 87.1 92.7 Maximum Impedance 107.1 104.7 102.0 100.9 100.2 Minimum Impedance 66.1 69.2 74.3 84.3 91.4 1 2 Samtec Inc. 520 Park East Blvd. New Albany IN 47151-1147 USA ©Samtec, Inc. 2005 WWW.SAMTEC.COM 1-800-SAMTEC-9 (US & Canada) [email protected] Page:7 Phone: 812-944-6733 Fax: 812-948-5047 Report Revision: 3/16/2012 All Rights Reserved High Speed Characterization Report Series: LSEM Description: Board-to-Board, 0.8mm (.0315”) Pitch, Right Angle to Vertical Orientation Table 5 - Single-Ended Crosstalk (%) Case Input(tr) NEXT 1 FEXT NEXT 2 FEXT 30ps 50 ps 100 ps 250 ps 500 ps GAQG 19.5 17.0 14.5 7.9 4.3 GAGQG 4.0 2.6 1.8 1.1 0.6 Xrow 3.4 2.9 2.3 1.2 0.7 GAQG 9.6 6.1 3.6 1.6 0.8 GAGQG 5.6 3.3 1.6 0.6 0.3 Xrow 2.4 1.3 0.6 0.2 <0.1 GAQG 22.0 20.3 17.6 10.9 6.0 GAGQG 3.8 2.8 2.0 1.2 0.7 Xrow 3.4 2.9 2.3 1.2 0.7 GAQG 7.1 5.8 3.5 1.8 1.0 GAGQG 4.2 3.1 1.6 0.6 0.3 Xrow 2.0 1.1 0.5 0.2 0.1 Table 6 - Differential Crosstalk (%) Case Input(tr) NEXT 1 FEXT NEXT 2 FEXT Samtec Inc. 520 Park East Blvd. New Albany IN 47151-1147 USA ©Samtec, Inc. 2005 30ps 50 ps 100 ps 250 ps 500 ps GAAQQG 5.7 4.8 3.9 2.0 1.1 GAAGQQG 0.7 0.4 0.2 <0.1 <0.1 Xrow 1.0 0.9 0.6 0.3 0.2 GAAQQG 1.7 1.0 0.7 0.3 0.2 GAAGQQG 1.3 0.8 0.4 0.1 <0.1 Xrow 0.4 0.3 0.1 <0.1 <0.1 GAAQQG 6.5 6.2 5.3 3.3 1.9 GAAGQQG 0.5 0.4 0.3 0.2 0.1 Xrow 1.0 0.9 0.6 0.3 0.2 GAAQQG 1.5 1.2 1.0 0.6 0.3 GAAGQQG 0.8 0.6 0.3 0.1 <0.1 Xrow 0.3 0.2 0.1 <0.1 <0.1 WWW.SAMTEC.COM 1-800-SAMTEC-9 (US & Canada) [email protected] Page:8 Phone: 812-944-6733 Fax: 812-948-5047 Report Revision: 3/16/2012 All Rights Reserved High Speed Characterization Report Series: LSEM Description: Board-to-Board, 0.8mm (.0315”) Pitch, Right Angle to Vertical Orientation Table 7 - Propagation Delay (Mated Connector) Case 1 Case 2 Single-Ended 77 ps Differential 70 ps Single-Ended 92 ps Differential 93 ps Samtec Inc. 520 Park East Blvd. New Albany IN 47151-1147 USA ©Samtec, Inc. 2005 WWW.SAMTEC.COM 1-800-SAMTEC-9 (US & Canada) [email protected] Page:9 Phone: 812-944-6733 Fax: 812-948-5047 Report Revision: 3/16/2012 All Rights Reserved High Speed Characterization Report Series: LSEM Description: Board-to-Board, 0.8mm (.0315”) Pitch, Right Angle to Vertical Orientation Characterization Details This report presents data that characterizes the signal integrity response of a connector pair in a controlled printed circuit board (PCB) environment. All efforts are made to reveal typical best-case responses inherent to the system under test (SUT). In this report, the SUT includes the connector pair and footprint effects on a typical multi-layer PCB. PCB effects (trace loss) are de-embedded from test data. Board related effects, such as pad-to-ground capacitance, are included in the data presented in this report. Additionally, intermediate test signal connections can mask the connector’s true performance. Such connection effects are minimized by using high performance test cables and adapters. Where appropriate, calibration and de-embedding routines are also used to reduce residual effects. Differential and Single-Ended Data Most Samtec connectors can be used successfully in both differential and single-ended applications. However, electrical performance will differ depending on the signal drive type. In this report, data is presented for both differential and single-ended drive scenarios. Connector Signal to Ground Ratio Samtec connectors are most often designed for generic applications and can be implemented using various signal and ground pin assignments. In high-speed systems, provisions must be made in the interconnect for signal return currents. Such paths are often referred to as “ground”. In some connectors, a ground plane or blade, or an outer shield, is used as the signal return, while in others, connector pins are used as signal returns. Various combinations of signal pins, ground blades, and shields can also be utilized. Electrical performance can vary significantly depending upon the number and location of ground pins. In general, the more pins dedicated to ground, the better electrical performance will be. However, dedicating pins to ground reduces signal density of a connector. Therefore, care must be taken when choosing signal/ground ratios in cost