Space Products Semelab products and processes for space applications SEMELAB | experience and innovation 2 Contents 1. Introduction ....................................................................................................................... 4 2. Programmes Supported . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .5 3. Innovations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .6 3.1 Improving the Space Weather Forecast with the LCC1- 4 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .6 3.2 SoLaRfets – Radiation Tolerant MosFETS ..................................................................... 7 3.3 Si3N4 via technology . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .7 3.4 Wide-Bandgap devices ................................................................................................. 8 3.5 Diode – Leadless Chip Carriers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .9 3.6 Diamond Substrate . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .9 4. Hi-Rel COTS – Commercial Considerations 5. Product Range .................................................................. 10 ................................................................................................................. 11 6. Package Drawings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .15 The following sections are extracted from Semelab document ‘High Reliability and Screening Applications’ available at www.semelab.com/sml_downloads. 9. MIL-PRF-19500 - QR216, QR217 (Space) ...................................................................... 17 9.1 Space Level Processed Discrete Semiconductors (QR216, QR217) . . . . . . . . . . . . . . . . . . . . . . . . . . .17 9.2 QR217 - Inspection levels:‘Space Level Processed’ Conformance 18 ............................ 9.3 QR216 - Screening: Space Level Processed’ Components . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .20 10. ESA - ESCC (Space) .......................................................................................................... 10.1 Chart F2 - Production Control 10.2 Chart F3 - Screening Tests 21 ................................................................................. 22 ....................................................................................... 23 10.3 Chart F4 - Qualification and Periodic Tests 11. Screening & Approval Comparison Tables 24 ............................................................. .................................................................. 25 11.1 Comparison of Space Level Screening Options . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .25 11.2 Comparison of Space Level Die Lot Approval Procedures . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .26 11.3 Comparison of High-Rel Screening Options . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .27 Issue 2 - (DMD) - 05/08 3 1. Introduction Experience and Innovation In Semiconductor Technology At SEMELAB, we research, design, manufacture and distribute an innovative range of semiconductor products throughout the world. Our R&D teams have an excellent track record for developing imaginative electronic solutions and our design engineers have created a wealth of high performance products. Our manufacturing divisions have ensured supreme quality and reliability. And our sales teams and distribution partners have opened international markets to some of the best electronics solutions available. Semelab has many years experience of the design and manufacture of supplying semiconductor solutions for use in space applications. All design and manufacturing is carried out in Semelab’s UK custom built facility. There are a wide range of discrete semiconductors available: Bipolar, SoLaRfets, MOSfets, Jfets, Linear Regulators and Diodes. These are available in many different package options: small ceramic surface mount; multi pad ceramic surface mount; power ceramic, metal hermetic packages. Details of the different package outlines and range of products are included in the following pages. Also available are a range of standard and custom MCAs (Multi Chip Arrays). These integrate several semiconductor die or other components into one package to provide a light weight, space saving and improved-reliability alternative to discrete circuits. There are a range of package styles available for small signal and power applications. These are cost effective solutions with little or no NRE and similar lead times to standard discrete products. The different package styles are included in the following pages. Example circuit based on Semelab MCAs (picture courtesy of Comdev) 4 2. Programmes Supported Over recent years many different Semelab products have been used in major Space programs including the following: ENVISAT LCC1, Small Signal IMMARSAT LCC1, Small Signal, TO18, High Speed Zener, Schottky Diode EMS LCC1 Small Signal ASTRA LCC1, LCC2, Small Signal (dual) SOHO CLUSTER J-Fets FIAR TO59 – Biploar power KOREA SAT LCC1, Small Signal, J-fets, Zener, Schottky Diodes SPOT / HELIOS LCC1, Small Signal, J-fets, Diodes SKYNET TO18 / TO39 – Small Signal ARTEMIS LCC1, LCC2, LCC4 ODYSSEY MCAs MIMR MCAs GLOBAL STAR MCAs - Analogue Arrays MSG MCAs METOP MCAs, Linear Regulators ROSETTA Small Signal LCC1 ATV T018 / 39 ISS Bipolar TO39 /TO66 , MCAs SMART 1 Digital voter circuit, Dual Bipolar, LCC2 RAINBOW MCA, Small Signal devices SIRAL Small Signal - JFET, LCC1 GALILEO MCA, Small Signal devices ARRIANE VEGA Power Module ALTIKA SoLaRfet©, MCA SKYNET MCA, Small Signal devices SENTINEL MCA, LCC1, SoLaRfet© (Power MOSfets), Small Signal devices BEPI-COLUMBO LCC1, Small