Space Products Brochure

Space Products
Semelab products and processes for space applications
Contents
1. Introduction
4
2. Programmes Supported
5
3. Innovations
6
3.1 Improving the Space Weather Forecast with the LCC1- 4
6
3.2 SoLaRfets – Radiation Tolerant MosFETS
7
3.3 Si3N4 via technology
7
3.4 Wide-Bandgap devices
8
3.5 Diode – Leadless Chip Carriers
9
3.6 Diamond Substrate
9
4. Hi-Rel COTS – Commercial Considerations
10
5. Product Range
11
6. Package Drawings
15
The following sections are extracted from Semelab document ‘High Reliability
and Screening Applications’ available at www.semelab.com/sml_downloads.
9. MIL-PRF-19500 - QR216, QR217 (Space)
17
9.1 Space Level Processed Discrete Semiconductors (QR216, QR217)
17
9.2 QR217 - Inspection levels:‘Space Level Processed’ Conformance
18
9.3 QR216 - Screening:‘Space Level Processed’ Components
20
10. ESA - ESCC (Space)
21
10.1 Chart F2 - Production Control
22
10.2 Chart F3 - Screening Tests
23
10.3 Chart F4 - Qualification and Periodic Tests
24
11. Screening & Approval Comparison Tables
25
11.1 Comparison of Space Level Screening Options
25
11.2 Comparison of Space Level Die Lot Approval Procedures
26
11.3 Comparison of High-Rel Screening Options
27
3
1. Introduction
2. Programmes Supported
Experience and Innovation In Semiconductor Technology
Over recent years many different Semelab products have been used in major Space
programmes including the following:
At SEMELAB, we research, design, manufacture and
distribute an innovative range of semiconductor products
throughout the world.
Our R&D teams have an excellent track record for
developing imaginative electronic solutions and our
design engineers have created a wealth of high
performance products. Our manufacturing divisions have
ensured supreme quality and reliability. And our sales
teams and distribution partners have opened international
markets to some of the best electronics solutions available.
At Semelab we have many year’s experience of the design
and manufacture of supplying semiconductor solutions for
use in space applications. All design and manufacturing is
carried out in Semelab’s UK custom built facility.
There are a wide range of discrete semiconductors
available: Bipolar, SoLaRfets, MOSfets, J-FETs, Linear
Regulators and Diodes. These are available in many
different package options: small ceramic surface mount;
multi pad ceramic surface mount; power ceramic, metal
hermetic packages. Details of the different package
outlines and range of products are included in the
following pages.
Also available are a range of standard and custom MCAs (Multi Chip Arrays). These integrate
several semiconductor die or other components into one package to provide a light weight,
space saving and improved-reliability alternative to discrete circuits. There are a range of
package styles available for small signal and power applications. These are cost effective
solutions with little or no NRE and similar lead times to standard discrete products. The different
package styles are included in the following pages.
ENVISAT
LCC1, Small Signal
IMMARSAT
LCC1, Small Signal, TO18, High Speed Zener, Schottky Diode
EMS
LCC1 Small Signal
ASTRA
LCC1, LCC2, Small Signal (dual)
SOHO CLUSTER
J-FETs
FIAR
TO59 – Biploar power
KOREA SAT
LCC1, Small Signal, J-FETs, Zener, Schottky Diodes
SPOT / HELIOS
LCC1, Small Signal, J-FETs, Diodes
SKYNET
TO18 / TO39 – Small Signal
ARTEMIS
LCC1, LCC2, LCC4
ODYSSEY
MCAs
MIMR
MCAs
GLOBAL STAR
MCAs - Analogue Arrays
MSG
MCAs
METOP
MCAs, Linear Regulators
ROSETTA
Small Signal LCC1
ATV
T018 / 39
ISS
Bipolar TO39 /TO66 , MCAs
SMART 1
Digital voter circuit, Dual Bipolar, LCC2
RAINBOW
MCA, Small Signal devices
SIRAL
Small Signal - JFET, LCC1
GALILEO
MCA, Small Signal devices
ARRIANE VEGA
Power Module
ALTIKA
SoLaRfet©, MCA
SKYNET
MCA, Small Signal devices
SENTINEL
MCA, LCC1, SoLaRfet© (Power MOSfets), Small Signal devices
BEPI-COLUMBO
LCC1, Small Signal device
Example circuit based on Semelab MCAs (picture courtesy of Comdev)
4
5
3. Innovations
Semelab has always been at the forefront of innovation. For many years our R&D teams have
been coming up with imaginative electronic and packaging solutions. Over the years many
of these solutions have become incorporated into our standard range of products with a
wide and extensive range of applications. This section gives details of some of our recent
developments.
3.1 Improving the Space Weather Forecast with the LCC1- 4
As spacecraft navigate the oceans of space, satellites encounter
severe storms in a ‘similar’way as Earth based ocean going
vessels do.
A documented phenomenon known as Deep Dielectric
Discharge, associates high speed solar wind streams with the
appearance of large numbers of highly energetic electrons in
the magnetosphere. These high energy electrons are
dangerous to the operation of the spacecraft as they bury
themselves into dielectric materials deep within the satellite,
(materials such as PCB materials, coaxial cables etc).
3.2 SoLaRfets
The Semelab SoLaRfet has been specifically developed to
provide a radiation tolerant MosFET for use in space
applications. The development is an extension of one of our
existing MosFET processes which has been sold in high
volumes over many years.
The structure of the device has been modified to enhance the
DC performance and give good SEU characteristics.The device
is ideally suited for fast switching applications in harsh
environments.
Semelab has also made developments in the substrate and package technology to further
optimise the performance of finished devices. Contact Semelab sales for further information.
110
90
80
VDS (V)
70
The build-up of charge occurs when the total amount of high velocity electrons exceed
1MeV (1 Million electron Volts) during the storm event. The charge continues to build-up
until the dielectric strength of the material is exceeded. Once this happens an instantaneous
electrical discharge occurs, which is similar to a miniature lightening strike. This is a
hazardous event capable of damaging semiconductor and other sensitive devices.
60
LET
ENERGY
MeV
14.1
150
42
Krypton
34
316
43
Xenon
55.9
459
43
RANGE
um Si
Ar = 14.1 MeV mg-1 cm2
Kr = 34.0 MeV mg-1 cm2
Xe = 55.9 MeV mg-1 cm2
50
40
30
20
Argon
Krypton
Xenon
10
Part of the solution is to incorporate design improvements to mitigate the effects of Deep
Dielectric Discharge. Semelab are currently offering LCC1-4 (Leadless Chip Carrier Number 1,
4 pads), which is based on the ESA qualified ceramic chip carrier technology, but has an
additional feature which electrically connects the metal lid of the discrete device, to an
additional solder pad at the base of the package, so the lid can be electrically connected to a
known potential, (usually ground), therefore conducting away the charge as it occurs.
ION
Argon
100
0
0
2
4
6
8
10
12
14
16
18
20
22
-VGS (V)
Single Event Effect Safe Operating Area
Single Event Effect Safe Operating Area
Radiation Tolerant MosFET bridge in Si3N4 package
3.3 Si3N4 Via Technology
Semelab has always been at the forefront of packaging technology, being the first to bring a
number of what have now become industry standard packages to the market place.
Semelab has also developed module packages (ie MCA, Power MCA and others) for
combining a number of different discrete devices and/or technologies in a range of hybrid
solutions.
Deep Dielectric Discharge: LCC1- 4 package
LCC1- 4 package – internal view
The full range of products that are available in the standard LCC1 package are also available
in the Deep Dielectric Discharge LCC1-4 package. Section 4 contains details of products
supplied in the past. Contact Semelab Sales for further information.
