QM2A1UB028

PREPARED BY:
DATE
Reference
SPEC NO.
FILE No.
ISSUE
CHECKED BY:
DATE
ELECTRONIC COMPOMENTS
AND DEVICES GROUP
APPROVED BY:
DATE
PAGE
Dec. 4, 2012
1/22
REPRESENTATIVE DIVISION
SHARP CORPORATION
SPECIFICATION
SYSTEM DEVICE DIVISION
DEVICE SPECIFICATION FOR
2.4GHz Wireless LAN Front-End IC
MODEL No.
QM2A1UB028
□ CUSTOMER’S APPROVAL
DATE
BY
PRESENTED
BY
Development Department Ⅰ
System Device Division
Electronic Components and Devices Group
SHARP CORPORATION
PAGE 2/22
MODEL No.
SPEC No.
QM2A1UB028
DOC. FIRST ISSUE
Dec. 4, 2012
RECORD OF REVISION
IDENT. DATA No.
REF. PAGE
DATE
PARAGRAPH
CHECK
REVISED
No.
SUMMARY
&
APPROVAL
DRAWING No.
Dec. 4, 2012
FIRST ISSUE
Apr. 15, 2013
Revised evaluation circuit for external noise reduction
PAGE 3/22
Product name :
2.4GHz Wireless LAN Front-End IC
Model No.
QM2A1UB028
1. These specification sheets include materials protected under copyright of Sharp Corporation ("Sharp").
Please do not reproduce or cause anyone to reproduce them without Sharp's consent.
2. When using this product, please observe the absolute maximum ratings and the instructions for use outlined
in these specification sheets, as well as the precautions mentioned below. Sharp assumes no responsibility
for any damage resulting from use of the product which does not comply with the absolute maximum ratings
and the instructions included in these specification sheets, and the precautions mentioned below.
(Precautions)
(1) Please do verify the validity of this part after assembling it in customer’s products, when customer
wants to make catalogue and instruction manual based on the specification sheet of this part.
(2) This product is designed for use in the following application areas ;
• OA equipment • Audio visual equipment • Home appliances
• Telecommunication equipment (Terminal) • Measuring equipment
• Tooling machines • Computers
If the use of the product in the above application areas is for equipment listed in paragraphs
(3) or (4), please be sure to observe the precautions given in those respective paragraphs.
(3) Appropriate measures, such as fail-safe design and redundant design considering
the safety design of the overall system and equipment, should be taken to ensure reliability
and safety when this product is used for equipment which demands high reliability and
safety in function and precision, such as ;
• Transportation control and safety equipment (aircraft, train, automobile etc.)
• Traffic signals • Gas leakage sensor breakers • Rescue and security equipment
• Other safety equipment
(4) Please do not use this product for equipment which require extremely high reliability
and safety in function and precision, such as ;
• Space equipment • Telecommunication equipment (for trunk lines)
• Nuclear power control equipment • Medical equipment
(5) Please contact and consult with a Sharp sales representative if there are any questions
regarding interpretation of the above three paragraphs.
3. Please contact and consult with a Sharp sales representative for any questions about this product.
PAGE 4/22
CONTENTS
Page
1. Description
5
2. Pin Out and Assignment
6
3. Absolute Maximum Ratings
7
4. Electrical Characteristics
8
5. Application Information
9
6. Package and packing specification
11
MODEL No.
QM2A1UB028
SPEC No.
PAGE
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522
1. Description
1-1 Functions
The QM2A1UB028 is an integrated Front-end IC in a small and low profile 2.5mmx2.5mmx0.4mm package for 2.4GHz
Band WLAN systems.
The QM2A1UB028 integrates two-stage Power Amplifier with a power detector, LNA and SP3T switch with all 50Ω
RF ports, which requires minimal external components and provides minimizing PCB foot-print.