or density-sensitive applications. For this connector, the following array configurations are evaluated: Single-Ended Impedance: • GSG (ground-signal-ground) Single-Ended Crosstalk: Samtec Inc. 520 Park East Blvd. New Albany IN 47151-1147 USA ©Samtec, Inc. 2005 WWW.SAMTEC.COM 1-800-SAMTEC-9 (US & Canada) [email protected] Page:10 Phone: 812-944-6733 Fax: 812-948-5047 Report Revision: 3/16/2012 All Rights Reserved High Speed Characterization Report Series: LSEM Description: Board-to-Board, 0.8mm (.0315”) Pitch, Right Angle to Vertical Orientation • Electrical “worst case”: GAQG (ground-active-quiet-ground) • Electrical “best case”: GAGQG (ground-active-ground-quiet-ground) • Across row: “xrow case”: GAG to GQG (from one row of terminals to the other row) Differential Impedance: • GSSG (Ground-positive signal-negative signal-ground) Differential Crosstalk: • Electrical “worst case”: GAAQQG (ground-active-active-quiet-quiet-ground) • Electrical “best case”: GAAGQQG (ground-active-active-ground-quiet-quietground) • Across row: “xrow case”: GAAG to GQQG (from one row of terminals to the other row) Only one single-ended signal or differential pair was driven for crosstalk measurements. Other configurations can be evaluated upon request. Please contact [email protected] for more information. In a real system environment, active signals might be located at the outer edges of the signal contacts of concern, as opposed to the ground signals utilized in laboratory testing. For example, in a single-ended system, a pin-out of “SSSS”, or four adjacent single ended signals might be encountered as opposed to the “GSG” and “GSSG” configurations tested in the laboratory. Electrical characteristics in such applications could vary slightly from laboratory results. However, in most applications, performance can safely be considered equivalent. Signal Edge Speed (Rise Time): In pulse signaling applications, the perceived performance of the interconnect can vary significantly depending on the edge rate or rise time of the exciting signal. For this report, the fastest rise time used was 30 ps. Generally, this should demonstrate worstcase performance. In many systems, the signal edge rate will be significantly slower at the connector than at the driver launch point. To estimate interconnect performance at other edge rates, data is provided for several rise times between 30ps and 500ps. For this report, measured rise times were at 10%-90% signal levels. Frequency Domain Data Frequency Domain parameters are helpful in evaluating the connector system’s signal loss and crosstalk characteristics across a range of sinusoidal frequencies. In this report, parameters presented in the Frequency Domain are Insertion Loss, Return Loss, and Near-End and Far-End Crosstalk. Other parameters or formats, such as VSWR or Samtec Inc. 520 Park East Blvd. New Albany IN 47151-1147 USA ©Samtec, Inc. 2005 WWW.SAMTEC.COM 1-800-SAMTEC-9 (US & Canada) [email protected] Page:11 Phone: 812-944-6733 Fax: 812-948-5047 Report Revision: 3/16/2012 All Rights Reserved High Speed Characterization Report Series: LSEM Description: Board-to-Board, 0.8mm (.0315”) Pitch, Right Angle to Vertical Orientation S-Parameters, may be available upon request. Please contact our Signal Integrity Group at [email protected] for more information. Frequency performance characteristics for the SUT are generated directly from network analyzer measurements. Time Domain Data Time Domain parameters indicate Impedance mismatch versus length, signal propagation time, and crosstalk in a pulsed signal environment. The measured S-Parameters from the network analyzer are post-processed using Agilent Advanced Design System to obtain the time domain response. Time Domain procedure is provided in Appendix E of this report. Parameters or formats not included in this report may be available upon request. Please contact our Signal Integrity Group at [email protected] for more information. In this report, propagation delay is defined as the signal propagation time through the connector and connector footprint. It includes 100 mils of PCB trace on the LSEM-DH connector side and 100 mils of PCB trace on the LSEM-DV connector side. Delay is measured at 