MAAM26100
GaAs MMIC Power Amplifier
2.0 - 6.5 GHz
Rev. V7
Die
Features
Saturated Power: 30.5 dBm Typical
Gain: 19 dB Typical
Power Added Efficiency: 30%
On-Chip Bias Network
DC Decoupled RF Input and Output
RoHS* Compliant
Description
The MAAM26100 is a GaAs MMIC two stage high
efficiency power amplifier. The MAAM26100 is a
fully monolithic design which eliminates the need for
external circuitry in 50-ohm systems.
The MAAM26100 is ideally suited for driver
amplifiers and transmitter outputs in UMTS
applications, test equipment, electronic warfare
jammers, missile subsystems and phased array
radars.
The MAAM26100 is fabricated using a
mature 0.5-micron gate length GaAs process. The
process features full passivation for increased
performance reliability.
Ordering Information
Part Number
Package
MAAM26100
Die
Absolute Maximum Ratings 1,2
Parameter
Absolute Maximum
VDD
+9 V
VG1, VG2
-2.5 V to -0.8 V
VGG3
-6 V to -3 V
RF Input Power
+17 dBm
Channel Temperature
150°C
Storage Temperature
-65°C to +150°C
1. Exceeding any one or combination of these limits may cause
permanent damage to this device and will void product
warranty.
2. M/A-COM does not recommend sustained operation near
these survivability limits.
3. VGG rating applies when using the optional on-chip resistor
network.
1
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MAAM26100
GaAs MMIC Power Amplifier
2.0 - 6.5 GHz
Rev. V7
Electrical Specifications: TA = 25°C, Z0 = 50 Ω, VDD = +8 V, VGG = -1.3 V nominal
Parameter
Test Conditions
Units
Min.
Typ.
Max.
Small Signal Gain
2 - 6 GHz
dB
15
19
—
Input VSWR
2 - 6 GHz
Ratio
-—
2.0:1
—
Output VSWR
2 - 6 GHz
Ratio
—
2.2:1
—
Saturated Output Power
Input Power +14 dBm, 2 - 6 GHz
dBm
29
30.5
—
Output Power at 1 dB Gain
Compression
2 - 6 GHz
dBm
—
28
—
Power Added Efficiency
—
%
—
30
—
Third Order Intercept
2 - 6 GHz
dBm
—
39
—
Reverse Isolation
2 - 6 GHz
dB
—
30
—
Bias Current
No RF
PIN = +14 dBm
mA
mA
—
—
390
475
—
650
Thermal Resistance 4
—
°C/W
—
14
—
4. Attachment method not included.
Schematic
VD1
VGG
VG2
GND
VD2
RF OUT
RF IN
VG1
E1
D1
C1
B1
A1
VG2
GND
E2
D2
C2
B2
A2
2
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Visit www.macom.com for additional data sheets and product information.
For further information and support please visit:
https://www.macom.com/support
MAAM26100
GaAs MMIC Power Amplifier
2.0 - 6.5 GHz
Rev. V7
Typical Performance Curves
Gain
Input Return Loss
0
25
-5
20
-10
15
-15
10
-20
5
-25
1.5
2.5
3.5
4.5
5.5
6.5
7.5
0
1.5
2.5
50
34
40
32
30
30
20
28
10
26
3.5
4.5
5.5
Frequency (GHz)
5.5
6.5
7.5
6.5
7.5
Output Power @ PIN = +14 dBm
Power Added Efficiency @ PIN = +14 dBm
2.5
4.5
Frequency (GHz)
Frequency (GHz)
0
1.5
3.5
6.5
7.5
24
1.5
2.5
3.5
4.5
5.5
Frequency (GHz)
3
M/A-COM Technology Solutions Inc. (MACOM) and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice.
Visit www.macom.com for additional data sheets and product information.
For further information and support please visit:
https://www.macom.com/support
MAAM26100
GaAs MMIC Power Amplifier
2.0 - 6.5 GHz
Handling Procedures
Rev. V7
Typical Bias Configuration 5,6
Permanent damage to the MAAM26100 may occur
if the following precautions are not adhered to:
A. Cleanliness - The MAAM26100 should be handled in a clean environment. DO NOT attempt
to clean assembly after the MAAM26100 is
installed.
B. Static Sensitivity - All die handling equipment
and personnel should comply with DOD-STD1686 Class I.
C. Transients - Avoid instrument and power supply transients while bias is connected to the
MAAM26100. Use shielded signal and bias
cables to minimize inductive pick-up.
D. General Handling - DO NOT touch the surface
of the die.
It is recommended that the
MAAM26100 die be handled along the long
side with a sharp pair of tweezers.
Mounting
The MAAM26100 is back-metallized with Pd/Ni/Au
(100/1,000/30,000Å) metallization. It is recommended that the die be mounted with Au/Sn eutectic preforms. The attachment surface should be
clean and flat.