Signal device 5 3. Innovations Semelab has always been at the forefront of innovation. For many years our R&D teams have been coming up with imaginative electronic and packaging solutions. Over the years many of these solutions have become incorporated into our standard range of products with a wide and extensive range of applications. This section gives details of some of our recent developments 3.1 Improving the Space Weather Forecast with the LCC1- 4 As spacecraft navigate the oceans of space, satellites encounter severe storms in a ‘similar’ way as Earth based ocean going vessels do. A documented phenomenon known as Deep Dielectric Discharge, associates high speed solar wind streams with the appearance of large numbers of highly energetic electrons in the magnetosphere. These high energy electrons are dangerous to the operation of the spacecraft as they bury themselves into dielectric materials deep within the satellite, (materials such as PCB materials, coaxial cables etc). The build-up of charge occurs when the total amount of high velocity electrons exceed 1MeV (1 Million electron Volts) during the storm event. The charge continues to build-up until the dielectric strength of the material is exceeded. Once this happens an instantaneous electrical discharge occurs, which is similar to a miniature lightening strike. This is a hazardous event capable of damaging semiconductor and other sensitive devices. Part of the solution is to incorporate design improvements to mitigate the effects of Deep Dielectric Discharge. Semelab are currently offering LCC1-4 (Leadless Chip Carrier Number 1, 4 pads), which is based on the ESA qualified ceramic chip carrier technology, but has an additional feature which electrically connects the metal lid of the discrete device, to an additional solder pad at the base of the package, so the lid can be electrically connected to a known potential, (usually ground), therefore conducting away the charge as it occurs. Deep Dielectric Discharge: LCC1- 4 package LCC1- 4 package – internal view The full range of products that are available in the standard LCC1 package are also available in the Deep Dielectric Discharge LCC1-4 package. Section 4 contains details of products supplied in the past. Contact Semelab Sales for further information. 6 3.2 SoLaRfets The Semelab SoLaRfet has been specifically developed to provide a radiation tolerant MosFET for use in space applications. The development is an extension of one of our existing MosFET processes which has been sold in high volumes over many years. The structure of the device has been modified to enhance the DC performance and give good SEU characteristics. The device is ideally suited for fast switching applications in harsh environments. Semelab have also made developments in the substrate and package technology to further optimise the performance of finished devices. Contact Semelab sales for further information. 110 ION LET ENERGY MeV Argon 14.1 150 42 Krypton 34 316 43 Xenon 55.9 459 43 100 90 80 VDS (V) 70 60 RANGE um Si Ar = 14.1 MeV mg-1 cm2 Kr = 34.0 MeV mg-1 cm2 Xe = 55.9 MeV mg-1 cm2 50 40 30 20 Argon Krypton Xenon 10 0 0 2 4 6 8 10 12 14 16 18 20 22 -VGS (V) Single Event Effect Safe Operating Area Radiation Tolerant MOSFET bridge in Si3N4 package 3.3 Si3N4 Via Technology Semelab have always been at the forefront of packaging technology, being the first to bring a number of what have now become industry standard packages to the market place. Semelab have also developed module packages (ie MCA, Power MCA and others) for combining a number of different discrete devices and/or technologies in a range of hybrid solutions. The benefits of Semelab’s modular solutions over discrete devices include: Higher density; Lighter weight; Easier interconnection; Little or No NRE; Lower cost; Fast turnaround & improved reliability. This trend continues with the recently introduced Si3N4 via technology module. The package combines state-ofthe-art Via technology with Si3N4 substrates to achieve high power performance without the use of glass seals. The package is semi-customable to enable multi-chip arrays based on circuit requirements. Example of the semi-customable Si3N4 7 3.4 Wide-Bandgap devices There has been much interest in Wide-bandgap semiconductor materials in recent years.Their exceptional electronic and thermal properties make them ideally suited to applications that require high temperature performance in a harsh environment. Semelab is the first European supplier to fully characterise Silicon Carbide Diodes up to 225 C. (see Semelab data sheet SML10SIC06-1NJC). The benefits of the technology can be clearly seen. Key benefits of Silicon Carbide diode include low on state losses (due to low VF and positive temperature coefficient); reduction in switching losses (due to Zero reverse recovery); high frequency operation and high-temperature performance. The combination of these benefits makes it possible to achieve higher performance in a smaller space when compared with standard Silicon devices. An additional benefit in space applications is the inherent rad-hardness of the device. 