SEMIPOWER SW1N60L

SAMWIN
SW1N60L
N-channel MOSFET
Features
BVDSS : 600V
TO-92
ID
■ High ruggedness
■ RDS(ON) (Max 23 Ω)@VGS=10V
■ Gate Charge (Max 4.5nC)
■ Improved dv/dt Capability
■ 100% Avalanche Tested
: 0.3A
RDS(ON) : 23ohm
1
2
2
3
1. Gate 2. Drain 3. Source
1
General Description
3
This power MOSFET is produced with advanced VDMOS technology of SAMWIN.
This technology enable power MOSFET to have better characteristics,
such as fast switching time, low on resistance, low gate charge and especially
excellent avalanche characteristics. This power MOSFET is usually used
at AC adaptors and SMPS.
Order Codes
Item
1
Sales Type
SW C 1N60L
Marking
SW1N60L
Package
TO-92
Packaging
TAPE
Absolute maximum ratings
Symbol
VDSS
ID
Parameter
Drain to Source Voltage
Value
Unit
600
V
Continuous Drain Current
(@TC=25oC)
0.3
A
Continuous Drain Current
(@TC=100oC)
0.18
A
1.2
A
± 30
V
IDM
Drain current pulsed
VGS
Gate to Source Voltage
EAS
Single pulsed Avalanche Energy
(note 2)
33
mJ
EAR
Repetitive Avalanche Energy
(note 1)
0.3
mJ
dv/dt
Peak diode Recovery dv/dt
(note 3)
4.5
V/ns
1
W
0.02
W/oC
-55 ~ + 150
oC
300
oC
Value
Unit
PD
TSTG, TJ
TL
(note 1)
Total power dissipation (@TC=25oC)
Derating Factor above 25oC
Operating Junction Temperature & Storage Temperature
Maximum Lead Temperature for soldering
purpose, 1/8 from Case for 5 seconds.
Thermal characteristics
Symbol
Parameter
RthCL
Thermal resistance, Junction to Lead Max
50
oC/W
RthjA
Thermal resistance, Junction to ambient
140
oC/W
Mar. 2011. Rev. 2.0
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SAMWIN
SW1N60L
Electrical characteristic ( TC = 25oC unless otherwise specified
Symbol
Parameter
Test conditions
Min.
Typ.
Max.
Unit
VGS=0V, ID=250uA
600
-
-
V
VDS=600V, VGS=0V
-
-
1
uA
-
-
10
uA
Off characteristics
BVDSS
IDSS
Drain to source breakdown voltage
Drain to source leakage current
VDS=480V,
TC=125oC
Gate to source leakage current, forward
VGS=30V, VDS=0V
-
-
100
nA
Gate to source leakage current, reverse
VGS=-30V, VDS=0V
-
-
-100
nA
3.0
-
4.5
V
23
Ω
IGSS
On characteristics
VGS(TH)
Gate threshold voltage
VDS=VGS, ID=50uA
RDS(ON)
Drain to source on state resistance
VGS=10V, ID = 0.2A
Dynamic characteristics
Ciss
Input capacitance
-
60
Coss
Output capacitance
-
12
Crss
Reverse transfer capacitance
-
3
td(on)
Turn on delay time
-
12
-
11
-
40
Fall time
-
18
Qg
Total gate charge
-
4.5
Qgs
Gate-source charge
-
1
-
Qgd
Gate-drain charge
-
3.5
-
Min.
Typ.
Max.
Unit
-
-
0.3
A
-
-
1.2
A
tr
td(off)
tf
Rising time
Turn off delay time
VGS=0V, VDS=25V, f=1MHz
VDS=300V, ID=0.3A, RG=25Ω
VDS=480V, VGS=10V, ID=0.3A
pF
ns
nC
Source to drain diode ratings characteristics
Symbol
Parameter
Test conditions
IS
Continuous source current
ISM
Pulsed source current
Integral reverse p-n Junction
diode in the MOSFET
VSD
Diode forward voltage drop.
IS=0.3A, VGS=0V
-
-
1.5
V
Trr
Reverse recovery time
-
112
-
ns
Qrr
Breakdown voltage temperature
IS=0.3A, VGS=0V,
dIF/dt=100A/us
-
0.3
-
uC
※. Notes
1.
Repeatitive rating : pulse width limited by junction temperature.
2.
L = 92mH, IAS = 0.3A, VDD = 50V, RG=25Ω, Starting TJ = 25oC
3.
ISD ≤ 0.3A, di/dt = 100A/us, VDD ≤ BVDSS, Staring TJ =25oC
4.
