Solid State Drive HG3 Series Key Features • • • • • • High capacity in smallest size Fast access and fast transfer rate Low power consumption High reliability Intelligent Interface Data integrity Applications • For General-purpose notebook PCs Specifications and Features Form Factor Memory Interface Capacity Performance Supply Voltage Power Consumption Temperature Shock Vibration Reliability 2.5-type Case 1.8-type Case Micro SATA Module TOSHIBA® 32nm MLC NAND Flash Memory ATA-8 ACS2, SATA revision 2.6 3Gb/s 64/128/256/512 GB 64/128/256 GB 64/128/256 GB Maximum Data Read : 220 MB/s (Ave), Maximum Data Write : 180 MB/s (Ave) 5.0V ±5% 3.3V ±5% 3.3V ±5% Active : 3.4W Typ. Active : 2.9W Typ. Active : 2.9W Typ. Idle : 53mW Typ. Idle : 47mW Typ. Idle : 47mW Typ. Operating : 0°C (Tc) – 70°C (Tc), Non-operating : -40°C – 85°C 1500G @ 0.5 ms Operating / Non-operating : 20G @ 10-2,000Hz Mean Time to Failure (MTTF) : 1,000,000 hours Product Life : Approximately 5 years or 20,000 power on hours, whichever comes earlier Size 100.0mm x 69.85mm x 78.5mm x 54.0mm x 5.0mm 77.13mm x 48.65mm x 9.5mm 4.75mm Weight 51-58g typ. 48g typ. 16g typ. More Features ・ Translation mode which enables any drive configuration ・ 28-bit LBA mode commands and 48-bit LBA mode commands support ・ Multi word DMA ・ Ultra-DMA ・ Advanced PIO mode ・ Data Set Management Command set (Trim) support ・ Automatic retries and corrections for read errors ・ FDE (Full Disk Encryption) (Optional) *1 Compliance UL, CSA, TUV, KCC, FCC, BSMI, CE, C-Tick NOTE: *1) The products with FDE option are subject to foreign exchange and foreign trade control laws. Products and specifications discussed herein are for reference purposes only and are subject to change without notice. All information discussed herein is provided on an “as is” basis, without warranties of any kind. Before creating and producing designs and using, customers must refer to and comply with the latest versions of the product specifications. Copyright © 2011 Toshiba Corporation. All rights reserved. Solid State Drive HG3 Series Brochure Rev.1.1 1 Solid State Drive HG3 Series Brochure Rev.1.1 Ordering Information THN SX X XXXG X X X 1 2 3 4 5 6 7 1. Model Name THN: Toshiba NAND drive 2. Model Type SN: Normal SSD, SF: FDE supported SSD (Optional) 3. Controller Type C: Type C 4. Capacity 064G / 128G / 256G / 512G / … 064G is 64GB, 128G is 128GB, 256G is 256GB and 512G is 512GB (1 GB = 1,000,000,000 bytes) 5. Form Factor A: 1.8-type case, B: 2.5-type case (9.5mm height), M: Module type 6. Host I/F Type M: Micro SATA, S: Standard SATA 7. NAND Process J: 32nm MLC Product Line up NOTE: Product Number Capacity THNSxC064GBSJ 64 GB THNSxC128GBSJ 128 GB THNSxC256GBSJ 256 GB THNSxC512GBSJ 512 GB THNSxC064GAMJ 64 GB THNSxC128GAMJ 128 GB THNSxC256GAMJ 256 GB THNSxC064GMMJ 64 GB THNSxC128GMMJ 128 GB THNSxC256GMMJ 256 GB Form Factor 2.5-type 9.5mm case 1.8-type case Micro SATA module x: Refer to Chapter “Ordering Information” Copyright © 2011 Toshiba Corporation. All rights reserved. 2 Solid State Drive HG3 Series Brochure Rev.1.1 Contents Ordering Information ................................................................................................................................................. 2 Product Line up .......................................................................................................................................................... 2 Contents..................................................................................................................................................................... 3 1. General Description ........................................................................................................................................... 4 2. Product Specifications ....................................................................................................................................... 4 2.1. Capacity..................................................................................................................................................... 4 2.2. Performance.............................................................................................................................................. 4 3. Electrical Characteristics .................................................................................................................................... 5 3.1. Supply Voltage........................................................................................................................................... 5 3.2. Power Consumption.................................................................................................................................. 5 4. Environmental Conditions ................................................................................................................................. 6 4.1. Temperature and Humidity ....................................................................................................................... 6 4.2. Shock and Vibration .................................................................................................................................. 6 5. Compliance ........................................................................................................................................................ 