30 picoseconds signal rise-time. Delay is calculated as the difference in time measured between the 50% amplitude levels of the input and output pulses. Crosstalk or coupled noise data is provided for various signal configurations. All measurements are single disturber. Crosstalk is calculated as a ratio of the input line voltage to the coupled line voltage. The input line is sometimes described as the active or drive line. The coupled line is sometimes described as the quiet or victim line. Crosstalk ratio is tabulated in this report as a percentage. Measurements are made at both the nearend and far-end of the SUT. Data for other configurations may be available. Please contact our Signal Integrity Group at [email protected] for further information. As a rule of thumb, 10% crosstalk levels are often used as a general first pass limit for determining acceptable interconnect performance. However, modern system crosstalk tolerance can vary greatly. For advice on connector suitability for specific applications, please contact our Signal Integrity Group at [email protected]. Additional information concerning test conditions and procedures is located in the appendices of this report. Further information may be obtained by contacting our Signal Integrity Group at [email protected]. Samtec Inc. 520 Park East Blvd. New Albany IN 47151-1147 USA ©Samtec, Inc. 2005 WWW.SAMTEC.COM 1-800-SAMTEC-9 (US & Canada) [email protected] Page:12 Phone: 812-944-6733 Fax: 812-948-5047 Report Revision: 3/16/2012 All Rights Reserved High Speed Characterization Report Series: LSEM Description: Board-to-Board, 0.8mm (.0315”) Pitch, Right Angle to Vertical Orientation Appendix A – Frequency Domain Response Graphs Single-Ended Application – Insertion Loss Single-Ended Application – Return Loss Samtec Inc. 520 Park East Blvd. New Albany IN 47151-1147 USA ©Samtec, Inc. 2005 WWW.SAMTEC.COM 1-800-SAMTEC-9 (US & Canada) [email protected] Page:13 Phone: 812-944-6733 Fax: 812-948-5047 Report Revision: 3/16/2012 All Rights Reserved High Speed Characterization Report Series: LSEM Description: Board-to-Board, 0.8mm (.0315”) Pitch, Right Angle to Vertical Orientation Single-Ended Application – NEXT Configurations Case 1 Case 2 Samtec Inc. 520 Park East Blvd. New Albany IN 47151-1147 USA ©Samtec, Inc. 2005 WWW.SAMTEC.COM 1-800-SAMTEC-9 (US & Canada) [email protected] Page:14 Phone: 812-944-6733 Fax: 812-948-5047 Report Revision: 3/16/2012 All Rights Reserved High Speed Characterization Report Series: LSEM Description: Board-to-Board, 0.8mm (.0315”) Pitch, Right Angle to Vertical Orientation Single-Ended Application – FEXT Configurations Case 1 Case 2 Samtec Inc. 520 Park East Blvd. New Albany IN 47151-1147 USA ©Samtec, Inc. 2005 WWW.SAMTEC.COM 1-800-SAMTEC-9 (US & Canada) [email protected] Page:15 Phone: 812-944-6733 Fax: 812-948-5047 Report Revision: 3/16/2012 All Rights Reserved High Speed Characterization Report Series: LSEM Description: Board-to-Board, 0.8mm (.0315”) Pitch, Right Angle to Vertical Orientation Differential Application – Insertion Loss Differential Application – Return Loss Samtec Inc. 520 Park East Blvd. New Albany IN 47151-1147 USA ©Samtec, Inc. 2005 WWW.SAMTEC.COM 1-800-SAMTEC-9 (US & Canada) [email protected] Page:16 Phone: 812-944-6733 Fax: 812-948-5047 Report Revision: 3/16/2012 All Rights Reserved High Speed Characterization Report Series: LSEM Description: Board-to-Board, 0.8mm (.0315”) Pitch, Right Angle to Vertical Orientation Differential Application – NEXT Configurations Case 1 Case 2 Samtec Inc. 520 Park East Blvd. New Albany IN 47151-1147 USA ©Samtec, Inc. 2005 WWW.SAMTEC.COM 1-800-SAMTEC-9 (US & Canada) [email protected] Page:17 Phone: 812-944-6733 Fax: 812-948-5047 Report Revision: 3/16/2012 All Rights Reserved High Speed Characterization Report Series: LSEM Description: Board-to-Board, 0.8mm (.0315”) Pitch, Right Angle to Vertical Orientation Differential Application – FEXT Configurations Case 1 Case 2 Samtec Inc. 520 Park East Blvd. New Albany IN 47151-1147 USA ©Samtec, Inc. 2005 WWW.SAMTEC.COM 1-800-SAMTEC-9 (US & Canada) [email protected] Page:18 Phone: 812-944-6733 Fax: 812-948-5047 Report Revision: 3/16/2012 All Rights Reserved High Speed Characterization