High-Reliability High-reliability requirements demand that products be able to function under abnormally severe levels of mechanical, environmental, and electrical stress. OPTEK has met this challenge with product designs and process control techniques that ensure high reliability and, thus, long life. CAPABILITY OPTEK maintains a well equipped high-reliability lab for conducting electrical, mechanical, and environmental test. OPTEKAs Calibration system complies with the requirements of ANSI/NCSL I 540-1. High reliability hall effect, and transistor devices from OPTEK are currently in use in a wide variety of space and defense programs. CERTIFICATIONS OPTEK is fully certified for commercial off the shelf (COTS) products as well as BS EN ISO 9001:2000 and ISO/TS16949:2002. Electrical, environmental and mechanical testing is based on MIL-PRF-19500, MIL-STD-883 and ESA 5000 test method and procedures. GENERIC SCREENING AND QCI TESTING Screening and Quality Conformance Testing can be provided on almost any hermetic product that OPTEK builds or quotes. OPTEK generic processing and QCI testing is explained in the ]Generic OPTEK Processing_ table. Specific details such as burn-in conditions or delta measurements performed can be obtained from the devices Data sheet. One of the key advantages of purchasing part types to a generic high-reliability screening program is that Group testing lot charges may be avoided, since OPTEK frequently spreads these costs over large groups of orders. Customers requiring Group testing on their individual orders can also be accommodated, but these orders have to be run under a special part number for control purposes. HIGH-RELIABILITY COUPLERS OPTEK offers high-reliability, optically coupled isolators to MIL-PRF-19500, and components processed to OPTEKas own military screening program. HIGH-RELIABILITY SENSORS AND EMITTERS A large selection of discrete emitter and sensor are offered that are processed to OPTEKas own military screening program patterned after MIL-PRF-19500 and MIL-STD-883.These devices are identified by ]TX_,_TXV_ , ]B_ and ]S_ suffixes. Although not military qualified devices, they receive 100% screening and are fully processed to the appropriate levels. For discrete sensors, the 100% screening includes both a 48-hour, high temperature reverse bias at TA=125 fC, and a 160 or 240-hour power burn-in at ambient temperature (TA=25 fC). For emitters, the 100% screening includes a burn-in in the forward direction for 96, 160 or 240 hours depending on the series. HIGH-RELIABILITY HALL EFFECT SENSOR OPTEK offers unipolar and bipolar (latching) hall effect magnetic sensing product in hermetic ceramic packages. These sensors are processed to OPTEKas screening procedure patterned after MILgSTD-883 Class B or Class S quality levels. These products operate from a 4.5 to 24 volt power supply and have an open collector logic level output capable of providing 25mA of sink current. HIGH- RELIABILITY TRANSISTOR PRODUCTS A line of standard transistor product in hermetic surface mount packages are offered to support the defense, space and high reliability industries. Single, dual, and quad package transistor chips are designed to conserve board space in high-density applications. OPTEK Technology • 1645 Wallace Drive Carrollton, TX 75006 USA • Tel: 972.323.2200 • [email protected] High-Reliability HIGH-RELIABILITY ASSEMBLIES OPTEK manufactures a wide variety of standard (commercial-off-the-shelf) and custom (built-to-print) assemblies. Most assemblies can be classified into one of two groups: slotted optical switches or reflective Assemblies. !"#$$%& #($)*+" ,-)$*.