MOSFET Reliability Test Standards

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深圳市天安数码时代广场 A 座 2005
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CECC 90.000
1,027
JEDECJESD 22
1,005
IEC
MIL STD 750
TEST
MIL STD 883
MOSFET 可靠性实验标准对比及常规实验条件
TYPICAL CONDITIONS
LIFE TESTS
High temperature life test
Low temperature life test High temp. retention bake
Write/erase plus retention bake
147.4
A108A
4.8
1,005
1,005
Thermal fatigue
1,037
Tj = 125 - 150℃ 500/1000 hours
10℃to -40℃ 500/1000 hours
150/250℃ 500/1000 hours
10K to 1M cycles, bake 168 hours
Tc= 70 to 100℃ 5K to 10K temp cycles
ENVIRONMENTAL
TESTS
Temperature cycles
1,010
1,051
68.2.14
A104
4.6.8.
-65/-40℃to 125/150°C, 1000 cycles
Thermal shocks
Temperature humidity bias
Highly accelerated stress test
1,011
1,052
68.2.14
A106A
A101B
A110B
4.6.8.
4.6.3.
4.6.3.
-65/-40℃to 125/150°C, 500 shocks
85℃ 85% RH 1000 hours
130℃ 85% RH 96 to 168 hours
Pressure cooker (autoclave)
121℃ 2atm./133℃ 3atm. 96 to
240 hrs
A102B
Moisture resistance
1,004
1,021
Salt atmosphere
1,009
1,041
68.2.11
A107A
Mechanical shock
Vibration variable frequency
Constant acceleration
2,002
2,007
2,001
2,016
2,056
2,006
68.2.27
68.2.6
68.2.7
B104A
4.6.4.
4.6.5.
4.6.7.
1500 G 0.5 msec.
20 Hz to 20 kHz 20G
30.000 G 1 minute, Y1 direction
Lead integrity
2,004
2,036
68.2.21
B105
4.6.12.
Tensile tests, package dependant
4.6.10.
215 to 245℃3 to 5 seconds
SMD devices, with preconditioning
4.4
3 Immersion conditions
10 cycles 25 to 65℃ RH = 90 to 98%
10 to 50 gr of NaCl/metres 2 @ 35℃
MECHANICAL
TESTS
BOARD ASSEMBLY RELATED
TESTS
Solderability
Resistance to solder heat
2,003
Resistance to solvents
2,015
2,023
68.2.20
B102B
J-Std-020
68.2.45
B107A