High Speed Characterization Report QRF8-052-02.0-L-D-GP Mates with QRM8-052-01-L-RA-GP Description: Q RATE® High Speed Socket Strip Slim Body Ground Plane, 0.8mm Centerline, Vertical Socket to Right Angle Terminal Connection Samtec Inc. 520 Park East Blvd. New Albany IN 47151-1147 USA ©Samtec, Inc. 2005 WWW.SAMTEC.COM 1-800-SAMTEC-9 (US & Canada) [email protected] Phone: 812-944-6733 Fax: 812-948-5047 Report Revision: 7/21/2011 All Rights Reserved High Speed Characterization Report Series: Q RATE®, QRF8-DV / QRM8-RA Series Description: Slim Body, 0.8mm Centerline, Vertical Socket to RA Terminal Connection Table of Contents Connector Overview........................................................................................................ 1 Connector System Speed Rating .................................................................................... 1 Frequency Domain Data Summary ................................................................................. 2 Table 1 - Single-Ended Signaling System Performance (row 1) ................................. 2 Table 2 - Differential Signaling System Performance (row 1)...................................... 2 Table 3 - Single-Ended Signaling System Performance (row 2) ................................. 3 Table 4- Differential Signaling System Performance (row 2)....................................... 3 Bandwidth Chart – Single-Ended & Differential Insertion Loss ................................... 4 Row 1, long path ...................................................................................................... 4 Row 2, short path ..................................................................................................... 4 Time Domain Data Summary .......................................................................................... 5 Table 5 - Single-Ended Impedance (Ω) – (row 1) ....................................................... 5 Table 6 - Differential Impedance (Ω) - (row 1)............................................................. 5 Table 7 - Single-Ended Impedance (Ω) – (row 2) ....................................................... 6 Table 8 - Differential Impedance (Ω) – (row 2)............................................................ 6 Table 9 – Single-Ended Crosstalk (%), row 1 ............................................................. 7 Table 10 - Differential Crosstalk (%), row 1................................................................. 7 Table 11 – Single-Ended Crosstalk (%), row 2 ........................................................... 8 Table 12 – Differential Crosstalk (%), row 2................................................................ 8 Table 13 - Propagation Delay (row 1) ......................................................................... 9 Table 14 - Propagation Delay (row 2) ......................................................................... 9 Characterization Details ................................................................................................ 10 Differential and Single-Ended Data........................................................................... 10 Connector Signal to Ground Ratio ............................................................................ 10 Frequency Domain Data ........................................................................................... 12 Time Domain Data .................................................................................................... 13 Appendix A – Frequency Domain Response Graphs .................................................... 15 Row 1, Long Path ..................................................................................................... 15 Single-Ended Application – Insertion Loss................................................................ 15 Single-Ended Application – Return Loss................................................................... 15 Single-Ended Application – NEXT Configurations .................................................... 16 Single-Ended Application – FEXT Configurations..................................................... 16 Row 1, Long Path ..................................................................................................... 17 Differential Application – Insertion Loss .................................................................... 17 Differential Application – Return Loss ....................................................................... 17 Differential Application – NEXT Configurations......................................................... 18 Differential Application – FEXT Configurations ......................................................... 18 Row 2, Short Path..................................................................................................... 19 Samtec Inc. 520 Park East Blvd. New Albany IN 47151-1147 USA ©Samtec, Inc. 2005 WWW.SAMTEC.COM 1-800-SAMTEC-9 (US & Canada) [email protected] Page:ii Phone: 812-944-6733 Fax: 812-948-5047 Report Revision: 7/21/2011 All Rights Reserved High Speed Characterization Report Series: Q RATE®, QRF8-DV / QRM8-RA Series Description: Slim Body, 0.8mm Centerline, Vertical Socket to RA Terminal Connection Single-Ended Application – Insertion Loss................................................................ 19 Single-Ended Application – Return Loss................................................................... 19 Single-Ended Application – NEXT Configurations .................................................... 20 Single-Ended Application – FEXT Configurations..................................................... 20 Row 2, Short Path..................................................................................................... 21 Differential Application – Insertion Loss .................................................................... 21 Differential Application – Return Loss ....................................................................... 21 Differential Application – NEXT Configurations......................................................... 22 Differential Application – FEXT Configurations ......................................................... 22 Appendix B – Time Domain Response Graphs............................................................. 23 Row 1, Long Path ..................................................................................................... 23 Single-Ended Application – Input Pulse .................................................................... 23 Single-Ended Application – Impedance .................................................................... 24 Single-Ended Application – Propagation Delay......................................................... 24 Single-Ended Application – NEXT, “Worst Case” Configuration ............................... 25 Single-Ended Application – FEXT, “Worst Case” Configuration................................ 25 Single-Ended Application – NEXT, “Best Case” Configuration ................................. 26 Single-Ended Application – FEXT, “Best Case” Configuration.................................. 26 Single-Ended Application – NEXT, “Row 1 to Row 2” Configuration......................... 27 Single-Ended Application – FEXT, “Row 1 to Row 2” Configuration ......................... 27 Row 1, Long Path ..................................................................................................... 28 Differential Application – Input Pulse ........................................................................ 28 Differential Application – Impedance......................................................................... 29 Differential Application – Propagation Delay ............................................................. 29 Differential Application – NEXT, “Worst Case” Configuration.................................... 30 Differential Application – FEXT, “Worst Case” Configuration .................................... 30 Differential Application – NEXT, “Best Case” Configuration...................................... 31 Differential Application – FEXT, “Best Case” Configuration ...................................... 31 Differential Application – NEXT, “Row 1 to Row 2”Configuration .............................. 32 Differential Application – FEXT, “Row 1 to Row 2”Configuration .............................. 32 Row 2, Short Path..................................................................................................... 33 Single-Ended Application – Impedance .................................................................... 33 Single-Ended Application – Propagation Delay......................................................... 33 Single-Ended Application – NEXT, “Worst Case” Configuration ............................... 34 Single-Ended Application – FEXT, “Worst Case” Configuration................................ 34 Single-Ended Application – NEXT, “Best Case” Configuration ................................. 35 Single-Ended Application – FEXT, “Best Case” Configuration.................................. 35 Differential Application – Impedance......................................................................... 36 Differential Application – Propagation Delay ............................................................. 36 Differential Application – NEXT, “Worst Case” Configuration.................................... 