20 200 18 180 TJ = 25ºC 16 160 TJ = 75ºC 140 TJ = 175ºC IR Reverse Current (A) IF Forward Current (A) TJ = 125ºC 14 TJ = 225ºC 12 120 10 100 8 6 TJ = 25ºC TJ = 125ºC 60 TJ = 175ºC TJ = 225ºC 4 40 2 20 0 TJ = 75ºC 80 0 0 10 20 30 0 100 VF Forward Voltage (V) 200 300 400 500 600 VR Reverse Voltage (V) Fig 1. SML10SIC06-1NJC - VF performance Fig 2. SML10SIC06-1NJC - Tr Wide Bandgap device - Silicon Carbon Diode 8 700 800 900 3.5 Diode Leadless Chip Carriers (DLCC) Semelab have been supplying a range of devices (bipolar, MOSFET and diodes) in in the popular range of LCC (leadless chip carriers) packages for many years. A recent addition has been the development of the DLCC, a surface mount package specifically designed for diodes to achieve optimum performance and space utilization. The package is an alternative to existing standard packages currently available on the market. The first two packages in this range are the DLCC1 and the DLCC2. The DLCC1 and DLCC2 packages have been developed to cover the wide range of Small Signal and Medium Power Diode chip types which are used extensively in existing and new designs. Benefits of the packages include a grounded lid to address the problem associated with the ‘Deep Dielectric Discharge’ phenomenon (see 3.1 - Improving the Space Weather Forecast with the LCC1- 4); and castellated design to achieve better ‘meniscus witness’ for improved overall system reliability. 3.6 Diamond Substrates Semelab have many years experience in the supply of RF MOSFETs. The devices are manufactured using a unique silicon Vertical DMOS process with gold metalisation which gives high performance and maximum reliability at high power levels. The diamond substrate was originally developed for use in the RF product range to enhance the performance and reliability of the device even further. Both simulations and measurements have shown a considerable improvement in a number of areas. The most significant of these is the halving in value of the junction to case thermal resistance when compared with the Beryllium Oxide substrate normally used. Please contact Semelab sales for further information on the use of diamond substrates in products for space use and also for information on Hermetic RF products. Enhanced performance RF device using diamond substrate 9 4. Hi-Rel ‘COTS’ – Commercial Considerations For many years there has been talk of COTS (commercial-off-the-shelf ) products for space use. There has been much confusion over what this means. At Semelab we have only ever believed in supplying High-Reliability devices for use in space applications. However, there are a number of commercial considerations which can be applied enabling High-Rel products to be supplied in shorter lead times and at a lower overall contract cost. Semelab works with it’s customers to supply the most appropriate commercial solutions for the contract requirements, ensuring best value and continuity of supply. 4.1 Space Kanban Semelab can work with it’s customers to supply ‘kanban’ solutions to meet production requirements. By placing a longer term contract, all wafer or die can be procured and reserved ensuring consistency of product over the full production time frame. In addition a reduction of ancillary costs can be achieved by single lot radiation testing and SEM’s; and a reduction of the additional costs such as ‘pre-cap visual inspections’ and ‘buy offs’ by producing larger batch quantities. Semelab will then hold fully completed stock in it’s bonded stores against the customer contract, available for immediate call off. Invoicing for the product will be at the time of shipping. Contact the Semelab Sales Office for further information. Benefits of Space Kanban include: - single wafer lot production - reduced ancillary costs - scope for re-scheduling - invoicing at point of shipping. 4.2 ‘Off-the Shelf’ Product Semelab have a number of space products which are manufactured on a regular basis. The ongoing production of these parts means that there is often stock available ‘off-the-shelf’ for immediate delivery. These products are available processed to Semelab’s QR217 (Space Level Full Quality Conformance Inspection and QR216 (‘Space Level Discrete Component Screening). See Section 9 for full details of QR217, QR216. (Please note that in addition, LVT’s are sometimes available on these parts, but not always) Parts Include: 2N2222, 2N2369, 2N2484, 2N2857, 2N2894, 2N2907 2N4391, 2N4392, 2N4393 4.3 Wafer & Die Storage To ensure long term availability of product supply Semelab can procure any volume of wafer or die on behalf of a customer. This will then go through immediate qualification and be held in storage for the sole use of that customer. This practice has been successfully employed by Semelab for many years. 10 5. Product Range Semelab have provided many products types in the past for space applications: BIPOLAR: 2N2219A 2N2222A 2N2222ACSM TO39 TO18 LCC1 2N2222ADCSM LCC2 2N2369A TO18 2N2369ACSM LCC1 2N2369ADCSM 2N2484 2N2484CSM 2N2484DCSM 2N2857 LCC2 TO18 LCC1 LCC2 TO18 2N2857CSM 2N2880 2N2894 2N2894DCSM 2N2905A 2N2907A 2N2907ACSM LCC1 TO59 TO18 LCC2 TO39 TO18 LCC1 2N2907ADCSM LCC2 2N2908X 2N2920 2N2920A 2N2920ADCSM 2N3019 TO53 TO77 TO77 LCC2 TO39 2N3019CSM LCC1 2N3439 2N3467 TO39 TO39 ESCC 5201 003 02C ESCC 5201 002 01B (&C) ESCC 5201-002-05C 66-LC-0147 O1B TPR-12-034 MA500 AJB STR01-020-01 66-LC0147 LVL C SCC 5201 002 04B STR01-031 01B 66-LC-0190 02B ESCC 5201 006 05B ESCC 5201 006 04B RA.1201.009.10 RA.1201.017.10 TPR-12-032 66-LC-0173-01 LVL B ESCC 5201 006 04B (&C) ESCC 5201 006 05B RA.1201.009.10 RA.1201.017.10 TRP-12-032 66-LC-0173 01 LVL B (&C) MIL-PRF-19500/317 (QR216/7) SCC 5201 001 01B (&C) 66-LC-0170 LVL B 66-LC-0171 LVL B SC 5201 014 01B (&C) 66-LC-0168 66-LC 0176 ESCC 5203 025 ESCC 5201 014 01C QR216 & QR217 ESCC 5202 002 02B (&C) ESCC 5202 001 01B ESCC 5202 001 04B (&C) 66 LCO145 LVL B (&C) MA-5000-AJC STR-021-01 TPR-12-030 RA.1202.008.11A ESCC 5201 001 1000 017 576 66-LC0189 02B STR01-032 IGG-290-874 01B SCC 5207 002 02B (&02C) SCC 5207 002 03B SCC 5207 002 12B SCC 5201 011 02C SCC 5201 011 03B