Pulse Test : Pulse Width ≤ 300us, duty cycle ≤ 2%
5.
Essentially independent of operating temperature.
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SAMWIN
SW1N60L
Fig. 1. On-state characteristics
Fig. 2. Transfer characteristics
VGS
15.0 V
10.0 V
8.0 V
7.0 V
6.5 V
6.0 V
Bottom : 5.5 V
0
ID , Drain Current [A]
10
ID , Drain Current [A]
Top :
-1
10
0
10
o
150 C
o
25 C
o
-55 C
※ Notes :
※ Notes :
1. 250μs Pulse Test
2. TC = 25℃
-2
10
1. VDS = 50V
2. 250μs Pulse Test
-1
10
-1
0
10
2
1
10
10
4
6
8
10
VGS, Gate-Source Voltage [V]
VDS, Drain-Source Voltage [V]
Fig. 3. On-resistance variation vs.
drain current and gate voltage
Fig. 4. On state current vs.
diode forward voltage
35
30
IDR, Reverse Drain Current [A]
RDS(ON),
Drain-Source On-Resistance [¥‫]ط‬
40
VGS = 10V
25
20
15
VGS = 20V
10
5
0
0.00
،‫ ط‬Note : TJ = 25،‫ة‬
0
10
150،‫ة‬
25،‫ة‬
،‫ ط‬Notes :
1. VGS = 0V
2. 250¥‫ى‬s Pulse Test
-1
10
0.25
0.50
0.75
1.00
ID, Drain Current [A]
Fig. 5. Capacitance characteristics
(Non-Repetitive)
1.25
1.50
0.2
0.4
0.6
0.8
1.0
1.2
1.4
1.6
VSD, Source-Drain voltage [V]
Fig. 6. Gate charge characteristics
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SAMWIN
SW1N60L
Fig 7. Breakdown Voltage Variation
vs. Junction Temperature
Fig. 8. On resistance variation
vs. junction temperature
3.0
RDS(on), (Normalized)
1.1
1.0
0.9
،‫ ط‬Notes :
1. VGS = 0 V
2. ID = 250 ¥‫ى‬A
0.8
-100
-50
0
50
100
150
200
o
Drain-Source On-Resistance
BVDSS, (Normalized)
Drain-Source Breakdown Voltage
1.2
2.5
2.0
1.5
1.0
،‫ ط‬Notes :
1. VGS = 10 V
0.5
2. ID = 0.5 A
0.0
-100
-50
0
50
100
150
200
o
TJ, Junction Temperature [ C]
TJ, Junction Temperature [ C]
Fig. 9. Maximum drain current vs.
case temperature.
Fig. 10. Maximum safe operating area
ID' Drain Current [A]
0.4
0.3
0.2
0.1
0.0
25
50
75
100
125
150
o
TC' Case Temperature [ C]
Fig. 11. Transient thermal response curve
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SAMWIN
SW1N60L
Fig. 12. Gate charge test circuit & waveform
VGS
Same type
as DUT
QG
VDS
QGD
QGS
DUT
VGS
1mA
Charge
Fig. 13. Switching time test circuit & waveform
VDS
RL
RG
90%
VDS
VDD
VIN
10VIN
DUT
10%
10%
td(on)
td(off)
tr
tON
tf
tOFF
Fig. 14. Unclamped Inductive switching test circuit & waveform
1
EAS =
L
BVDSS
IAS
BVDSS - VDD
IAS
VDS
RG
2
BVDSS
L X IAS2 X
VDD
ID(t)
10VIN
DUT
VDS(t)
tp
time
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SAMWIN
SW1N60L
Fig. 15. Peak diode recovery dv/dt test circuit & waveform
DUT
+ V
DS
10V
VGS (DRIVER)
L
IS
di/dt
IS (DUT)
IRM
VDS
RG
10VGS
Diode reverse current
VDD
Diode recovery dv/dt
Same type
as DUT
VDS (DUT)
*. dv/dt controlled by RG
*. Is controlled by pulse period
VF
VDD
Body diode forward voltage drop
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SAMWIN
SW1N60L
REVISION HISTORY
Revision No.
Changed Characteristics
Responsible
Date
Issuer
REV 1.0
Origination, First Release
Alice Nie
2007.12.05
XZQ
REV 2.0
Updated the format of datasheet and added
Order Codes.
Alice Nie
2011.03.24
XZQ
WWW.SEMIPOWER.COM.CN
西安芯派电子科技有限公司
深圳市南方芯源科技有限公司
地址:西安市高新区高新一路25号创新大厦MF6
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