TX
PA
ANT
RX
LNA
SW
(SP3T)
Bypass
BT
1-2 Features
▪
Integrates matching network, All RF ports are 50Ω
▪
Integrates the high efficiency and high linearity PA
Pout=19dBm, 802.11ac (MCS7, BW=20MHz , 64QAM,) at EVM 2%, 2.4-2.5GHz, VDD=3.6V
▪
Wide dynamic range and load insensitive built-in power detector
▪
SP3T Switch capable of alternative reception for WLAN and Bluetooth
▪
The LNA with bypass mode function which allows wide dynamic range Rx operation
▪
Lead Free / RoHS Compliant / Halogen Free
1-3 Applications
▪
W-LAN(IEEE 802.11b/g./n/ac)
====== Not designed or rated as radiation hardened ======
1-4 Handle with care
▪
ESD ( Electro-Static Discharge ) sensitive.
▪
Gallium (Ga) and Arsenic (As) specified as poisonous chemicals by law. For the prevention of a hazard, do not
burn, destroy, or process chemically to make them as gas or powder.
When the product is disposed, please follow the related regulation and do not mix this with general industrial
waste or household waste.
MODEL No.
QM2A1UB028
SPEC No.
PAGE
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622
GND
BT
VDD_LNA
LNA_ON
2. Pin Out and Assignment
2-1 Pin Out
12
11
10
9
TOP VIEW
14
NC
15
ANT
16
1
2
3
8
RX
7
GND
6
PA_ON
5
TX
4
VDD_PA1
VC_RX
028
YMX
SB
VDD_PA2
13
N.C.
VC_BT
VDET
(contact pins facing down)
2-2 Pin Description
Pin
1
2
3
4
5
6
7
8
Symbol
VDET
N.C.
VDD_PA2
VDD_PA1
TX
PA_ON
GND
RX
Description
Detector Voltage Output
Non Connection
PA 2nd Stage Supply Voltage
PA 1stStage Supply Voltage
Tx Port Input
PA ON/OFF Control Voltage
Ground
Rx Port Output
Pin
9
10
11
12
13
14
15
16
Symbol
LNA_ON
VDD_LNA
BT
GND
VC_BT
VC_RX
N/C
ANT
Description
LNA ON/OFF Control Voltage
LNA Supply Voltage
Bluetooth Port
Ground
BT Switch Control Voltage
Rx Switch Control Voltage
No Connect
Antenna Port
MODEL No.
QM2A1UB028
SPEC No.
PAGE
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722
3. Absolute Maximum Ratings and Recommended Operating Conditions
3-1 Absolute Maximum Ratings
Applied conditions greater than those listed may cause permanent damage to the IC. Functional operation is not
implied under these conditions. Exposure to absolute ratings for extended periods of time may adversely affect reliability.
Parameter
Symbol
DC Supply Voltage (VDD)
VDD
Unit
Min.
Max.
V
-
5
No RF Applied, Ta=25℃
Note
DC Supply Current (IDD)
IDD_PA
Total DC Power Dissipation
PD
mA
-
300
While Tx mode, Ta=25℃
W
-
1
Ta=25℃
TX RF Input Level
TX_IN
dBm
-
0
Ta=25℃
RX RF Input Level
RX_IN
dBm
-
5
At ANT Port,Ta=25℃
Storage Temperature
Tstg
℃
-55
+125
Operating Temperature
Ta_opr
℃
-30
+85
Maximum Junction Temperature
Tj_max
℃
+150
3-2 Recommended Operating Conditions
Parameter
Frequency
DC Supply Voltage
Control Voltage (High State)
Control Voltage (Low State)
Unit
Min.
MHz
V
V
V
V
2400
3.2
2.95
2.8
-
Typ.
Max.
3.6
3.3
3.3
0
2500
4.6
3.65
VDD
0.4
Note
VDD_PA,VDD_LNA
PA_ON (*1)
VC_RX, LNA_ON, VC_BT
PA_ON, VC_RX, LNA_ON
(*1) with virtual resistor R2 in our evaluation board. (refer to page.9)
3-3 FEIC Control Logic Table
Mode
Bluetooth
WLAN RX (Normal-mode)
WLAN RX (Bypass-mode)
WLAN TX
VC_BT
VC_RX
LNA_ON
PA_ON
High
Low
Low
Low
Low
High
High
Low
Low
High
Low
Low
Low
Low
Low
High
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SPEC No.
