Low Profile Type (Chip Common Mode Filter) HCM1012G Series Features Powerful components with composite co-fired material to solve EMI problem for high speed differential signal transmission line as USB, and LVDS, without distortion to high speed signal transmission. Application MIPI, MHL serial interface in mobile device. Part Numbering HCM 1012 G (1) (2) (3) (1) (2) (3) (4) (5) (6) (7) (8) (9) (4) 50 0 (5) (6) (7) 05 P (8) (9) Series Name Dimensions L*W Material Code Product identification number Impedance value (ex: 500=50 Ω) Fixed Decimal Point Socay internal code Dimension T (ex：05=0.50mm) Packaging style P-Embossed paper tape, 7”reel. Electrical Characteristics Part Number Imp. Com. (Ω)±25% @100MHz DCR Max. (Ω) Rated Current Max.(mA) Rated Voltage (V) Insulation Resistance Min.(MΩ) HCM1012GD500A05P 50 1.5 100 10 100 HCM1012GD670A05P 67 1.5 100 10 100 HCM1012GD900B05P 90 3.0 100 10 100 HCM1012GS500A05P 50 1.5 100 10 100 HCM1012GS670A05P 67 1.5 100 10 100 HCM1012GS900B05P 90 3.0 100 10 100 Test Instruments： Agilent E4991A RF Impedance / Material Analyzer HP4338 Milliohmmeter Agilent E5071C ENA Series Network Analyzer Keithley 2410 1100V Source Meter SOCAY Electronics Co., Ltd. Revision July 20, 2015 www.socay.com 1/6 @ SOCAY Electronics Co., Ltd. 2015 Specifications are subject to change without notice. Please refer to www.socay.com for current information. Low Profile Type (Chip Common Mode Filter) HCM1012G Series General Technical Data Operating Temperature Range -40℃ ~ +85℃ Storage Condition Less than 40℃ and 70% RH Storage Time 6 months Max. Soldering Method Reflow or Wave Soldering Typical Characteristics HCM1012GD500A Fig 1.Impedance vs. Frequency Characteristics Fig 2.Insertion Loss vs. Frequency Characteristics HCM1012GD670A05 Fig 3.Impedance vs. Frequency Characteristics Fig 4.Insertion Loss vs. Frequency Characteristics SOCAY Electronics Co., Ltd. Revision July 20, 2015 www.socay.com 2/6 @ SOCAY Electronics Co., Ltd. 2015 Specifications are subject to change without notice. Please refer to www.socay.com for current information. Low Profile Type (Chip Common Mode Filter) HCM1012G Series HCM1012GD900B05 Fig 5.Impedance vs. Frequency Characteristics Fig 6.Insertion Loss vs. Frequency Characteristics HCM1012GS500A Fig 7.Impedance vs. Frequency Characteristics Fig 8.Insertion Loss vs. Frequency Characteristics HCM1012GS670A05 Fig 9.Impedance vs. Frequency Characteristics Fig 10.Insertion Loss vs. Frequency Characteristics SOCAY Electronics Co., Ltd. Revision July 20, 2015 www.socay.com 3/6 @ SOCAY Electronics Co., Ltd. 2015 Specifications are subject to change without notice. Please refer to www.socay.com for current information. Low Profile Type (Chip Common Mode Filter) HCM1012G Series HCM1012GS900B05 Fig 11.Impedance vs. Frequency Characteristics Fig 12.Insertion Loss vs. Frequency Characteristics Construction & Dimensions Type Dimension（Unit：mm） L 1.25±0.10 W 1.00±0.10 T 0.50±0.10 P 0.55±0.10 C1 0.30±0.10 C2 0.20±0.15 Circuit Configuration & Layout Pad（Unit: mm） U SOCAY Electronics Co., Ltd. Revision July 20, 2015 www.socay.com 4/6 @ SOCAY Electronics Co., Ltd. 2015 Specifications are subject to change without notice. Please refer to www.socay.com for current information. Low Profile Type (Chip Common Mode Filter) HCM1012G Series Tape and Reel Specifications/Taping Dimensions（Unit: mm） Type：Paper Carrier Symbol Size Symbol Size A 1.20±0.05 P0 4.00±0.10 B 1.45±0.05 P1 4.00±0.10 W 8.00±0.10 P2 2.00±0.05 E 1.75±0.05 D0 1.55±0.05 F 3.50±0.05 T 0.60±0.03 Reel Dimensions（Unit: mm） Standard Quantity for Packaging Packaging Style Reel Packaging Quantity Inner Box Taping 4000 pcs/reel 5 reel/inner box SOCAY Electronics Co., Ltd. Revision July 20, 2015 www.socay.com 5/6 @ SOCAY Electronics Co., Ltd. 2015 Specifications are subject to change without notice. Please refer to www.socay.com for current information. Low Profile Type (Chip Common Mode Filter) HCM1012G Series Recommended Soldering Conditions Reliability and Test Condition Test item Test condition Criteria A.Temperature : -40℃ ~ +85℃ Temperature Cycle B.Cycle : 100 cycles A.No mechanical damage C.Dwell time : 30 minutes B.Impedance value should be within Measurement : at ambient temperature 24 hrs after ±20 % of the initial value test completion A.Temperature : 85℃ ± 5℃ Operational Life B.Test time : 1000 hrs A.No mechanical damage C.Apply current : full rated current B.Impedance value should be within Measurement : at ambient temperature 24 hrs after ±20 % of the initial value test completion A.Temperature : 40℃ ± 2℃ B.Humidity : 90 ~ 95 % RH Biased Humidity A.No mechanical damage C.Test time : 1000 hrs D.Apply current : full rated current Measurement : at ambient temperature 24 hrs after B.Impedance value should be within ±20 % of the initial value test completion A.More A.Solder temperature : 260℃ ± 5℃ Resistance to Solder Heat B.Flux : Rosin than 95 % of terminal electrode should be covered with new solder B.No mechanical damage C.DIP time : 10 ± 1 sec C.Impedance value should be within ±20 % of the initial value A.Temperature : 93℃ ± 2℃ B.Test time : 4 hrs Steam Aging Test C.Solder temperature : 235℃ ± 5℃ D.Flux : Rosin More than 95 % of terminal electrode should be covered with new solder E.DIP time : 5 ± 1 sec SOCAY Electronics Co., Ltd. Revision July 20, 2015 www.socay.com 6/6 @ SOCAY Electronics Co., Ltd. 2015 Specifications are subject to change without notice. Please refer to www.socay.com for current information.