37 Differential Application – FEXT, “Worst Case” Configuration .................................... 37 Samtec Inc. 520 Park East Blvd. New Albany IN 47151-1147 USA ©Samtec, Inc. 2005 WWW.SAMTEC.COM 1-800-SAMTEC-9 (US & Canada) [email protected] Page:iii Phone: 812-944-6733 Fax: 812-948-5047 Report Revision: 7/21/2011 All Rights Reserved High Speed Characterization Report Series: Q RATE®, QRF8-DV / QRM8-RA Series Description: Slim Body, 0.8mm Centerline, Vertical Socket to RA Terminal Connection Differential Application – NEXT, “Best Case” Configuration...................................... 38 Differential Application – FEXT, “Best Case” Configuration ...................................... 38 Appendix C – Product and Test System Descriptions ................................................... 39 Product Description................................................................................................... 39 Test System Description ........................................................................................... 39 PCB-102757-TST Test Fixtures, Row 1, Longer Terminal Contact .......................... 40 PCB-102757-TST- Test Fixtures, Row 2, Shorter Terminal Contact......................... 40 PCB-102757-TST, Set 11 & 12 Mapping .................................................................. 41 PCB-102757-TST, Set 21 & 22 Mapping .................................................................. 42 PCB-102757-TST, Set 31 & 32 Mapping .................................................................. 43 PCB-102757-TST, Set 41 & 42 Mapping .................................................................. 44 PCB101757-TST-CAL REV A................................................................................... 45 Appendix D – Test and Measurement Setup................................................................. 46 CSA8000/TDA IConnect Measurements Capability.................................................. 46 Horizontal Orientation Eight Channel 40 GHz Microprobe Setup.............................. 47 Test Instruments ....................................................................................................... 47 Measurement Station Accessories............................................................................ 47 Test Cables & Adapters ............................................................................................ 47 Appendix E - Frequency and Time Domain Measurements .......................................... 48 Sample Preparation .................................................................................................. 48 Frequency (S-Parameter) Domain Procedures......................................................... 48 CSA8000 Setup ..................................................................................................... 48 Insertion Loss (TDA conversion) ............................................................................ 49 Return Loss (TDA conversion) ............................................................................... 49 Near-End Crosstalk (TDA conversion) ................................................................... 50 Far-End Crosstalk (TDA conversion) ..................................................................... 50 Time Domain Procedures ......................................................................................... 51 Impedance (TDR)................................................................................................... 51 Propagation Delay (TDT) ....................................................................................... 51 Near-End Crosstalk (TDT) ..................................................................................... 51 Far-End Crosstalk (TDT)........................................................................................ 52 Appendix F – Glossary of Terms................................................................................... 53 Samtec Inc. 520 Park East Blvd. New Albany IN 47151-1147 USA ©Samtec, Inc. 2005 WWW.SAMTEC.COM 1-800-SAMTEC-9 (US & Canada) [email protected] Page:iv Phone: 812-944-6733 Fax: 812-948-5047 Report Revision: 7/21/2011 All Rights Reserved High Speed Characterization Report Series: Q RATE®, QRF8-DV / QRM8-RA Series Description: Slim Body, 0.8mm Centerline, Vertical Socket to RA Terminal Connection Connector Overview Q RATE® High Speed Socket and Terminal Strip with 0.8mm centerline and slim body ground plane. Socket and terminal strips are available up to 78 contacts per row. The QRF8/QRM8 series configuration styles include double row vertical and right angle selections of either gender. Data presented in this report is applicable only to a QRF8-DV socket strip connector mated with QRM8-RA right angle terminal strip connector. Connector System Speed Rating QRF8-DV / QRM8-RA Series, 0.8mm (0.0315”) Centerline, QRF8-DV double row vertical socket mated to a QRM8-RA right angle terminal connector Signaling Single-Ended: Differential: Speed Rating Long Path, Row 1 4.0 GHz / 8Gbps Short Path, Row 2 5.5 GHz / 11Gbps Long Path, Row 1 5.5 GHz / 11Gbps Short Path, Row 2 6.5 GHz / 13Gbps The Speed Rating is based on the -3 dB insertion loss point of the connector system. The -3 dB point can be used to estimate usable system bandwidth in a typical, two-level signaling environment. To calculate the Speed Rating, the measured -3 dB point is rounded-up to the nearest half-GHz level. The up rounding corrects for a portion of the test board’s trace loss, since trace losses are included in the loss data in this report. The resulting loss value is then doubled to determine the approximate maximum data rate in Gigabits per second (Gbps). For example, a connector with a -3 dB point of 7.8 GHz would have a Speed Rating of 8 GHz/ 16 Gbps. A connector with a -3 dB point of 7.2 GHz would have a Speed Rating of 7.5 GHz/15 Gbps. Samtec Inc. 520 Park East Blvd. New Albany IN 47151-1147 USA ©Samtec, Inc. 2005 WWW.SAMTEC.COM 1-800-SAMTEC-9 (US & Canada) [email protected] Page:1 Phone: 812-944-6733 Fax: 812-948-5047 Report Revision: 7/21/2011 All Rights Reserved High Speed Characterization Report Series: Q RATE®, QRF8-DV / QRM8-RA Series Description: Slim Body, 0.8mm Centerline, Vertical Socket to RA Terminal Connection Frequency Domain Data Summary ROW 1 – Long Path Table 1 - Single-Ended Signaling System Performance (row 1) Parameter Conf. Source Victim Insertion Loss sp57il probe 1=QRF8-DV_57, probe 3=QRM8-RA_57 -3dB @ 4.0 GHz Return Loss sp57rl probe 1=QRF8-DV_57, probe 3=QRM8-RA_57 ≤ -7dB to 4.0 GHz sp63N65 QRF8-DV_63 QRF8-DV_65 ≤ -6dB to 4.0 GHz sp57N61 QRF8-DV_57 QRF8-DV_61 ≤ -21dB to 4.0 GHz sp101N102 QRF8-DV_101 QRF8-DV_102 ≤ -21dB to 4.0 GHz sp63F65 QRF8-DV_63 QRM8-RA_65 ≤ -14dB to 4.0 GHz sp57F61 QRF8-DV_57 QRM8-RA_61 ≤ -19dB to 4.0 GHz sp101F102 QRF8-DV_101 QRM8-RA_102 ≤ -21dB to 4.0 GHz Near-End Crosstalk Far-End Crosstalk Table 2 - Differential Signaling System Performance (row 1) Parameter Conf. Source Victim Insertion Loss sp11-9il probe12=QRF8-DV_11-9, probe78=QRM8-RA_11-9, -3dB @ 5.1 GHz Return Loss sp11-9rl probe12=QRF8-DV_11-9, probe78=QRM8-RA_11-9, ≤ -5dB to 5.1 GHz sp11-9N15-13 QRF8-DV_11-9 QRF8-DV_15-13 ≤ -17dB to 5.1 GHz sp11-9N17-15 QRF8-DV_11-9 QRF8-DV_17-15 ≤ -37dB to 5.1 GHz sp101-99N102-100 QRF8-DV_101-99 QRF8-DV_102-100 ≤ -42B to 5.1 GHz sp11-9F15-13 QRF8-DV_11-9 QRM8-RA_15-13 ≤ -24dB to 5.1 GHz sp11-9F17-15 QRF8-DV_11-9 QRM8-RA_17-15 ≤ -31dB to 5.1 GHz sp101-99F102-100 QRF8-DV_101-99 QRM8-RA_102-100 ≤ -43dB to 5.1 GHz Near-End Crosstalk Far-End Crosstalk Samtec Inc. 520 Park East Blvd. New Albany IN 47151-1147 USA ©Samtec, Inc. 2005 WWW.SAMTEC.COM 1-800-SAMTEC-9 (US & Canada) [email protected] Page:2 Phone: 812-944-6733 Fax: 812-948-5047 Report Revision: 7/21/2011 All Rights Reserved High Speed Characterization Report Series: Q RATE®, QRF8-DV / QRM8-RA Series Description: Slim Body, 0.8mm Centerline, Vertical Socket to RA Terminal Connection ROW 2 – Short Path Table 3 - Single-Ended Signaling System Performance (row 2) Parameter Conf. Source Victim Insertion Loss sp80il probe 1=QRF8-DV_80, probe 3=QRM8-RA_80 -3dB @ 5.4 GHz Return Loss sp80rl probe 1=QRF8-DV_80, probe 3=QRM8-RA_80 ≤ -7dB to 5.4 GHz sp82N84 QRF8-DV_82 QRF8-DV_84 ≤ -8dB to 5.4 GHz sp80N84 QRF8-DV_80 QRF8-DV_84 ≤ -17dB to 5.4 GHz sp82F84 QRF8-DV_82 QRM8-RA_84 ≤ -11dB to 5.4 GHz sp80F84 QRF8-DV_80 QRM8-RA_84 ≤ -13dB to 5.4 GHz Near-End Crosstalk Far-End Crosstalk Table 4- Differential Signaling System Performance (row 2) Parameter Conf. Source Victim Insertion Loss sp22-20il probe12=QRF8-DV_22-20, probe78=QRM8-RA_22-20 -3dB @ 6.5 GHz Return Loss sp22-20rl probe12=QRF8-DV_22-20, probe78=QRM8-RA_22-20 ≤ -8dB to 6.5 GHz sp22-20N26-24 QRF8-DV_22-20 QRF8-DV_26-24 ≤ -19dB to 6.5 GHz sp22-20N28-26 QRF8-DV_22-20 QRF8-DV_28-26 ≤ -24dB to 6.5 GHz sp22-20F26-24 QRF8-DV_22-20 QRF8-RA_26-24 ≤ -23dB to 6.5 GHz sp22-20F28-26 QRF8-DV_22-20 QRM8-RA_28-26 ≤ -27dB to 6.5 GHz Near-End Crosstalk Far-End Crosstalk Samtec Inc. 520 Park East Blvd. New Albany IN 47151-1147 USA ©Samtec, Inc. 2005 WWW.SAMTEC.COM 1-800-SAMTEC-9 (US & Canada) [email protected] Page:3 Phone: 812-944-6733 Fax: 812-948-5047 Report Revision: 7/21/2011 All Rights Reserved High Speed Characterization Report Series: Q RATE®, QRF8-DV / QRM8-RA Series Description: Slim Body, 0.8mm Centerline, Vertical Socket to RA Terminal Connection Bandwidth