6
The benefits of Semelab’s modular solutions over discrete devices
include: Higher density; Lighter weight; Easier interconnection;
Little or No NRE; Lower cost; Fast turnaround & improved reliability.
This trend continues with the recently introduced Si3N4 via
technology module. The package combines state-ofthe- art Via
technology with Si3N4 substrates to achieve high power
performance without the use of glass seals. The package is
semi-customable to enable multi-chip arrays based on
circuit requirements.
7
Example of the semi-customable Si3N4
3.4 Wide-Bandgap devices
3.5 Diode Leadless Chip Carriers (DLCC)
There has been much interest in Wide-bandgap
semiconductor materials in recent years.Their exceptional
electronic and thermal properties make them ideally suited
to applications that require high temperature performance in
a harsh environment.
Semelab have been supplying a range of devices (bipolar, MosFET and diodes) in the popular
range of LCC (leadless chip carriers) packages for many years. A recent addition has been the
development of the DLCC, a surface mount package specifically designed for diodes to
achieve optimum performance and space utilization.
The package is an alternative to existing
standard packages currently available on the
market.The first two packages in this range are
the DLCC1 and the DLCC2.
Semelab is the first European supplier to fully characterise
Silicon Carbide Diodes up to 225 C. (see Semelab data sheet
SML10SIC06-1NJC).The benefits of the technology can be
clearly seen.
The DLCC1 and DLCC2 packages have been
developed to cover the wide range of Small
Signal and Medium Power Diode chip types which
are used extensively in existing and new designs.
Key benefits of Silicon Carbide diode include low on state
losses (due to low VF and positive temperature coefficient);
reduction in switching losses (due to Zero reverse recovery);
high frequency operation and high-temperature
performance.
Benefits of the packages include a grounded lid to address the problem associated with the
‘Deep Dielectric Discharge’ phenomenon (see 3.1 - Improving the Space Weather Forecast
with the LCC1- 4); and castellated design to achieve better ‘meniscus witness’ for improved
overall system reliability.
The combination of these benefits makes it possible to achieve higher performance in a
smaller space when compared200with standard Silicon devices. An additional benefit in space
applications is the inherent rad-hardness
of the device.
180
TJ = 25ºC
160
20
TJ = 25ºC
16
IF Forward Current (A)
TJ = 125ºC
10
TJ = 225ºC
10
140
80
0
4
20
0
30
TJ = 75ºC
TJ = 125ºC
TJ = 175ºC
100
20
6
TJ = 25ºC
120
60
40
8
Semelab has many years experience in the supply of RF MosFET. The devices are
manufactured using a unique silicon Vertical DMOS process with gold metalisation which
gives high performance and maximum reliability at high power levels.
160
100
TJ = 175ºC
12
180
120
TJ = 75ºC
14
3.6 Diamond Substrates
200
140
TJ = 175ºC 18
TJ = 225ºC
IR Reverse Current (A)
TJ = 125ºC
IR Reverse Current (A)
TJ = 75ºC
100
VF Forward
Voltage (V)
2
200
TJ = 225ºC
TJ = 25ºC
The diamond substrate was originally developed for use in the RF product range to enhance
the performance and reliability of the device even further. Both simulations and
measurements have shown a considerable improvement in a number of areas.The most
significant of these is the halving in value of the junction to case thermal resistance when
compared with the Beryllium Oxide substrate normally used.
TJ = 75ºC
80
TJ = 125ºC
60
TJ = 175ºC
TJ = 225ºC
40
300
400
500
600
700
800
300
400
500
900
VR Reverse
Voltage (V)
20
0
0
0
10
20
30
0
100
VF Forward Voltage (V)
Fig 1. SML10SIC06-1NJC - VF performance
200
600
700
800
900
VR Reverse Voltage (V)
Fig 2. SML10SIC06-1NJC - Tr
Please contact Semelab sales for further information on the use of diamond substrates in
products for space use and also for information on Hermetic RF products.
Enhanced performance RF device using diamond substrate
Wide Bandgap device - Silicon Carbide Diode
8
9
4. Hi-Rel ‘COTS’ – Commercial Considerations
5. Product Range
For many years there has been talk of COTS (commercial-off-the-shelf ) products for space
use.There has been much confusion over what this means. At Semelab we have only ever
believed in supplying High-Reliability devices for use in space applications.However, there
are a number of commercial considerations which can be applied enabling High-Rel
products to be supplied in shorter lead times and at a lower overall contract cost.
Semelab have provided many products types in the past for space applications:
BIPOLAR:
2N2219A
2N2222A
2N2222ACSM
TO39
TO18
LCC1
Semelab works with it’s customers to supply the most appropriate commercial solutions for
the contract requirements, ensuring best value and continuity of supply.
4.1 Space Kanban
Semelab can work with its customers to supply ‘kanban’ solutions to meet production
requirements. By placing a longer term contract, all wafer or die can be procured and
reserved ensuring consistency of product over the full production time frame. In addition a
reduction of ancillary costs can be achieved by single lot radiation testing and SEM’s; and a
reduction of the additional costs such as ‘pre-cap visual inspections’ and ‘buy offs’ by
producing larger batch quantities. Semelab will then hold fully completed stock in its
bonded stores against the customer contract, available for immediate call off. Invoicing for
the product will be at the time of shipping. Contact the Semelab Sales Office for
further information.
Benefits of Space Kanban include:
- single wafer lot production
- reduced ancillary costs
- scope for re-scheduling
- invoicing at point of shipping.
4.2 ‘Off-the Shelf’ Product
Semelab has a number of space products which are manufactured on a regular basis.The
ongoing production of these parts means that there is often stock available ‘off-the-shelf’ for
immediate delivery.These products are available processed to Semelab’s QR217 (Space Level
Full Quality Conformance Inspection and QR216 (‘Space Level Discrete Component
Screening). See Section 9 for full details of QR217, QR216. (Please note that in addition, LVT’s
are sometimes available on these parts, but not always)
Parts Include:
2N2222, 2N2369, 2N2484, 2N2857, 2N2894, 2N2907
2N4391, 2N4392, 2N4393
4.3 Wafer & Die Storage
To ensure long term availability of product supply Semelab can
procure any volume of wafer or die on behalf of a customer.
This will then go through immediate qualification and be held in
storage for the sole use of that customer.This practice has been
successfully employed by Semelab for many years.