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4. Electrical Characteristics
These specifications are obtained with the evaluation board shown in Page 10
Test conditions are Ta = 25 °C, Source impedance: ZS = 50Ω, load impedance: ZL = 50 Ω, unless otherwise noted.
Common Parameters
Ta=25℃,VDD_PA=VDD_LNA=3.6V, PA_ON=LNA_ON=VC_BT=VC_RX=0V, no RF input
Parameter
Stand-by Leakage Current
Symbol
ILEAK
Condition
Measured on VDD leakage current
Min.
Typ.
Max
Unit
－
－
20
µA
Tx Parameters
Ta=25℃,Freq=2.4-2.5GHz, VDD_PA=VDD_LNA=3.6V, PA_ON=3.3V, LNA_ON=VC_BT=VC_RX=0V,
unless otherwise noted.
Parameter
Symbol
Power Gain
GAIN_TX
Power Consumption
IDD_PA_
PA Control Current
Error Vector Magnitude(*1)
Power Detector Voltage Output
Condition
Min.
Typ.
Max
Unit
27
dB
200
mA
IPA_ON
6
mA
EVM
2
%
No RF
0.21
V
Pout=19dBm, CW
0.8
V
Pout=21dBm (802.11b, CCK-1Mbps)
-14
dBm/MHz
VDET_DC
VDET
Pout=19dBm ,
802.11ac, MCS7, BW=20MHz, 64QAM,
Dynamic-EVM
nd
2fo
rd
3fo
-33
dBm/MHz
TX Input
RL_TX
12
dB
ANT port
RL_ANT_t
12
dB
2 Harmonic
3 Harmonic
Return Loss
RX Parameters
Ta=25℃,Freq=2.4-2.5GHz, VDD_PA=VDD_LNA=3.6V, PA_ON=VC_BT=0V, LNA_ON=3.3V,VC_RX=3.3V,
unless otherwise noted.
Parameter
Symbol
Normal-mode Gain
GAIN_Rx
Bypass-mode Gain
GAIN_BP
Noise Figure
NF
Input IP3
Condition
Min.
Typ.
Max
13
Unit
dB
LNA_ON=0V
-5.5
dB
(Includes the SW loss before LNA)
2.0
dB
7
dBm
15
dBm
The tone separation=100kHz, Pin=-20dBm
Normal-mode
IIP3_NORM
Bypass-mode
IIP3_BP
LNA Supply Current
IDD_LNA
Rx Control Current
LNA Control Current
LNA_ON=0V
10
mA
IC_RX
Measured on VC_RX
-
6
µA
ILNA_ON
Measured on LNA_EN
-
6
µA
Measured on VDD_LNA
Return Loss
RX output
RL_RX
7
dB
ANT port
RL_ANT_r
12
dB
Bluetooth Parameters
Ta=25℃,Freq=2.4-2.5GHz, VDD_PA=VDD_LNA=3.6V, PA_ON=LNA_ON=VC_RX=0V,VC_BT=3.3V,
unless otherwise noted.
Parameter
Symbol
Insertion Loss
IL_BT
BT Control Current
IC_BT
BT Port Return Loss
RL_BT
Condition
Measured on VC_BT
Min.
Typ.
Max
Unit
0.6
dB
6
µA
20
dB
MODEL No.
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SPEC No.
PAGE
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922
5. Application Information
5-1
Typical Evaluation Circuit
VDD_PA
C2
C1
（
VDET
NC
5
ANT
15
）
6
（
R1
1
PA
R2
PA_ON
2
）
TX
3
16
4
C6
SP3T
(*3)
VC_RX
14
7
LNA
C4
13
8
RX
(*3)
VC_BT
C5
9
10
11
(*3)
12
LNA_ON
C3
VDD_LNA
BT
Figure 1. Schematic of Evaluation Circuit
Table 1. Parts List of Evaluation Circuit
Symbol
Value
Vendor
Part Number
C1
10 pF
KYOCERA
CM05CH100B50AB
C2
1 µF
Murata
GRM155F11C105Z
C3
1 µF
Murata
GRM155F11C105Z
C4 (*3)
10 pF
Kyocera
CM05CH100J50AB
C5 (*3)
10 pF
Kyocera
CM05CH100J50AB
C6 (*3)
10 pF
Kyocera
CM05CH100J50AB
R1(*2)
27k ohm
ROHM
MCR MZSJ 273
R2 (*2)
24 ohm
ROHM
MCR01 MRTJ240
(*2) These resistors do not need in the real circuit because they are put to simulate the output series resistor and input impedance
of the chip set.
