GL100MNxMP Series

GL100MNxMP Series
GL100MNxMP
Series
Compact, Surface Mount Type
Infrared Emitting Diode
■ Features
■ Outline Dimensions
1. Compact and thin package
2. Surface mount type
3. 2-way mounting;top view/side view
4. Reflow soldering
5. High output type:GL100MN1MP
6. General purpose type:GL100MN0MP
Pair use with PT100MC0MP/PT100MF0MP
is recommended
0.65
0.95
1.5
0.4
1
2.2
(Ta=25°C)
(0.57)
(0.57)
1
1
(1)
1
2
2
(1)
Pattern example seeing
from PCB (Side view)
3
1.1
Anode
Cathode
Pattern example seeing
from PCB (Top view)
3
1.5
1.1
2
1.5
1.1
1.7
Unit
mA
A
V
mW
˚C
˚C
˚C
0.85
Rating
50
0.5
6
75
−30 to +85
−40 to +95
240
1.4
*1 Pulse width 100µs, duty 0.01
*2 Max. 10s
Symbol
IF
IFM
VR
P
Topr
Tstg
Tsol
R0.8
(0.65)
Parameter
Forward current
*1
Peak forward current
Reverse voltage
Power dissipation
Operating temperature
Storage temperature
*2
Soldering temperature
(0.4)
1.5
1. Touch panel for ATM
2. Touch panel for Car navigation system
3. Touch panel for FA equipment
2.2
(0.2)
(0.35)
0.75
2.8
■ Applications
■ Absolute Maximum Ratings
(Unit : mm)
3
1.1
(Lens center)
Please pay attention not to make circuit pattern in
area.
❈ Unspecified tolerance : ±0.2mm
❈ ( ) : Reference dimensions
Au-plated area
Notice
In the absence of confirmation by device specification sheets, SHARP takes no responsibility for any defects that may occur in equipment using any SHARP
devices shown in catalogs, data books, etc. Contact SHARP in order to obtain the latest device specification sheets before using any SHARP device.
Internet Internet address for Electronic Components Group http://sharp-world.com/ecg/
GL100MNxMP Series
■ Electro-optical Characteristics
Parameter
GL100MN0MP
GL100MN1MP
Forward voltage
Peak forward voltage
Reverse current
GL100MN0MP
GL100MN1MP
Radiant flux
Peak emission wavelength
Half intensity wave length
Terminal capacitance
Response frequency
Half intensity angle
Symbol
VF
VF
VFM
IR
Φe
Φe
λp
∆λ
Ct
fc
∆θ
MIN.
−
−
−
−
1.0
Conditions
IF=20mA
IF=20mA
IFM=0.5A
VR=3V
IF=20mA
IF=20mA
IF=5mA
IF=5mA
VR=0, f=1MHz
−
−
TYP.
1.2
1.2
3.0
−
−
−
940
45
50
300
±10
2.0
−
−
−
−
−
(Ta=25˚C)
Unit
V
V
V
µA
mW
mW
nm
nm
pF
kHz
˚
−
−
−
−
Fig.2 Peak Forward Current vs. Duty Ratio
Fig.1 Forward Current vs. Ambient
Temperature
1 000
60
Pulse width≤100µs
Ta=25°C
500
Peak forward current IFM (mA)
50
Forward current IF (mA)
MAX.
1.4
1.5
4.0
10
3.0
6.0
−
40
30
20
100
10
10
0
−25
0
25
50
75 85
1
10−4
100
10−3
10−2
Fig.3 Spectral Distribution
Fig.4 Spectral Distribution
GL100MN0MP
GL100MN1MP
100
IF=5mA
Ta=25°C
80
Relative radiant intensity (%)
Relative radiant intensity (%)
IF=5mA
Ta=25°C
60
40
20
0
860
880
900
920
940
960
1
Duty ratio
Ambient temperature Ta (°C)
100
10−1
980 1 000 1 020 1 040
Wavelength λ (nm)
80
60
40
20
0
860
880
900
920
940
960
980 1 000 1 020 1 040
Wavelength λ (nm)
GL100MNxMP Series
Fig.5 Peak Emission Wavelength vs.
Ambient Temperature GL100MN0MP
980
Fig.6 Peak Emission Wavelength vs.
Ambient Temperature GL100MN1MP
980
IF=const.
970
Peak emission wavelength λp (nm)
Peak emission wavelength λp (nm)
IF=const.