Report Series: LSEM Description: Board-to-Board, 0.8mm (.0315”) Pitch, Right Angle to Vertical Orientation Appendix B – Time Domain Response Graphs Single-Ended Application – Input Pulse Samtec Inc. 520 Park East Blvd. New Albany IN 47151-1147 USA ©Samtec, Inc. 2005 WWW.SAMTEC.COM 1-800-SAMTEC-9 (US & Canada) [email protected] Page:19 Phone: 812-944-6733 Fax: 812-948-5047 Report Revision: 3/16/2012 All Rights Reserved High Speed Characterization Report Series: LSEM Description: Board-to-Board, 0.8mm (.0315”) Pitch, Right Angle to Vertical Orientation Single-Ended Application – Impedance Case 1 Case 2 Samtec Inc. 520 Park East Blvd. New Albany IN 47151-1147 USA ©Samtec, Inc. 2005 WWW.SAMTEC.COM 1-800-SAMTEC-9 (US & Canada) [email protected] Page:20 Phone: 812-944-6733 Fax: 812-948-5047 Report Revision: 3/16/2012 All Rights Reserved High Speed Characterization Report Series: LSEM Description: Board-to-Board, 0.8mm (.0315”) Pitch, Right Angle to Vertical Orientation Single-Ended Application – Propagation Delay Case 1 Case 2 Samtec Inc. 520 Park East Blvd. New Albany IN 47151-1147 USA ©Samtec, Inc. 2005 WWW.SAMTEC.COM 1-800-SAMTEC-9 (US & Canada) [email protected] Page:21 Phone: 812-944-6733 Fax: 812-948-5047 Report Revision: 3/16/2012 All Rights Reserved High Speed Characterization Report Series: LSEM Description: Board-to-Board, 0.8mm (.0315”) Pitch, Right Angle to Vertical Orientation Single-Ended Application – NEXT, Worst Case Configuration Case 1 Case 2 Samtec Inc. 520 Park East Blvd. New Albany IN 47151-1147 USA ©Samtec, Inc. 2005 WWW.SAMTEC.COM 1-800-SAMTEC-9 (US & Canada) [email protected] Page:22 Phone: 812-944-6733 Fax: 812-948-5047 Report Revision: 3/16/2012 All Rights Reserved High Speed Characterization Report Series: LSEM Description: Board-to-Board, 0.8mm (.0315”) Pitch, Right Angle to Vertical Orientation Single-Ended Application – FEXT, Worst Case Configuration Case 1 Case 2 Samtec Inc. 520 Park East Blvd. New Albany IN 47151-1147 USA ©Samtec, Inc. 2005 WWW.SAMTEC.COM 1-800-SAMTEC-9 (US & Canada) [email protected] Page:23 Phone: 812-944-6733 Fax: 812-948-5047 Report Revision: 3/16/2012 All Rights Reserved High Speed Characterization Report Series: LSEM Description: Board-to-Board, 0.8mm (.0315”) Pitch, Right Angle to Vertical Orientation Single-Ended Application – NEXT, Best Case Configuration Case 1 Case 2 Samtec Inc. 520 Park East Blvd. New Albany IN 47151-1147 USA ©Samtec, Inc. 2005 WWW.SAMTEC.COM 1-800-SAMTEC-9 (US & Canada) [email protected] Page:24 Phone: 812-944-6733 Fax: 812-948-5047 Report Revision: 3/16/2012 All Rights Reserved High Speed Characterization Report Series: LSEM Description: Board-to-Board, 0.8mm (.0315”) Pitch, Right Angle to Vertical Orientation Single-Ended Application – FEXT, Best Case Configuration Case 1 Case2 Samtec Inc. 520 Park East Blvd. New Albany IN 47151-1147 USA ©Samtec, Inc. 2005 WWW.SAMTEC.COM 1-800-SAMTEC-9 (US & Canada) [email protected] Page:25 Phone: 812-944-6733 Fax: 812-948-5047 Report Revision: 3/16/2012 All Rights Reserved High Speed Characterization Report Series: LSEM Description: Board-to-Board, 0.8mm (.0315”) Pitch, Right Angle to Vertical Orientation Single-Ended Application – NEXT, Across Row Configuration Case 1 Case 2 Samtec Inc. 520 Park East Blvd. New Albany IN 47151-1147 USA ©Samtec, Inc. 2005 WWW.SAMTEC.COM 1-800-SAMTEC-9 (US & Canada) [email protected] Page:26 Phone: 812-944-6733 Fax: 812-948-5047 Report Revision: 3/16/2012 All Rights Reserved High Speed Characterization Report Series: LSEM Description: Board-to-Board, 0.8mm (.0315”) Pitch, Right Angle to Vertical Orientation Single-Ended Application – FEXT, Across Row Configuration Case 1 Case 2 Samtec Inc. 520 Park East Blvd. New Albany IN 47151-1147 USA ©Samtec, Inc. 2005 WWW.SAMTEC.COM 1-800-SAMTEC-9 (US & Canada) [email protected] Page:27 Phone: 812-944-6733 Fax: 812-948-5047 Report Revision: 3/16/2012 All Rights Reserved High Speed Characterization Report Series: LSEM Description: Board-to-Board, 0.8mm (.0315”) Pitch, Right Angle to Vertical Orientation Differential Application – Input Pulse Samtec Inc. 520 Park East Blvd. New Albany IN 47151-1147 USA ©Samtec, Inc. 2005 WWW.SAMTEC.COM 1-800-SAMTEC-9 (US & Canada) [email protected] Page:28 