STU06L01 STD06L01

Green
Product
STU06L01
STD06L01
S a mHop Microelectronics C orp.
Ver 1.1
N-Channel Logic Level Enhancement Mode Field Effect Transistor
FEATURES
Super high dense cell design for low R DS(ON).
PRODUCT SUMMARY
V DSS
R DS(ON) (m Ω) Max
ID
Rugged and reliable.
353 @ VGS=10V
100V
TO-252 and TO-251 Package.
6A
553 @ VGS=4.5V
G
G
D
S
STU SERIES
TO - 252AA( D - PAK )
S
STD SERIES
TO - 251 ( I - PAK )
ABSOLUTE MAXIMUM RATINGS ( T C=25 °C unless otherwise noted )
Symbol
Parameter
Limit
Units
VDS
Drain-Source Voltage
100
V
VGS
Gate-Source Voltage
±20
V
ID
Drain Current-Continuous
6
A
4.8
A
17
A
3.6
mJ
TC=25°C
42
W
TC=70°C
27
W
-55 to 150
°C
Thermal Resistance, Junction-to-Case
3
°C/W
Thermal Resistance, Junction-to-Ambient
50
°C/W
IDM
-Pulsed
TC=25°C
TC=70°C
a e
b
EAS
Single Pulse Avalanche Energy
PD
Maximum Power Dissipation
TJ, TSTG
Operating Junction and Storage
Temperature Range
d
THERMAL CHARACTERISTICS
R JC
R JA
Details are subject to change without notice.
Oct,30,2013
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STU06L01
STD06L01
Ver 1.1
ELECTRICAL CHARACTERISTICS ( T C=25 °C unless otherwise noted )
Symbol
Parameter
OFF CHARACTERISTICS
BVDSS
Drain-Source Breakdown Voltage
Conditions
Min
VGS=0V , ID=10mA
100
IDSS
Zero Gate Voltage Drain Current
VDS=80V , VGS=0V
IGSS
Gate-Body Leakage Current
VGS= ±20V , VDS=0V
ON CHARACTERISTICS
Gate Threshold Voltage
VGS(th)
Drain-Source On-State Resistance
gFS
Forward Transconductance
Max
Units
V
1
uA
±100
nA
3
V
VGS=10V , ID=3A
282
353
m ohm
VGS=4.5V , ID=2A
410
553
m ohm
VDS=10V , ID=3A
4.5
S
VDS=25V,VGS=0V
f=1.0MHz
273
25
18
pF
pF
pF
8.5
ns
9.6
ns
15.2
ns
2.5
ns
4.3
nC
1
nC
1.6
nC
VDS=VGS , ID=250uA
RDS(ON)
Typ
1
2
c
DYNAMIC CHARACTERISTICS
Input Capacitance
CISS
Output Capacitance
COSS
Reverse Transfer Capacitance
CRSS
SWITCHING CHARACTERISTICS
tD(ON)
Turn-On Delay Time
tr
Rise Time
c
VDD=50V
ID=1A
VGS=10V
RGEN= 6 ohm
tD(OFF)
Turn-Off Delay Time
tf
Qg
Fall Time
Total Gate Charge
VDS=50V,ID=3A,VGS=10V
Qgs
Gate-Source Charge
Qgd
Gate-Drain Charge
VDS=50V,ID=3A,
VGS=10V
DRAIN-SOURCE DIODE CHARACTERISTICS AND MAXIMUM RATINGS
Diode Forward Voltage
VSD
VGS=0V,IS=1A
0.8
1.3
V
Notes
_ 10sec.
a.Surface Mounted on FR4 Board,t <
_ 300us, Duty Cycle <
_ 2%.
b.Pulse Test:Pulse Width <
c.Guaranteed by design, not subject to production testing.
d.Starting TJ=25°C,L=0.5mH,VDD = 50V.(See Figure13)
e.Drain current limited by maximum junction temperature.