STR01-019-02B SCC 5201 011 02C SCC 5201 011 03B STR01-019-02B ESCC 5203 011 02B ESCC 5208 009 01 11 LCC1 LCC2 SMD1 TO257 TO18 TO39 2N3501 2N3637 2N3700CSM 2N3764 2N3765 2N3810 2N3810DCSM 2N3822 2N3906CSM 2N5153 2N5153SMD05 TO39 TO39 LCC1 TO18 TO46 TO77 LCC2 TO18 LCC1 TO39 SMD05 2N5153U 2N5154X 2N5154XSMD05 TO39 TO39 SMD05 2N5154XSMD1 2N5672 SMD1 TO3 2N5954 2N6849 2N918 BDS16 BDS18 BDS20 BUL54AH BUL54A-T257 FMMT92CSM TO66 TO39 TO72 TO257 TO257 TO257 TO5 TO257 LCC1 ESCC 5201 013 02B ESCC 5208 003 03B (&4B) ESCC 5201 004 04B MA.500.ACK IGG-221-724 ESCC 5207 005 02B (&1C) 66-LC0169 IGG-232-777-02 ESCC 5204 002 05B ESCC 5204 002 02B (&03B) SCC 5204 002 XX MIL-PRF-19500/545D (QR216/7) ESCC 5204 002 05B ESCC 5203 010 04B ESCC 5203 010 04B QR217 GPS A,B,C + QR216 QR217 GPS A,B,C + QR216 SCC 5203 004 03B 66-LC0131 IGG-221-826-01 ESCC 5206 003 01C ESCC 5201 009 01B T-120-01B (&1C) T-121-01B (&1C) SAH 0046-G200-W2 RA.1203.004.10-11 RA.1203.003.10-12 RA.1202.006.11 LCC6 LCC6 LCC20 LCC20 LCC20 LCC20 LCC20 LCC6 LCC6 LCC6 LCC6 LCC6 LCC6 LCC6 LCC6 LCC6 LCC6 LCC6 LCC6 LCC6 LCC6 LCC6 LCC20 LCC6 LCC6 LCC6 MCA 0102 TC - CDP 9.19 MCA 0102 UC - CDP 9.19 MCA 0102 VC - CDP 9.19 MCA 0102 WC - CDP 9.19 MCA 0102 1C - CDP 9.19 MCA 0102 2C - CDP 9.19 MCA 0102 3C - CDP 9.19 SE5000 / MCA0301 -01 SE5000 / MCA0301 -02 SE5000 / MCA0301 -03 SE5000 / MCA0301 -04 SE5000 / MCA0301 -05 SE5000 / MCA0301 -06 SE5000 / MCA0301 -07 SE5000 / MCA0301 -08 SE5000 / MCA0301 -09 SE5000 / MCA0301 -10 SE5000 / MCA0301 -11 SE5000 / MCA0301 -12 SE5000 / MCA0301 -13 SE5000 / MCA0301 -14 SE5000 / MCA0301 -15 IGG-160-1474-02C SCD 201366-1 SCD 201366-3 SCD 201366-5 LCC1 LCC2 SMD1 MCA’S MCA0102/T MCA0102/U MCA0102/V MCA0102/W MCA0102/X MCA0102/Y MCA0102/Z MCA0301/A2 MCA0301/B MCA0301/C2 MCA0301/D MCA0301/E MCA0301/F MCA0301/G MCA0301/H MCA0301/J MCA0301/K MCA0301/L MCA0301/M MCA0301/N MCA0301/P MCA0301/Q MCA0401/1 MCA0616/1 MCA0616/2 MCA0616/3 12 LCC6 LCC20 MCA0625/1 MCA0625/2 MCA0625/3 MCA0625/4 MCA0627/1 MCA0627/3 MCA2696/1 MCA2696/2 MCA2696/3 MCA2696/4 MCA2696/5 MCA2696/A2 MCA2696/B MCA2696/C2 MCA2696/D MCA2696/E MCA2696/F MCA2696/G MCA2696/H MCA2696/J MCA2696/L MCA2703/1 MCA3201/1A MCA3201/1B MCA3201/2B MCA3201/3A MCA3201/3B MCA3201/4B MCA4003/1 MCA4003/2 MCA4003/3 MCA5001/5 LCC20 LCC20 LCC20 LCC6 LCC6 LCC6 LCC6 LCC6 LCC6 LCC6 LCC6 LCC6 LCC6 LCC6 LCC6 LCC6 LCC6 LCC6 LCC6 LCC6 LCC6 LCC16 LCC6 LCC6 LCC20 LCC6 LCC6 LCC20 LCC20 LCC6 LCC6 LCC6 SCD 201366-7 SCD 201366-9 SCD 201366-11 SCD 201366-13 SCD 201366-15 SCD 201366-17 RA.0812.002.11B RA.0812.002.12B RA.0812.002.13B RA.0812.002.14B RA.0812.002.15B TL-AM-1201-16B TL-AM-1201-17B TL-AM-1201-18B TL-AM-1201-19B TL-AM-1201-20B TL-AM-1201-21B TL-AM-1201-22B TL-AM-1201-23B TL-AM-1201-24B TL-AM-1201-25B 96-LC0071-01 CDP 9.90.01 CDP 9.90.02 CDP 9.90.04 CDP 9.90.05 CDP 9.90.06 CDP 9.90.07 SCD-200301-1 SCD-157592-3 SCD-157603-5 SCD 157592-1 1N4003Q 1N4148 LCC2 LCC1 1N4150 1N4151 1N4572 1N4626 1N5617 1N5711 45CKQ100 60CKQ045 BAS70 BAT54 LCC1 LCC1 LCC1 LCC1 LCC1 LCC1 TO258 TO258 LCC1 LCC1 BZX55C15 LCC1 BZX55C33 BZX55C3V3 LCC1 LCC1 BZX55C3V9 BZX55C5V6 LCC1 LCC1 65-LC-0124 65-LC-0119 SCD 157769 TPR-04-066 65-LC-0134-01 65-LC-0134-02 65-LC-0132-08 65-LC-0145-01 65-LC-0133 QR217 GPS A,B,C QR216 PO-PS-IGG-PL-0100 PO-PS-IGG-PL-0063 SCD 201444-01 65-LC0118 PO-PS-IGG-PL-0189 SCD 157558 (CDP926E O1) 65-LC-0120-20 TPR-04-059-20 65-LC0120-28 65-LC0120-04 TPR-04-059-04 65-LC-0120-06 65-LC-0120-10 LCC6 LCC20 DIODES 13 LCC1 LCC2 TO258 BZX55C7V5 HP5082-2800 HP5082-2810 MP2835 LCC1 LCC1 LCC1 LCC1 65-LC-0120-13 65-LC-0136-01 (&02) 65-LC-0135-01 (&02) 65-LC-0150 2N4391 TO18 2N4392 2N4392CSM TO18 LCC1 2N4393 2N4393CSM TO18 LCC1 2N4416 2N5116 TO72 TO18 ESCC 5205 003 01B (&01C) MA 5000 AKW 01B 66-LC-0197 ESCC 5205 003 02B (&02C) ESCC 5205 003 02B RA.1205.071.10 TL-AM-023 30600050/022 ESCC 5205 003 03B (&03C) 65-LC-0153-01B 97 30600051/022 ESCC 5205 004 01B (&01C) 66-LC-0180-01 TO39 cer-dip TO257 TO257 TO257 ESCC 5206 003 01B (&C) INM-232-312 INM-232-313 IGG-232-394 INM-232-314 TO39 T257 LCC4 ESCC 9102 005 06B 44-LC-0152 TLAM 0814 03B SML150FBH12ESA custom SML150HBH06ESA custom 150A 1200V IGBT Hermetic Module 150A 600V 3 phase IGBT Bridge - Hermetic Module LCC1 JFETS LCC1 TO18 MOSFETS 2N6849 IRFG110 IRFY044 IRFY140 IRFY240 TO257 REGULATORS LM117H LM137 LM137 LCC4 MODULES SoLaRfet SFA001 custom SML12SF24SMD SMD1 Radiation Tolerant MOSFET bridge in Si3N4 package Radiation Tolerant FET 14 6. Package Drawings 0.31 rad. (0.012) 2.54 ± 0.13 (0.10 ± 0.005) 0.76 ± 0.15 (0.03 ± 0.006) 2 1 1.91 ± 0.10 (0.075 ± 0.004) 3.05 ± 0.13 (0.12 ± 0.005) A= 3 2 1 4 A 6 0.23 rad. (0.009) 5 A 0.31 rad. (0.012) A = 1.27 ± 0.13 (0.05 ± 0.005) 6.22 ± 0.13 (0.245 ± 0.005) 1.40 (0.055) max. 1.02 ± 0.10 (0.04 ± 0.004) LCC1 1.40 ± 0.15 (0.055 ± 0.006) 1.65 ± 0.13 (0.065 ± 0.005) 4.32 ± 0.13 (0.170 ± 0.005) 2.29 ± 0.20 (0.09 ± 0.008) 3 0.64 ± 0.06 (0.025 ± 0.003) 2.54 ± 0.13 (0.10 ± 0.005) 0.51 ± 0.10 (0.02 ± 0.004) LCC2 1.40 ± 0.15 (0.055 ± 0.006) 5.59 ± 0.13 (0.22 ± 0.005) 9.14 (0.360) 8.64 (0.340) 1.27 (0.050) 1.07 (0.040) # 2.16 (0.085) 12 13 14 15 16 0.25 ± 0.03 (0.01 ± 0.001) 3 1.27 ± 0.05 (0.05 ± 0.002) 0.23 rad. (0.009) 0.64 ± 0.08 (0.025 ± 0.003) 2 4 1 7.62 (0.300) 7.12 (0.280) 0.23 min. (0.009) 11 17 10 18 9 1 8 2 7 6 5 4 0.33 (0.013) Rad. 0.08 (0.003) 3 2.03 ± 0.20 (0.08 ± 0.008) 1.02 ± 0.20 (0.04 ± 0.008) LCC3 0.43 (0.017) 0.18 (0.007 Rad. 1.65 (0.065) 1.40 (0.055) 1.39 (0.055) 1.15 (0.045) LCC4 0.30 (0.012) Rad. 4 plcs 8.89 (0.350) 12 13 14 15 9.09 (0.358) 8.69 (0.342) 1.14 – 0.15 (0.045 – 0.006) 19 16 11 18 10 9 1 2 8 7 6 5 4 20 3 1 18 17 0.23 (0.009) Rad. 18 plcs 4 0.711 (0.028) 0.559 (0.022) 9.09 (0.358) 8.69 (0.342) 0.65 (0.025) typ. 1.27 (0.050) typ. 7.24 (0.285) 0.76 (0.030) 0.51 (0.020) 14 3 8 13 2.54 (0.100) 1.14(0.045) typ 2.36 (0.093) 1.96 (0.077) 3.81 ± 0.13 (0.15 ± 0.005) 1.39 (0.055) 1.02 (0.040) 1.40 (0.055) Nom. 9 1.39 (0.055) 2.54 (0.064) 1.52 (0.100) 1.15( 0.045) Dimensions in mm (inches) LCC6/8/18 LCC20 7.54 (0.296) 0.89 (0.035) min. 2.41 (0.095) 2.41 (0.095) 10.69 (0.421) 10.39 (0.409) 5.72 (.225) 2 0.76 (0.030) min. 3 10.16 (0.400) 1 0.76 (0.030) min. 3.05 (0.120) 0.127 (0.005) 3.70 (0.146) 3.41 (0.134) 3.175 (0.125) Max. 4.14 (0.163) 3.84 (0.151) min. 3.70 (0.146) 3.41 (0.134) 1 3.60 (0.142) Max. 3 2 16.02 (0.631) 15.73 (0.619) 0.76 (0.030) 0.127 (0.005) 0.127 (0.005) 16 PLCS 0.50(0.020) 7.26 (0.286) 9.67 (0.381) 9.38 (0.369) 0.50 (0.020) max. 11.58 (0.456) 11.28 (0.444) SMD05 SMD1 15 0.50 (0.020) 0.26 (0.010) Package Drawings 13.59 (0.535) 13.84 (0.545) 6.32 (0.249) 6.60 (0.260) 1.02 (0.040) 1.27 (0.050) 30.35 (1.195) 31.40 (1.235) 16.89 (0.665) 17.40 (0.685) 13.59 (0.535) 13.84 (0.545) 20.07 (0.790) 20.32 (0.800) 3.53 (0.139) Dia. 3.78 (0.149) 1 2 3 0.89 (0.035) 1.14 (0.045) TO257 TO254 6.86 (0.270) 6.09 (0.240) 2 19.05 (0.750) 12.70 (0.500) 1 12.7 (0.500) min. 5.08 (0.200) BSC 5.84 (0.230) 5.31 (0.209) 4.95 (0.195) 4.52 (0.178) 21.21 (0.835) 20.70 (0.815) 2.54 (0.100) Nom. 4.19 (0.165) 3.94 (0.155) Dia. 1 2 3 0.48 (0.019) 0.41 (0.016) dia. 1.14 (0.707) 0.88 (0.035) 3 17.96 (0.707) 17.70 (0.697) 17.65 (0.695) 17.39 (0.685) 13.84 (0.545) 13.58 (0.535) 3.81 (0.150) BSC 3.81 (0.150) BSC 5.33 (0.210) 4.32 (0.170) 3.56 (0.140) BSC 1.65 (0.065) 1.39 (0.055) Typ. TO258 TO18 38.00 (1.5) min. 6.35 (0.25) 9.15 (0.36) 10.67 (0.42) 11.18 (0.44) 1.52 (0.06) 3.43 (0.135) 1 2 22.23 (0.875) max. 0.97 (0.060) 1.10 (0.043) 16.64 (0.655) 17.15 (0.675) 38.61 (1.52) 39.12 (1.54) 8.51 (0.34) 9.40 (0.37) 3 7.75 (0.305) 8.51 (0.335) 2 5.08 (0.200) typ. 1 29.9 (1.177) 30.4 (1.197) 0.41 (0.016) 0.53 (0.021) dia. 45° 0.89 max. (0.035) 0.71 (0.028) 0.86 (0.034) 0.74 (0.029) 1.14 (0.045) 6.10 (0.240) 6.60 (0.260) 25.15 (0.99) 26.67 (1.05) 3 (case) 2.54 (0.100) 3.84 (0.151) 4.09 (0.161) 7.92 (0.312) 12.70 (0.50) TO5 TO3 40.76 37.97 35.70 25.00 27.27 32.80 25.43 34.34 2.54 11 PLCS 5.02 27.940 3.955 2.430 0.780 PIN 1 IDENT 7.745 3.20 3.83 2.50 DIMENSIONS IN mm TOLERANCE ± 0.125 mm SM Power MCA Power MCA 16 Ø0.570-0.650 9. MIL-PRF-19500 – QR216, QR217 (Space) 9.1 Space Level Processed Discrete Semiconductors (MIL-PRF-19500) QR217: ‘Space Level’ Full Quality Conformance Inspection. QR216: ‘Space Level’ Discrete Component Screening SEMELAB’s QR217 and QR216 processing specifications, in conjunction with the company’s ISO 9001:2000 approval present a viable alternative to American MIL-PRF-19500 space level parts supplied from a European manufacturer. QR217 (quality conformance) is based on the quality conformance inspection requirements of MIL-PRF-19500 groups A (table V), B (table VIa), C (table VII) and also ESA / ESCC 5000 (chart F4) lot validation tests. QR216 (screening) is based on the screening requirements of MIL-PRF-19500 (table IV) and also ESA /ESCC 5000 (chart F3). Details of QR217 and QR216 are included in the following pages. All manufacture and processing is carried out on our approved High-Rel assembly line in Lutterworth and product is released under our ISO 9001:2000 defence standard approval. The ‘standard’ JQRS part is processed to the Semelab data sheet, screened to QR216 and has conformance testing to Q217 groups A and B. Available options and the associated part number extensions are shown below. These are chargeable and must be specified at order stage. The extensions on the Semelab part numbers used reflect these additional items. Ordering Information: (example) Part Number Description Marking (*) 2N2369-JQRS QR217 groups A,B Screening to QR216 2N2369-JQRS Additional options: Customer Pre-Cap Visual Inspection Customer Buy-Off visit Data Pack -CVP -CVB -DA Group B charge Group B destructive mechanical samples -GRPB -GBDM (12 pieces) Group C charge Group C destructive electrical samples Group C destructive mechanical samples -GRPC -GCDE (12 pieces) -GCDM (6 pieces) Solderability Samples Scanning Electron Microscopy Radiography (X-ray) Total Dose Radiation Test -SS -SEM -XRAY -RAD Notes: 1) All ‘Additional Options’ are chargeable and must be specified at order stage. 2) When Group B or C is required, additional electrical and mechanical destructive samples must be ordered 3) All destructive samples are marked the same as other production parts unless otherwise requested. pages extracted from ‘Semelab - High Reliability and Screening Options’ 17 MIL-PRF-19500 – QR216, QR217 (Space) (continued) 9.2 QR217 Inspection Levels for ‘Space Level Processed’ Products QR217: Group A - Electrical Tests *small lot conformance Subgroup Description 1 Visual + mechanical Inspection Sample* 20 Reject 0 2 DC electrical tests at 25°C 20 0 3 DC electrical tests. Hot & Cold temps as per device datasheet 45 0 4 AC electrical tests at 25°C 45 0 5 Safe Operating Area (Power Transistors) Endpoint electrical measurements 8 0 The specified parameters to be included in each subgroup shall be as per Semelab Data Sheet. Where no parameters are specified in a particular subgroup or test within a subgroup, no Group A testing is required for that subgroup or test to satisfy Group A requirements. A single sample may be used for all subgroup testing. These tests are considered non-destructive. QR217: Group B - Short term Environmental & Endurance Tests *small lot conformance Test note Subgroup 1 Physical Dimensions Subgroup 2 Solderability Resistant to solvents (3) (3) Subgroup 3 Thermal shock (liquid to liquid) Temperature Cycling (air to air) MIL-STD-750 method Sample* Reject d=destructive 2066 As per specification 2026 1022 (minimum 3 devices) (Separate samples can be used) 1056 Test condition B (25 cycles) (glass diodes only) 1051 Hermetic seal (a) Fine Leak (b) Gross leak Condition 8 0 6d leads 6d devices 6d 0 6d 0 Test condition C or max stg temp, whichever is less. 100 cyles. 