Phone: 812-944-6733 Fax: 812-948-5047 Report Revision: 3/16/2012 All Rights Reserved High Speed Characterization Report Series: LSEM Description: Board-to-Board, 0.8mm (.0315”) Pitch, Right Angle to Vertical Orientation Differential Application – Impedance Case 1 Case 2 Samtec Inc. 520 Park East Blvd. New Albany IN 47151-1147 USA ©Samtec, Inc. 2005 WWW.SAMTEC.COM 1-800-SAMTEC-9 (US & Canada) [email protected] Page:29 Phone: 812-944-6733 Fax: 812-948-5047 Report Revision: 3/16/2012 All Rights Reserved High Speed Characterization Report Series: LSEM Description: Board-to-Board, 0.8mm (.0315”) Pitch, Right Angle to Vertical Orientation Differential Application – Propagation Delay Case 1 Case 2 Samtec Inc. 520 Park East Blvd. New Albany IN 47151-1147 USA ©Samtec, Inc. 2005 WWW.SAMTEC.COM 1-800-SAMTEC-9 (US & Canada) [email protected] Page:30 Phone: 812-944-6733 Fax: 812-948-5047 Report Revision: 3/16/2012 All Rights Reserved High Speed Characterization Report Series: LSEM Description: Board-to-Board, 0.8mm (.0315”) Pitch, Right Angle to Vertical Orientation Differential Application – NEXT, Worst Case Configuration Case 1 Case 2 Samtec Inc. 520 Park East Blvd. New Albany IN 47151-1147 USA ©Samtec, Inc. 2005 WWW.SAMTEC.COM 1-800-SAMTEC-9 (US & Canada) [email protected] Page:31 Phone: 812-944-6733 Fax: 812-948-5047 Report Revision: 3/16/2012 All Rights Reserved High Speed Characterization Report Series: LSEM Description: Board-to-Board, 0.8mm (.0315”) Pitch, Right Angle to Vertical Orientation Differential Application – FEXT, Worst Case Configuration Case 1 Case 2 Samtec Inc. 520 Park East Blvd. New Albany IN 47151-1147 USA ©Samtec, Inc. 2005 WWW.SAMTEC.COM 1-800-SAMTEC-9 (US & Canada) [email protected] Page:32 Phone: 812-944-6733 Fax: 812-948-5047 Report Revision: 3/16/2012 All Rights Reserved High Speed Characterization Report Series: LSEM Description: Board-to-Board, 0.8mm (.0315”) Pitch, Right Angle to Vertical Orientation Differential Application – NEXT, Best Case Configuration Case 1 Case 2 Samtec Inc. 520 Park East Blvd. New Albany IN 47151-1147 USA ©Samtec, Inc. 2005 WWW.SAMTEC.COM 1-800-SAMTEC-9 (US & Canada) [email protected] Page:33 Phone: 812-944-6733 Fax: 812-948-5047 Report Revision: 3/16/2012 All Rights Reserved High Speed Characterization Report Series: LSEM Description: Board-to-Board, 0.8mm (.0315”) Pitch, Right Angle to Vertical Orientation Differential Application – FEXT, Best Case Configuration Case 1 Case 2 Samtec Inc. 520 Park East Blvd. New Albany IN 47151-1147 USA ©Samtec, Inc. 2005 WWW.SAMTEC.COM 1-800-SAMTEC-9 (US & Canada) [email protected] Page:34 Phone: 812-944-6733 Fax: 812-948-5047 Report Revision: 3/16/2012 All Rights Reserved High Speed Characterization Report Series: LSEM Description: Board-to-Board, 0.8mm (.0315”) Pitch, Right Angle to Vertical Orientation Differential Application – NEXT, Across Row Case Configuration Case 1 Case 2 Samtec Inc. 520 Park East Blvd. New Albany IN 47151-1147 USA ©Samtec, Inc. 2005 WWW.SAMTEC.COM 1-800-SAMTEC-9 (US & Canada) [email protected] Page:35 Phone: 812-944-6733 Fax: 812-948-5047 Report Revision: 3/16/2012 All Rights Reserved High Speed Characterization Report Series: LSEM Description: Board-to-Board, 0.8mm (.0315”) Pitch, Right Angle to Vertical Orientation Differential Application – FEXT, Across Row Case Configuration Case 1 Case 2 Samtec Inc. 520 Park East Blvd. New Albany IN 47151-1147 USA ©Samtec, Inc. 2005 WWW.SAMTEC.COM 1-800-SAMTEC-9 (US & Canada) [email protected] Page:36 Phone: 812-944-6733 Fax: 812-948-5047 Report Revision: 3/16/2012 All Rights Reserved High Speed Characterization Report Series: LSEM Description: Board-to-Board, 0.8mm (.0315”) Pitch, Right Angle to Vertical Orientation Appendix C – Product and Test System Descriptions Product Description Product test samples are from the hermaphroditic high-speed LSEM connector series. Part numbers are LSEM-150-01-L-DH-A-N-TR and LSEM-150-03.0-L-DV-A-N-TR. Each connector has two rows of 30 contacts evenly spaced on a 0.8 mm (0.0314”) pitch. A photo of the test articles mounted to SI test boards is shown below. Test System Description The test fixtures are composed of four-layer FR-4 material with 50Ω signal trace and pad