Chart – Single-Ended & Differential Insertion Loss Row 1, long path PCB/Connector Test System Single-Ended & Differential Application QRF8-DV mated to QRM8-RA (row 1) 1 Insertion Loss (dB) 0 -1 -2 -3 -4 sp57il -5 sp11-9il -6 -7 -8 -9 0 1 2 3 4 5 6 Frequency (GHz) Row 2, short path PCB/Connector Test System Single-Ended & Differential Application QRF8-DV mated to QRM8-RA (row 2) 1 Insertion Loss (dB) 0 -1 -2 -3 sp80il sp22-20il -4 -5 -6 -7 -8 -9 0 1 2 3 4 Frequency (GHz) 5 6 Pin Map (reference Appendix C for full description of test boards) Samtec Inc. 520 Park East Blvd. New Albany IN 47151-1147 USA ©Samtec, Inc. 2005 WWW.SAMTEC.COM 1-800-SAMTEC-9 (US & Canada) [email protected] Page:4 Phone: 812-944-6733 Fax: 812-948-5047 Report Revision: 7/21/2011 All Rights Reserved High Speed Characterization Report Series: Q RATE®, QRF8-DV / QRM8-RA Series Description: Slim Body, 0.8mm Centerline, Vertical Socket to RA Terminal Connection Time Domain Data Summary ROW 1 – Long Path Table 5 - Single-Ended Impedance (Ω) – (row 1) Signal Risetime Maximum Impedance Minimum Impedance 35±5ps 50 ps 100 ps 250 ps 500 ps 750 ps 1 ns 61.3 60.3 58.3 53.3 51.7 51.2 51.0 40.4 45.3 48.6 48.9 49.5 49.5 49.5 Single Ended Application Im pedance vs. Risetim e Impedance (ohms) 80 70 60 maximum minimum 50 40 30 20 35 50 100 250 500 750 1000 Risetime (pSec) Table 6 - Differential Impedance (Ω) - (row 1) Signal Risetime Maximum Impedance Minimum Impedance 35±5ps 50 ps 100 ps 250 ps 500 ps 750 ps 1 ns 104.4 104.1 103.7 100.2 99.8 99.4 99.3 71.9 80.5 86.0 90.5 93.3 94.9 96.1 Impedance (ohms) Differential Application Im pedance vs. Risetim e 120 110 100 90 80 70 60 50 maximum minimum 35 50 100 250 500 750 1000 Risetime (pSec) Samtec Inc. 520 Park East Blvd. New Albany IN 47151-1147 USA ©Samtec, Inc. 2005 WWW.SAMTEC.COM 1-800-SAMTEC-9 (US & Canada) [email protected] Page:5 Phone: 812-944-6733 Fax: 812-948-5047 Report Revision: 7/21/2011 All Rights Reserved High Speed Characterization Report Series: Q RATE®, QRF8-DV / QRM8-RA Series Description: Slim Body, 0.8mm Centerline, Vertical Socket to RA Terminal Connection ROW 2 – Short Path Table 7 - Single-Ended Impedance (Ω) – (row 2) Signal Risetime Maximum Impedance Minimum Impedance 35±5ps 50 ps 100 ps 250 ps 500 ps 750 ps 1 ns 60.4 56.7 53.0 51.7 50.9 50.8 50.8 40.4 45.5 47.9 49.4 49.5 49.5 49.5 Single Ended Application Im pedance vs. Risetim e Impedance (ohms) 80 70 60 maximum minimum 50 40 30 20 35 50 100 250 500 750 1000 Risetime (pSec) Table 8 - Differential Impedance (Ω) – (row 2) Signal Risetime Maximum Impedance Minimum Impedance 35±5ps 50 ps 100 ps 250 ps 500 ps 750 ps 1 ns 105.2 104.2 103.8 100.8 100.6 100.3 100.2 73.6 80.6 85.2 89.8 94.1 95.5 96.5 Impedance (ohms) Differential Application Im pedance vs. Risetim e 120 110 100 90 maximum minimum 80 70 60 50 35 50 100 250 500 750 1000 Risetime (pSec) Samtec Inc. 520 Park East Blvd. New Albany IN 47151-1147 USA ©Samtec, Inc. 2005 WWW.SAMTEC.COM 1-800-SAMTEC-9 (US & Canada) [email protected] Page:6 Phone: 812-944-6733 Fax: 812-948-5047 Report Revision: 7/21/2011 All Rights Reserved High Speed Characterization Report Series: Q RATE®, QRF8-DV / QRM8-RA Series Description: Slim Body, 0.8mm Centerline, Vertical Socket to RA Terminal Connection Table 9 – Single-Ended Crosstalk (%), row 1 Source N E X T F E X T Victim 35± 5ps 50ps 100ps 250ps 500ps 750ps 1ns QRF8DV_63 QRF8DV_65 15.8 15.3 14.5 9.6 5.8 4.1 3.2 QRF8DV_57 QRF8DV_61 3.5 2.5 1.9 1.3 < 1.0% < 1.0% < 1.0% QRF8DV_101 QRF8DV_102 < 1.0% < 1.0% < 1.0% < 1.0% < 1.0% < 1.0% < 1.0% QRF8DV_63 QRM8RA_65 8.0 7.0 5.7 3.5 2.0 1.4 1.1 QRF8DV_57 QRM8RA_61 4.9 3.7 2.2 1.2 < 1.0% < 1.0% < 1.0% QRF8DV_101 QRM8RA_102 < 1.0% < 1.0% < 1.0% < 1.0% < 1.0% < 1.0% < 1.0% Table 10 - Differential Crosstalk (%), row 1 Source N E X T F E X T Victim 35± 5ps 50ps 100ps 250ps 500ps 750ps 1ns QRF8DV_11-9 QRF8DV_15-13 5.0 4.7 4.3 2.8 1.8 1.3 1.0 QRF8DV_11-9 QRF8DV_17-15 < 1.0% < 1.0% < 1.0% < 1.0% < 1.0% < 1.0% < 1.0% QRF8DV_101-99 QRF8DV_102-100 < 1.0% < 1.0% < 1.0% < 1.0% < 1.0% < 1.0% < 1.0% QRF8DV_11-9 QRM8RA_15-13 2.5 1.8 1.2 < 1.0% < 1.0% < 1.0% < 1.0% QRF8DV_11-9 QRM8RA_17-15 1.2 < 1.0% < 1.0% < 1.0% < 1.0% < 1.0% < 1.0% QRF8DV_101-99 QRM8RA_102-100 < 1.0% < 1.0% < 1.0% < 1.0% < 1.0% < 1.0% < 1.0% Samtec Inc. 520 Park East Blvd. New Albany IN 47151-1147 USA ©Samtec, Inc. 2005 WWW.SAMTEC.COM 1-800-SAMTEC-9 (US & Canada) [email protected] Page:7 Phone: 812-944-6733 Fax: 812-948-5047 Report Revision: 7/21/2011 All Rights Reserved High Speed Characterization Report Series: Q RATE®, QRF8-DV / QRM8-RA Series Description: Slim Body, 0.8mm Centerline, Vertical Socket to RA Terminal Connection Table 11 – Single-Ended Crosstalk (%), row 2 Source Victim 35± 5ps 50ps 100ps 250ps 500ps 750ps 1ns N E X T QRF8DV_82 QRF8DV_84 15.0 14.5 12.7 7.8 4.8 3.4 2.7 QRF8DV_80 QRF8DV_84 4.0 3.0 2.2 1.9 1.1 < 1.0% < 1.0% F E X T QRF8DV_82 QRM8RA_84 12.8 10.7 7.3 3.6 2.0 1.5 1.1 QRF8DV_80 QRM8RA_84 8.2 6.3 4.1 1.8 < 1.0% < 1.0% < 1.0% Table 12 – Differential Crosstalk (%), row 2 Source Victim 35± 5ps 50ps 100ps 250ps 500ps 750ps 1ns N E X T QRF8DV_22-20 QRF8DV_26-24 4.2 4.2 3.5 2.2 1.3 < 1.0% < 1.0% QRF8DV_22-20 QRF8DV_28-26 1.0 < 1.0% < 1.0% < 1.0% < 1.0% < 1.0% < 1.0% F E X T QRF8DV_22-20 QRF8RA_26-24 2.3 1.6 1.0 < 1.0% < 1.0% < 1.0% < 1.0% QRF8DV_22-20 QRM8RA_28-26 2.0 1.3 < 1.0% < 1.0% < 1.0% < 1.0% < 1.0% Samtec Inc. 520 Park East Blvd. New Albany IN 47151-1147 USA ©Samtec, Inc. 2005 WWW.SAMTEC.COM 1-800-SAMTEC-9 (US & Canada) [email protected] Page:8 Phone: 812-944-6733 Fax: 812-948-5047 Report Revision: 7/21/2011 All Rights Reserved High Speed Characterization Report Series: Q RATE®, QRF8-DV / QRM8-RA Series Description: Slim Body, 0.8mm Centerline, Vertical Socket to RA Terminal Connection Table 13 - Propagation Delay (row 1) Signal Configuration Mated Connector Only Single-Ended probe 1 = QRF8-DV_57, probe 3 = QRM8-RA_57 69 ps Differential probe 12 = QRF8-DV_11-9, probe 78 = QRF8-RA_11-9 59 ps Table 14 - Propagation Delay (row 2) Signal Configuration Mated Connector Only Single-Ended probe 1 = QRF8-DV_80, probe 3 = QRM8-RA_80 49 ps Differential probe 12 = QRF8-DV_22-20, probe 78 = QRF8-RA_22-20 45 ps Pin Map (reference Appendix C for full description of test boards) Samtec Inc. 520 Park East Blvd. New Albany IN 47151-1147 USA ©Samtec, Inc. 2005 WWW.SAMTEC.COM 1-800-SAMTEC-9 (US & Canada) [email protected] Page:9 Phone: 812-944-6733 Fax: 812-948-5047 Report Revision: 7/21/2011 All Rights Reserved High Speed Characterization Report Series: Q RATE®, QRF8-DV / QRM8-RA Series Description: Slim Body, 0.8mm Centerline, Vertical Socket to RA Terminal Connection Characterization Details This report presents data that characterizes the signal integrity response of a connector pair in a controlled printed circuit board (PCB) environment. All efforts are made to reveal typical best-case responses inherent to the system under test (SUT). In this report, the SUT includes the test PCB from drive side probe tip to receive side probe tip. PCB effects are not removed or de-embedded from test data. PCB designs with impedance mismatch, large losses, skew, cross talk, or similar impairments can have a significant impact on observed test data. Therefore, great design effort is put forth to limit these effects in the PCB utilized in these tests. Some board related effects, such as pad-to-ground capacitance and trace loss, are included in the data presented in this report. However, other effects, such as via coupling or stub resonance, are not evaluated here. Such effects are addressed and characterized fully by the Samtec Final Inch® products. Additionally, intermediate test signal connections can mask the connectors’ true performance. Such connection effects are minimized by using high performance test cables, adapters, and microwave probes. Where appropriate, calibration and deembedding routines are also used to reduce residual effects. Differential and Single-Ended Data Most Samtec connectors can be used successfully in both differential and single-ended applications. However, electrical performance will differ depending on the signal drive type. In this report, data is presented for both differential and single-ended drive scenarios. Connector Signal to Ground Ratio Samtec connectors are most often designed for generic applications, and can be implemented using various signal and ground pin assignments. In high-speed systems, provisions must be made in the interconnect for signal return currents. Such paths are often referred to as “ground”. In some connectors, a ground plane or blade, or an outer shield is used as the signal return, while in others; connector pins are used as signal returns. Various combinations of signal pins, ground blades, and shields can also be utilized. Electrical performance can vary significantly depending upon the number and location of ground pins. In general, the more pins dedicated to ground, the better electrical performance will be. However, dedicating pins to ground reduces signal density of a connector. Therefore, care must be taken when choosing signal/ground ratios in cost- or density-sensitive applications. Samtec Inc. 520 Park East Blvd. New Albany IN 47151-1147 USA ©Samtec, Inc. 2005 WWW.SAMTEC.COM 1-800-SAMTEC-9 (US & Canada) [email protected] Page:10 Phone: 812-944-6733 Fax: 812-948-5047 Report Revision: 7/21/2011 All Rights Reserved High Speed Characterization Report