%, are designed to provide non-contact sensing of linear or rotary motion. /%0"%*$)1% +,,%23")%, are designed to provide non-contact sensing of reflective surfaces, or a change in surface reflectivity of an obhect. High reliability assemblies are generally made with plastic housing and hermetically sealed discrete sensors and emitters. Before being placed in the housing the discrete components are subhected to high-reliability processing. Frequently, this processing on the discrete device is similar to what is specified on the individual high-reliability sensor and emitter data sheets. CUSTOMER SPECIFIC DESIGNS Sometimes, it is necessary to have special electrical selections, screening requirements, or package configuration that is different from the standard offerings shown in the data sheets. OPTEKas custom capability is extensive. Assembly and test areas were designed with a great deal of flexibility, which allows the product to be built and tested on an order-to-order basis. The Quality Control DepartmentAs Environmental testing areas are set up similarly, allowing many orders to be handled, each requiring different tests, screens, and conditions. Group A: Consists of electrical tests and external visual done on a sample basis by Q.C. Prior to submittal to Q.C for Group A inspection, all devices in the lot are 100% electrically tested in manufacturing. Group B: Consists of tests conducted on a sample basis to verify production lot conformance to package integrity, environmental extremes, and long-term reliability. The Group B samples are normally selected from the lots that are manufactured within a six-week time period, based on the date of final package sealing Group C: Is further environmental testing similar to Group B, but sample testing is performed on a periodic basis (typically at six month intervals.) High Temperature Reverse Bias (HTRB): Devices are reverse biased in a non-conduction mode at high temperature for a period of time in this test. This test is used primarily to screen out those devices with inferior semiconductor die characteristics, such as poor voltage breakdown or leakage current. Ambient temperature is usually specified somewhere between +100fC to +175fC. MIL-PRF19500: Military document that establishes the general requirements for semiconductor devices for a particular series (e.g., 4N22A military series is spelled out in MIL-PRF-19500/486.) MIL-STD-750: MIL-STD-883: Level TX: Level TXV: Military specification that depicts electrical, mechanical, and environmental test procedures and methods for discrete semiconductors. Military specification that establishes uniform methods, controls and procedures for testing microelectronic devices. All TX units receive process conditioning prior to quality conformance inspection. (!%% 6)7 1) All TXV units receive process conditioning prior to quality conformance inspection as well as 100% visual inspection. (!%% 6)7 2) Level B: All B units receive process conditioning prior to quality conformance inspection. (!%% 6)7 3) Level S: An ultra-high-reliability device with very strict quality assurance and manufacturing controls imposed. Level S devices are designed with space applications in mind with the highest product assurance reliability test. (!%% 6)7 4) Level ESA/ SCC/5000: European Space Agency specification that defines the general requirements for the qualification approval, procurement, including lot acceptance testing and delivery of discrete semiconductor components for space applications. (!%% 6)7 5) OPTEK Technology • 1645 Wallace Drive Carrollton, TX 75006 USA • Tel: 972.323.2200 • [email protected] High-Reliability OPERATING LIFE Also known as burn-in, life testing, and power age. Operating the device in a conduction mode (turn on) to simulate what the part will encounter in actual service. As a very common test in process conditioning, operating life is used to screen out those parts with potential short service life. QUALITY CONFORMANCE INSPECTION (QCI): Those tests performed to verify a given lotas conformance to a military document or a customeras specification. Quality conformance inspection consists of Group A, but may include Group B or C, depending on the requirements for the formulation of these groups of tests. QUALIFICATION (QUAL): All testing performed to qualify a new