10
2N2222ADCSM
LCC2
2N2369A
TO18
2N2369ACSM
LCC1
2N2369ADCSM
2N2484
2N2484CSM
2N2484DCSM
2N2857
LCC2
TO18
LCC1
LCC2
TO18
2N2857CSM
2N2880
2N2894
2N2894DCSM
2N2905A
2N2907A
2N2907ACSM
LCC1
TO59
TO18
LCC2
TO39
TO18
LCC1
2N2907ADCSM
LCC2
2N2908X
2N2920
2N2920A
2N2920ADCSM
2N3019
TO53
TO77
TO77
LCC2
TO39
2N3019CSM
LCC1
2N3439
2N3467
TO39
TO39
ESCC 5201 003 02C
ESCC 5201 002 01B (&C)
ESCC 5201-002-05C
66-LC-0147 O1B
TPR-12-034
MA500 AJB
STR01-020-01
66-LC0147 LVL C
SCC 5201 002 04B
STR01-031 01B
66-LC-0190 02B
ESCC 5201 006 05B
ESCC 5201 006 04B
RA.1201.009.10
RA.1201.017.10
TPR-12-032
66-LC-0173-01 LVL B
ESCC 5201 006 04B (&C)
ESCC 5201 006 05B
RA.1201.009.10
RA.1201.017.10
TRP-12-032
66-LC-0173 01 LVL B (&C)
MIL-PRF-19500/317 (QR216/7)
SCC 5201 001 01B (&C)
66-LC-0170 LVL B
66-LC-0171 LVL B
SC 5201 014 01B (&C)
66-LC-0168
66-LC 0176
ESCC 5203 025
ESCC 5201 014 01C
QR216 & QR217
ESCC 5202 002 02B (&C)
ESCC 5202 001 01B
ESCC 5202 001 04B (&C)
66 LCO145 LVL B (&C)
MA-5000-AJC
STR-021-01
TPR-12-030
RA.1202.008.11A
ESCC 5201 001
1000 017 576
66-LC0189 02B
STR01-032
IGG-290-874 01B
SCC 5207 002 02B (&02C)
SCC 5207 002 03B
SCC 5207 002 12B
SCC 5201 011 02C
SCC 5201 011 03B
STR01-019-02B
SCC 5201 011 02C
SCC 5201 011 03B
STR01-019-02B
ESCC 5203 011 02B
ESCC 5208 009 01
11
11
LCC1
LCC2
SMD05
TO257
TO18
TO39
2N3501
2N3637
2N3501
2N3700CSM
2N3637
2N3764
2N3700CSM
2N3765
2N3764
2N3810
2N3765
2N3810DCSM
2N3810
2N3822
2N3810DCSM
2N3906CSM
2N3822
2N5153
2N3906CSM
2N5153SMD05
2N5153
2N5153SMD05
2N5153U
TO39
TO39
TO39
LCC1
TO39
TO18
LCC1
TO46
TO18
TO77
TO46
LCC2
TO77
TO18
LCC2
LCC1
TO18
TO39
LCC1
SMD05
TO39
SMD05
TO39
2N5154X
2N5153U
2N5154XSMD05
2N5154X
2N5154XSMD05
2N5154XSMD1
TO39
TO39
SMD05
TO39
SMD05
SMD1
2N5672
2N5154XSMD1
2N5672
2N5954
TO3
SMD1
TO3
TO66
2N6849
2N5954
2N918
2N6849
BDS16
2N918
BDS18
BDS16
BDS20
BDS18
BUL54AH
BDS20
BUL54A-T257
BUL54AH
FMMT92CSM
BUL54A-T257
FMMT92CSM
TO39
TO66
TO72
TO39
TO257
TO72
TO257
TO257
TO257
TO257
TO5
TO257
TO257
TO5
LCC1
TO257
LCC1
ESCC 5201 013 02B
ESCC 5208 003 03B (&4B)
ESCC 5201
ESCC
5201 013
004 02B
04B
ESCC 5208 003 03B (&4B)
MA.500.ACK
ESCC 5201 004 04B
IGG-221-724
MA.500.ACK
ESCC 5207 005 02B (&1C)
IGG-221-724
66-LC0169
ESCC 5207 005 02B (&1C)
IGG-232-777-02
66-LC0169
ESCC 5204 002 05B
IGG-232-777-02
ESCC 5204 002 02B (&03B)
ESCC
5204002
002XX
05B
SCC 5204
ESCC
5204 002 02B (&03B)
MIL-PRF-19500/545D
(QR216/7)
SCC
ESCC5204
5204002
002XX
05B
MIL-PRF-19500/545D
ESCC
5203 010 04B (QR216/7)
ESCC
ESCC 5204
5203 002
010 05B
04B
ESCC
04B
QR2175203
GPS010
A,B,C
+ QR216
ESCC
04B
QR2175203
GPS010
A,B,C
+ QR216
QR217
GPS
A,B,C
SCC
5203
004
03B+ QR216
QR217 GPS A,B,C + QR216
66-LC0131
SCC 5203 004 03B
IGG-221-826-01
66-LC0131
ESCC
5206 003 01C
IGG-221-826-01
ESCC 5201 009 01B
ESCC
5206 (&1C)
003 01C
T-120-01B
ESCC
5201 (&1C)
009 01B
T-121-01B
T-120-01B
(&1C)
SAH 0046-G200-W2
T-121-01B (&1C)
RA.1203.004.10-11
SAH
0046-G200-W2
RA.1203.003.10-12
RA.1203.004.10-11
RA.1202.006.11
RA.1203.003.10-12
RA.1202.006.11
LCC6
LCC6
LCC6
LCC20
LCC6
LCC20
LCC20
LCC20
LCC20
LCC20
LCC20
LCC20
LCC20
LCC6
LCC20
LCC6
LCC6
LCC6
LCC6
LCC6
LCC6
LCC6
LCC6
LCC6
LCC6
LCC6
LCC6
LCC6
LCC6
LCC6
LCC6
LCC6
LCC6
LCC6
LCC6
LCC6
LCC6
LCC6
LCC6
LCC6
LCC6
LCC6
LCC6
LCC20
LCC6
LCC6
LCC20
LCC6
LCC6
LCC6
LCC6
LCC6
MCA 0102 TC - CDP 9.19
MCA 0102 UC - CDP 9.19
MCA
MCA 0102
0102 TC
VC -- CDP
CDP 9.19
9.19
MCA
UC -- CDP
MCA 0102
0102 WC
CDP 9.19
9.19
MCA
CDP 9.19
9.19
MCA 0102
0102 VC
1C -- CDP
MCA
0102
WC
CDP
9.19
MCA 0102 2C - CDP 9.19
MCA 0102
0102 3C
1C -- CDP
CDP 9.19
9.19
MCA
MCA
0102
2C - CDP-01
9.19
SE5000
/ MCA0301
MCA
0102
3C - CDP-02
9.19
SE5000
/ MCA0301
SE5000 // MCA0301
MCA0301 -03
-01
SE5000
SE5000
SE5000 // MCA0301
MCA0301 -02
-04
SE5000 // MCA0301
MCA0301 -05
-03
SE5000
SE5000 // MCA0301
MCA0301 -06
-04
SE5000
SE5000 // MCA0301
MCA0301 -07
-05
SE5000
SE5000 // MCA0301
MCA0301 -08
-06
SE5000
SE5000 // MCA0301
MCA0301 -09
-07
SE5000
SE5000 // MCA0301
MCA0301 -10
-08
SE5000
SE5000 // MCA0301
MCA0301 -11
-09
SE5000
SE5000 // MCA0301
MCA0301 -12
-10
SE5000
SE5000 // MCA0301
MCA0301 -13
-11
SE5000
SE5000 // MCA0301
MCA0301 -14
-12
SE5000
SE5000 // MCA0301
MCA0301 -15
-13
SE5000
SE5000
/ MCA0301 -14
IGG-160-1474-02C
SE5000
/ MCA0301 -15
SCD
201366-1
IGG-160-1474-02C
SCD
201366-3
SCD
