SW DEVICE SPEC. No. ED-96027A ISSUE September PAGE 13 Pages ELECTRONIC COMPONENTS GROUP SHARP CORPORATION REPRESENTATIVE SPECIFICATION OPTO-ELECTRONIC SPECIFICATION FOR 30, 1998 DMSION DEVICES Business dealing name PHOTOCOUPLER MODEL No. PC3H4 1. These specification sheets include materials protected Please do not reproduce or cause anyone to reproduce under copyright of Sharp Corporation them without Sharp’s consent. (“Sharp”). 2. When using this product. please observe the absolute maximum ratings and the instructions for use outlined in these specification sheets. as well as the precautions mentioned below. Sharp assumes no responsibility for any damage resulting from use of the product which does not comply with the absolute maximum ratings and the instructions included in these specification sheets, and the precautions mentioned below. (Precautions) (1) This product is designed for use in the following application areas : OA equipment * Audio visual equipment * Home appliances * Telecommunication equipment (Terminal) Measuring equipment * Tooling machines * Computers [ l l 1 If the use of the product in the above application areas is for equipment listed in paragraphs (2) or (31, please be sure to observe the precautions given in those respective paragraphs. (21 Appropriate measures, such as fail-safe design and redundant design considering the safety design of the overall system and equipment. should be taken to ensure reliability and safety when this product is used for equipment which demands high reliability and safety in function and precision, such as ; * Transportation control and safety equipment (aircraft, train, automobile etc.1 * Rescue and security equipment * Trafhc signals * Gas leakage sensor breakers C * Other safety equipment (3) Please do not use this product for equipment which require extremely high reliability and safety in function and precision, such as ; * Space equipment * Telecommunication equipment (for trunk lines1 * Nuclear power control equipment * Medical equipment 1 1 1 (4) Please contact and consult with a Sharp sales representative regarding interpretation of the above three paragraphs. 3. Please contact CUSTOMERS DATE BY and consult with a Sharp APPROVAL sales representative if there are any questions for any questions about this product. DATE PRESENTED BY T. Matsumura, Department General Manager Engineering Dept.51 Opto-Electronic Devices Div. ELECOM Group SHARP CORPORATION of DIV SHARP CORPORATION ED-96027A MODEL No. PC3H4 1. Application This specification applies Model No. PC3H4. to the outline and characteristics of photocoupler; 2. Outline Refer to the attached 3. Ratings drawing No. CY8374KO2. and characteristics Refer to the attached sheet, page 4 to 6. sheet, page 7. sheet, page 8. 4. Reliability Refer to the attached 5. Incoming inspection Refer to the attached 6. Supplement 6.1 Isolation voltage shaI.I be measured in the following (1) Short between anode and cathode on the primary collector and emitter on the secondary side. (2) The dielectric withstand (3) The wave form of applied 6.2 Packaging tester voltage with zero-cross sheet, side and between circuit shah be a sine wave. spectications Refer to the attached method. page 9 to 11. shall be used. 1 September 30, 1998 PAGE l/11 SHARP CORPORATION PC3H4 6.3 Collector (“3” current mark (Ic) : indicates Ordered product Delivery business table dealing Business dealingname name of ordered Rank mark product) Test conditions Ic (mA) PC3H4 A or no mark 0.2 to 4.0 IF’+ PC3H4A A 0.5 to 1.5 Vc,=5V, High temperature test are carried 6.4 This Model is approved Approved rank out at production 1mA Ta=25’C process. by UL. Model No. : PC3H4 UL tile No. : E64380 6.5 This product is AC input 6.6 This product is not designed 6.7 type. against This product is assembled with This product incorporates non-coherent irradiation. electrical input and output. light emitting diode. ODS materials This product shall not contain the following materials. Also, the following materials shall not be used in the production for this product. Materials 6.8 Brominated for ODS : CFC,, Halon, Carbon 1.1.1 -Trichloroethane process tetrachloride, (Methylchloroform) flame retardants Specific