product, traditionally consists of Groups A, B and C. Individual test or requirements are sometimes added or deleted for qualification. PROCESS CONDITIONING: Test (sometimes referred to as screens) that are performed on 100% of the devices in the lot to assure long-term reliability characteristics. SIMPLIFIED PRODUCT FLOWS TX TXV B Per 883 S Per 883 Commercial Product 100%: Pre-Cap, Visual Commercial Product High Temperature Storage High Temperature Storage High Temperature Storage 100%: Non-Destruct Bond Pull High Temperature Storage Temperature Cycle Temperature Cycle Temperature Cycle High Temperature Storage Temperature Cycle Constant Acceleration Constant Acceleration Constant Acceleration Temperature Cycle Constant Acceleration Hermetic Seal Test Hermetic Seal Test Hermetic Seal Test Constant Acceleration Hermetic Seal Test HTRB HTRB HTRB Hermetic Seal Test HTRB Power Burn-In Power Burn-In Power Burn-In HTRB Power Burn-In SEMkInspection 100%: Pre-Cap, Visual ESA 100%: Pre-Cap, Visual Power Burn-In QCI LAT A B C QCI LAT A B C QCI LAT A B C Ship Ship Ship Ship Ship (6)7. 1) (6)7. 2) (6)7. 3) (6)7. 4) (6)7. 5) OPTEK Technology • 1645 Wallace Drive Carrollton, TX 75006 USA X-Ray QCI LAT A B D • Tel: 972.323.2200 • QCI LAT LAT 3 LAT 2 LAT 1 [email protected] High-Reliability GENERIC OPTEK PROCESSING Screening Operation Description TX & TXV per MILPRF-19500 S-Level per MILPRF-19500 B-Level per M5004 of MIL-STD-8832 S-Level per M5004 of MIL-STD-8832 B-Level per ESA 5000 7 MIL-STD-750 Method MIL-STD-750 Method MIL-STD-883 Method MIL-STD-883 Method MIL-STD-750 Method Bond Pull, Ball Shear, Die Shear Test: In process monitors in the form of SPC. (Ball shear applies to gold ball bonded devices only) Non-Destruct Bond Pull Internal Precap Inspection Performed on all OPTEK Hi-Rel Products (Per MIL-PRF-19500 App D for S Level plus ball shear) N/A N/A N/A 2023 N/A 20723 2072 2010 2010 2072 nes nes RGA Monitors Periodic monitors. Not performed on every lot. 1018 100% Post Seal Electrical Test Selected DC tests only. Per OPTEK published data sheet Permanent Serialization No High Temperature Storage N/A 1051 Condition C, 20 Cycles Temperature Cycle4 -55fC to +175fC nes No Optional 48 hrs. Max TJ 1051 Condition C, 20 Cycles 1010 Condition C, 10 Cycles -65fC to +150fC 1010 Condition C, 10 Cycles (MIL-STD-202) M 102, 20 Cycles -65fC to +125fC 2006, 20 KG, n1 2006, 20 KG, n1 2001, 30 KG, n1 2001, 30 KG, n1 2006, 20 KG, n1 Visual Inspection/Dimension Check No No For Catastrophic visual defects For Catastrophic visual defects All dimensions on 5 pieces Particle Impact Noise Detection N/A 2052 Cond. A N/A 2020 Cond. A 2052 Cond. A Fine Leak Test5 1071 Cond. H 5X10-8 1071 Cond. H 5X10-8 1014 Cond. A1 5X10-8 1014 Cond. A1 5X10-8 1071 Cond. H 5X10-8 Gross Leak Test5 1071 Cond. C 1071 Cond. C 1014 Cond. C 1014 Cond. C 1071 Cond. C Thermal Response Test6 3101 or 3131 3101 or 3131 N/A N/A N/A N/A N/A N/A N/A nes 1038 or 1039 Cond. A 1038 or 1039 Cond. A N/A N/A 1038 or 1039 Cond. A Acceleration Pre HTRB Electrical Measurements Recorded parameters for delta data HTRB Post HTRB/Pre Burn-In Testing Record parameters for delta calculations OPTEK Technology • 1645 Wallace Drive Carrollton, TX 75006 USA nes • Tel: 972.323.2200 • [email protected] High-Reliability GENERIC OPTEK PROCESSING (Continued) Screening Operation Description Burn-In TX & TXV per MILPRF-19500 S-Level per MILPRF-19500 MIL-STD-750 Method MIL-STD-750 Method 1038 or 1039 Cond. B Diodes 96 hrs., Transistors 160 hrs. 1038 or 1039 Cond. B 240 hrs. B-Level per M5004 S-Level per M5004 of MIL-STD-8832 of MIL-STD-8832 MIL-STD-883 Method 1015, 160 hrs Post Burn-In Testing Read & Record, and Delta Calculations PDA Limit B-Level per ESA 5000 7 MIL-STD-883 Method MIL-STD-750 Method 1015, 240 hrs 1038 or 1039 Cond. B Diodes 96 hrs., Transistors 160 hrs. nes 10% 5% 5% 5% 5% ALL other specified electrical test Perform 100% Read & Record No No nes No nes No nes No nes nes Calculate PDA on all tests