SCD 201366-1
201366-5
SCD 201366-3
SCD 201366-5
LCC1
LCC1
LCC2
LCC2
SMD1
SMD1
MCA’S
MCA0102/T
MCA’S
MCA0102/U
MCA0102/T
MCA0102/V
MCA0102/U
MCA0102/W
MCA0102/V
MCA0102/X
MCA0102/W
MCA0102/Y
MCA0102/X
MCA0102/Z
MCA0102/Y
MCA0301/A2
MCA0102/Z
MCA0301/B
MCA0301/A2
MCA0301/C2
MCA0301/B
MCA0301/D
MCA0301/C2
MCA0301/E
MCA0301/D
MCA0301/F
MCA0301/E
MCA0301/G
MCA0301/F
MCA0301/H
MCA0301/G
MCA0301/J
MCA0301/H
MCA0301/K
MCA0301/J
MCA0301/L
MCA0301/K
MCA0301/M
MCA0301/L
MCA0301/N
MCA0301/M
MCA0301/P
MCA0301/N
MCA0301/Q
MCA0301/P
MCA0401/1
MCA0301/Q
MCA0616/1
MCA0401/1
MCA0616/2
MCA0616/1
MCA0616/3
MCA0616/2
MCA0616/3
12
12
MCA0625/1
MCA0625/2
MCA0625/1
MCA0625/3
MCA0625/2
MCA0625/4
MCA0625/3
MCA0627/1
MCA0625/4
MCA0627/3
MCA0627/1
MCA2696/1
MCA0627/3
MCA2696/2
MCA2696/1
MCA2696/3
MCA2696/2
MCA2696/4
MCA2696/3
MCA2696/5
MCA2696/4
MCA2696/A2
MCA2696/5
MCA2696/B
MCA2696/A2
MCA2696/C2
MCA2696/B
MCA2696/D
MCA2696/C2
MCA2696/E
MCA2696/D
MCA2696/F
MCA2696/E
MCA2696/G
MCA2696/F
MCA2696/H
MCA2696/G
MCA2696/J
MCA2696/H
MCA2696/L
MCA2696/J
MCA2703/1
MCA2696/L
MCA3201/1A
MCA2703/1
MCA3201/1B
MCA3201/1A
MCA3201/2B
MCA3201/1B
MCA3201/3A
MCA3201/2B
MCA3201/3B
MCA3201/3A
MCA3201/4B
MCA3201/3B
MCA4003/1
MCA3201/4B
MCA4003/2
MCA4003/1
MCA4003/3
MCA4003/2
MCA5001/5
MCA4003/3
MCA5001/5
LCC20
LCC20
LCC20
LCC20
LCC20
LCC6
LCC20
LCC6
LCC6
LCC6
LCC6
LCC6
LCC6
LCC6
LCC6
LCC6
LCC6
LCC6
LCC6
LCC6
LCC6
LCC6
LCC6
LCC6
LCC6
LCC6
LCC6
LCC6
LCC6
LCC6
LCC6
LCC6
LCC6
LCC6
LCC6
LCC6
LCC6
LCC6
LCC6
LCC6
LCC6
LCC16
LCC6
LCC6
LCC16
LCC6
LCC6
LCC20
LCC6
LCC6
LCC20
LCC6
LCC6
LCC20
LCC6
LCC20
LCC20
LCC6
LCC20
LCC6
LCC6
LCC6
LCC6
LCC6
SCD 201366-7
SCD 201366-9
SCD 201366-7
SCD 201366-11
SCD 201366-9
SCD 201366-13
SCD 201366-11
SCD 201366-15
SCD 201366-13
SCD 201366-17
SCD 201366-15
RA.0812.002.11B
SCD 201366-17
RA.0812.002.12B
RA.0812.002.11B
RA.0812.002.13B
RA.0812.002.12B
RA.0812.002.14B
RA.0812.002.13B
RA.0812.002.15B
RA.0812.002.14B
TL-AM-1201-16B
RA.0812.002.15B
TL-AM-1201-17B
TL-AM-1201-16B
TL-AM-1201-18B
TL-AM-1201-17B
TL-AM-1201-19B
TL-AM-1201-18B
TL-AM-1201-20B
TL-AM-1201-19B
TL-AM-1201-21B
TL-AM-1201-20B
TL-AM-1201-22B
TL-AM-1201-21B
TL-AM-1201-23B
TL-AM-1201-22B
TL-AM-1201-24B
TL-AM-1201-23B
TL-AM-1201-25B
TL-AM-1201-24B
96-LC0071-01
TL-AM-1201-25B
CDP 9.90.01
96-LC0071-01
CDP 9.90.02
CDP 9.90.01
CDP 9.90.04
CDP 9.90.02
CDP 9.90.05
CDP 9.90.04
CDP 9.90.06
CDP 9.90.05
CDP 9.90.07
CDP 9.90.06
SCD-200301-1
CDP 9.90.07
SCD-157592-3
SCD-200301-1
SCD-157603-5
SCD-157592-3
SCD 157592-1
SCD-157603-5
SCD 157592-1
1N4148
1N4003Q
1N4148
LCC2
LCC1
LCC2
LCC1
1N4150
1N4151
1N4150
1N4572
1N4151
1N4626
1N4572
1N5617
1N4626
1N5711
1N5617
45CKQ100
1N5711
60CKQ045
45CKQ100
BAS70
60CKQ045
BAT54
BAS70
BAT54
LCC1
LCC1
LCC1
LCC1
LCC1
LCC1
LCC1
LCC1
LCC1
LCC1
LCC1
TO258
LCC1
TO258
TO258
LCC1
TO258
LCC1
LCC1
LCC1
BZX55C15
LCC1
BZX55C15
BZX55C33
BZX55C3V3
BZX55C33
BZX55C3V3
BZX55C3V9
BZX55C5V6
BZX55C3V9
BZX55C5V6
LCC1
LCC1
LCC1
LCC1
LCC1
LCC1
LCC1
LCC1
LCC1
65-LC-0124
65-LC-0119
65-LC-0124
SCD 157769
65-LC-0119
TPR-04-066
SCD 157769
65-LC-0134-01
TPR-04-066
65-LC-0134-02
65-LC-0134-01
65-LC-0132-08
65-LC-0134-02
65-LC-0145-01
65-LC-0132-08
65-LC-0133
65-LC-0145-01
QR217 GPS A,B,C QR216
65-LC-0133
PO-PS-IGG-PL-0100
QR217 GPS A,B,C QR216
PO-PS-IGG-PL-0063
PO-PS-IGG-PL-0100
SCD 201444-01
PO-PS-IGG-PL-0063
65-LC0118
SCD 201444-01
PO-PS-IGG-PL-0189
65-LC0118
SCD 157558 (CDP926E O1)
PO-PS-IGG-PL-0189
65-LC-0120-20
SCD 157558 (CDP926E O1)
TPR-04-059-20
65-LC-0120-20
65-LC0120-28
TPR-04-059-20
65-LC0120-04
65-LC0120-28
TPR-04-059-04
65-LC0120-04
65-LC-0120-06
TPR-04-059-04
65-LC-0120-10
65-LC-0120-06
65-LC-0120-10
LCC20
LCC20
DIODES
DIODES
1N4003Q
LCC6
LCC6
13
LCC1
LCC1
LCC2
LCC2
TO258
TO258
6. Package Drawings
0.51 ± 0.10
(0.02 ± 0.004)
2N4393
2N4393CSM
2N4416
2N5116
TO18
LCC1
TO18
LCC1
TO72
TO18
1.91 ± 0.10
(0.075 ± 0.004)
LCC1
A=
0.64 ± 0.06
(0.025 ± 0.003)
1
4
A
6
0.23 rad.
(0.009)
5
A
0.31 rad.
(0.012)
3.05 ± 0.13
(0.12 ± 0.005)
3
2
A = 1.27 ± 0.13
(0.05 ± 0.005)
6.22 ± 0.13
(0.245 ± 0.005)
1.40
(0.055)
max.
1.02 ± 0.10
(0.04 ± 0.004)
LCC1
LCC2
1.40 ± 0.15
(0.055 ± 0.006)
5.59 ± 0.13
(0.22 ± 0.005)
9.14 (0.360)
8.64 (0.340)
1.27 (0.050)
1.07 (0.040)
2.16 (0.085)
12 13 14 15 16
0.25 ± 0.03
(0.01 ± 0.001)
TO18
1.39 (0.055)
1.02 (0.040)
0.23 rad.