configurations designed for the electrical characterization of Samtec high speed connector products. A PCB mount SMA connector is used to interface the VNA test cables to the test fixtures. SMA launch optimization is attained using full wave simulation tools to minimize reflections. There are 17 test fixtures specific to the LSEM-DH series connector set. Sixteen of the 17 fixtures mate comprising a full hi-speed characterization utilizing 12 test configurations of two signal types. The remaining board contains the SMA/LRM calibration structures designed specifically for the LSEM-DH series. Displayed on the following pages is information for SMA/LRM calibration structures and directives for mating LSEM series fixtures. PCB-103257-TST-XX Test Fixture Populated Test Components Samtec Inc. 520 Park East Blvd. New Albany IN 47151-1147 USA ©Samtec, Inc. 2005 WWW.SAMTEC.COM 1-800-SAMTEC-9 (US & Canada) [email protected] Page:37 Phone: 812-944-6733 Fax: 812-948-5047 Report Revision: 3/16/2012 All Rights Reserved High Speed Characterization Report Series: LSEM Description: Board-to-Board, 0.8mm (.0315”) Pitch, Right Angle to Vertical Orientation PCB-103257-TST-XX PCB Layout Panel PCB design artwork shown below. Samtec Inc. 520 Park East Blvd. New Albany IN 47151-1147 USA ©Samtec, Inc. 2005 WWW.SAMTEC.COM 1-800-SAMTEC-9 (US & Canada) [email protected] Page:38 Phone: 812-944-6733 Fax: 812-948-5047 Report Revision: 3/16/2012 All Rights Reserved High Speed Characterization Report Series: LSEM Description: Board-to-Board, 0.8mm (.0315”) Pitch, Right Angle to Vertical Orientation PCB Fixtures The test fixtures used are as follows: PCB-103257-TST-01 Rev, LSEM-DH mates with PCB-103257-TST-02 Rev, LSEM-DV Case 1, Single-Ended Best & Worst Case Configurations, Transmission/ Reflection Parameters, Crosstalk Parameters PCB-103257-TST-03 Rev, LSEM-DH mates with PCB-103257-TST-04 Rev, LSEM-DV Case 2, Single-Ended Best & Worst Case Configurations, Transmission/ Reflection Parameters, Crosstalk Parameters Samtec Inc. 520 Park East Blvd. New Albany IN 47151-1147 USA ©Samtec, Inc. 2005 WWW.SAMTEC.COM 1-800-SAMTEC-9 (US & Canada) [email protected] Page:39 Phone: 812-944-6733 Fax: 812-948-5047 Report Revision: 3/16/2012 All Rights Reserved High Speed Characterization Report Series: LSEM Description: Board-to-Board, 0.8mm (.0315”) Pitch, Right Angle to Vertical Orientation PCB Fixtures (Cont.) PCB-103257-TST-05 Rev, LSEM-DH mates with PCB-103257-TST-06 Rev, LSEM-DV Case 1, Single-Ended Across Row Configuration, Crosstalk Parameters PCB-103257-TST-07 Rev, LSEM-DH mates with PCB-103257-TST-08 Rev, LSEM-DV Case 1, Differential Across Row Configuration, Crosstalk Parameters Samtec Inc. 520 Park East Blvd. New Albany IN 47151-1147 USA ©Samtec, Inc. 2005 WWW.SAMTEC.COM 1-800-SAMTEC-9 (US & Canada) [email protected] Page:40 Phone: 812-944-6733 Fax: 812-948-5047 Report Revision: 3/16/2012 All Rights Reserved High Speed Characterization Report Series: LSEM Description: Board-to-Board, 0.8mm (.0315”) Pitch, Right Angle to Vertical Orientation PCB Fixtures (Cont.) PCB-103257-TST-12 Rev, LSEM-DH mates with PCB-103257-TST-11 Rev, LSEM-DV Case 1, Differential Worst Case Configuration, Crosstalk Parameters PCB-103257-TST-10 Rev, LSEM-DH mates with PCB-103257-TST-09 Rev, LSEM-DV Case 2, Differential Worst Case Configuration, Crosstalk Parameters Samtec Inc. 520 Park East Blvd. New Albany IN 47151-1147 USA ©Samtec, Inc. 2005 WWW.SAMTEC.COM 1-800-SAMTEC-9 (US & Canada) [email protected] Page:41 Phone: 812-944-6733 Fax: 812-948-5047 Report Revision: 3/16/2012 All Rights Reserved High Speed Characterization Report Series: LSEM Description: Board-to-Board, 0.8mm (.0315”) Pitch, Right Angle to Vertical Orientation PCB Fixtures (Cont.) PCB-103257-TST-16 Rev, LSEM-DH mates with PCB-103257-TST-15 Rev, LSEM-DV Case 1, Differential Best Case Configuration, Transmission/ Reflection Parameters, Crosstalk Parameters PCB-103257-TST-14 Rev, LSEM-DH mates with PCB-103257-TST-13 Rev, LSEM-DV Case 2, Differential Best Case Configuration, Transmission/ Reflection Parameters, Crosstalk Parameters Samtec Inc. 520 Park East Blvd. New Albany IN 47151-1147 USA ©Samtec, Inc. 2005 WWW.SAMTEC.COM 1-800-SAMTEC-9 (US & Canada) [email