Silicon Avalanche Photodiode (Si APD) S12427-02 Description u Silicon Avalanche Photodiode (Si APD) u Low Bias operation for 760nm band u 3.1×1.8×1.0mm SMD package u 0.2mmφ active area u VBR=80 to 120V select Absolute Maximum Ratings Parameter Symbol Value Unit Operating temperature Topr -20 to +60 °C Storage temperature Tstg -40 to +80 °C Remark Electrical and Optical Characteristics (Ta=25℃) Parameter Symbol Condition Min. Typ. Max. Unit Spectral response range λ M=1 — 400 to 1000 — nm Peak sensitivity wavelength λp M=100 — 760 — nm Photo sensitivity S M=1,λ=760nm — 0.48 — A/W Quantum efficiency QE M=1,λ=760nm — 78 — % Breakdown voltage VBR ID=100μA 80 100 120 V Temperature coefficient of VBR γ — 0.42 — V/℃ Dark current ID M=100 — 0.05 0.5 nA Cut-off frequency fc M=100,λ=760nm,RL=50Ω,-3dB — 1500 — MHz Terminal capacitance Ct M=100,f=1MHz — 1.2 — pF Excess noise figure x M=100,λ=760nm — 0.3 — Gain M λ=800nm — 100 — Dimensional Outline ( Unit : mm ) u u u u u u SOCAY Electronics Co., Ltd. Revision June 2, 2015 Tolerance unless otherwise noted: ±0.2. Active area position accuracy: X,Y<±0.2. Values in parentheses indicate reference value. Package side: Wiring is exposed on A and B side. Do not allow any conductor to make contact with the package side to avoid shorting. Electrodes. www.socay.com 1/5 @SOCAY Electronics Co., Ltd. 2015 Specifications are subject to change without notice. Please refer to www.socay.com for current information. Silicon Avalanche Photodiode (Si APD) S12427-02 Packing Specifications:Embossed Tape Carrier Width : 8mm, Pitch : 4mm Packing Specifications:Taping to Reel The following parameters & bar-code are indicated on the label. ①Manufacturer part number (MPN) ②Quantity (QTY) ③Lot No ④Date Code SOCAY Electronics Co., Ltd. Revision June 2, 2015 www.socay.com 2/5 @SOCAY Electronics Co., Ltd. 2015 Specifications are subject to change without notice. Please refer to www.socay.com for current information. Silicon Avalanche Photodiode (Si APD) S12427-02 Packing Specifications:Reel Max. 1000pcs /reel Packing Specifications:Reel Packing The following parameters & bar-code are indicated on the label. u Manufacturer part number (MPN) u Quantity (QTY) u Lot No u Date Code The precaution label for moisture proof storage is stuck on the pack. Precautions for Handling The material (resin) for this package is selected for optimum light transmission, while this resin is inferior to general electric IC in the resistance to soldering heat.If this product is used with a severe condition, unexpected troubles may occur.Pleas read this document previously use. u Precaution for Storage Soldering in the condition that moisture absorption of the package (resin) should be done, the vaporization of moisture may cause serious troubles, for example, breaking bonding wire or decrease sensitivity. 1)These devices are package with a moisture-proof conductive film enclosed silica gel to protect the terminal leads from oxidation and stains, and to prevent the package from absorbing moisture. Avoid unpacking the devices until they are actually in use. 2)Since these device are package with a moisture-proof conductive film, they can be stored for long periods (about 3 months) if they are left in air-conditioned environment at normal room temperatures and moistures (5°C to 30°C, 70% or bellow). Even when the devices are packed with the moisture-proof film, protect them against water leakage, moisture condensation, corrosive gases, direct sunlight, or temperature rise (e.g., turning off the air conditioner at night or holiday). 3)The state of anti-moisture vacuum package should be checked. A silica gel interested should be changed color by moisture absorption. The color of silica gel should be checked as well. 4)After removing the moisture-proof film, store the device in dehumidified atmosphere (5°C to 25°C, 60% or below) and use then within 24 hours. SOCAY Electronics Co., Ltd. Revision June 2, 2015 www.socay.com 3/5 @SOCAY Electronics Co., Ltd. 2015 Specifications are subject to change without notice. Please refer to www.socay.com for current information. Silicon Avalanche Photodiode (Si APD) S12427-02 Precautions for Handling 5)If the devices are stored for than 3 months, or if after unpacking, they are left for more than 24 hours, they should be backed in following conditions.3 to 5 hours at 150°C in nitrogen, Max. 2 times. u Mounting on the Board 1)Do not apply the mechanical strength to the product during the mounting process. 2)Do not use any flux which is highly acidic, alkaline, or inorganic because they may erode the electrodes.Use a flex made of resin. 3)Reflow soldering Set the soldering conditions so that the package surface temperature is lower than 235℃. However, please observe the following conditions. ①Soldering process is 1 time only. ②Soldering process is carried out within 24 hours after unpacking. Reference the following chart of recommended conditions for reflow soldering.A troubled caused by reflow soldering should depend upon a PCB (Printed Circuit Board) and a reflow soldering furnace. Please confirm there is no problem in device reliability when the soldering conditions are decided. Sudden temperature variations may be the cause of troubles in reflow soldering. Set the soldering conditions to "4℃ within one second". * We will consider the other conditions that customer request. u Cleaning When removing stains and dirt from the resin surface, use a cotton swab moistened with alcohol and wipe gently, being careful not to cause any damage. Do not use ultrasonic cleaning methods on these devices. If the devices are cleaned with organic solvents other than alcohol, the solvents may soak into the package, causing it to expand, thus generating a "swelling" phenomenon. SOCAY Electronics Co., Ltd. Revision June 2, 2015 www.socay.com 4/5 @SOCAY Electronics Co., Ltd. 2015 Specifications are subject to change without notice. Please refer to www.socay.com for current information. Silicon Avalanche Photodiode (Si APD) S12427-02 Notice Socay Electronics Co., Ltd (SOCAY) has made every effort to enhance the reliability of its semiconductor devices; however ,the possibility of defects cannot be entirely eliminated. In order to minimize risk of damage or injury arising from a defect in a SOCAY semiconductor device, the customer must be familiar with the property of such devices, and utilize appropriate safety measures in the design of equipment incorporating the devices. These measures may include,but are not limited to, redundancy, fire-containment, and anti-failure design features. This product is warranted to the original purchaser for a period of 12 months following the date of shipment. The warranty is limited to replacement or repair of any defective material due to defects in workmanship or materials used in manufacture. It does not cover loss or damage of the product due to natural calamity or misuse, even within the warranty period. In no circumstances, should these semiconductor devices be used by persons unfamiliar with their properties and limitations, or who lack proper knowledge of safe, electronic design. SOCAY Electronics Co., Ltd. Revision June 2, 2015 www.socay.com 5/5 @SOCAY Electronics Co., Ltd. 2015 Specifications are subject to change without notice. Please refer to www.socay.com for current information.