(0.009)
3
2
4
1
7.62 (0.300)
7.12 (0.280)
0.23 min.
(0.009)
11
17
10
18
9
1
8
2
0.76 (0.030)
0.51 (0.020)
MosFETS
5
7
2N6849
IRFG110
IRFY044
IRFY140
IRFY240
TO39
cer-dip
TO257
TO257
TO257
ESCC 5206 003 01B (&C)
INM-232-312
INM-232-313
IGG-232-394
INM-232-314
LCC3
REGULATORS
0.30
(0.012)
Rad.
4 plcs
9.09 (0.358)
8.69 (0.342)
1.14 – 0.15
(0.045 – 0.006)
20
0.65 (0.025)
typ.
12
13
14
18
10
1
18
17
9
3
16
15
11
0.23
(0.009)
Rad.
18 plcs
1
4
0.711 (0.028)
0.559 (0.022)
9.09 (0.358)
8.69 (0.342)
LCC4
7.24 (0.285)
19
ESCC 9102 005 06B
44-LC-0152
TLAM 0814 03B
2
8
3
4
5
6
14
7
8
13
2.54
(0.100)
1.14(0.045)
typ
MODULES
SML150FBH12ESA
custom
SML150HBH06ESA
custom
150A 1200V IGBT
Hermetic Module
150A 600V 3 phase
IGBT Bridge - Hermetic Module
0.43 (0.017)
0.18 (0.007 Rad.
LCC4
1.27 (0.050)
typ.
TO39
T257
LCC4
4
1.65 (0.065)
1.40 (0.055)
1.39 (0.055)
1.15 (0.045)
8.89 (0.350)
LM117H
LM137
LM137
0.33 (0.013)
Rad.
0.08 (0.003)
63
2.03 ± 0.20
(0.08 ± 0.008)
1.02 ± 0.20
(0.04 ± 0.008)
TO257
4.32 ± 0.13
(0.170 ± 0.005)
ESCC 5205 003 01B (&01C)
MA 5000 AKW 01B
66-LC-0197
ESCC 5205 003 02B (&02C)
ESCC 5205 003 02B
RA.1205.071.10
TL-AM-023
30600050/022
ESCC 5205 003 03B (&03C)
65-LC-0153-01B 97
30600051/022
ESCC 5205 004 01B (&01C)
66-LC-0180-01
1
1.27 ± 0.05
(0.05 ± 0.002)
2N4392
2N4392CSM
TO18
3.81 ± 0.13
(0.15 ± 0.005)
2N4391
2
1.40 ± 0.15
(0.055 ± 0.006)
1.65 ± 0.13
(0.065 ± 0.005)
2.36 (0.093)
1.96 (0.077)
JFETS
2.29 ± 0.20
(0.09 ± 0.008)
3
0.76 ± 0.15
(0.03 ± 0.006)
LCC1
0.31 rad.
(0.012)
2.54 ± 0.13
(0.10 ± 0.005)
65-LC-0120-13
65-LC-0136-01 (&02)
65-LC-0135-01 (&02)
65-LC-0150
2.54 ± 0.13
(0.10 ± 0.005)
LCC1
LCC1
LCC1
LCC1
0.64 ± 0.08
(0.025 ± 0.003)
BZX55C7V5
HP5082-2800
HP5082-2810
MP2835
1.40
(0.055)
Nom.
9
1.39 (0.055)
2.54 (0.064)
1.52 (0.100)
1.15( 0.045)
Dimensions in mm (inches)
LCC6/8/18
LCC20
7.54(0.296)
CUSTOM
0.89
(0.035)
min.
0.76 (0.030)
min.
2.41 (0.095)
3.70 (0.146)
3.41 (0.134)
3.175 (0.125)
Max.
2.41 (0.095)
3.70 (0.146)
3.41 (0.134)
3.60 (0.142)
Max.
2
4.14 (0.163)
3.84 (0.151)
1
3
2
16.02 (0.631)
15.73 (0.619)
SMD1
10.69 (0.421)
10.39 (0.409)
SML12SF24SMD
Radiation Tolerant MOSFET
bridge in Si3N4 package
Radiation Tolerant FET
1 0.16 (0.400)
custom
3
5.72 (.225)
SFA001
1
0.76
(0.030)
min.
SoLaRfet
0.76
(0.030)
min.
3.05 (0.120)
0.127 (0.005)
CUSTOM
0.127 (0.005)
0.127 (0.005)
16 PLCS
0.50(0.020)
9.67 (0.381)
9.38 (0.369)
0.50 (0.020)
max.
11.58 (0.456)
11.28 (0.444 )
7.26 (0.286)
SMD05
14
SMD1
15
0.50 (0.020)
0.26 (0.010)
Package Drawings
9. MIL-PRF-19500 – QR216, QR217 (Space)
4.83 (0.190)
5.08 (0.200)
10.41 (0.410)
10.67 (0.420)
9.1 Space Level Processed Discrete Semiconductors (MIL-PRF19500)
6.32 (0.249)
6.60 (0.260)
13.59 (0.535)
13.84 (0.545)
0.89 (0.035)
1.14 (0.045)
1.02 (0.040)
1.27 (0.050)
3.53 (0.139)
Dia.
3.78 (0.149)
12.70 (0.500)
19.05 (0.750)
? ? ?
QR217:‘Space Level’ Full Quality Conformance Inspection.
QR216:‘Space Level’ Discrete Component Screening
20.07 (0.790)
20.32 (0.800)
30.35 (1.195)
31.40 (1.235)
16.89 (0.665)
17.40 (0.685)
13.59 (0.535)
13.84 (0.545)
10.41 (0.410)
10.92 (0.430)
13.38 (0.527)
13.64 (0.537)
16.38 (0.645)
16.89 (0.665)
3.56 (0.140)
Dia.
3.81 (0.150)
1
2
3
SEMELAB’s QR217 and QR216 processing specifications, in conjunction with the company’s
ISO9001:2000 approval present a viable alternative to American MIL-PRF-19500 space level
parts supplied from a European manufacturer.
0.64 (0.025)
Dia.
0.89 (0.035)
2.54 (0.100)
BSC
3.05 (0.120)
BSC
0.89 (0.035)
1.14 (0.045)
TO257
TO254
6.86 (0.270)
6.09 (0.240)
21.21 (0.835)
20.70 (0.815)
19.05 (0.750)
12.70 (0.500)
12.7 (0.500)
min.
5.08 (0.200)
BSC
5.84 (0.230)
5.31 (0.209)
2
4.95 (0.195)
4.52 (0.178)
4.19 (0.165)
3.94 (0.155)
Dia.
1 2 3
QR216 (screening) is based on the screening requirements of MIL-PRF-19500 (table IV) and
also ESA /ESCC 5000 (chart F3).Details of QR217 and QR216 are included in the following
pages.
0.48 (0.019)
0.41 (0.016)
dia.
1.14 (0.707)
0.88 (0.035)
2.54 (0.100)
Nom.
17.96 (0.707)
17.70 (0.697)
17.65 (0.695)
17.39 (0.685)
13.84 (0.545)
13.58 (0.535)
QR217 (quality conformance) is based on the quality conformance inspection requirements
of MIL-PRF-19500 groups A (table V), B (table VIa), C (table VII) and also ESA / ESCC 5000
(chart F4) lot validation tests.
3.81 (0.150)
BSC
3.81 (0.150)
BSC
All manufacture and processing is carried out on our approved High-Rel assembly line in
Lutterworth and product is released under our ISO 9001:2000 defence standard approval.