protected] Page:42 Phone: 812-944-6733 Fax: 812-948-5047 Report Revision: 3/16/2012 All Rights Reserved High Speed Characterization Report Series: LSEM Description: Board-to-Board, 0.8mm (.0315”) Pitch, Right Angle to Vertical Orientation Calibration Board Test fixture losses and test point reflections were removed from the data by use of LRM calibration. The calibration boards are shown below. Prior to making any measurements, the calibration board is characterized to obtain parameters required to define the calibration kit. Once a cal kit is defined, calibration using the standards on the calibration board can be performed. Finally, the device can be measured and the test board effects are automatically removed. Line - Reflect - Match (LRM) Calibration Standards PCB-103257-TST-99 Reflect Standard - Length = 1600 mils Match Standard – Length = 1600 mils Line 1 - Length = 6586 mils Line 2 - Length = 3877 mils Samtec Inc. 520 Park East Blvd. New Albany IN 47151-1147 USA ©Samtec, Inc. 2005 Line 3 - Length = 3335 mils Thru Line (2X) = 3200 mils WWW.SAMTEC.COM 1-800-SAMTEC-9 (US & Canada) [email protected] Page:43 Phone: 812-944-6733 Fax: 812-948-5047 Report Revision: 3/16/2012 All Rights Reserved High Speed Characterization Report Series: LSEM Description: Board-to-Board, 0.8mm (.0315”) Pitch, Right Angle to Vertical Orientation All traces on the test boards are length matched to 1700 mils measured from the center of the pad to the SMA. The TRL calibration effectively removes 1600 mils of trace effects from each test board. The reference plane location is effectively 100 mils from the center of each signal pad. This means 200 mils of PCB signal trace length are included in the measurement. The S-Parameter measurements include: ABCDE- The LSEM-DH/LSEM-DV-03.0 mated connector Via and footprint effects for LSEM-DH 100 mils of 16 mil wide microstrip Via and footprint effects for LSEM-DV 100 mils of 16 mil wide microstrip The figure below shows the location of the measurement reference plane. Measurement reference plane for the LSEM-DV connector D E B C Measurement reference plane for the LSEM-DH connector Samtec Inc. 520 Park East Blvd. New Albany IN 47151-1147 USA ©Samtec, Inc. 2005 WWW.SAMTEC.COM 1-800-SAMTEC-9 (US & Canada) [email protected] Page:44 Phone: 812-944-6733 Fax: 812-948-5047 Report Revision: 3/16/2012 All Rights Reserved High Speed Characterization Report Series: LSEM Description: Board-to-Board, 0.8mm (.0315”) Pitch, Right Angle to Vertical Orientation Appendix D – Test and Measurement Setup The test instrument is the Agilent N5230C PNA-L network analyzer. Frequency domain data and graphs are obtained directly from the instrument. Post-processed time domain data and graphs are generated using convolution algorithms within Agilent ADS. The network analyzer is configured as follows: Start Frequency – 300 KHz Stop Frequency – 20 GHz Number of points -1601 IFBW – 1 KHz With these settings, the measurement time is approximately 20 seconds. N5230C Measurement Setup Test Instruments QTY Description 1 Agilent N5230C PNA-L 4-Port Network Analyzer (300 KHz to 20 GHz) 1 Agilent N4433A Ecal module (300 KHz to 20 GHz) Test Cables & Adapters QTY Description 4 WL Gore –Z0CJ0CK0360 3.5 mm(f) to 3.5mm(m) Test Port Cables Samtec Inc. 520 Park East Blvd. New Albany IN 47151-1147 USA ©Samtec, Inc. 2005 WWW.SAMTEC.COM 1-800-SAMTEC-9 (US & Canada) [email protected] Page:45 Phone: 812-944-6733 Fax: 812-948-5047 Report Revision: 3/16/2012 All Rights Reserved High Speed Characterization Report Series: LSEM Description: Board-to-Board, 0.8mm (.0315”) Pitch, Right Angle to Vertical Orientation Appendix E - Frequency and Time Domain Measurements Frequency (S-Parameter) Domain Procedures The quality of any data taken with a network analyzer is directly related to the quality of the calibration standards and the use of proper test procedures. For this reason, extreme care is taken in the design of the LRM calibration standards, the SI test boards, and the selection of the PCB vendor. The measurement process begins with a measurement of the LRM calibration standards. A coaxial SOLT calibration is performed using an N4433A ecal module. This measurement is required in order