No No No No nes X-Ray No 2076 No 2012 2076 External Visual No 2071 2009 2009 2071 Produce a Failure Accountability Sheet No nes No No nes 5005 See Table provided for Group A, B, C testing 5005 See Table provided for Group A, B, D testing ESA 5000 See Table provided for Group level 1, 2 and 3 testing MIL-PRF-19500 MIL-PRF-19500 See Table See Table provided for TX provided for S and TXV Group A, level Group A, B, B, C testing C testing Lot Acceptance Testing Notes: 1. Revision K 2. OPTEK is a compliant COTS supplier per MIL-STD 750 and MIL-PRF-19500. OPTEK does not claim to be a supplier as defined in MIL-STD-883D, paragraph 1.2.1. MIL-STD-883 requirements are based on Revision D, Notice 2. 3. TX products receives only 30X inspection. TXV product receives those magnifications called out in Method 2072. 4. This temperature or the maximum device rating (whichever is less) will be used. 5. Hermeticity testing will be performed at this point or after Burn-In electrical test. 6. Performed routinely on select transistor and diodes only but available on any bi-polar or PN hunction device. 7. European Space Agency (ESA) 5000 Revision D. 8. The sample sizes given are for lot sizes of 2,500 pieces or less, the definition for ]small lot_ size per MIL-PRF-19500. OPTEK Technology • 1645 Wallace Drive Carrollton, TX 75006 USA • Tel: 972.323.2200 • [email protected] High-Reliability LOT ACCEPTANCE TESTING — MIL-PRF-19500 Per MIL-PRF-19500, lot acceptance testing is performed by sampling each date code lot following all 100% screening operations and performing a series of tests. Tests are divided into groups. Group A for electrical, Group B & C for Environmental and life test. Group A& B is performed on every lot while Group C is performed on one lot for each package and chip combination every 12 months. Standard OPTEK products that have a TX or TXV suffix typically follow the generic MIL-PRF-10500 lot acceptance test outline and rules. Products with a B or S suffix are usually MIL-STD-883, M5005 controlled. Special circumstances may warrant a deviation on some products. The following tables reflect MIL-PRF-19500 Revision M as they affect OPTEK standard products. OPTEK attempts to maintain standard TX, TXV, S, B & ESA specifications up to the most current revision. LOT ACCEPTANCE TESTING — Group A Per MIL-PRF-19500 and MIL-STD-883 Method 5005 MIL-STD-8832 Method 5005 MIL-PRF-19500 TX, TXV, & S Level Sample Quantity 8 Subgroup Operation TX & TXV S-Level B & S Level samples size for All Subgroups = 116/0 Subgroup 1 Visual & Mechanical 45 15 25 f C DC Test Subgroup 2 25fC DC Test 45 116 High Temp. DC Test Subgroup 3 High & Low Temp Test 45 116 Low Temp. DC Test Subgroup 4 25fC Dynamic Test 45 116 25 f C Dynamic Test Subgroup 5 Safe Operating Area 45 45 High Temp. Dynamic Test Subgroup 6 Surge Current 22 45 Low Temp. Dynamic Test Subgroup 7 Misc. 22 45 25fC Functional Test Subgroup 8A N/A 0 0 High Temp. Functional Test Subgroup 8B N/A 0 0 Low Temp. Functional Test Subgroup 9 N/A 0 0 25fC Switching Time Test Subgroup 10 N/A 0 0 High Temp Switching Time Test Subgroup 11 N/A 0 0 Low Temp Switching Time Test OPTEK Technology • 1645 Wallace Drive Carrollton, TX 75006 USA • Tel: 972.323.2200 • [email protected] High-Reliability LOT ACCEPTANCE TESTING — Group B MIL-PRF-19500 Subgroup MIL-STD-883 Method 5005 TX & TXV S-Level B-Level S-Level Subgroup 1 Solderability Resistance to Solvents Physical Dimensions N/A Physical Dimensions Internal Water Vapor Subgroup 2 Temp Cycling, Surge, Hermetic Seal, Electrical End Points Solderability Resistance to Solvents Resistance to Solvents Resistance to Solvents, Internal Visual, Bond Strength, Die Shear Subgroup 3 Steady State Operation Life (340 hrs) Electrical End Points, Bond Strength Temp cycling, Thermal Shock, Surge (when applicable), Hermetic Seal, Electrical End Points, Bond Strength, SEM, Die Shear Solderability Solderability Subgroup 4 De-Cap Internal Visual Intermittent Operating Life Test, Electrical