5.33 (0.210)
4.32 (0.170)
The ‘standard’ JQRS part is processed to the Semelab data sheet, screened to QR216 and has
conformance testing to Q217 groups A and B. Available options and the associated part
number extensions are shown below.These are chargeable and must be specified at order
stage. The extensions on the Semelab part numbers used reflect these additional items.
Ordering Information: (example)
3.56 (0.140)
BSC
1.65 (0.065)
1.39 (0.055)
Typ.
TO258
TO18
38.00
(1.5)
min.
6.35 (0.25)
9.15 (0.36)
10.67 (0.42)
11.18 (0.44)
1.52 (0.06)
3.43 (0.135)
2
22.23
(0.875)
max.
1
0.97 (0.060)
1.10 (0.043)
16.64 (0.655)
17.15 (0.675)
8.51 (0.34)
9.40 (0.37)
3
7.75 (0.305)
8.51 (0.335)
2
5.08 (0.200)
typ.
1
38.61 (1.52)
39.12 (1.54)
0.41 (0.016)
0.53 (0.021)
dia.
0.89
max.
(0.035)
45°
29.9 (1.177)
30.4 (1.197)
0.71 (0.028)
0.86 (0.034)
0.74 (0.029)
1.14 (0.045)
6.10 (0.240)
6.60 (0.260)
25.15 (0.99)
26.67 (1.05)
3
(case)
2.54
(0.100)
3.84 (0.151)
4.09 (0.161)
7.92 (0.312)
12.70 (0.50)
TO5
TO3
40.76
37.97
35.70
2. 4 11 PLCS
00 . 5 2
7 2 .7 2
08.23
34.52
43.43
¯0.570-0.650
5.0
27 940
PIN 1 IDENT
0 8 7 .0
03 4 . 2
559.3
3.20
38.3
2.50
5 4 7 .7
DIMENSIONS IN mm
TOLERANCE ± 0.125 mm
SM Power MCA
Power MCA
16
Part Number
Description
Marking (*)
2N2369-JQRS
QR217 groups A,B Screening to QR216
2N2369-JQRS
Additional options:
Customer Pre-Cap Visual Inspection
Customer Buy-Off visit
Data Pack
-CVP
-CVB
-DA
Group B charge
Group B destructive mechanical samples
-GRPB
-GBDM (12 pieces)
Group C charge
Group C destructive electrical samples
Group C destructive mechanical samples
-GRPC
-GCDE (12 pieces)
-GCDM (6 pieces)
Solderability Samples
Scanning Electron Microscopy
Radiography (X-ray)
Total Dose Radiation Test
-SS
-SEM
-XRAY
-RAD
Notes:
1) All ‘Additional Options’ are chargeable and must be specified at order stage.
2) When Group B or C is required, additional electrical and mechanical destructive samples must be ordered
3) All destructive samples are marked the same as other production parts unless otherwise requested.
pages extracted from ‘Semelab - High Reliability and Screening Options’
17
MIL-PRF-19500 – QR216, QR217 (Space) continued
9.2 QR217 Inspection Levels for ‘Space Level Processed’ Products
QR217: Group A - Electrical Tests
Subgroup
Description
QR217: Group C - Long term Environmental & Endurance Tests
S
al + mechanical
isuInspection
le*
Test
amp
Reject
1
V
20
0
2
DC electrical tests at 25°C
20
0
3
DC electrical tests. Hot & Cold temps as per device datasheet
45
0
4
AC
45
0
5
Safe Operating Area (Power Transistors)
Endpoint electrical measurements
Subgroup 2 & 3
Thermal Shock
(glass strain)
8
0
ctrical tests at ele
25°C
QR217: Group B - Short term Environmental & Endurance Tests *small lot conformance
note
Subgroup 1
Physical Dimensions
Subgroup 2
Solderability
Resistant to solvents
MIL-STD-750
method
Condition
S
le*
Reject
amp
d=destructive
2066
As per specification
2026
1022
(minimum 3 devices)
(Separate samples can be used)
8
1056
1051
Hermetic seal
(a) Fine Leak
(b) Gross leak
1071
Test condition B (25 cycles)
(glass diodes only)
T condition C or max stg temp,
whichever is less. 100 cyles.
6d
0
est
(4)
2075
Visual criteria in accordance
with qualified design.
Bond strength
2037
(minimum 6 devices)
Die Shear
2017
1027
1037
0
12 wires d
0
Parts from bond strength (min=6)
6d
0
340hrs at specified bias conditions
12
0
(5)
Electrical Measurements
Subgroup 6
Thermal resistance
6d
As specified
3131 and
As per SEMELAB specification
6
0
340hrs high temperature storage
As specified
12
0
SML 7404
Subgroup 7
High temperature life
(non operating)
1032
Electrical Measurements
(Minimum quantity of destructive samples required is 12 pieces)
(Full notes for numbered references are at the end of group C table)
pages extracted from ‘Semelab - High Reliability and Screening Options’
18
Reject
amp
0
1056
Test condition B (25 cycles)
6d
0
Temperature Cycling
(air to air)
1051
Test condition C or max stg temp,
whichever is less.
(45 cycles inc. screening)
Shock
2016
Non operating, 1500G, 0.5ms, 5
blows in each orientation, X1, Y1, Z1
(Y1 only for axial glass diodes)
Vibration
(Variable frequency)
2056
Hermetic seal
(a) Fine Leak
1071
Test condition H.
<0.01cc. max = 5 x 10-9 atm cc/s,
>0.01cc. max = 1 x 10-8 atm cc/s
b) Test condition C
Moisture resistance
1021
Omit initial conditioning
Terminal strength
2036
As specified
see (2)
6d
0
6
0
12d
0
Subgroup 4
Salt atmosphere
(corrosion)
As specified
(2)
Subgroup 6
Steady-state operation life
Electrical Measurement
le*
6
Subgroup 5
Thermal resistance
Test condition H.
<0.01cc. max = 5 x 10-9 atm cc/s,
>0.01cc. max = 1 x 10-8 atm cc/s
S
d=destructive
Dimensions per case outline specified
0
6d leads
6d devices
Condition
2066
Electrical Measurement
Temperature Cycling
(air to air)
Subgroup 4 / 5
Steady-state operation life
or Intermittent operation life
or Blocking life
MIL-STD-750
method
(b) Gross leak
(3)
(3)
Subgroup 3
Thermal shock
(liquid to liquid)
Internal visual design
verification
note
Subgroup 1
Physical Dimensions
The specified parameters to be included in each subgroup shall be as per Semelab Data Sheet. Where no parameters are specified
in a particular subgroup or test within a subgroup, no Group A testing is required for that subgroup or test to satisfy Group A
requirements. A single sample may be used for all subgroup testing. These tests are considered non-destructive.
Test
*small lot conformance
*small lot conformance
1041
Covered by MIL883 ongoing
Group D programme
3131 and
SML 7404
As per SEMELAB specification
1026
or Intermittent operation life
or Blocking life
1000hrs at max operating
junction temp
As specified
1036
Electrical Measurements
Subgroup 7
Internal Gas Analysis
(corrosion)
(2)
Covered by
ongoing
Group D programme
see (2)
3d
5d
MIL8830
1
(Minimum quantity of destructive samples required is 18 pieces)
1) Individual subgroups may be performed on representative parts from the same package family.
2) Group C subgroup 4 and 7 are covered by MIL883B ongoing group D programme. If customers require these subgroups to
be done on the specific batch being covered, an additional ‘Grp C extra’ charge applies and an additional 11 destructive
samples must be ordered. This must be specified at order stage.