Oct,30,2013
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STU06L01
STD06L01
Ver 1.1
6.0
3.0
ID, Drain Current(A)
2.4
VGS=4V
1.8
1.2
VGS=3.5V
0.6
0
RDS(on)(m Ω)
VGS=4.5V
0
0.5
1.5
1
2
2.5
4.8
3.6
Tj=125 C
25 C
1.2
0
0
2
1
4
3
6
5
VDS, Drain-to-Source Voltage(V)
V GS, Gate-to-Source Voltage(V)
Figure 1. Output Characteristics
Figure 2. Transfer Characteristics
900
2.25
750
2.00
600
V G S =4.5V
450
300
V G S =10V
150
V G S =10V
I D =3A
1.75
1.50
1.25
V G S =4.5V
I D =2A
1.00
0
0.01
1.2
0.6
1.8
2.4
0
3.0
0
I D, Drain Current(A)
BVDSS, Normalized
Drain-Source Breakdown Voltage
V DS =V G S
I D =250uA
1.2
1.0
0.8
0.6
0.4
0.2
-50 -25
0
25
50
50
75
100
125
150
T j ( °C )
Figure 4. On-Resistance Variation with Drain
Current and Temperature
1.6
1.4
25
Tj, Junction Temperature(° C )
Figure 3. On-Resistance vs. Drain Current
and Gate Voltage
Vth, Normalized
Gate-Source Threshold Voltage
-55 C
2.4
3
R DS(on), On-Resistance
Normalized
ID, Drain Current(A)
VGS=10V
75 100 125 150
Tj, Junction Temperature( ° C )
1.15
I D =10mA
1.10
1.05
1.00
0.95
0.90
0.85
-50 -25
0
25
50
75
100 125 150
Tj, Junction Temperature(° C )
Figure 5. Gate Threshold Variation
with Temperature
Figure 6. Breakdown Voltage Variation
with Temperature
Oct,30,2013
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STU06L01
STD06L01
Ver 1.1
900
20.0
Is, Source-drain current(A)
I D =3A
RDS(on)(m Ω)
750
600
125 C
450
75 C
300
25 C
150
0
2
6
4
8
25 C
0
0.3
0.6
0.9
1.2
1.5
VGS, Gate-to-Source Voltage(V)
VSD, Body Diode Forward Voltage(V)
Figure 7. On-Resistance vs.
Gate-Source Voltage
Figure 8. Body Diode Forward Voltage
Variation with Source Current
V GS, Gate to Source Voltage(V)
300
Ciss
240
180
120
Coss
60
Crss
10
VDS=50V
ID=3A
8
6
4
2
0
0
0
75 C
125 C
10
360
C, Capacitance(pF)
5.0
1.0
0
5
10
15
20
25
30
0
1
2
4
3
5
VDS, Drain-to-Source Voltage(V)
Qg, Total Gate Charge(nC)
Figure 9. Capacitance
Figure 10. Gate Charge
6
60
I D, Drain Current(A)
100
TD(off )
Switching Time(ns)
10.0
Tr
10
TD(on)
Tf
1
10
RD
10
100
it
1m
10 s
ms
DC
0.1
VGS=10V
Single Pulse
TC=25 C
0.01
1
(
L im
1
VDS=50V,ID=1A
VGS=10V
0.1
S
)
ON
0.1
1
10
100
Rg, Gate Resistance(Ω)
V DS, Drain-Source Voltage(V)
Figure 11. switching characteristics
Figure 12. Maximum Safe Operating Area
Oct,30,2013
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STU06L01
STD06L01
Ver 1.1
V(BR)DSS
tp
L
VDS
D.U.T
RG
+
- VDD
IAS
20V
tp
0.01
IAS
Unclamped Inductive Waveforms
Uncamped Inductive Test Circuit
Figure 13b.
Figure 13a.
2
1
Normalized Transient
Thermal Resistance
D=0.5
0.2
0.1
P DM
0.1
0.05
t1
t2
0.02
0.01
1.
2.
3.
4.
S ING LE P ULS E
R J J C (t)=r (t) * R J J C
R J J C =S ee Datas heet
T J M-T C = P DM* R J J C (t)
Duty C ycle, D=t1/t2
0.01
10
-5
10
-4
10
-3
10
-2
10
-1
1
10
Square Wave Pulse Duration(sec)
Figure 14. Normalized Thermal Transient Impedance Curve
Oct,30,2013
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STU06L01
STD06L01
Ver 1.1
E
TO-252
A
b2
C
L3
1
D1
D
E1
H
1
2
3
DETAIL "A"
L4
b1
e
b
L2
L
A1
DETAIL "A"
L1
SYMBOLS
A
A1
b
b1
b2
C
D
D1
E
E1
e
H
L
L1
L2
L3
L4
1
MILLIMETERS
MIN
2.100
0.000
0.400
0.770
4.800
0.400
5.300
4.900
6.300
4.400
2.290
8.900
1.397
2.743
0.508
0.890
0.500
0°
7°
INCHES
MAX
2.500
0.200
0.889
1.140
5.460
0.600
6.223
5.515
6.731
5.004
REF
10.400
1.770
REF.