brominated flame retardants in this device at all. 7. Notes Refer to the attached sheet- .1-l, 2. such as the PBBO, and PBB, are not used SHARP CORPORATION Anode mark \ Pin Nos. and internal connection diagram Date code l l Rankmark / :...::...::...: e d i-l d Epoxy resin *l) 2-digit number shall be marked according to DIN standard. *21 Dimensions in parenthesis are shown for reference. I Product mass : Approx. UNIT: 0.05g l/l mm Name PC3H4 Outline Dimensions (Business dealing name : PC3H4) Drawing No. CY8374K02 SHARP CORPORATION ED-96027A MODEL 1 September 30, 1998 No. PAG E PC3H4 3. Ratings 4/11 and characteristics 3.1 Absolute maximum ratings Ta=25C l 1 Forward current *l Total power dissipation Operating temperature Topr -30 to t100 “C Storage temperature Tstg -40 to t125 “C *3 Isolation voltage Vii0 2.5 *4 Soldering temperature Tsol 260 kVrms @l The derating factors of absolute maximum ratings due to ambient temperature are shown in Fig. 1 to 4. *2 Pulse widths100 ps, Duty ratio : 0.001 (Refer to Fig. 5) *3 AC for 1 min, 40 to 6O%RH, f=GOHz *4 For 10s “C SHARP CORPORATION ED-96027A MODEL No. 1 September PC3H4 3.2 Electra-optical 30. 1998 PAGE 5/11 characteristics Ta=25”C Parameter Forward SJTIlbol voltage Conditions VF I,=f2OmA Ct v=o, f=lkHz MIN. TYP. MAX. unit 1.2 1.4 V Input Terminal Dark output capacitance current E EO Collector-emitter breakdown voltage BvCEO Emitter-collector breakdown voltage BvECO V,,&OV, - nA Ic=O. 1mA IF=0 70 V I,=10 /IA, I,=0 6 V Transfer charac- I Floating PF IF0 4.0 mA 0.1 0.2 V 10” - R 1.0 PF 0.6 capacitance I PS Ic=2mA R,=lOO Q PS SHARP CORPORATION (Fig. 1) Forward ambient (Fig. 2) Diode power dissipation vs. ambient temperature current vs. temperature 5 g 100 50 a 3 k 40 '"i? 30 g d it 1 80 70 60 4 2 -g 20 f2g 10 0 -30 0 25 Ambient 55 75 temperature 100 125 25 125 Ambient Ta ( ‘C ) temperature (Fig. 4) Total power vs. ambient (Fig. 3) Collector power dissipation vs. ambient temperature Ta ( “C ) dissipation temperature 5 Ei 170 s 150 _a rn ! 100 b 3 -30 0 25 Ambient 50 75 temperature 100 125 & 3 5 r 50 0 -30 Ta ( “C ) 0 Ambient (Fig. 5) Peak forward current vs. duty ratio Pulse width5100 Ta=25% 3 a3 A” 5 lo-“2 5 1o’22 5 lo-‘2 Duty ratio 5 10” ps 25 50 temperature 75 100 Ta (‘C ) 125 SHARP CORPORATION ED-96027A MODEL 1 September No. 30, 1998 PAGE PC3H4 7/11 4. Reliability The reliability of products items listed below. Confidence level : 90% LTPD: 10%/20% shall satisfy Test Conditions Test Items Failure *1 Solderability *2 Soldering heat Terminal (Bending) shock n=ll, C=O 26O”C, 10s n=ll, C=O n=ll, C=O n=ll. C=O n=ll, C=O v,>ux 15000m/s’, 0.5ms 3 times/ +X, +Y, +Z direction frequency 100 to 2000 to 1ooHz/4min 200m/s2 4 times/ X, Y, Z direction Temperature cycling 1 cycle -40°C to t125”C (30min) (30min) 20 cycles test High temp. and high humidity storage +85”C, 85%RH, High temp. storage +125C, Low temp. storage -40°C. 1 OOOh Operation I,=t50mA, Ptot= 170mW Ta=25”C, 1 OOOh Iife conforms 500h 1.2 EEO >ux2 Ic<LX0.7 V CEbat) > ” ’ ‘2 n=22,C=O *5 U : Upper specification limit L : Lower specification limit lOOOh Test method, *2 Solder shalI adhere at the area of 95% or more of immersed portion of lead, and pin hole or other holes shall not be concentrated on one portion. *4 Terminal *5 It evaluates bending to JIS C 7021. dipped direction after washing into solder is shown by specified shall be 0.2mm away from the below. solvent in attach sheet- l-l. n 0.2mm Soldering area n=22 ,C=O n=22 ,C=O n=22 ,C=O n=22,C=O *l *3 The lead pin depth root of lead pins. Samples (n) Defective(C) 23O”C, 5 s Weight : IN 1 time/each terminaI strength l4 Mechanical Variable vibration l3 Judgement Criteria or more MODEL No. ’ PC3H4 5. Incoming inspection 5.1 Inspection items (11 Electrical characteristics V,, I,, Ic, , Visa (2) Appearance 5.2 Sampling method and Inspection level A single sampling plan, normal inspection level II based on IS0 2859 is applied. The AQL according to the inspection items are shown below. I Defect 1 Major defect I 1 September ED-96027A SHARP CORPORATION I 1 I Inspection item Electrical characteristics Unreadable marking Appearance defect except the above mentioned. 