3) Electrical reject devices from the same inspection lot may be used for all subgroups when electrical end point measurements
are not required.
4) Post burn-in electrical rejects may be used.
5) If a given inspection lot undergoing Group B inspection has been selected to satisfy Grp C inspection requirements, the 340
hour life test may be continued to 1000 hrs to satisfy the Group C life test requirements. In such cases, either the 340 hour end
point measurements must be made as a basis for Group B lot acceptance or the 1000 hour end point measurement shall be
used as the basis for both Group B and Group C acceptance.
6) Internal Visual Design Verification may be omitted if the devices have been manufactured by Semelab as sample pre-cap visual
inspection will have been performed.
pages extracted from ‘Semelab - High Reliability and Screening Options’
19
MIL-PRF-19500 – QR216, QR217 (Space) continued
10. ESA/ESCC - Space Level Product
9.3 QR216:‘Space Level’ Discrete Component Screening
Semelab’s Space Quality Level Products are based on the testing procedures specified in the
generic ESCC 5000 issue 3 and in the corresponding Detail Specifications.
QR216: Discrete Component Screening (with reference to MIL-STD-750)
Description
MIL-STD-750
method
1
Internal Visual (Pre-cap) Inspection
2069, 207, 2072
2
Customer Pre Cap Visual Inspection
2069, 2070, 2072
Customer specified option (chargeable)
100%
3
High temperature stabilisation bake
1032
24 hrs min at rated maximum
storage temperature
100%
20 cycles at -55°C to +175°C or max
storage temp (whichever is lower)
with minimum 10 minutes dwell time
100%
4
5
Temperature Cycling
Constant acceleration
Conditions
JQR-S
100%
1051
2006
20,000G force in Y1axis for 1 min duration
(see note 2)
100%
(full yielded quantity)
100%
6
Particle Impact Noise Detection (PIND)
7
Device Serialisation
Device serialisation is carried through to shipping.
8
Interim electrical
Read & Record
100%
9
High temperature reverse bias
a) Bipolar
b) Power MOSFET
c) Diodes
Test Condition A
Test Condition B
Test Condition A
100%
Read & Record, Drift Check
100%
2052
1039
1042
1038
10 Interim electrical (note 3)
11 Power burn-in
a) Bipolar
b) Power MOSFET
c) Diodes
1039
1042
Test Condition B - 240 hrs min
Test Condition A - 240 hrs min
1038
Test Condition B - 240 hrs min (4)
12 Final electricals (note 3)
13 a) Hermeticity – Fine
All manufacture and processing is carried out on our approved High-Rel assembly line in our
Lutterworth factory and product is released under our ISO 9001:2000 defence standard
approval.
1071
100%
Read & Record, Drift check (1)
100%
100%
100%
b) Hermeticity - Gross
1071
Test condition H. Max leak rate =5x10-8 atm cc/s,
(5x10-7 atm cc/s for internal cavity <0.3cc)
Condition C
14 Radiographic tests (X-Ray)
2076
(May be performed at any time after serialization)
15 External Visual Inspection
2071
100%
The table below shows the additional options which may be required by the customer. All
items must be agreed and specified at order stage.
The following pages show the generic chart F2 (component lot manufacturing), chart F3
(screening) and chart F4 (Validation) requirements.
Additional options:
Customer Pre-Cap Visual Inspection
Customer Buy-Off visit
Data Pack
-CVP
-CVB
-DA
Lot Validation Testing (subgroup 1) charge
LVT1 destructive samples (electrical)
LVT1 destructive samples (mechanical)
-LVT1
-L1DE (normally 15 pieces)
-L1DM (normally 15 pieces)
Lot Validation Testing (subgroup 2) charge
LVT2 destructive samples (electrical)
-LVT2
-L2D (normally 15 pieces)
Lot Validation Testing (subgroup 3) charge
LVT3 destructive samples (electrical)
-LVT3 (normally 5 pieces)
Scanning Electron Microscopy (SEM)
Radiography (X-ray)
Total Dose Radiation tests
-SEM
-XRAY
-RAD
Notes:
1) All ‘Additional Options’ must be specified at order stage
2) All ‘Additional Options’ are chargeable
3) All destructive samples are marked the same as other production parts unless otherwise requested.
Notes:
1) QR217 Group A subgroups 2 and 3 end point tests as per device detail spec.
2) 10000G force for devices with power rating >10 watts at Tc=25°C.
3) PDA (percentage defects allowable) is 10% between steps 8 & 10 and 10 & 12.
4) Zener diodes shall be subjected to high temperature reverse bias at 80 - 85 percent of nominal VZ for VZ > 10 V.
Omit test for devices with VZ ≤ 10 V. For JQRS case mounted rectifiers condition A is required.
pages extracted from ‘Semelab - High Reliability and Screening Options’
20
pages extracted from ‘Semelab - High Reliability and Screening Options’
21
ESA/ESCC (Space Level Flow) continued
10.2 ESA/ESCC - Chart F3 Screening (ESCC 5000 issue 3)
10.1 Chart
- Production
Control
(ESCC 5000 issue 3)
10.1
ChartF2F2
- Production
Control
(ESCC 5000 issue 3)
Components from Production Control
para 8.5
Component Lot manufacturing
Electrical Test
para 8.6.1
Wafer Lot Acceptance
para 5.3.1
Process Monitoring Review
para 5.3.2
SEM Inspection
para 5.3.3
Total Dose Rad Testing (1,4)
Special In - Process controls
para 5.2.1
High Temperature Stabilisation Bake
Internal Visual inspection (Pre-cap inspection)
para 5.2.1
Bond Strength (Pre-cap inspection)
(1)
para 5.2.1
Die Shear (Pre-cap inspection)
(1)
(1,3)
(11)
Temperature Cycling
Acceleration
(10)
para 8.7
Particle Impact Noise Detection (PIND)
para 8.22
Verification of Safe Operating Area
para 8.9.1
Electrical Measurements, Serialisation
and Parameter Drift Values
(1)
para 8.20
High Temperature Reverse Bias Burn-In
(2)
para 8.9.1
Parameter Drift Values
HTRB Final and Power Burn-In Intial Measurements
(1)
para 8.21
Power Burn-In
(2)
para 8.9.1
Parameter Drift Values (Final Measurements)
(4)
para 8.9.2
High and Low Temperature Electrical Measurements
(2,3)
(4,5)
Hot Solder Dip (if applicable) (6)
para 5.2.1
para 5.2.1
para 5.2.3
Encapsulation (Pre-cap inspection)
Dimension Check
(1)
(1)
Weight
(2)
para 8.3
Radiographic Inspection
(9)
para 8.8.1&2
Seal (Fine & Gross Leak)
para 8.9.3
Room Temperature Electrical Measurements (inc AC)
para 6.4.1
Check for Lot Failure
(8)
para 8.10
External Visual Inspection
(8)
para 8.16
Solderability
(4,5)
To Chart F4 (Validation Testing)
To Chart F3 (Screening)
Notes:
1) Performed on a sample basis.
2) Guaranteed but not tested.
3) If specified in the detail specification.
4) If specified in the detail specification and required in the Purchase Order.
pages extracted from ‘Semelab - High Reliability and Screening Options’
22
(4,7)
Notes:
1) All components shall be serialised prior to Initial Electrical Measurement.
2) If specified in detail spec.
3) Can be performed at any time prior to initial measurements of Parametric Drift values.
4) The Lot Failure criteria of paragraph 6.4 applies to this test.
5) Performed on a sample basis.