(*3) These components are for external noise reduction. Please confirm the system performance on your board, if you want to
remove or change them.
MODEL No.
QM2A1UB028
SPEC No.
PAGE
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1022
Evaluation Board
028
R1
C2
1pin index
C1
●
5-2
R2
Layer Structure.
Material: FR4 (ε=4.7）
SR
Cu
PP
Unit: um
20
18
200
C3
Cu
35
Core
400
Cu
PP
35
200
Cu
SR
18
20
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1122
6. Package and packing specification
6-1 Storage Conditions
6-1-1 Storage conditions required before opening the dry packing
• Normal temperature : 5 ~ 40 °C
• Normal humidity : 80 % ( Relative humidity ) or less
• Storage period : One year or less
* " Humidity " means " Relative humidity "
6-1-2 Storage conditions required after opening the dry packing
In order to prevent moisture absorption after opening, ensure the following storage conditions apply:
(1) Storage conditions for one-time soldering ( Convection reflow**, IR / Convection reflow** )
• Temperature : 5 ~ 25 °C
• Humidity : 60 % or less
• Period : 96 hours or less after opening
(2) Storage conditions for two-time soldering ( Convection reflow**, IR / Convection reflow** )
a. Storage conditions following opening and prior to performing the 1st reflow
• Temperature : 5 ~ 25 °C
• Humidity : 60 % or less
• Period : 96 hours or less after opening
b. Storage conditions following completion of the 1st reflow and prior to performing the 2nd reflow
• Temperature : 5 ~ 25 °C
• Humidity : 60 % or less
• Period : 96 hours or less after completion of the 1st reflow
** : Air or nitrogen environment
6-1-3 Temporary storage after opening
To re-store the devices before soldering, do so only once and use a dry box or place desiccant ( with a blue
humidity indicator ) with the devices and perform dry packing again using heat-sealing.
The storage period, temperature and humidity must be as follows :
(1) Storage temperature and humidity
First opening
X1
Re-sealing
Ｙ
Re-opening
X2
Mounting
Temperature : 5 ~ 40 °C
Temperature : 5 ~ 25 °C
Temperature : 5 ~ 40 °C
Temperature : 5 ~ 25 °C
Humidity : 80 % or less
***
Humidity : 60 % or less
Humidity : 80 % or less
***
Humidity : 60 % or less
***：External atmosphere temperature and humidity of the dry packing
(2) Storage period
• X1＋X2 ‫׃‬
•Y
‫׃‬
Refer to Section 6-1-2 (1) and (2) a , depending on the mounting method.
Two weeks or less
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6-2 Baking Condition
(1) Situations requiring baking before mounting
• Storage conditions exceed the limits specified in Section 6-1-2 or 6-1-3.
• Humidity indicator in the desiccant was already red ( pink ) when opened.
( Also for re-opening.)
(2) Recommended baking conditions
• Baking temperature and period : 120 + 10 / -0 °C for 2 ~ 3 hours
• The above baking conditions do not apply since the embossed carrier tape is not heat-resistant.
Replace the devices on heat-resistant carrier.
(3) Storage after baking
• After baking, store the devices in the environment specified in Section 6-1-2 and mount immediately.
6-3 Surface Mount Conditions
The following soldering conditions are recommended to ensure device quality.
6-3-1 Soldering
(1) Convection reflow or IR/Convection reflow
( one-time soldering or two-time soldering in air or nitrogen environment )
• Temperature and period :
A) Peak temperature
260℃ max
B) Heating temperature
40 to 60 seconds as 230℃
C) Preheat temperature
It is 150 to 200℃, and is 120±30 seconds
D) Temperature increase rate It is 1 to 3℃/seconds
• Measuring point : IC package surface
• Temperature profile :
A
IC package surface
temperature
B
C
D
Time
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6-4 Condition for removal of residual flux
(1) Ultrasonic washing power : 25 watts / liter or less
(2) Washing time : Total 1 minute or less
(3) Solvent temperature : 15 ~ 40 °C
6-5 Package outline specification
6-5-1 Package outline
Refer to the attached drawing.