960
950
940
930
920
−50 −30 −25
0
25
50
970
960
950
940
930
920
−50 −30 −25
75 85 100
Ambient temperature Ta (°C)
Fig.7 Forward Current vs. Forward
Voltage
GL100MN0MP
1 000
0
25
50
75 85 100
Ambient temperature Ta (°C)
Fig.8 Forward Current vs. Forward
Voltage
GL100MN1MP
1 000
25°C
0°C
50°C
100
Forward current IF (mA)
Forward current IF (mA)
Ta=85°C
−30°C
10
1
Ta=85°C
100
50°C
10
25°C
0°C
−30°C
1
0.1
0.1
0
0.5
1
1.5
2
2.5
0
3
0.5
1
Fig.9 Relative Radiant Flux vs. Ambient
Temperature
GL100MN0MP
1
0
25
2.5
3
50
Ambient temperature Ta (°C)
75 85 100
GL100MN1MP
10
IF=const.
0.1
−50 −30 −25
2
Fig.10 Relative Radiant Flux vs. Ambient
Temperature
Relative radiant flux (%)
Relative radiant flux (%)
10
1.5
Forward voltage VF (V)
Forward voltage VF (V)
IF=const.
1
0.1
−50 −30 −25
0
25
50
Ambient temperature Ta (°C)
75 85 100
GL100MNxMP Series
Fig.11 Radiant Flux vs. Forward
Current
GL100MN0MP
100
Fig.12 Radiant Flux vs. Forward
Current
GL100MN1MP
100
Ta=25°C
Ta=25°C
1
Radiant flux Φe (mW)
Radiant flux Φe (mW)
10
Pulse
(Pulse width≤100µs)
10
Pulse
(Pulse width≤100µs)
1
0.1
0.01
0.1
10
100
1 000
1
10
Forward current IF (mA)
Fig.13 Relative Output vs. Distance To
Detector
100
IF=const.
Ta=25°C
−20°
Relative output (%)
−50°
−60°
−70°
1 000
−90°
Only one time soldering is recommended within the temperature
profile shown below.
240°CMAX.
200°C
1 to 4°C/s
1 to 4°C/s
1 to 4°C/s
25°C
10sMAX.
60sMAX.
+20°
Ta=25°C
+30°
60
+40°
40
+50°
+60°
20
+70°
+80°
0
Angular displacement θ
Fig.15 Reflow Soldering
90sMAX.
80
−80°
Distance to detector d (mm)
120sMAX.
+10°
0°
−30°
1
0.1
−10°
100
−40°
165°CMAX.
1 000
Fig.14 Radiation Diagram (Typical Value)
10
Distance combine GL100MN0 (1) MP
0.01 and PT100MC (F) 0MP
0.1
1
10
100
100
Forward current IF (mA)
Relative radiant intensity (%)
1
+90°
NOTICE
●
The circuit application examples in this publication are provided to explain representative applications of SHARP
devices and are not intended to guarantee any circuit design or license any intellectual property rights. SHARP takes
no responsibility for any problems related to any intellectual property right of a third party resulting from the use of
SHARP's devices.
●
Contact SHARP in order to obtain the latest device specification sheets before using any SHARP device. SHARP
reserves the right to make changes in the specifications, characteristics, data, materials, structure, and other contents
described herein at any time without notice in order to improve design or reliability. Manufacturing locations are
also subject to change without notice.
●
Observe the following points when using any devices in this publication. SHARP takes no responsibility for damage
caused by improper use of the devices which does not meet the conditions and absolute maximum ratings to be used
specified in the relevant specification sheet nor meet the following conditions:
(i) The devices in this publication are designed for use in general electronic equipment designs such as:
- - - Personal computers
- -- Office automation equipment
- -- Telecommunication equipment [terminal]
- - - Test and measurement equipment
- - - Industrial control
- -- Audio visual equipment
- -- Consumer electronics
(ii) Measures such as fail-safe function and redundant design should be taken to ensure reliability and safety when
SHARP devices are used for or in connection with equipment that requires higher reliability such as:
- -- Transportation control and safety equipment (i.e., aircraft, trains, automobiles, etc.)
- - - Traffic signals
- - - Gas leakage sensor breakers
- - - Alarm equipment
- -- Various safety devices, etc.
(iii)SHARP devices shall not be used for or in connection with equipment that requires an extremely high level of
reliability and safety such as:
- - - Space applications
- -- Telecommunication equipment [trunk lines]
- -- Nuclear power control equipment
- -- Medical and other life support equipment (e.g., scuba).
●
If the SHARP devices listed in this publication fall within the scope of strategic products described in the Foreign
Exchange and Foreign Trade Law of Japan, it is necessary to obtain approval to export such SHARP devices.
●
This publication is the proprietary product of SHARP and is copyrighted, with all rights reserved. Under the copyright
laws, no part of this publication may be reproduced or transmitted in any form or by any means, electronic or
mechanical, for any purpose, in whole or in part, without the express written permission of SHARP. Express written
permission is also required before any use of this publication may be made by a third party.
●
Contact and consult with a SHARP representative if there are any questions about the contents of this publication.