Series: Q RATE®, QRF8-DV / QRM8-RA Series Description: Slim Body, 0.8mm Centerline, Vertical Socket to RA Terminal Connection For this connector, the following array configurations are evaluated: open pin field P# X grounded pin field signal aggressor or signal victim pins Single-Ended Impedance: • Well-referenced line (reference 1:1), Single-Ended Crosstalk: • Well-referenced line; mimics 1:1 S:G ratio • 2:1 S:G ratio Only one single-ended signal was driven for crosstalk measurements. Samtec Inc. 520 Park East Blvd. New Albany IN 47151-1147 USA ©Samtec, Inc. 2005 WWW.SAMTEC.COM 1-800-SAMTEC-9 (US & Canada) [email protected] Page:11 Phone: 812-944-6733 Fax: 812-948-5047 Report Revision: 7/21/2011 All Rights Reserved High Speed Characterization Report Series: Q RATE®, QRF8-DV / QRM8-RA Series Description: Slim Body, 0.8mm Centerline, Vertical Socket to RA Terminal Connection Differential Impedance: • Well-referenced line (reference 1:1) Differential Crosstalk: • Well-referenced line; mimics 1:1 S:G ratio • Higher Signal Density • Full-Row Differential (2:1 S:G) Only one differential pair was driven for crosstalk measurements. *In all cases where a center ground blade is present in the connector, it is always grounded to the PCB. Only one single-ended signal or differential pair was driven for crosstalk measurements. Other configurations can be evaluated upon request. Please contact [email protected] for more information. In a real system environment, active signals might be located at the outer edges of the signal contacts of concern, as opposed to the ground signals utilized in laboratory testing. For example, in a single-ended system, a pin-out of “SSSS”, or four adjacent single ended signals, might be encountered, as opposed to the “GSG” and “GSSG” configurations tested in the laboratory. Electrical characteristics in such applications could vary slightly from laboratory results. However, in most applications, performance can safely be considered equivalent. Signal Edge Speed (Rise Time): In pulse signaling applications, the perceived performance of the interconnect, can vary significantly depending on the edge rate or rise time of the exciting signal. For this report, the fastest rise time used was 35 +/-5 ps. Generally, this should demonstrate worst-case performance. In many systems, the signal edge rate will be significantly slower at the connector than at the driver launch point. To estimate interconnect performance at other edge rates, data is provided for several rise times between 30 ps and 1.0 ns. For this report, measured rise times were at 10%-90% signal levels. Frequency Domain Data Frequency domain parameters are helpful in evaluating the connector system’s signal loss and crosstalk characteristics across a range of sinusoidal frequencies. In this reSamtec Inc. 520 Park East Blvd. New Albany IN 47151-1147 USA ©Samtec, Inc. 2005 WWW.SAMTEC.COM 1-800-SAMTEC-9 (US & Canada) [email protected] Page:12 Phone: 812-944-6733 Fax: 812-948-5047 Report Revision: 7/21/2011 All Rights Reserved High Speed Characterization Report Series: Q RATE®, QRF8-DV / QRM8-RA Series Description: Slim Body, 0.8mm Centerline, Vertical Socket to RA Terminal Connection port, parameters presented in the frequency domain are insertion loss, return loss, and near-end and far-end crosstalk. Other parameters or formats, such as VSWR or Sparameters, may be available upon request. Please contact our Signal Integrity Group at [email protected] for more information. Frequency performance characteristics for the SUT are generated from time domain measurements using Fourier Transform calculations. Procedures and methods used in generating the SUT’s frequency domain data are provided in the frequency domain test procedures in Appendix E of this report. Time Domain Data Time Domain parameters indicate impedance mismatch versus length, signal propagation time, and crosstalk in a pulsed signal environment. Time Domain data is provided in Appendix E of this report. Parameters or formats not included in this report may be available upon request. Please contact our Signal Integrity Group at [email protected] for more information. Reference plane impedance is 50 ohms for single-ended measurements and 100 ohms for differential measurements. The fastest risetime signal exciting the SUT is 35 ± 5 picoseconds. In this report, propagation delay is defined as the signal propagation time through the PCB connector pads and connector pair. It does not include PCB traces. Delay is measured at 35 ± 5 picoseconds signal risetime. Delay is calculated as the difference in time measured between the 50% amplitude levels of the input and output pulses. Crosstalk or coupled noise data is provided for various signal configurations. All measurements are single disturber. Crosstalk is calculated as a ratio of the input line voltage to the coupled line voltage. The input line is sometimes described as the active or drive line. The coupled line is sometimes described as the quiet or victim line. Crosstalk ratio is tabulated in this report as a percentage. Measurements are made at both the nearend and far-end of the SUT. Data for other configurations may be available. Please contact our Signal Integrity Group at [email protected] for further information. As a rule of thumb, 10% crosstalk levels are often used as a general first pass limit for determining acceptable interconnect performance. But modern system crosstalk tolerance can vary greatly. For advice on connector suitability for specific applications, please contact our Signal Integrity Group at [email protected]. Samtec Inc. 520 Park East Blvd. New Albany IN 47151-1147 USA ©Samtec, Inc. 2005 WWW.SAMTEC.COM 1-800-SAMTEC-9 (US & Canada) [email protected] Page:13 Phone: 812-944-6733 Fax: 812-948-5047 Report Revision: 7/21/2011 All Rights Reserved High Speed Characterization Report Series: Q RATE®, QRF8-DV / QRM8-RA Series Description: Slim Body, 0.8mm Centerline, Vertical Socket to RA Terminal Connection Additional information concerning test conditions and procedures is located in the appendices of this report. Further information may be obtained by contacting our Signal Integrity Group at [email protected]. Samtec Inc. 520 Park East Blvd. New Albany IN 47151-1147 USA ©Samtec, Inc. 2005 WWW.SAMTEC.COM 1-800-SAMTEC-9 (US & Canada) [email protected] Page:14 Phone: 812-944-6733 Fax: 812-948-5047 Report Revision: 7/21/2011 All Rights Reserved High Speed Characterization Report Series: Q RATE®, QRF8-DV / QRM8-RA Series Description: Slim Body, 0.8mm Centerline, Vertical Socket to RA Terminal Connection Appendix A – Frequency Domain Response Graphs Row 1, Long Path Single-Ended Application – Insertion Loss Configuration: probe 1 = QRF8-DV_57, probe 3 = QRM8-RA_57 PCB/Connector Test System Single Ended Application QRF8-DV mated to QRM8-RA (row 1) Insertion Loss(dB) 1 0 -1 -2 -3 -4 -5 sp57il -6 -7 -8 -9 0 1 2 3 4 Frequency (GHz) Single-Ended Application – Return Loss Configuration: probe 1 = QRF8-DV_57, probe 3 = QRM8-RA_57 PCB/Connector Test System Single Ended Application QRF8-DV mated to QRM8-RA (row 1) 0 Return Loss (dB) -10 -20 -30 -40 sp57rl -50 -60 -70 -80 0 1 2 3 4 Frequency (GHz) Samtec Inc. 520 Park East Blvd. New Albany IN 47151-1147 USA ©Samtec, Inc. 2005 WWW.SAMTEC.COM 1-800-SAMTEC-9 (US & Canada) [email protected] Page:15 Phone: 812-944-6733 Fax: 812-948-5047 Report Revision: 7/21/2011 All Rights Reserved High Speed Characterization Report Series: Q RATE®, QRF8-DV / QRM8-RA Series Description: Slim Body, 0.8mm Centerline, Vertical Socket to RA Terminal Connection Single-Ended Application – NEXT Configurations worse case best case row 1 to 2 QRF8-DV_63 QRF8-DV_57 QRF8-DV_101 QRF8-DV_65 QRF8-DV_61 QRF8-DV_102 Near-End Crosstalk (dB) PCB/Connector Test System Single Ended Application QRF8-DV mated to QRM8-RA (row 1) 0 -10 -20 -30 -40 -50 -60 -70 -80 -90 -100 sp63N65 sp57N61 sp101N102 0 1 2 3 4 Frequency (GHz) Single-Ended Application – FEXT Configurations worse case best case row 1 to 2 QRF8-DV_63 QRF8-DV_57 QRF8-DV_101 QRM8-RA_65 QRM8-RA_61 QRM8-RA_102 PCB/Connector Test System Single Ended Application QRF8-DV mated to QRM8-RA (row 1) Far-End Crosstalk (dB) 0 -10 -20 -30 -40 -50 -60 sp63F65 sp57F61 sp101F102 -70 -80 -90 -100 0 1 2 3 4 Frequency (GHz) Samtec Inc. 520 Park East Blvd. New Albany IN 47151-1147 USA ©Samtec, Inc. 2005 WWW.SAMTEC.COM 1-800-SAMTEC-9 (US & Canada) [email protected] Page:16 Phone: 812-944-6733 Fax: 812-948-5047 Report Revision: 7/21/2011 All Rights Reserved High Speed Characterization Report Series: Q RATE®, QRF8-DV / QRM8-RA Series Description: Slim Body, 0.8mm Centerline, Vertical Socket to RA Terminal Connection Row 1, Long Path Differential Application – Insertion Loss Configuration: probe 12 = QRF8-DV_11-9, probe 78 = QRF8-RA_11-9 PCB/Connector Test System Differential Application QRF8-DV mated to QRM8-RA (row 1) Insertion Loss (dB) 1 0 -1 -2 -3 -4 -5 -6 -7 sp11-9il -8 -9 0 1 2 3 4 5 Frequency (GHz) Differential Application – Return Loss Configuration: probe 12 = QRF8-DV_11-9, probe 78 = QRF8-RA_11-9 PCB/Connector Test System Differential Application QRF8-DV mated to QRM8-RA (row 1) 0 -10 Return Loss (dB) -20 -30 sp11-9rl -40 -50 -60 -70 -80 0 Samtec Inc. 520 Park East Blvd. New Albany IN 47151-1147 USA ©Samtec, Inc. 2005 1 2Frequency 3(GHz) 4 WWW.SAMTEC.COM 1-800-SAMTEC-9 (US & Canada) [email protected] Page:17 5 Phone: 812-944-6733 Fax: 