1 AQL(%) 1 1 I 0.1 I I I o.4 I 30, 1998 PAGE 8/11 SHARP CORPORATION 6.2 Package 6.2.1 specifications Taping conditions (1) Tape structure and Dimensions (Refer to the attached sheet, Page 10) The tape shall have a structure in which a cover tape is sealed heat-pressed the carrier tape of protect against static electricity. (2) Reel structure and Dimensions (Refer to the attached The taping reel shall be of plastic with as shown in the attached drawing. (3) Direction of product insertion Product direction in carrier hole side on the tape. (4) Joint (5) The way to repair 6.2.3 Adhesiveness 6.2.4 sheet, Page 11) at the tape in one reel shall be jointless. taped failure devices devices cut a bottom of carrier tape with a cutter, and the cut portion shall be sealed with adhesive tape. of cover tape method be and quantity Wind the tape back on the reel so that the cover tape will be outside the tape. Attach more than 20cm of blank tape to the trailer and the leader of the tape and fix the both ends with adhesive tape. One reel shah contain 3OOOpcs. Marking l The outer * Model 6.2.5 (Refer to the attached The exfoliation force between carrier tape and cover tape shall 0.2N to 0.7N for the angle from 160’ to 180’ . Rolling l its dimensions tape shall direct to the anode mark The way to repair taped failure after replacing to good devices, l Page 11) of tape The cover tape and carrier 6.2.2 sheet, Storage packaging No. * Number case shall be marked of pieces delivered with following * Production information. date condition . Taped products shah be stored at the temperature 5 to 30°C and the humidities lower than 70%RH. 6.2.6 on Safety protection during shipping * There shall be no deformation of component characteristics due to shipping. or degradation of electrical SHARP CORPORATION ED-96027A MODEL No. 1 September PC3H4 Carrier tape structure lO/ll and Dimensions 5” max A mm mm B C kO.1 f0.3 D kO.1 E kO.1 F to.1 zko.1 12.0 5.5 1.75 8.0 2.0 4.0 G H I J K L +o. 1 -0.0 $51.5 kO.1 7.5 kO.05 0.3 kO.1 2.3 kO.1 3.1 30, 1998 PAGE +o. 1 -0.0 4 1.6 ED-96027A SHARP CORPORATION MODEL 1 September No. PC3H4 Reel structure ll/ll and Dimensions a Check word a mm 330 b 13.5t1.5 C lOOf d 13t0.5 e 23tl 30. 199! PAGE f 2.0 to.5 g 2.0 to.5 Direction of product insertion Pull-out direction SHARP CORPORATION ED-96027A MODEL No. 1 September PC3H4 Precautions 30, 1999 PAG E Attach sheet- 1- 1 for Photocouplers 1 For cleaning ( 1) Solvent I cleaning : Solvent temperature 45°C or less Immersion for 3 mm or less (2) Ultrasonic cleaning (31 Applicable solvent : The effect to device by ultrasonic cleaning differs by cleaning bath size, ultrasonic power output, cleaning time, PCB size or device mounting condition etc. Please test it in actual using condition and confirm that doesn’t occur any defect before starting the ultrasonic cleaning. : Ethyl alcohol, Methyl alcohol, Isopropyl alcohol In case when the other solvent is used, there are cases that the packaging resin is eroded. Please use the other solvent after thorough confirmation is performed in actual using condition. 2. The LED used in the Photocoupler generally decreases the light emission power by operation. In case of long operation time, please design the circuit with considering the degradation of the light emission power of the LED. (50%/5years) 3. There are cases that the deviation of the CTR and the degradation of the LED become big at IF is less than 1 .OmA. Please design the circuit with considering this point. I- of the light emission power SHARP CORPORATION ED-96027A MODEL No. 1 September PC3H4 4. Precautions for Soldering ( 1) If solder reflow 30, 1994, PAGE Attach sheet- 1-2 Photocouplers , : It is recommended that only one soldering be done at the temperature and the time within the temperature profile as shown in the figure below. 230C 25C lmill < I- 1.5nlin , 7 Since, influence to the device is different according to reflow equipment and its condition, please use the device after confirming no damage in the actual using condition. (21 Other precautions An infrared lamp used to heat up for soldering may cause a localized temperature rise in the resin. So keep the package temperature within that specified in Item (1). Also avoid immersing the resin part in the solder. 1 I