1071 Test condition H. <0.01cc. max = 5 x 10-9 atm cc/s, >0.01cc. max = 1 x 10-8 atm cc/s 2075 Visual criteria in accordance with qualified design. Bond strength 2037 (minimum 6 devices) 12 wires d 0 Die Shear 2017 Parts from bond strength (min=6) 6d 0 1027 1037 340hrs at specified bias conditions 12 0 As per SEMELAB specification 6 0 340hrs high temperature storage As specified 12 0 Electrical Measurement Internal visual design verification Subgroup 4 / 5 Steady-state operation life or Intermittent operation life or Blocking life (4) (5) Electrical Measurements Subgroup 6 Thermal resistance As specified 3131 and SML 7404 Subgroup 7 High temperature life (non operating) 1032 Electrical Measurements (Minimum quantity of destructive samples required is 12 pieces) (Full notes for numbered references are at the end of group C table) pages extracted from ‘Semelab - High Reliability and Screening Options’ 18 MIL-PRF-19500 – QR216, QR217 (Space) (continued) QR217: Group C - Long term Environmental & Endurance Tests Test note Subgroup 1 Physical Dimensions MIL-STD-750 method Condition *small lot conformance Sample* Reject d=destructive 2066 Dimensions per case outline specified 6 0 1056 Test condition B (25 cycles) 6d 0 Temperature Cycling (air to air) 1051 Test condition C or max stg temp, whichever is less. (45 cycles inc. screening) Shock 2016 Non operating, 1500G, 0.5ms, 5 blows in each orientation, X1, Y1, Z1 (Y1 only for axial glass diodes) Vibration (Variable frequency) 2056 Hermetic seal (a) Fine Leak 1071 Test condition H. <0.01cc. max = 5 x 10-9 atm cc/s, >0.01cc. max = 1 x 10-8 atm cc/s b) Test condition C Moisture resistance 1021 Omit initial conditioning Terminal strength 2036 As specified see (2) 6d 0 6 0 12d 0 see (2) 3d 5d 0 1 Subgroup 2 & 3 Thermal Shock (glass strain) (b) Gross leak Electrical Measurement Subgroup 4 Salt atmosphere (corrosion) As specified (2) Subgroup 5 Thermal resistance Subgroup 6 Steady-state operation life 1041 Covered by MIL883 ongoing Group D programme 3131 and SML 7404 As per SEMELAB specification 1026 or Intermittent operation life or Blocking life 1036 1000hrs at max operating junction temp As specified Electrical Measurements Subgroup 7 Internal Gas Analysis (corrosion) (2) Covered by MIL883 ongoing Group D programme (Minimum quantity of destructive samples required is 18 pieces) 1) Individual subgroups may be performed on representative parts from the same package family. 2) Group C subgroup 4 and 7 are covered by MIL883B ongoing group D programme. If customers require these subgroups to be done on the specific batch being covered, an additional ‘Grp C extra’ charge applies and an additional 11 destructive samples must be ordered. This must be specified at order stage. 3) Electrical reject devices from the same inspection lot may be used for all subgroups when electrical end point measurements are not required. 4) Post burn-in electrical rejects may be used. 5) If a given inspection lot undergoing Group B inspection has been selected to satisfy Grp C inspection requirements, the 340 hour life test may be continued to 1000 hrs to satisfy the Group C life test requirements. In such cases, either the 340 hour end point measurements must be made as a basis for Group B lot acceptance or the 1000 hour end point measurement shall be used as the basis for both Group B and Group C acceptance. 6) Internal Visual Design Verification may be omitted if the devices have been manufactured by Semelab as sample pre-cap visual inspection will have been performed. pages extracted from ‘Semelab - High Reliability and Screening Options’ 19 MIL-PRF-19500 – QR216, QR217 (Space) (continued) 9.3 QR216: ‘Space Level’ Discrete Component Screening QR216: Discrete Component Screening (with reference to MIL-STD-750) Description MIL-STD-750 method 1 Internal Visual (Pre-cap) Inspection 2069, 207, 2072 2 Customer Pre Cap Visual Inspection 2069, 2070, 2072 Customer specified option (chargeable) 100% 3 High temperature stabilisation bake 1032 24 hrs min at rated maximum storage temperature 100% 20 cycles at -55°C to +175°C or max storage temp (whichever is lower) with minimum 10 minutes dwell time 100% 20,000G force in Y1axis for 1 min duration (see note 2) 100% (full yielded quantity) 100% 4 5 Temperature Cycling Constant acceleration Conditions JQR-S 100% 1051 2006 6 Particle Impact Noise Detection (PIND) 7 Device Serialisation 2052 Device serialisation is carried through to shipping. 8 Interim electrical Read & Record 100% 9 High temperature reverse bias a) Bipolar b) Power MOSFET c) Diodes Test Condition A Test Condition B Test Condition A 100% Read & Record, Drift Check 100% 1039 1042 Test Condition B - 240 hrs min Test Condition A - 240 hrs min 100% 1038 Test Condition B - 240 hrs min (4) Read & Record, Drift check (1) 100% 1071 100% 100% 1039 1042 1038 10 Interim electrical (note 3) 11 Power burn-in a) Bipolar b) Power MOSFET c) Diodes 12 Final electricals (note 3) 13 a) Hermeticity – Fine b) Hermeticity - Gross 1071 Test condition H. Max leak rate =5x10-8 atm cc/s, (5x10-7 atm cc/s for internal cavity <0.3cc) Condition C 14 Radiographic tests (X-Ray) 2076 (May be performed at any time after serialization) 15 External Visual Inspection 2071 Notes: 1) QR217 Group A subgroups 2 and 3 end point tests as per device detail spec. 2) 10000G force for devices with power rating >10 watts at Tc=25°C. 3) PDA (percentage defects allowable) is 10% between steps 8 & 10 and 10 & 12. 