6) Can be performed at any time prior to Room Temp Electrical Measurements during screening (prior to Seal test).
7) Measurements of parametric Drift Values need not be repeated in Room Temperature Electrical measurements.
8) Check for Lot Failure shall take into account all electrical parameter failures that may occur during screening.
Tests in accordance with paragraph 8.9.1, 8.9.2, 8.9.3 subsequent to HTRB Burn-In.
9) Radiographic Inspection may be performed at any point during Screening Tests.
10) Not specified in ESCC 5000 iss 3, but performed by Semelab to MIL-STD-750 method 2006.
11) Not specified in ESCC 5000 iss 3, but performed by Semelab as a process monitor.
pages extracted from ‘Semelab - High Reliability and Screening Options’
23
ESA/ESCC (Space Level Flow) continued
11. Screening & Approval Comparison Tables
10.3 Chart F4 - Validation Testing (ESCC 5000 issue 3)
11.1 Comparison of Space Level Screening Options
Components for Validation
Space Level Flow Comparison Table
GENERIC
Screening
LVT1
(Subgroup 1)
Mechanical & Environmental
15 Components
Mechanical Shock
para 8.11
Vibration
para 8.12
15 Components
Thermal Shock (2)
para 8.11
LVT2
(Subgroup 1)
Endurance
LVT3
(Subgroup 3)
Assembly Capability
15 Components
5 Components
Operating Life (4)
2000 hours
data points:
0, 1000, 2000hrs
para 8.19
Temp Cycling (3)
para 8.6.2
ESCC
JANS*
JQRS
OPT
OPT
OPT
24 hrs
24 hrs
24hrs
Temperature cycling
20 cycles
20 cycles
20 cycles
Thermal impedance
OPT
Pre-cap Visual
Customer pre-cap Visual
High Temp Storage (Stabilization Bake)
Constant Acceleration
Terminal Strength
para 8.18
QR216
-
_
PIND
Fine/Gross Leak ∑
Constant
Acceleration
para 8.13
Immediate & End
Ppoint Electrical End
Measurements
para 8.9.4
Moisture
Resistance
para 8.15
Internal Visual
Inspection
para 8.1
Serialization
Interim Electrical Measurements
-
-
-
-
-
-
min 168 hrs
max 264 hrs
240 hrs
240hrs
-
-
-
Interim Electrical Measurements (Read and Record / Drift)
Seal
para 8.8.1 & 8.8.2
Seal
para 8.8.1 & 8.8.2
Seal
para 8.8.1 & 8.8.2
Immediate & End
Ppoint Electrical End
Measurements
para 8.9.4
Immediate & End
Ppoint Electrical End
Measurements
para 8.9.4
External Visual
Inspection
para 8.10
External Visual
Inspection
para 8.10
External Visual
Inspection
para 8.10
Permanence of
Marking
para 8.17
Bond Strength
para 8.2.1
HTRB
Electrical Measurements
Die Shear
para 8.2.2
Parametric Drift measurements (Read and Record / Drift)
Burn-In
Electrical Measurements
Parameter Drift Measurements (Read and Record)
PDA Calculations
LVT1 (Subgroup 1)
Lot Validation
LVT2 (Subgroup 2)
Lot Validation
LVT3 (Subgroup 3)
Lot Validation
Read and Record Test Data
Other Electrical Parameters (Temp, Dynamic)
Fine/Gross Leak
Notes:
1) ESCC 5000 iss 3 table F4 - Qualification & Periodic Testing becomes ‘Validation Testing’ for non qualified parts.
2) Only applicable to axial diodes.
3) Not applicable to axial lead glass diodes.
4) Variance in Test method based on product type.
Ordering Information:
1) Order for Subgroup 1 (includes subgroups 2 & 3) requires order for 50 (30+15+5) destructive samples.
2) Order for Subgroup 2 (includes subgroup 3) requires order for 20 (15+5) destructive samples.
3) Order for Subgroup 3 requires order for 5 destructive samples.
4) Other Ordering Options are available - please contact Semelab Sales
pages extracted from ‘Semelab - High Reliability and Screening Options’
24
Radiography
External Visual Inspection
Notes:
if specified in detail specification.
_ not specified in ESCC 5000 iss 3, but performed by Semelab.
pages extracted from ‘Semelab - High Reliability and Screening Options’
25
*JANS part not available from Semelab.
Screening & Approval Comparison Tables
11.2 Comparison of Space Level Die Lot Approval Procedures.
11.3 Comparison of High-Rel Screening Options (Discrete Devices)
The table below shows a comparison of operations carried out for die approval within the
generic approval systems (MIL-PRF-19500 space level and ESA / ESCC 5000. It must be noted
that SEM and RHA total dose evaluation are options which must be specified if required
carry an additional charge.
The table below shows the comparison of screening options available within the CECC, BS and
MIL approvals. Comparison is also shown with Semelab’s in-house QR204 options.
CECC / QR209
A
Space Level/ Die Lot Acceptance Table
GENERIC
Die Lot Acceptance
ESCC
SML
JANS
JQR-S
Selected Wafer
B
C
BS 9300
D
A
B
C
QR204
D
MIL
JQRA JQRB JAN* JAN*
TXV TX
Pre-cap Visual
High Temp Storage
Temperature Cycle
5
5
5
cycles cycles cycles
10
10
10
cycles cycles cycles
20
20
20
20
cycles cycles cycles cycles
Probe Test (100%)
Constant Acceleration
Glassivation / Metallization Inspection
Visual Inspection (100%)
Particle impact noise
detection (PIND)
Sample Assembly (10 pcs)
Fine Leak test
Stabilization
Gross Leak Test
Temperature Cycling
Device Serialisation
Electrical Test (read/record)
Variables Electrical test
HTRB
Attributes Electrical tests
Electrical Test (read/record)
Burn-In (HTRB)
168
hrs*
172
hrs*
48
hrs*
160
hrs*
72
hrs*
48
hrs*
±
±
±
±
±
±
±
±
160
hrs*
160
hrs*
160
hrs*
160
hrs*
±
±
±
±
48
hrs*
Steady State Life (1000 hrs)
Variables Electrical test
Electrical Test (read/record)
Attributes Electrical tests
Wire Bond Evaluation
Burn-In (Power)
Die Shear Evaluation
168
hrs*
SEM
OPT
OPT
OPT
Variables Electrical test
RHA Total Dose Evaluation
OPT
OPT
OPT
Attributes Electrical tests
172
hrs*
48
hrs*
160
hrs*
72
hrs*
48
hrs*
48
hrs*
Radiographic tests
* full JANTX, JANTXV not available from Semelab
Test Performed
± Test Performed if required by device detail specification
24 hours for PNP devices. 48 hours for NPN devices
* High Temp Reverse Bias for Case rated devices
Power Burn-in for Ambient rated Devices
CECC / QR209
BS
QR216
QR204
MIL
pages extracted from ‘Semelab - High Reliability and Screening Options’’
26
: Screening carried out in accordance with CECC 50000 Appendix 6
: Screening carried out in accordance with BS9300 section 1.2.10
: Screening carried out in accordance with Semelab QR216
: Screening carried out in accordance with Semelab QR204
: Screening carried out in accordance with MIL-PRF-19500 (Table 2)
pages extracted from ‘Semelab - High Reliability and Screening Options’
27
Experience and Innovation in Semiconductor Solutions
Specialists in
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Your Semelab Distributor:
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Semelab Limited
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A subsidiary of TT electronics plc.
DSCC
Qualified
Manufacturers
List
Defence
Supply
Center
Columbus
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Space Agency
MOD
Registration
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Issue 2