A. An 80/20 preform is recommended with a work
surface temperature of approximately 255°C
and a tool temperature of 265°C. When hot
90/5 nitrogen/hydrogen gas is applied, solder
temperature should be approximately 290°C.
B. DO NOT expose the MAAM26100 to a temperature greater than 320°C for more than 20
seconds. No more than 3 seconds of scrubbing should be required for attachment.
VDD
(VD1, VD2)
1000 pF minimum
RF OUT
RF IN
VGG
(VG1, VG2)
5. Nominal bias is obtained by first connecting -1.3 volts to pads
VG1 and VG2 followed by connecting +8 volts to pads VD1 and
VD2 (note sequence).
6. The recommended VDD range is +6 to +9 volts.
Bonding Table7
Bin #
Bond Pads
1
E1 to VG1, E2 to VG2
2
D1 to VG1, D2 to VG2
3
C1 to VG1, C2 to VG2
4
B1 to VG1, B2 to VG2
7. Optional on-chip resistor networks are used by connecting a
nominal -5 volts to the pad VGG then connecting pads per
the bonding table.
Each gel pack is labeled with a CD # which corresponds to a
Bin # in the bonding table. For example, CD1 on the gel
pack corresponds to Bin 1, which means that pad E1 must
be connected to pad VG1 and pad E2 must be connected to
pad VG2.
Bonding
A. Ball or wedge bond with 1.0 mil diameter gold
wire of 3.0 mil x 0.5 mil ribbon. Thermosonic
bonding with a nominal stage temperature of
150°C and a ball bonding force of 40 to 50
grams or wedge bonding force of 18 to 22
grams is recommended. Ultrasonic energy and
time should be adjusted to the minimum levels
necessary to achieve reliable bonds.
B. Bonds should be started on the die and terminated on the package.
C. Bonding pads are 4.0 x 4.0 mils minimum.
4
M/A-COM Technology Solutions Inc. (MACOM) and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice.
Visit www.macom.com for additional data sheets and product information.
For further information and support please visit:
https://www.macom.com/support
MAAM26100
GaAs MMIC Power Amplifier
2.0 - 6.5 GHz
Rev. V7
Outline Drawing
3
4
5
6
7
28
9
27
10
22
24
23
21
26
20
13
14
19
12
15
11
16
17
Pad Configuration 8
Die Size: 2.342 x 1.802 x 0.102 mm (nominal)
Pad No.
X (mm) Y (mm)
nominal nominal
Pad Size
(mm)
Description
Pad No.
X (mm) Y (mm)
nominal nominal
Pad Size
(mm)
Description
3
0
0
.10 x .10
VD1
16
1.613
1.580
.10 x .10
A2
4
0.6435
0
.10 x .10
VGG
17
1.942
1.580
.10 x .10
GND
5
0.9235
0
.10 x .10
VG2
19
0.5525
1.580
.10 x .10
A1
6
1.0885
0
.15 x .10
GND
20
0.5025
1.420
.10 x .10
B1
7
1.954
0
.15 x .10
VD2
21
0.3525
1.380
.10 x .10
C1
9
1.979
0.640
.10 x .10
GND
22
0.2025
1.420
.10 x .10
D1
10
1.979
0.840
.10 x .20
RFOUT
23
0.1525
1.580
.10 x .10
E1
11
1.564
1.420
.10 x .10
B2
24
0.0025
1.580
.10 x .10
GND
12
1.413
1.380
.10 x .10
C2
26
0.3525
1.580
.10 x .10
VG1
13
1.263
1.420
.10 x .10
D2
27
-0.141
0.840
.10 x .20
RFIN
14
1.213
1.580
.15 x .10
E2
28
-0.141
0.640
.10 x .10
GND
15
1.413
1.580
.15 x .10
VG2
8. All X,Y locations are at pad center.
5
M/A-COM Technology Solutions Inc. (MACOM) and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice.
Visit www.macom.com for additional data sheets and product information.
For further information and support please visit:
https://www.macom.com/support
MAAM26100
GaAs MMIC Power Amplifier
2.0 - 6.5 GHz
Rev. V7
M/A-COM Technology Solutions Inc. All rights reserved.
Information in this document is provided in connection with M/A-COM Technology Solutions Inc ("MACOM")
products. These materials are provided by MACOM as a service to its customers and may be used for
informational purposes only. Except as provided in MACOM's Terms and Conditions of Sale for such products or
in any separate agreement related to this document, MACOM assumes no liability whatsoever. MACOM
assumes no responsibility for errors or omissions in these materials. MACOM may make changes to
specifications and product descriptions at any time, without notice. MACOM makes no commitment to update
the information and shall have no responsibility whatsoever for conflicts or incompatibilities arising from future
changes to its specifications and product descriptions. No license, express or implied, by estoppels or otherwise,
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6
M/A-COM Technology Solutions Inc. (MACOM) and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice.
Visit www.macom.com for additional data sheets and product information.
For further information and support please visit:
https://www.macom.com/support