4) Zener diodes shall be subjected to high temperature reverse bias at 80 - 85 percent of nominal VZ for VZ > 10 V. Omit test for devices with VZ ≤ 10 V. For JQRS case mounted rectifiers condition A is required. pages extracted from ‘Semelab - High Reliability and Screening Options’ 20 100% 10. ESA/ESCC - Space Level Product Semelab’s Space Quality Level Products are based on the testing procedures specified in the generic ESCC 5000 issue 3 and in the corresponding Detail Specifications. All manufacture and processing is carried out on our approved High-Rel assembly line in our Lutterworth factory and product is released under our ISO 9001:2000 defence standard approval. The table below shows the additional options which may be required by the customer. All items must be agreed and specified at order stage. The following pages show the generic chart F2 (component lot manufacturing), chart F3 (screening) and chart F4 (Validation) requirements. Additional options: Customer Pre-Cap Visual Inspection Customer Buy-Off visit Data Pack -CVP -CVB -DA Lot Validation Testing (subgroup 1) charge LVT1 destructive samples (electrical) LVT1 destructive samples (mechanical) -LVT1 -L1DE (normally 15 pieces) -L1DM (normally 15 pieces) Lot Validation Testing (subgroup 2) charge LVT2 destructive samples (electrical) -LVT2 -L2D (normally 15 pieces) Lot Validation Testing (subgroup 3) charge LVT3 destructive samples (electrical) -LVT3 (normally 5 pieces) Scanning Electron Microscopy (SEM) Radiography (X-ray) Total Dose Radiation tests -SEM -XRAY -RAD Notes: 1) All ‘Additional Options’ must be specified at order stage 2) All ‘Additional Options’ are chargeable 3) All destructive samples are marked the same as other production parts unless otherwise requested. pages extracted from ‘Semelab - High Reliability and Screening Options’ 21 ESA/ESCC (Space Level Flow) (continued) 10.1 Chart F2 - Production Control (ESCC 5000 issue 3) Component Lot manufacturing Wafer Lot Acceptance para 5.3.1 Process Monitoring Review para 5.3.2 SEM Inspection para 5.3.3 Total Dose Rad Testing (1,4) Special In - Process controls para 5.2.1 Internal Visual inspection (Pre-cap inspection) para 5.2.1 Bond Strength (Pre-cap inspection) (1) para 5.2.1 Die Shear (Pre-cap inspection) (1) para 5.2.1 Encapsulation (Pre-cap inspection) (1) para 5.2.1 Dimension Check (1) para 5.2.3 Weight (2) To Chart F3 (Screening) Notes: 1) Performed on a sample basis. 2) Guaranteed but not tested. 3) If specified in the detail specification. 4) If specified in the detail specification and required in the Purchase Order. pages extracted from ‘Semelab - High Reliability and Screening Options’ 22 (1,3) 10.2 ESA/ESCC - Chart F3 Screening (ESCC 5000 issue 3) Components from Production Control para 8.5 High Temperature Stabilisation Bake Electrical Test para 8.6.1 (11) Temperature Cycling Acceleration (10) para 8.7 Particle Impact Noise Detection (PIND) para 8.22 Verification of Safe Operating Area para 8.9.1 Electrical Measurements, Serialisation and Parameter Drift Values (1) para 8.20 High Temperature Reverse Bias Burn-In (2) para 8.9.1 Parameter Drift Values HTRB Final and Power Burn-In Intial Measurements (1) para 8.21 Power Burn-In (2) para 8.9.1 Parameter Drift Values (Final Measurements) (4) para 8.9.2 High and Low Temperature Electrical Measurements (2,3) (4,5) Hot Solder Dip (if applicable) (6) para 8.3 Radiographic Inspection (9) para 8.8.1&2 Seal (Fine & Gross Leak) para 8.9.3 Room Temperature Electrical Measurements (inc AC) para 6.4.1 Check for Lot Failure (8) para 8.10 External Visual Inspection (8) para 8.16 Solderability (4,7) (4,5) To Chart F4 (Validation Testing) Notes: 1) All components shall be serialised prior to Initial Electrical Measurement. 2) If specified in detail spec. 3) Can be performed at any time prior to initial measurements of Parametric Drift values. 4) The Lot Failure criteria of paragraph 6.4 applies to this test. 5) Performed on a sample basis. 6) Can be performed at any time prior to Room Temp Electrical Measurements during screening (prior to Seal test). 7) Measurements of parametric Drift Values need not be repeated in Room Temperature Electrical measurements. 8) Check for Lot Failure shall take into account all electrical parameter failures that may occur during screening. Tests in accordance with paragraph 8.9.1, 8.9.2, 8.9.3 subsequent to HTRB Burn-In. 9) Radiographic Inspection may be performed at any point during Screening Tests. 10) Not specified in ESCC 5000 iss 3, but performed by Semelab to MIL-STD-750 method 2006. 11) Not specified in ESCC 5000 iss 3, but performed by Semelab as a process monitor. pages extracted from ‘Semelab - High Reliability and Screening Options’ 23 ESA/ESCC (Space Level Flow) (continued) 10.3 Chart F4 - Validation Testing (ESCC 5000 issue 3) Components for Validation LVT1 (Subgroup 1) Mechanical & Environmental LVT2 (Subgroup 1) Endurance LVT3 (Subgroup 3) Assembly Capability 15 Components 15 Components 15 Components 5 Components Mechanical Shock para 8.11 Thermal Shock (2) para 8.11 Vibration para 8.12 Temp Cycling (3) para 8.6.2 Operating Life (4) 2000 hours data points: 0, 1000, 2000hrs para 8.19 Terminal Strength para 8.18 Constant Acceleration para 8.13 Moisture Resistance para 8.15 Immediate & End Ppoint Electrical End Measurements para 8.9.4 Internal Visual Inspection para 8.1 Seal para 8.8.1 & 8.8.2 Seal para 8.8.1 & 8.8.2 Seal para 8.8.1 & 8.8.2 Bond Strength para 8.2.1 Immediate & End Ppoint Electrical End Measurements para 8.9.4 Immediate & End Ppoint Electrical End Measurements para 8.9.4 External Visual Inspection para 8.10 Die Shear para 8.2.2 External Visual Inspection para 8.10 External Visual Inspection para 8.10 Permanence of Marking para 8.17 LVT1 (Subgroup 1) Lot Validation LVT2 (Subgroup 2) Lot Validation LVT3 (Subgroup 3) Lot Validation Notes: 1) ESCC 5000 iss 3 table F4 - Qualification & Periodic Testing becomes ‘Validation Testing’ for non qualified parts. 