to obtain precise values of the line standard offset delay and frequency bandwidths. Measurements of the reflect and 2x through line standard can be used to determine the maximum frequency for which the calibration standards are valid. For the LSEM_DH/LSEM_DV Series test boards, this is greater than 20 GHz. From the LRM calibration standard measurements, a user defined calibration kit is developed and stored in the network analyzer. Calibration is then performed on all 4 ports following the calibration wizard within the Agilent N5230C. This calibration is saved and can be recalled at any time. Calibration takes roughly 30 minutes to perform. Time Domain Procedures Mathematically, Frequency Domain data can be transformed to obtain a Time Domain response. Perfect transformation requires Frequency Domain data from DC to infinity Hz. Fortunately, a very accurate Time Domain response can be obtained with bandwidth-limited data, such as measured with modern network analyzer. The Time Domain responses were generated using Agilent ADS 2011.10. This tool has a transient convolution simulator, which can generate a Time Domain response directly from measured S-Parameters. An example of a similar methodology is provided in the Samtec Technical Note on domain transformation. http://www.samtec.com/Technical_Library/reference/articles/pdfs/tech-note_usingPLTS-for-time-domain-data_web.pdf Impedance (TDR) A step pulse is applied to the touchstone model of the connector and the reflected voltage is monitored. The reflected voltage is converted to a reflection coefficient and then transformed into an impedance profile. All ports of the Touchstone model are terminated in 50 ohms. Samtec Inc. 520 Park East Blvd. New Albany IN 47151-1147 USA ©Samtec, Inc. 2005 WWW.SAMTEC.COM 1-800-SAMTEC-9 (US & Canada) [email protected] Page:46 Phone: 812-944-6733 Fax: 812-948-5047 Report Revision: 3/16/2012 All Rights Reserved High Speed Characterization Report Series: LSEM Description: Board-to-Board, 0.8mm (.0315”) Pitch, Right Angle to Vertical Orientation Propagation Delay (TDT) The Propagation Delay is a measure of the Time Domain delay through the connector and footprint. A step pulse is applied to the touchstone model of the connector and the transmitted voltage is monitored. The same pulse is also applied to a reference channel with zero loss, and the Time Domain pulses are plotted on the same graph. The difference in time, measured at the 50% point of the step voltage is the propagation delay. Near-End Crosstalk (TDT) & Far End Crosstalk (TDT) A step pulse is applied to the touchstone model of the connector and the coupled voltage is monitored. The amplitude of the peak-coupled voltage is recorded and reported as a percentage of the input pulse. Samtec Inc. 520 Park East Blvd. New Albany IN 47151-1147 USA ©Samtec, Inc. 2005 WWW.SAMTEC.COM 1-800-SAMTEC-9 (US & Canada) [email protected] Page:47 Phone: 812-944-6733 Fax: 812-948-5047 Report Revision: 3/16/2012 All Rights Reserved High Speed Characterization Report Series: LSEM Description: Board-to-Board, 0.8mm (.0315”) Pitch, Right Angle to Vertical Orientation Appendix F – Glossary of Terms ADS – Advanced Design Systems BC – Best Case crosstalk configuration DUT – Device under test, term used for TDA IConnect & Propagation Delay waveforms FD – Frequency domain FEXT – Far-End Crosstalk GSG – Ground–Signal-Ground; geometric configuration GSSG - Ground–Signal-Signal-Ground; geometric configuration HDV – High Density Vertical NEXT – Near-End Crosstalk OV – Optimal Vertical OH – Optimal Horizontal PCB – Printed Circuit Board PPO – Pin Population Option SE – Single-Ended SI – Signal Integrity SUT – System Under Test S – Static (independent of PCB ground) SOLT – acronym used to define Short, Open, Load & Thru Calibration Standards TD – Time Domain TDA – Time Domain Analysis TDR – Time Domain Reflectometry TDT – Time Domain Transmission WC – Worst Case crosstalk configuration Z – Impedance (expressed in ohms) Samtec Inc. 520 Park East Blvd. New Albany IN 47151-1147 USA ©Samtec, Inc. 2005 WWW.SAMTEC.COM 1-800-SAMTEC-9 (US & Canada) [email protected] Page:48 Phone: 812-944-6733 Fax: 812-948-5047 Report Revision: 3/16/2012 All Rights Reserved