End Points N/A Lead Integrity, Hermeticity, Lid Torque Subgroup 5 Thermal Resistance Accelerated Steady State, Operating Life Test, Electrical End Points, Bond Strength Bond Strength Electrical R&R, Steady State Life Test, Electrical End Points Subgroup 6 High Temp. Storage (340 hrs) Thermal Resistance N/A Electrical R&R, Temp. Cycling, Constant Acceleration, Hermeticity, Electrical End Points LOT ACCEPTANCE TESTING — Group C MIL-PRF-19500 MIL-STD-883 Method 5005 Subgroup All Levels B-Level S-Level Subgroup 1 Physical Dimensions (Not required for S-Level) Electrical Test, 1,000 hr Life Test, Electrical Test N/A Subgroup 2 Thermal Shock, Terminal Strength, Hermetic Seal, Moisture Resistance, Electrical End Points N/A N/A Subgroup 3 Shock, Vibration, Variable Frequency, Constant Acceleration, Electrical End Points N/A N/A Subgroup 4 Salt Atmosphere N/A N/A Subgroup 5 N/A N/A N/A Subgroup 6 Electrical Test, Operational Life, Electrical Test N/A N/A OPTEK Technology • 1645 Wallace Drive Carrollton, TX 75006 USA • Tel: 972.323.2200 • [email protected] High-Reliability LOT ACCEPTANCE TESTING — Group D Subgroup MIL-STD-883 Method 5005 only (All quality levels) Subgroup 1 Physical Dimensions Subgroup 2 Lead Integrity, Seal Test Subgroup 3 Thermal Shock, Temperature Cycle, Moisture Resistance, Visual Inspect, Seal Test, Electrical End Points Subgroup 4 Mechanical Shock, Variable Frequency Vibration, Constant Acceleration, Seal Test, Visual Inspect, Electrical End Points Subgroup 5 Salt Atmosphere, Visual Inspection, Seal Test Subgroup 6 Internal Water Vapor Content (RGA) Subgroup 7 Adhesion of Lead Finish Subgroup 8 Lid Torque (For Glass Only) OPTEK supports process flow and lot acceptance test requirements of European Space Agency (ESA) documents with some limitations. OPTEK high reliability manufacturing procedures reflect United States (US) military documents. Therefore, some referenced ESA documents must default to similar US documents. Test limits, conditions, sequence and sample size specified in the ESA documents are maintained. A document cross reference list is provided in the following table. ESA Specification Description Substitute Specification 20400 Internal Visual Inspection MIL-STD-750 Method 2072 20500 External Visual Inspection MIL-STD-750 Method 2071 20900 Radiographic Inspection MIL-STD-750 Method 2076 24800 Resistance to Solvents MIL-STD-750 Method 1022 23500 Lead Materials and Finish MIL-PRF-19500 20100 Qualification Requirements MIL-PRF-19500 20600 Preservation and Packaging MIL-PRF-19500 21300 Terms and Definitions MIL-PRF-19500 22800 Non-Conformance Control MIL-PRF-19500 21500 Calibration System MIL-PRF-19500 OPTEK Technology • 1645 Wallace Drive Carrollton, TX 75006 USA • Tel: 972.323.2200 • [email protected] High-Reliability Lot Acceptance Test for ESA Devices Level 1k56 Components Environmental Mechanical Subgroups 16 Components Shock Test Method 2016 8 Components Thermal Shock MIL-STD-202 Method 2016 8 Components Vibration Method 2056 Moisture Resistance Method 1021 (2) Level 2k40 Components Endurance Subgroup 15 Components Level 3k25 Components Seal Test Method 1071 (2) Electrical Subgroup 25 Components Operating Life M1026 Electrical Measurements during Endurance Test Constant Acceleration Method 2006 (2) 20 Components (Electrical Measurements) 5 Components (Assembly/ Capability Test) Electrical Measurements at Room Temperature Solderability M2026 Constant Acceleration Electrical Measurements Room Temp External Visual Inspection Method 2071 Electrical Measurements at High & Low Temperature Permanence of Marking M1022 Constant Acceleration Constant Acceleration No Failures Allowed No Failures Allowed Level 3 k Lot Acceptance No Failures Allowed Level 2 k Lot Acceptance Level 1 k Lot Acceptance Note: Test methods referenced are from MIL-STD-750 unless otherwise specified. Diagram reflects ESA5000 Rev. D OPTEK Technology • 1645 Wallace Drive Carrollton, TX 75006 USA • Tel: 972.323.2200 • [email protected]