6-5-2 LEAD FINISH or BALL TYPE
LEAD FREE TYPE ( Ni / Pd / Au )
6-6. Markings
6-6-1 Marking details ( The information on the package should be given as follows. )
(1) Product name
: 028
(2) Date code
: YMX
Y →
Denotes the production year. (Last one digit of the year.)
M →
Denotes the production month.（1・2・～・8・9・0・N・D）
X →
Denotes the production ref. code (1 digit).
(3) Company name
: S
(4) Factory Code
: (1 digit, Example “B”)
6-6-2 Marking layout
The layout is shown in the attached drawing.
(The layout does not specify the size of the marking character and marking position.)
028
YMX
SB
S … Brand name “S”
B … Factory code
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SPEC No.
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Package specifications
TOP VIEW
2.5
2.5
028
YMX
SB
S … Brand name “S”
B … Factory code
Pin 1 indicator
0.4
1.7
1.7
Pin 1 indicator
0.2
0.25
0.5
UNIT : mm
BOTTOM VIEW
NOTE :
LEAD FREE product.
LEAD FINISH : Ni/Pd/Au PLATING
LEAD MATERIAL : Cu Alloy
MODEL No.
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SPEC No.
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6-7 Packing specifications ( Embossed carrier tape specifications )
This standard applies to the embossed carrier tape specifications for ICs supplied by SHARP CORPORATION.
SHARP’s embossed carrier tape specifications are generally based on those described in JIS C 0806 ( Japanese
Industrial Standard ) and EIA481A.
6-7-1 Tape structure
The embossed carrier tape is made of conductive plastic. The embossed portions of the carrier tape are filled with IC
packages and a top covering tape is used to enclose them.
6-7-2 Taping reel and embossed carrier tape size
For the taping reel and embossed carrier tape sizes, refer to the attached drawing.
6-7-3 IC package enclosure direction in embossed carrier tape
The IC package enclosure direction in the embossed portion relative to the direction in which the tape is pulled is
indicated by an index mark on the package ( indicating the No. 1 pin ) shown in the attached drawing.
6-7-4 Missing IC packages in embossed carrier tape
The number of missing IC packages in the embossed carrier tape per reel should not exceed either 1 or 0.1 % of the
total contained on the tape per reel, whichever is larger. There should never be more than two consecutive missing
IC packages.
6-7-5 Tape joints
There is no joint in an embossed carrier tape.
6-7-6 Peeling strength of the top covering tape
Peeling strength must meet the following conditions.
(1) Peeling angle : 165 ~ 180 °
(2) Peeling speed : 300 mm / min
(3) Peeling strength : 0.2 ~ 0.7 Ｎ ( 20 ~ 70 gf )
Top covering tape
165 ~ 180°
Peeling direction
Pull-out direction
Embossed carrier tape
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6-7-7 Packing
(1) The top covering tape ( leader side ) at the leading edge of the embossed carrier tape, and the trailing edge of the
embossed carrier tape, should both be held in place with paper adhesive tape at least 30 mm in length.
(2) The leading and trailing edges of the embossed carrier tape should be left empty ( with embossed portions not
filled with IC packages ) in the attached drawing.
(3) The number of IC packages enclosed in the embossed carrier tape per reel should generally comply with the list
given below.
Number of IC Packages
/ Reel
Number of IC Packages
/ Inner carton
Number of IC Packages
/ Outer carton
5,000 devices / Reel
5,000devices / Inner carton
25,000 devices / Outer carton
6-7-8 Indications
The following should be indicated on the taping reel and the packing carton.
• Part Number ( Product Name ) • Storage Quantity • Packed Date
• Manufacture’s Name ( SHARP )
Note : The IC taping direction is indicated by " EL " suffixed to the part number.
EL : Equivalent to " L " of the JIS C 0806 standard.
6-7-9 Protection during transportation
The IC packages should have no deformation and deterioration of their electrical characteristics resulting from
transportation.