812-948-5047 Report Revision: 7/21/2011 All Rights Reserved High Speed Characterization Report Series: Q RATE®, QRF8-DV / QRM8-RA Series Description: Slim Body, 0.8mm Centerline, Vertical Socket to RA Terminal Connection Differential Application – NEXT Configurations worse case best case row 1 to 2 QRF8-DV_11-9 QRF8-DV_11-9 QRF8-DV_101-99 QRF8-DV_15-13 QRF8-DV_17-15 QRF8-DV_102-100 Near-End Crosstalk (dB) PCB/Connector Test System Differential Application QRF8-DV mated to QRM8-RA (row 1) 0 -10 -20 -30 -40 -50 -60 -70 -80 -90 -100 sp11-9N15-13 sp11-9N17-15 sp101-99N102-100 0 1 2 3 4 5 Frequency (GHz) Differential Application – FEXT Configurations worse case best case row 1 to 2 QRF8-DV_11-9 QRF8-DV_11-9 QRF8-DV_101-99 QRM8-RA_15-13 QRM8-RA_17-15 QRM8-RA_102-100 Far-End Crosstalk (dB) PCB/Connector Test System Differential Application QRF8-DV mated to QRM8-RA (row 1) 0 -10 -20 -30 -40 -50 -60 -70 -80 -90 -100 sp11-9F15-13 sp11-9F17-15 sp101-99F102-100 0 1 2 3 4 5 Frequency (GHz) Samtec Inc. 520 Park East Blvd. New Albany IN 47151-1147 USA ©Samtec, Inc. 2005 WWW.SAMTEC.COM 1-800-SAMTEC-9 (US & Canada) [email protected] Page:18 Phone: 812-944-6733 Fax: 812-948-5047 Report Revision: 7/21/2011 All Rights Reserved High Speed Characterization Report Series: Q RATE®, QRF8-DV / QRM8-RA Series Description: Slim Body, 0.8mm Centerline, Vertical Socket to RA Terminal Connection Row 2, Short Path Single-Ended Application – Insertion Loss Configuration: probe 1 = QRF8-DV_80, probe 3 = QRM8-RA_80 PCB/Connector Test System Single Ended Application QRF8-DV mated to QRM8-RA (row 2) Insertion Loss(dB) 1 0 -1 -2 -3 -4 -5 sp80il -6 -7 -8 -9 0 1 2 3 4 5 Frequency (GHz) Single-Ended Application – Return Loss Configuration: probe 1 = QRF8-DV_80, probe 3 = QRM8-RA_80 PCB/Connector Test System Single Ended Application QRF8-DV mated to QRM8-RA (row 2) 0 Return Loss (dB) -10 -20 -30 -40 sp80rl -50 -60 -70 -80 0 1 2 3 4 5 Frequency (GHz) Samtec Inc. 520 Park East Blvd. New Albany IN 47151-1147 USA ©Samtec, Inc. 2005 WWW.SAMTEC.COM 1-800-SAMTEC-9 (US & Canada) [email protected] Page:19 Phone: 812-944-6733 Fax: 812-948-5047 Report Revision: 7/21/2011 All Rights Reserved High Speed Characterization Report Series: Q RATE®, QRF8-DV / QRM8-RA Series Description: Slim Body, 0.8mm Centerline, Vertical Socket to RA Terminal Connection Single-Ended Application – NEXT Configurations worse case best case QRF8-DV_82 QRF8-DV_80 QRF8-DV_84 QRF8-DV_84 Near-End Crosstalk (dB) PCB/Connector Test System Single Ended Application QRF8-DV mated to QRM8-RA (row 2) 0 -10 -20 -30 -40 -50 -60 -70 -80 -90 -100 sp82N84 sp80N84 0 1 2 3 4 5 Frequency (GHz) Single-Ended Application – FEXT Configurations worse case best case QRF8-DV_82 QRF8-DV_80 QRM8-RA_84 QRM8-RA_84 PCB/Connector Test System Single Ended Application QRF8-DV mated to QRM8-RA (row 2) Far-End Crosstalk (dB) 0 -10 -20 -30 -40 -50 -60 sp82F84 sp80F84 -70 -80 -90 -100 0 1 2 3 4 5 Frequency (GHz) Samtec Inc. 520 Park East Blvd. New Albany IN 47151-1147 USA ©Samtec, Inc. 2005 WWW.SAMTEC.COM 1-800-SAMTEC-9 (US & Canada) [email protected] Page:20 Phone: 812-944-6733 Fax: 812-948-5047 Report Revision: 7/21/2011 All Rights Reserved High Speed Characterization Report Series: Q RATE®, QRF8-DV / QRM8-RA Series Description: Slim Body, 0.8mm Centerline, Vertical Socket to RA Terminal Connection Row 2, Short Path Differential Application – Insertion Loss Configuration: probe 12 = QRF8-DV_22-20, probe 78 = QRF8-RA_22-20 PCB/Connector Test System Differential Application QRF8-DV mated to QRM8-RA (row 2) Insertion Loss (dB) 1 0 -1 -2 -3 -4 -5 -6 -7 sp22-20il -8 -9 0 1 2 3 4 5 6 Frequency (GHz) Differential Application – Return Loss Configuration: probe 12 = QRF8-DV_22-20, probe 78 = QRF8-RA_22-20 PCB/Connector Test System Differential Application QRF8-DV mated to QRM8-RA (row 2) 0 -10 Return Loss (dB) -20 -30 -40 sp22-20rl -50 -60 -70 -80 0 Samtec Inc. 520 Park East Blvd. New Albany IN 47151-1147 USA ©Samtec, Inc. 2005 1 2 3 4 Frequency (GHz) 5 WWW.SAMTEC.COM 1-800-SAMTEC-9 (US & Canada) [email protected] Page:21 6 Phone: 812-944-6733 Fax: 812-948-5047 Report Revision: 7/21/2011 All Rights Reserved High Speed Characterization Report Series: Q RATE®, QRF8-DV / QRM8-RA Series Description: Slim Body, 0.8mm Centerline, Vertical Socket to RA Terminal Connection Differential Application – NEXT Configurations worse case best case QRF8-DV_22-20 QRF8-DV_22-20 QRF8-DV_26-24 QRF8-DV_28-26 Near-End Crosstalk (dB) PCB/Connector Test System Differential Application QRF8-DV mated to QRM8-RA (row 2) 0 -10 -20 -30 -40 -50 -60 -70 -80 -90 -100 sp22-20N26-24 sp22-20N28-26 0 1 2 3 4 5 6 Frequency (GHz) Differential Application – FEXT Configurations worse case best case QRF8-DV_22-20 QRF8-DV_22-20 QRF8-RA_26-24 QRM8-RA_28-26 Far-End Crosstalk (dB) PCB/Connector Test System Differential Application QRF8-DV mated to QRM8-RA (row 2) 0 -10 -20 -30 -40 -50 -60 -70 -80 -90 -100 sp22-20F26-24 sp22-20F28-26 0 1 2 3 4 5 6 Frequency (GHz) Samtec Inc. 520 Park East Blvd. New Albany IN 47151-1147 USA ©Samtec, Inc. 2005 WWW.SAMTEC.COM 1-800-SAMTEC-9 (US & Canada) [email protected] Page:22 Phone: 812-944-6733 Fax: 812-948-5047 Report Revision: 7/21/2011 All Rights Reserved High Speed Characterization Report Series: Q RATE®, QRF8-DV / QRM8-RA Series Description: Slim Body, 0.8mm Centerline, Vertical Socket to RA Terminal Connection Appendix B – Time Domain Response Graphs Row 1, Long Path Single-Ended Application – Input Pulse Samtec Inc. 520 Park East Blvd. New Albany IN 47151-1147 USA ©Samtec, Inc. 2005 WWW.SAMTEC.COM 1-800-SAMTEC-9 (US & Canada) [email protected] Page:23 Phone: 812-944-6733 Fax: 812-948-5047 Report Revision: 7/21/2011 All Rights Reserved High Speed Characterization Report Series: Q RATE®, QRF8-DV / QRM8-RA Series Description: Slim Body, 0.8mm Centerline, Vertical Socket to RA Terminal Connection Single-Ended Application – Impedance Configuration: probe 1 = QRF8-DV_57, probe 3 = QRM8-RA_57 Single-Ended Application – Propagation Delay Configuration: probe 1 = QRF8-DV_57, probe 3 = QRM8-RA_57 Samtec Inc. 520 Park East Blvd. New Albany IN 47151-1147 USA ©Samtec, Inc. 2005 WWW.SAMTEC.COM 1-800-SAMTEC-9 (US & Canada) [email protected] Page:24 Phone: 812-944-6733 Fax: 812-948-5047 Report Revision: 7/21/2011 All Rights Reserved High Speed Characterization Report Series: Q RATE®, QRF8-DV / QRM8-RA Series Description: Slim Body, 0.8mm Centerline, Vertical Socket to RA Terminal Connection Single-Ended Application – NEXT, “Worst Case” Configuration QRF8-DV_63 QRF8-DV_65 Single-Ended Application – FEXT, “Worst Case” Configuration QRF8-DV_63 QRM8-RA_65 Samtec Inc. 520 Park East Blvd. New Albany IN 47151-1147 USA ©Samtec, Inc. 2005 WWW.SAMTEC.COM 1-800-SAMTEC-9 (US & Canada) [email protected] Page:25 Phone: 812-944-6733 Fax: 812-948-5047 Report Revision: 7/21/2011 All Rights Reserved High Speed Characterization Report Series: Q RATE®, QRF8-DV / QRM8-RA Series Description: Slim Body, 0.8mm Centerline, Vertical Socket to RA Terminal Connection Single-Ended Application – NEXT, “Best Case” Configuration QRF8-DV_57 QRF8-DV_61 Single-Ended Application – FEXT, “Best Case” Configuration QRF8-DV_57 QRM8-RA_61 Samtec Inc. 520 Park East Blvd. New Albany IN 47151-1147 USA ©Samtec, Inc. 2005 WWW.SAMTEC.COM 1-800-SAMTEC-9 (US & Canada) [email protected] Page:26 Phone: 812-944-6733 Fax: 812-948-5047 Report Revision: 7/21/2011 All Rights Reserved High Speed Characterization Report Series: Q RATE®, QRF8-DV / QRM8-RA Series Description: Slim Body, 0.8mm Centerline, Vertical Socket to RA Terminal Connection Single-Ended Application – NEXT, “Row 1 to Row 2” Configuration QRF8-DV_101 QRF8-DV_102 Single-Ended Application – FEXT, “Row 1 to Row 2” Configuration QRF8-DV_101 QRM8-RA_102 Samtec Inc. 520 Park East Blvd. New Albany IN 47151-1147 USA ©Samtec, Inc. 2005 WWW.SAMTEC.COM 1-800-SAMTEC-9 (US & Canada) [email protected] Page:27 Phone: 812-944-6733 Fax: 812-948-5047 Report Revision: 7/21/2011 All Rights Reserved High Speed Characterization Report Series: Q RATE®, QRF8-DV / QRM8-RA Series Description: Slim Body, 0.8mm Centerline, Vertical Socket to RA Terminal Connection Row 1, Long Path Differential Application – Input Pulse Samtec Inc. 520 Park East Blvd. New Albany IN 47151-1147 USA ©Samtec, Inc. 2005 WWW.SAMTEC.COM 1-800-SAMTEC-9 (US & Canada) [email protected] Page:28 Phone: 812-944-6733 Fax: 812-948-5047 Report Revision: 7/21/2011 All Rights Reserved High Speed Characterization Report Series: Q RATE®, QRF8-DV / QRM8-RA Series Description: Slim Body, 0.8mm Centerline, Vertical Socket to RA Terminal Connection Differential Application – Impedance Configuration: probe 12 = QRF8-DV_11-9, probe 78 = QRF8-RA_11-9 Differential Application – Propagation Delay Configuration: probe 12 = QRF8-DV_11-9, probe 78 = QRF8-RA_11-9 Samtec Inc. 520 Park East Blvd. New Albany IN 47151-1147 USA ©Samtec, Inc. 2005 WWW.SAMTEC.COM 1-800-SAMTEC-9 (US & Canada) [email protected] Page:29 Phone: 812-944-6733 Fax: 812-948-5047 Report Revision: 7/21/2011 All Rights Reserved High Speed Characterization Report Series: Q RATE®, QRF8-DV / QRM8-RA Series Description: Slim Body, 0.8mm Centerline, Vertical Socket to RA Terminal Connection Differential Application – NEXT, “Worst Case” Configuration QRF8-DV_11-9 QRF8-DV_15-13 Differential Application – FEXT, “Worst Case” Configuration QRF8-DV_11-9 QRM8-RA_15-13 Samtec Inc. 520 Park East Blvd. New Albany IN 47151-1147 