2) Only applicable to axial diodes. 3) Not applicable to axial lead glass diodes. 4) Variance in Test method based on product type. Ordering Information: 1) Order for Subgroup 1 (includes subgroups 2 & 3) requires order for 50 (30+15+5) destructive samples. 2) Order for Subgroup 2 (includes subgroup 3) requires order for 20 (15+5) destructive samples. 3) Order for Subgroup 3 requires order for 5 destructive samples. 4) Other Ordering Options are available - please contact Semelab Sales pages extracted from ‘Semelab - High Reliability and Screening Options’ 24 11. Screening & Approval Comparison Tables 11.1 Comparison of Space Level Screening Options Space Level Flow Comparison Table GENERIC Screening QR216 ESCC JANS* JQRS OPT OPT OPT 24 hrs 24 hrs 24hrs Temperature cycling 20 cycles 20 cycles 20 cycles Thermal impedance OPT Pre-cap Visual Customer pre-cap Visual High Temp Storage (Stabilization Bake) Constant Acceleration - _ PIND Fine/Gross Leak ∑ Serialization Interim Electrical Measurements - - - - - - min 168 hrs max 264 hrs 240 hrs 240hrs - - - Interim Electrical Measurements (Read and Record / Drift) HTRB Electrical Measurements Parametric Drift measurements (Read and Record / Drift) Burn-In Electrical Measurements Parameter Drift Measurements (Read and Record) PDA Calculations Read and Record Test Data Other Electrical Parameters (Temp, Dynamic) Fine/Gross Leak Radiography External Visual Inspection Notes: if specified in detail specification. _ not specified in ESCC 5000 iss 3, but performed by Semelab. pages extracted from ‘Semelab - High Reliability and Screening Options’ 25 *JANS part not available from Semelab. Screening & Approval Comparison Tables 11.2 Comparison of Space Level Die Lot Approval Procedures. The table below shows a comparison of operations carried out for die approval within the generic approval systems (MIL-PRF-19500 space level and ESA / ESCC 5000. It must be noted that SEM and RHA total dose evaluation are options which must be specified if required carry an additional charge. Space Level/ Die Lot Acceptance Table GENERIC Die Lot Acceptance SML ESCC JANS JQR-S SEM OPT OPT OPT RHA Total Dose Evaluation OPT OPT OPT Selected Wafer Probe Test (100%) Glassivation / Metallization Inspection Visual Inspection (100%) Sample Assembly (10 pcs) Stabilization Temperature Cycling Electrical Test (read/record) HTRB Electrical Test (read/record) Steady State Life (1000 hrs) Electrical Test (read/record) Wire Bond Evaluation Die Shear Evaluation pages extracted from ‘Semelab - High Reliability and Screening Options’ 26 Screening & Approval Comparison Tables 11.3 Comparison of High-Rel Screening Options (Discrete Devices) The table below shows the comparison of screening options available within the CECC, BS and MIL approvals. Comparison is also shown with Semelab’s in-house QR204 options. CECC / QR209 A B C BS 9300 D A B C QR204 D MIL JQRA JQRB JAN* JAN* TXV TX Pre-cap Visual High Temp Storage Temperature Cycle 5 5 5 cycles cycles cycles 10 10 10 cycles cycles cycles 20 20 20 20 cycles cycles cycles cycles Constant Acceleration Particle impact noise detection (PIND) Fine Leak test Gross Leak Test Device Serialisation Variables Electrical test ± ± ± ± ± ± ± ± 160 hrs* 160 hrs* 160 hrs* 160 hrs* ± ± ± ± Attributes Electrical tests Burn-In (HTRB) 168 hrs* 172 hrs* 48 hrs* 160 hrs* 72 hrs* 48 hrs* 48 hrs* Variables Electrical test Attributes Electrical tests Burn-In (Power) 168 hrs* 172 hrs* 48 hrs* 160 hrs* 72 hrs* 48 hrs* Variables Electrical test 48 hrs* Attributes Electrical tests Radiographic tests * full JANTX, JANTXV not available from Semelab Test Performed ± Test Performed if required by device detail specification 24 hours for PNP devices. 48 hours for NPN devices * High Temp Reverse Bias for Case rated devices Power Burn-in for Ambient rated Devices CECC / QR209 BS QR216 QR204 MIL : Screening carried out in accordance with CECC 50000 Appendix 6 : Screening carried out in accordance with BS9300 section 1.2.10 : Screening carried out in accordance with Semelab QR216 : Screening carried out in accordance with Semelab QR204 : Screening carried out in accordance with MIL-PRF-19500 (Table 2) pages extracted from ‘Semelab - High Reliability and Screening Options’ 27 Experience and Innovation in Semiconductor Solutions Specialists in • Chip design and wafer fabrication • Plastic packaged devices • Ceramic surface mount products • Metal packaged devices • Power modules • Standard and custom products • Screening and qualification • Continuity of supply Your Semelab Distributor: ISO 9001 FM36235 M/0103/CECC/UK Semelab Plc Coventry Road, Lutterworth, Leicestershire. LE17 4JB UK BS 9000 1360/M DSCC Qualified Manufacturers List Defence Supply Center Columbus European Space Agency MOD Registration VQC-03-003050 VQC-03-003049 Cage Code U3158 Qualification 253 2M8S02 Tel: +44 (0) 1455 556565 Fax: +44 (0) 1455 552612 Email: [email protected] Web: www.semelab.co.uk www.semelab.com Members of the Component Obsolescence Group