6-8 Precautions for use
(1) Opening must be done on an anti-ESD treated workbench.
All workers must also have undergone anti-ESD treatment.
(2) The devices should be mounted within one year of the date of delivery.
6-9 Chemical substance information in the product
Product Information Notification based on Chinese law, Management Methods for Controlling Pollution by Electronic
Information Products.
Names and Contents of the Toxic and Hazardous Substances or Elements in the Product
Lead
( Pb )
Mercury
( Hg )
Cadmium
( Cd )
Hexavalent
Chromium
( Cr (VI) )
Polybrominated
Biphenyl
( PBB )
Polybrominated
Diphenyl Ethers
( PBDE )
○
○
○
○
○
○
○ : indicates that the content of the toxic and hazardous substance in all the homogeneous materials of the part is
below the concentration limit requirement as described in SJ / T 11363 - 2006.
x : indicates that the content of the toxic and hazardous substance in at least one homogeneous material of the part
exceeds the concentration limit requirement as described in SJ / T 11363 - 2006 standard.
MODEL No.
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SPEC No.
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Product Orientation
Emboss taping type (EL)
The drawing direction of tape
Index mark
Trailer side of tape
Adhesive tape (paper)
30 MIN.
Carrier tape (empty enboss）
500 MIN.
Leader side of tape
Filled emboss with products
Filled emboss with products
Index mark
Carrier tape (empty enboss）
500 MIN.
Adhesive tape (paper)
30 MIN.
Top cover tape
200 MIN.
The drawing direction of tape
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SPEC No.
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1822
Tape structure and dimensions
Pocket hole for IC
Hole for Taping Machine
（
）
（
）
（
（
）
）
Unit: mm
Symbol
Size
Symbol
Size
Symbol
（
）
（
）
（
）
Size
◎ R1,R2,R3, and θ are reference value
（
）
MODEL No.
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SPEC No.
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1922
9.5
Reel structure and dimensions
UNIT : mm
· UNIT: mm
· ( ): Reference value
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SPEC No.
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2022
Inner packing appearance
Reel & tape
Inner label
Pull-out direction
Desiccant with humidity indicator
Inner label
Laminated aluminum bag
Cushion pad
Inner label
Laminated aluminum bag
Cushion pad
Inner label
Inner box
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SPEC No.
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2122
Outer packing appearance
(345)
45
)
(55)
(3
Inner label
Inner box
5 rows
adhesivetape
tape(“Ｈ”taping)
Adshive
( “H” taping )
)
65
3
(
(385)
Outer label
Outer box
(315)
UNIT: mm
( ) : Reference value
0.23 ± 0.1
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Inner label and Outer label
Inner carton label
(a)
LEAD FREE
QM2A1UB028
(3N)1 QM2A1UB028
<QUANTITY>
(b)
$TD44a
(c)
< LOT > xxxxxxxxxx xxxx
QM2A1UB028/EL/
(d)
YYYY.MM.DD
MADE IN xxxx
(f)
(e)
5000
(3N)2 5000 XXXXXXXXXXXX 103120
(j)
TYPE : A
EIAJ C-3 <RMK> XXXXXXXXXXXXXXXXX
(g)
(h)
(i)
Outer carton label
(c)
(4S)PKG ID : QM2A1UB028/EL/
(e)
(Q)QUANTITY : 25000
(g)
MADE IN xxxx
LEAD FREE
XXXXXXXXXXXXXXXXXXXX
(a)
(k)
XXXXXXXXXXXXXXXXXXXX
YYYY.MM.DD
XXXXXXXXXXXXXXXXXXXX
(d)
(P)CUST PROD ID : QM2A1UB028
XXXXXXXXXXX
X
(f)
NOTE : The « LEAD FREE » indicates this product is lead free articles.
"R.C." is SHARP’s corporate logo which indicates RoHS compliant
( a ) Model No.
( b ) Quantity / PD lot / Company code
( c ) SHARP internal Model No.
( d ) Packed date
( e ) Quantity
( f ) “ SHARP ” Logo
( g ) The country of origin
( h ) Type name / Former
( i ) Assemble management No.
( j ) Assemble lot No. / Date code / Quantity
( k ) Shipment lot No.