USA ©Samtec, Inc. 2005 WWW.SAMTEC.COM 1-800-SAMTEC-9 (US & Canada) [email protected] Page:30 Phone: 812-944-6733 Fax: 812-948-5047 Report Revision: 7/21/2011 All Rights Reserved High Speed Characterization Report Series: Q RATE®, QRF8-DV / QRM8-RA Series Description: Slim Body, 0.8mm Centerline, Vertical Socket to RA Terminal Connection Differential Application – NEXT, “Best Case” Configuration QRF8-DV_11-9 QRF8-DV_17-15 Differential Application – FEXT, “Best Case” Configuration QRF8-DV_11-9 QRM8-RA_17-15 Samtec Inc. 520 Park East Blvd. New Albany IN 47151-1147 USA ©Samtec, Inc. 2005 WWW.SAMTEC.COM 1-800-SAMTEC-9 (US & Canada) [email protected] Page:31 Phone: 812-944-6733 Fax: 812-948-5047 Report Revision: 7/21/2011 All Rights Reserved High Speed Characterization Report Series: Q RATE®, QRF8-DV / QRM8-RA Series Description: Slim Body, 0.8mm Centerline, Vertical Socket to RA Terminal Connection Differential Application – NEXT, “Row 1 to Row 2”Configuration QRF8-DV_101-99 QRF8-DV_101-99 Differential Application – FEXT, “Row 1 to Row 2”Configuration QRF8-DV_101-99 QRM8-RA_102-100 Samtec Inc. 520 Park East Blvd. New Albany IN 47151-1147 USA ©Samtec, Inc. 2005 WWW.SAMTEC.COM 1-800-SAMTEC-9 (US & Canada) [email protected] Page:32 Phone: 812-944-6733 Fax: 812-948-5047 Report Revision: 7/21/2011 All Rights Reserved High Speed Characterization Report Series: Q RATE®, QRF8-DV / QRM8-RA Series Description: Slim Body, 0.8mm Centerline, Vertical Socket to RA Terminal Connection Row 2, Short Path Single-Ended Application – Impedance Configuration: probe 1 = QRF8-DV_80, probe 3 = QRM8-RA_80 Single-Ended Application – Propagation Delay Configuration: probe 1 = QRF8-DV_80, probe 3 = QRM8-RA_80 Samtec Inc. 520 Park East Blvd. New Albany IN 47151-1147 USA ©Samtec, Inc. 2005 WWW.SAMTEC.COM 1-800-SAMTEC-9 (US & Canada) [email protected] Page:33 Phone: 812-944-6733 Fax: 812-948-5047 Report Revision: 7/21/2011 All Rights Reserved High Speed Characterization Report Series: Q RATE®, QRF8-DV / QRM8-RA Series Description: Slim Body, 0.8mm Centerline, Vertical Socket to RA Terminal Connection Single-Ended Application – NEXT, “Worst Case” Configuration QRF8-DV_82 QRF8-DV_84 Single-Ended Application – FEXT, “Worst Case” Configuration QRF8-DV_82 QRM8-RA_84 Samtec Inc. 520 Park East Blvd. New Albany IN 47151-1147 USA ©Samtec, Inc. 2005 WWW.SAMTEC.COM 1-800-SAMTEC-9 (US & Canada) [email protected] Page:34 Phone: 812-944-6733 Fax: 812-948-5047 Report Revision: 7/21/2011 All Rights Reserved High Speed Characterization Report Series: Q RATE®, QRF8-DV / QRM8-RA Series Description: Slim Body, 0.8mm Centerline, Vertical Socket to RA Terminal Connection Single-Ended Application – NEXT, “Best Case” Configuration QRF8-DV_80 QRF8-DV_84 Single-Ended Application – FEXT, “Best Case” Configuration QRF8-DV_80 QRM8-RA_84 Samtec Inc. 520 Park East Blvd. New Albany IN 47151-1147 USA ©Samtec, Inc. 2005 WWW.SAMTEC.COM 1-800-SAMTEC-9 (US & Canada) [email protected] Page:35 Phone: 812-944-6733 Fax: 812-948-5047 Report Revision: 7/21/2011 All Rights Reserved High Speed Characterization Report Series: Q RATE®, QRF8-DV / QRM8-RA Series Description: Slim Body, 0.8mm Centerline, Vertical Socket to RA Terminal Connection Row 2, Short Path Differential Application – Impedance Configuration: probe 12 = QRF8-DV_22-20, probe 78 = QRF8-RA_22-20 Differential Application – Propagation Delay Configuration: probe 12 = QRF8-DV_22-20, probe 78 = QRF8-RA_22-20 Samtec Inc. 520 Park East Blvd. New Albany IN 47151-1147 USA ©Samtec, Inc. 2005 WWW.SAMTEC.COM 1-800-SAMTEC-9 (US & Canada) [email protected] Page:36 Phone: 812-944-6733 Fax: 812-948-5047 Report Revision: 7/21/2011 All Rights Reserved High Speed Characterization Report Series: Q RATE®, QRF8-DV / QRM8-RA Series Description: Slim Body, 0.8mm Centerline, Vertical Socket to RA Terminal Connection Differential Application – NEXT, “Worst Case” Configuration QRF8-DV_22-20 QRF8-DV_26-24 Differential Application – FEXT, “Worst Case” Configuration QRF8-DV_22-20 QRF8-RA_26-24 Samtec Inc. 520 Park East Blvd. New Albany IN 47151-1147 USA ©Samtec, Inc. 2005 WWW.SAMTEC.COM 1-800-SAMTEC-9 (US & Canada) [email protected] Page:37 Phone: 812-944-6733 Fax: 812-948-5047 Report Revision: 7/21/2011 All Rights Reserved High Speed Characterization Report Series: Q RATE®, QRF8-DV / QRM8-RA Series Description: Slim Body, 0.8mm Centerline, Vertical Socket to RA Terminal Connection Differential Application – NEXT, “Best Case” Configuration QRF8-DV_22-20 QRF8-DV_28-26 Differential Application – FEXT, “Best Case” Configuration QRF8-DV_22-20 QRM8-RA_28-26 Samtec Inc. 520 Park East Blvd. New Albany IN 47151-1147 USA ©Samtec, Inc. 2005 WWW.SAMTEC.COM 1-800-SAMTEC-9 (US & Canada) [email protected] Page:38 Phone: 812-944-6733 Fax: 812-948-5047 Report Revision: 7/21/2011 All Rights Reserved High Speed Characterization Report Series: Q RATE®, QRF8-DV / QRM8-RA Series Description: Slim Body, 0.8mm Centerline, Vertical Socket to RA Terminal Connection Appendix C – Product and Test System Descriptions Product Description Product test samples are Q RATE® series vertical socket style QRF8-052-02.0-L-D-GP and the right angle terminal style QRM8-052-01-L-RA-GP. Vertical socket style and right angle terminal style are SMT. Right angle surface mount designs force the top row terminals to have a longer electrical length than those of the bottom row; hence, electrical characteristics between the short row and longer row are characterized. When mated the connectors are probed at a right angle orientation. The sample connector density is two rows of 26 contact terminals in a two-bank plastic connector structure. Centerline spacing between each contact is 0.8mm (.0315”). Test System Description The test fixtures are composed of 4-layer FR-4 material with 50Ω and100Ω signal trace and pad configurations designed for the electrical characterization of Samtec Hi-Speed connector products. Instructions for mating test fixtures appear in the table below. Printed Circuit Board Fixture Identification PCB-102757-TST-11, worst case mates with PCB-102757-TST-12, worst case PCB-102757-TST-21, best case mates with PCB-102757-TST-22, best case PCB-102757-TST-31, worst case mates with PCB-102757-TST-32, worst case PCB-102757-TST-41, best case mates with PCB-102757-TST-42, best case S-parameter and time domain data is available from a socket side launch. Data contained within this report comes from one of the two socket paths measured. Electrical continuity exists between like labeled test points when mated as designated. Reference plane and calibration standards are located on PCB102757-TST-CAL REV A. Samtec Inc. 520 Park East Blvd. New Albany IN 47151-1147 USA ©Samtec, Inc. 2005 WWW.SAMTEC.COM 1-800-SAMTEC-9 (US & Canada) [email protected] Page:39 Phone: 812-944-6733 Fax: 812-948-5047 Report Revision: 7/21/2011 All Rights Reserved High Speed Characterization Report Series: Q RATE®, QRF8-DV / QRM8-RA Series Description: Slim Body, 0.8mm Centerline, Vertical Socket to RA Terminal Connection PCB-102757-TST Test Fixtures, Row 1, Longer Terminal Contact PCB-102757-TST- Test Fixtures, Row 2, Shorter Terminal Contact Samtec Inc. 520 Park East Blvd. New Albany IN 47151-1147 USA ©Samtec, Inc. 2005 WWW.SAMTEC.COM 1-800-SAMTEC-9 (US & Canada) [email protected] Page:40 Phone: 812-944-6733 Fax: 812-948-5047 Report Revision: 7/21/2011 All Rights Reserved High Speed Characterization Report Series: Q RATE®, QRF8-DV / QRM8-RA Series Description: Slim Body, 0.8mm Centerline, Vertical Socket to RA Terminal Connection PCB-102757-TST, Set 11 & 12 Mapping Fixture Test Points – QRF8-DV/QRM8-RA µProbe Test Board, Worst Case PCB-102757-TST-21 Rev Socket: QRF8-052-02.0-L-D-GP Board No. PCB-102757-TST-22 Rev Terminal: QRM8-052-01-L-RA-GP Crosstalk Frequency & Time Domain Response Parameters, NEXT, FEXT Signal Type Differential SingleEnded Sig. to Gnd. Case1 2:1, S:G Case 1 2:1, S:G Samtec Inc. 520 Park East Blvd. New Albany IN 47151-1147 USA ©Samtec, Inc. 2005 Near-End Aggressor: Far-End Aggressor: Near-End Aggressor: Far-End Aggressor: QRF8-DV_22-20 QRF8-DV _22-20 QRF8-DV_82 QRF8-DV _82 WWW.SAMTEC.COM 1-800-SAMTEC-9 (US & Canada) [email protected] Page:41 Victim: Victim: Victim: Victim: QRF8-DV_26-24 QRM8-RA_26-24 QRF8-DV_84 QRM8-RA_84 Phone: 812-944-6733 Fax: 812-948-5047 Report Revision: 7/21/2011 All Rights Reserved High Speed Characterization Report Series: Q RATE®, QRF8-DV / QRM8-RA Series Description: Slim Body, 0.8mm Centerline, Vertical Socket to RA Terminal Connection PCB-102757-TST, Set 21 & 22 Mapping Fixture Test Points – QRF8-DV/QRM8-RA µProbe Test Board, Worst Case PCB-102757-TST-21 Rev Socket: QRF8-052-02.0-L-D-GP Board No. PCB-102757-TST-22 Rev Terminal: QRM8-052-01-L-RA-GP Transmission and Reflection Test Parameters: Insertion Loss, Return Loss, Impedance, Propagation Delay Differential: Single-Ended: Tx, probe 12 = QRF8-DV_22-20, Rx, probe 78 = QRM8-RA_22-20 Tx, probe 1 = QRF8-DV_80, Rx, probe 3 = QRM8-RA_80 Crosstalk Frequency & Time Domain Response Parameters, NEXT, FEXT Signal Type Differential SingleEnded Sig. to Gnd. Case 2 1:1, S:G Case 2 1:1, S:G Samtec Inc. 520 Park East Blvd. New Albany IN 47151-1147 USA ©Samtec, Inc. 2005 Near-End Aggressor: Far-End Aggressor: Near-End Aggressor: Far-End Aggressor: QRF8-DV_22-20 QRF8-DV _22-20 QRF8-DV_80 QRF8-DV _80 WWW.SAMTEC.COM 1-800-SAMTEC-9 (US & Canada) [email protected] Page:42 Victim: Victim: Victim: Victim: QRF8-DV_28-26 QRM8-RA_28-26 QRF8-DV_84 QRM8-RA_84 Phone: 812-944-6733 Fax: 812-948-5047 Report Revision: 7/21/2011 All Rights Reserved High Speed Characterization Report Series: Q RATE®, QRF8-DV / QRM8-RA Series Description: Slim Body, 0.8mm Centerline, Vertical Socket to RA Terminal Connection PCB-102757-TST, Set 31 & 32 Mapping Fixture Test Points – QRF8-DV/QRM8-RA µProbe Test Board, Worst Case Board No. PCB-102757-TST-31 Rev Socket: PCB-102757-TST-32 Rev Terminal: QRF8-052-02.0-L-D-GP QRM8-052-01-L-RA-GP Crosstalk Frequency & Time Domain Response Parameters, NEXT, FEXT Signal Type Differential SingleEnded Differential Sig. to Gnd. Case 1 2:1, S:G Case 1 2:1, S:G Case 3 1:1, S:G Samtec Inc. 520 Park East Blvd. New Albany IN 47151-1147 USA ©Samtec, Inc. 2005 Near-End Aggressor: Far-End Aggressor: Near-End Aggressor: Far-End Aggressor: Near-End Aggressor: Far-End Aggressor: QRF8-DV_11-09 QRF8-DV_11-09 QRF8-DV_63 QRF8-DV _63 QRF8-DV_101-99 QRF8-DV_101-99 WWW.SAMTEC.COM 1-800-SAMTEC-9 (US & Canada) [email protected] Page:43 Victim: Victim: Victim: Victim: Victim: Victim: QRF8-DV_15-13 QRM8-RA_15-13 QRF8-DV_65 QRM8-RA_65 QRF8-DV_102-100 QRM8-RA_102-100 Phone: 812-944-6733 Fax: 812-948-5047 Report Revision: 7/21/2011 All Rights Reserved High Speed Characterization Report Series: Q RATE®, QRF8-DV / QRM8-RA Series Description: Slim Body, 0.8mm Centerline, Vertical Socket to RA Terminal Connection PCB-102757-TST, Set 41 & 42 Mapping Fixture Test Points – QRF8-DV/QRM8-RA µProbe Test Board, Worst Case Board No. PCB-102757-TST-41 Rev Socket: PCB-102757-TST-42 Rev Terminal: QRF8-052-02.0-L-D-GP QRM8-052-01-L-RA-GP Transmission and Reflection Test Parameters: Insertion Loss, Return Loss, Impedance, Propagation Delay Differential: Single-Ended: Tx, probe 12 = QRF8-DV_11-09, Rx, probe 78 = QRM8-RA_11-09 Tx, probe 1 = QRF8-DV_57, Rx, probe 3 = QRM8-RA_57 Crosstalk Frequency & Time Domain Response Parameters, NEXT, FEXT Signal Type Differential SingleEnded SingleEnded Sig. to Gnd. Case 2 1:1, S:G Case 2 1:1, S:G Case 3 1:1, S:G Samtec Inc. 520 Park East Blvd. New Albany IN 47151-1147 USA ©Samtec, Inc. 2005 Near-End Aggressor: Far-End Aggressor: Near-End Aggressor: Far-End Aggressor: Near-End Aggressor: Far-End Aggressor: QRF8-DV_11-09 QRF8-DV_11-09 QRF8-DV_57 QRF8-DV _57 QRF8-DV_101 QRF8-DV_101 WWW.SAMTEC.COM 1-800-SAMTEC-9 (US & Canada) [email protected] Page:44 Victim: Victim: Victim: Victim: Victim: Victim: QRF8-DV_15-17 QRM8-RA_15-17 QRF8-DV_61 QRM8-RA_61 QRF8-DV_102 QRM8-RA_102 Phone: 812-944-6733 Fax: 812-948-5047 Report Revision: 7/21/2011 All Rights Reserved High Speed Characterization Report Series: Q RATE®, QRF8-DV / QRM8-RA Series Description: Slim Body, 0.8mm Centerline, Vertical Socket to RA Terminal Connection PCB101757-TST-CAL REV A Short Path Long Path Propagation Delay Reference Length Differential, Short & Long Paths 2802 mils TDA Step Waveform Transmission/Reflection Standard Propagation Delay Reference Length Single-Ended, Short & Long Paths 2194 mils Note: Open Standards are used for connector only de-embedding purposes. All Performance data, with the exception of propagation delay include effects of PCB signal launch traces. Samtec Inc. 520 Park East Blvd. New Albany IN 47151-1147 USA ©Samtec, Inc. 2005 WWW.SAMTEC.COM 1-800-SAMTEC-9 (US & Canada) [email protected] Page:45 Phone: 812-944-6733 Fax: 812-948-5047 Report Revision: 7/21/2011 All Rights Reserved High Speed Characterization Report Series: Q RATE®, QRF8-DV / QRM8-RA Series Description: Slim Body, 0.8mm Centerline, Vertical Socket to RA Terminal Connection Appendix D – Test and Measurement Setup The test instrument is the Tektronix CSA8000 Communication Signal Analyzer Mainframe. Four bays of the CSA8000 use four Tektronix 80E04 TDR/Sampling Heads. Time domain data and graphs are real-time. Post-processed s-parameter data and graphs extend from a TDR based software tool called I-Connect Probing uses a video microscopy system, microprobe positioners, and 40GHz capable probes. Four hundred and fifty micron pitch probes are located to PCB launch points with 25X to 175X magnification and XYZ fine positioning adjustments available from both the probe table and micro-probe positioners. Electrically the microwave probes rate a < 1.0 dB insertion loss, a ≥18 dB return loss, and an isolation of 38 dB providing high-bandwidth and low parasitic measurement results. Combined, the above technology provides a stable measurement environment along with the electrical accuracies for obtaining precise calibrations and signal launch capabilities. CSA8000/TDA IConnect Measurements Capability Samtec Inc. 520 Park East Blvd. New Albany IN 47151-1147 USA ©Samtec, Inc. 2005 WWW.SAMTEC.COM 1-800-SAMTEC-9 (US & Canada) [email protected] Page:46 Phone: 812-944-6733 Fax: 812-948-5047 Report Revision: 7/21/2011 All Rights Reserved High Speed Characterization Report Series: Q RATE®, QRF8-DV / QRM8-RA Series Description: Slim Body, 0.8mm Centerline, Vertical Socket to RA Terminal Connection Horizontal Orientation Eight Channel 40 GHz Microprobe Setup Test Instruments QTY Description 1 Tektronix CSA8000 Communication Signal Analyzer 4 Tektronix 80E04 Dual Channel 20 GHz TDR Sampling Module 1 Tektronix 80E03 Dual Channel 20 GHz Sampling Module Measurement Station Accessories QTY Description 1 GigaTest Labs Model (GTL3030) Probe Station 4 GTL Micro-Probe Positioners (2) 4 Picoprobe by GGB Ind. Dual Model 40A GSG-GSG (differential applications) 1 Keyence VH-5910 High Resolution Video Microscope 1 Keyence VH-W100 Fixed Magnification Lens 100 X 1 Keyence VH-Z25 Standard Zoom Lens 25X-175X Test Cables & Adapters QTY Description 8 Pasternack Enterprises 2.9mm Semi-Rigid (.086) 6” Cable Assemblies (4) 4 Tektronix 1 Meter Module Extenders (2) Samtec Inc. 520 Park East Blvd. New Albany IN 47151-1147 USA ©Samtec, Inc. 2005 WWW.SAMTEC.COM 1-800-SAMTEC-9 (US & Canada) [email protected] Page:47 Phone: 812-944-6733 Fax: 812-948-5047 Report Revision: 7/21/2011 All Rights Reserved High Speed Characterization Report Series: Q RATE®, QRF8-DV / QRM8-RA Series Description: Slim Body, 0.8mm Centerline, Vertical Socket to RA Terminal Connection Appendix E - Frequency and Time Domain Measurements In a two row connector series where terminal geometry and dimensions are equal, only one row is measured. The following test procedures are written for same geometry equal length double row connector series’. In two row connector design where contact geometry and/or length may differ (right angle terminal) between terminal rows it is necessary to measure SI performance for both rows. This condition effectively doubles the number of measurements needed to characterize the connector series. It is also important to note before gathering measurement data that TDA Systems IConnect measurements and CSA8000 measurements are virtually the same measurements using diverse formats. This means that the operator being extremely aware, can obtain SI time and frequency characteristics in an almost simultaneous fashion Since IConnect setup procedures are specific to the frequency information sought, it is mandatory that the sample preparation and CSA8000 functional setups be consistent throughout the waveform gathering process. If the operators test equipment permits recall sequencing between the various test parameter setups, it insures IConnect functional setups remain consistent with the TDR/TDT waveforms previously recorded. Sample Preparation Determine signal launch and test points by referencing test parameter fixture tables and schematic layout maps. Calibration Board, CAL PCB Fixture Sets I, II, III, & IV Wherever practical it is a good practice to terminate all non-active signal lines immediately adjacent to the designated active or quiet signal lines under test. Frequency (S-Parameter) Domain Procedures Frequency data extraction involves a two-step process. The first step creates the TDR based waveform relationships utilizing a Tektronix CSA8000 time based instrument. The second step involves the conversion of these time-based waveforms into sparameter format using the TDA Systems IConnect software tool. TDA Systems labels time related conversion waveforms as the Step and DUT waveform references. This section establishes the setup procedures for defining the Step and DUT reference for conversion to frequency s-parameters presented in this report. CSA8000 Setup Listed below is the CSA 8000 functional menu setups used for single-ended and differential frequency response extractions. Both signal types utilize I-Connect software tools Samtec Inc. 520 Park East Blvd. New Albany IN 47151-1147 USA ©Samtec, Inc. 2005 WWW.SAMTEC.COM 1-800-SAMTEC-9 (US & Canada) [email protected] Page:48 Phone: 812-944-6733 Fax: 812-948-5047 Report Revision: 7/21/2011 All Rights Reserved High Speed Characterization Report Series: Q RATE®, QRF8-DV / QRM8-RA Series Description: Slim Body, 0.8mm Centerline, Vertical Socket to RA Terminal Connection to generate S-parameter upper and lower frequency boundaries along with the step frequency. Functional settings such as window length, number of points and averaging capability determines the instruments frequency boundaries. Once window length, number of points and averaging functions are set, maintain the same instrument settings throughout the extraction process. The single channel pulsed source processes sparameters in single-ended format. A dual