REF.
1.700
1.100
10°
REF.
MIN
0.083
0.000
0.016
0.030
0.189
0.016
0.209
0.193
0.248
0.173
0.090
0.350
0.055
0.108
0.020
0.035
0.020
0°
7°
MAX
0.098
0.008
0.035
0.045
0.215
0.024
0.245
0.217
0.265
0.197
BSC
0.409
0.070
REF.
REF.
0.067
0.043
10 °
REF.
Oct,30,2013
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STU06L01
STD06L01
Ver 1.1
PACKAGE OUTLINE DIMENSIONS
TO-251
A
E
b3
c2
D1
E1
D
H
1
2
3
b2
L5
L4
L
b
e
SYMBOL
b4
c
MILLIMETERS
INCHES
MIN
MAX
MIN
MAX
E
6.400
6.731
0.252
0.265
L
3.980
4.280
0.157
0.169
L4
0.698 REF
0.027 REF
0.038
0.236
0.048
0.245
0.435
0.450
0.880
0.025
0.035
1.140
5.460
0.030
0.205
0.045
0.215
0.550
0.018
0.022
L5
0.972
1.226
D
6.000
11.050
6.223
11.450
0.640
0.770
5.210
0.450
H
b
b2
b3
b4
e
A
c
c2
D1
E1
2.286 BSC
2.380
2.200
0.400
0.600
0.400
0.600
5.100
4.400
0.090 BSC
0.087
0.094
0.016
0.016
0.201
0.173
0.024
0.024
Oct,30,2013
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STU06L01
STD06L01
Ver 1.1
TO-251 Tube/TO-252 Tape and Reel Data
TO-251 Tube
0.4
5.25
4.5
1.4
2.25
" A"
1.65
5.5
2~ӿ3.0
7.50
1.25
1.90
540 + 1.5
6.60
19.75
TO-252 Carrier Tape
B0
E
E2
T
E1
P1
P2
D1
K0
FEED DIRECTION
A0
D0
P0
UNIT:р
PACKAGE
TO-252
(16 р*
A0
6.96
²0.1
B0
10.49
²0.1
K0
2.79
²0.1
D0
D1
E
E1
E2
P0
P1
P2
T
ӿ2
ӿ1.5
+ 0.1
- 0
16.0
²0.3
1.75
²0.1
7.5
²0.15
8.0
²0.1
4.0
²0.1
2.0
²0.15
0.3
²0.05
TO-252 Reel
T
S
M
N
K
G
V
R
H
W
UNIT:р
TAPE SIZE
16 р
REEL SIZE
ӿ 330
M
ӿ330
² 0.5
N
W
ӿ97
² 1.0
17.0
+ 1.5
- 0
T
H
2.2
ӿ13.0
+ 0.5
- 0.2
K
S
10.6
2.0
²0.5
G
R
V
Oct,30,2013
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STU06L01
STD06L01
Ver 1.1
TOP MARKING DEFINITION
TO-252
SamHop Logo
STU06L01
XXXXXX
Product No.
SMC internal code No. (A,B,C...Z)
Wafer Lot No.
Production Date (1,2 ~ 9, A,B.....)
Production Month (1,2 ~ 9, A,B,C)
Production Year (2009 = 9, 2010 = A.....)
Oct,30,2013
9
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STU06L01
STD06L01
Ver 1.1
TOP MARKING DEFINITION
TO-251
SamHop Logo
STD06L01
XXXXXX
Product No.
SMC internal code No. (A,B,C...Z)
Wafer Lot No.
Production Date (1,2 ~ 9, A,B.....)
Production Month (1,2 ~ 9, A,B,C)
Production Year (2009 = 9, 2010 = A.....)
Oct,30,2013
10
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