channel differential pulsed source processes s-parameters in differential format. Vertical Scale: Offset: Horizontal Scale: Max. Record Length: Averages: Single-Ended Signal 100 mV/ Div: Default / Scroll 1nSec/ Div = 20 MHz step frequency 4000 = Min. Resolution ≥ 128 Differential Signal 100 mV/ Div: Default / Scroll 1nSec/ Div = 20 MHz step frequency 4000 = Min. Resolution ≥ 128 Insertion Loss (TDA conversion) Step Waveform - determine TD waveform by making a TDT transmission measurement that includes all cables, adapters, and probes connected in the test systems transmission path. Complete the transmission path by inserting a negligible length of transmission standard between the system test probes. Calibration or waveform referencing utilizes a six pad cal structure for each of the probe touchdowns (ie; se thru = 3 pads or diff thru = 6 pads). Reference the calibration board CAL, and use the 1mm (0.390”) length calibration reflect/transmission structure for TDA step waveform characterization. DUT Waveform - determine TD waveform by making an active TDT transmission measurement that includes all cables, adapters, and probes connected in the test systems transmission path. Insert the SUT between the probes in place of the reflection/transmission standard and record the measurement. The QRF8-DV/QRM8-RA characterization reports insertion loss for one long & short single-ended electrical path and one long & short differential electrical path. Reference PCB fixture set II and fixture set IV for an appropriate signal path. Return Loss (TDA conversion) Step Waveform – determine TD waveform by making an active TDR reflection measurement that includes all cables, adapters, and probes connected in the test systems electrical path up to and including an open standard. Calibration or waveform referencSamtec Inc. 520 Park East Blvd. New Albany IN 47151-1147 USA ©Samtec, Inc. 2005 WWW.SAMTEC.COM 1-800-SAMTEC-9 (US & Canada) [email protected] Page:49 Phone: 812-944-6733 Fax: 812-948-5047 Report Revision: 7/21/2011 All Rights Reserved High Speed Characterization Report Series: Q RATE®, QRF8-DV / QRM8-RA Series Description: Slim Body, 0.8mm Centerline, Vertical Socket to RA Terminal Connection ing utilizes three pads for each probe touchdown (ie; se reflect = 3 pads or diff reflect = 6 pads). Reference CAL calibration board and use the 1mm (0.390”) length calibration reflect/transmission standard for TDA step waveform characterization. DUT Waveform – determine waveform by making an active TDR reflection measurement that includes all cables, adapters, and probes connected in the test systems transmission path. Insert the SUT between the probes in place of the reflection/transmission standard and record the measurement. In this condition cables and adapters located at the far-end of the inserted SUT function as the systems 50Ω singleended and/or 100Ω differential matching impedance. The QRF8-DV/QRM8-RA characterization reports return loss for one long & short single-ended electrical path and one long & short differential electrical path. Reference PCB fixture set II and fixture set IV for an appropriate signal path. Near-End Crosstalk (TDA conversion) Step Waveform – Use Return Loss (RL) step waveform. DUT Waveform - determine waveform by driving specified signal type and monitoring coupled energy levels at the configurations adjacent near-end signal line. QRF8DV/QRM8-RA examines three single-ended and three differential near-end crosstalk case scenarios. Reference PCB fixture sets I, II, III, & IV for crosstalk case configurations. Far-End Crosstalk (TDA conversion) Step Waveform - Use Insertion Loss (IL) step waveform. DUT Waveform - determine waveform by driving specified signal type and monitoring coupled energy levels at the configurations adjacent far-end signal line. QRF8DV/QRM8-RA examines three single-ended and three differential far-end crosstalk case scenarios. Reference PCB fixture sets I, II, III, & IV for crosstalk case configurations. Samtec Inc. 520 Park East Blvd. New Albany IN 47151-1147 USA ©Samtec, Inc. 2005 WWW.SAMTEC.COM 1-800-SAMTEC-9 (US & Canada) [email protected] Page:50 Phone: 812-944-6733 Fax: 812-948-5047 Report Revision: 7/21/2011 All Rights Reserved High Speed Characterization Report Series: Q RATE®, QRF8-DV / QRM8-RA Series Description: Slim Body, 0.8mm Centerline, Vertical Socket to RA Terminal Connection Time Domain Procedures Utilize the Time Domain Reflectometer (TDR) or Time Domain Transmission (TDT) method for digital type pulse measurements. Impedance and propagation delay characterization utilize TDR measurement methods. Crosstalk measurements utilize TDT methods. The Tektronix 80E04 TDR/ Sampling Head provide both the signaling type and sampling capability necessary to characterize the SUT. Impedance (TDR) Energize the SUT’s signal line(s) with a TDR pulse. The far-end of the energized signal lines are terminated in the test systems characteristic impedance (e.g.; 50Ω or 100Ω termination) or use quality cables and adapters located at the far-end of the inserted SUT function as the systems 50Ω single-ended and/or 100Ω differential matching impedance. The QRF8-DV/QRM8-RA characterization reports one long & short singleended electrical path response and one long & short differential electrical path response. Reference PCB fixture set II and fixture set IV for the appropriate signal paths. Propagation Delay (TDT) This test reports differential or single-ended signal delay as the measured difference of propagation between a combined electrical length of the input/output signal pads and signal traces (35 ± 5 ps edge rate) and the device under test (DUT) plus a referenced electrical length of the signal pads and signal traces (PDpads/traces- PDDUT + PDpads/traces). The recorded delay is the signal delay of the connector only. PDpads/traces is the nomenclature representing the electrical length of PCB signal pads & traces equal to physical lengths of PCB pads & traces entering and leaving the device under test (DUT). The PDDUT + PDpads/traces variable is the mated DUT fixture. Measure the risetime of PDpads/traces waveform & PDDUT + PDpads/traces waveforms. Record the 50% amplitude of each rising edge. The distance in time between the rising edges is the propagation delay of the device under test (DUT= mated connector only). The QRF8-DV/QRM8-RA characterization reports propagation delay for one long & short single-ended electrical path and one long & short differential electrical path. Reference PCB fixture set II and fixture set IV for an appropriate signal path. Near-End Crosstalk (TDT) Energize the pre-determined signal line(s) with the appropriate signal type. Monitor the configurations adjacent quiet signal line at the near-end for magnitudes of coupled energy. Terminate adjacent signal lines not under test in the test systems characteristic impedance. QRF8-DV/QRM8-RA examines three single-ended and three differential near-end crosstalk case scenarios. Reference PCB fixture sets I, II, III, & IV for crosstalk case configurations. Samtec Inc. 520 Park East Blvd. New Albany IN 47151-1147 USA ©Samtec, Inc. 2005 WWW.SAMTEC.COM 1-800-SAMTEC-9 (US & Canada) [email protected] Page:51 Phone: 812-944-6733 Fax: 812-948-5047 Report Revision: 7/21/2011 All Rights Reserved High Speed Characterization Report Series: Q RATE®, QRF8-DV / QRM8-RA Series Description: Slim Body, 0.8mm Centerline, Vertical Socket to RA Terminal Connection Far-End Crosstalk (TDT) Energize the pre-determined signal line(s) with the appropriate signal type. Monitor the configurations adjacent quiet signal line at the far-end for magnitudes of coupled energy. Terminate adjacent signal lines not under test in the test systems characteristic impedance. QRF8-DV/QRM8-RA examines three single-ended and three differential far-end crosstalk case scenarios. Reference PCB fixture sets I, II, III, & IV for crosstalk case configurations. Samtec Inc. 520 Park East Blvd. New Albany IN 47151-1147 USA ©Samtec, Inc. 2005 WWW.SAMTEC.COM 1-800-SAMTEC-9 (US & Canada) [email protected] Page:52 Phone: 812-944-6733 Fax: 812-948-5047 Report Revision: 7/21/2011 All Rights Reserved High Speed Characterization Report Series: Q RATE®, QRF8-DV / QRM8-RA Series Description: Slim Body, 0.8mm Centerline, Vertical Socket to RA Terminal Connection Appendix F – Glossary of Terms TD – Time Domain FD – Frequency Domain PD – Propagation Delay DUT – Device under test, term used for TDA IConnect & Propagation Delay waveforms EC6 – Edge Card with a .635mm signal pad pitch FEXT – Far-End Crosstalk GSG – Ground–Signal-Ground; geometric configuration GSSG - Ground–Signal-Signal-Ground; geometric configuration LEC6 – Signal Launch Edge Card with a .635 mm signal pad pitch NEXT – Near-End Crosstalk PCB – Printed Circuit Board SE – Single-Ended SI – Signal Integrity SUT – System Under Test TDR – Time Domain Reflectometry TDT – Time Domain Transmission WC – Worst Case crosstalk configuration BC – Best Case crosstalk configuration Z – Impedance (expressed in ohms) OV – Optimal Vertical OH – Optimal Horizontal HDV – High Density Vertical PPO – Pin Population Option S – Static (independent of PCB ground) Samtec Inc. 520 Park East Blvd. New Albany IN 47151-1147 USA ©Samtec, Inc. 2005 WWW.SAMTEC.COM 1-800-SAMTEC-9 (US & Canada) [email protected] Page:53 Phone: 812-944-6733 Fax: 812-948-5047 Report Revision: 7/21/2011 All Rights Reserved