7 6. Reliability ........................................................................................................................................................... 7 7. Mechanical Specifications ................................................................................................................................. 8 7.1. 2.5-type Case ............................................................................................................................................ 8 7.2. 1.8-type Case ............................................................................................................................................ 9 7.3. Micro SATA Module ................................................................................................................................. 10 8. Interface Connector......................................................................................................................................... 11 8.1. 2.5-type Case .......................................................................................................................................... 11 8.2. 1.8-type Case and Micro SATA Module ................................................................................................... 12 9. 10. Command Descriptions ................................................................................................................................... 13 Revision History ........................................................................................................................................... 16 RESTRICTIONS ON PRODUCT USE ............................................................................................................................ 17 Copyright © 2011 Toshiba Corporation. All rights reserved. 3 Solid State Drive HG3 Series Brochure Rev.1.1 1. General Description The TOSHIBA SSD HG series is a memory storage device using NAND Flash Memories, which has no mechanical moving parts and provides high performance and reliability. The drive features an ATA-8 and Serial ATA revision 2.6 interface embedded controller that requires a simplified adapter board for interfacing to a Serial ATA or Serial ATA compatible bus. The drive is distinctive for its small and light body. 2. Product Specifications 2.1. Capacity Table 2-1. User Addressable Sectors in LBA Mode NOTE: Formatted Capacity Total Number of User Addressable Sectors in LBA Mode 64 GB 125,045,424 128 GB 250,069,680 256 GB 500,118,192 512 GB 1,000,215,216 1 GB (Gigabyte) = 1,000,000,000 bytes Bytes per sector: 512 bytes 2.2. Performance Table 2-2. Host Transfer Rate and Data Transfer Rate in Read/Write Parameter Transfer Rate Host Transfer Rate 300 MB/s Maximum Data Read *1 220 MB/s (Ave.) Maximum Data Write *1 180 MB/s (Ave.) NOTE: *1) Under the condition of measurement with 128KB unit sequential access Copyright © 2011 Toshiba Corporation. All rights reserved. 4 Solid State Drive HG3 Series Brochure Rev.1.1 3. Electrical Characteristics 3.1. Supply Voltage Table 3-1. Supply Voltage 2.5-type Case Allowable voltage Allowable noise/ripple Micro SATA Module 5.0V ±5% 3.3V ±5% 100 mV p-p or less 100 mV p-p or less 2 –100 ms 2 –100 ms Allowable supply rise time NOTE: 1.8-type Case The drive has over current protection circuit. (Rated current: 3.15A) 3.2. Power Consumption Table 3-2. Power Consumption in 2.5-type Case Type Operation 2.5-type Case (@25°C) THNSxC064GBSJ THNSxC128GBSJ THNSxC256GBSJ THNSxC512GBSJ Read *1 1.2W Typ. 1.4W Typ. 1.7W Typ. 1.8W Typ. *1 2.8W Typ. 3.0W Typ. 3.3W Typ. 3.4W Typ. 51mW Typ. 52mW Typ. 52mW Typ. 53mW Typ. 51mW Typ. 52mW Typ. 52mW Typ. 53mW Typ. 50mW Typ. 52mW Typ. 52mW Typ. 53mW Typ. Write Idle *2 Standby *3 Sleep *3 Table 3-3. Power Consumption in 1.8-type Case Type and Micro SATA Module Type Operation (@25°C) 1.8-type Case / Micro SATA Module THNSxC064GAMJ THNSxC128GAMJ THNSxC256GAMJ THNSxC064GMMJ THNSxC128GMMJ THNSxC256GMMJ Read *1 1.1W Typ. 1.3W Typ. 1.5W Typ. Write *1 2.6W Typ. 2.7W Typ. 2.9W Typ. 47mW Typ. 47mW Typ. 47mW Typ. 47mW Typ. 47mW Typ. 47mW Typ. 47mW Typ. 47mW Typ. 47mW Typ. Idle *2 Standby Sleep *3 *3 NOTE: *1) The read/write current is specified 220 MB/s in read, 180 MB/s in write. *2) The values are based on using S-ATA power management features. The Slumber mode is used for the idle mode power consumption measurements. In Idle mode, if a background write operation occurs, the drive power consumption may temporally rise to that in write operation. *3) The values are based on using S-ATA power management features. The Slumber mode is used for Standby and Sleep modes power consumption measurements. In Standby mode, if a background write operation occurs, the drive power consumption may temporally rise to that in write operation. Copyright © 2011 Toshiba Corporation. All rights reserved. 5 Solid State Drive HG3 Series Brochure Rev.1.1 4. Environmental Conditions 4.1. Temperature and Humidity Table 4-1. Temperature Condition Range Gradient 0°C (Tc) – 70°C (Tc) 30°C (Ta) / h maximum Non-operating -40°C – 85°C 30°C / h maximum Under Shipment *2 -40°C – 85°C 30°C / h maximum Operating NOTE: *1 *1) Ta: Ambient Temperature, Tc: Case Temperature *2) Packed in Toshiba’s original shipping package Table 4-2. Humidity Condition Range Operating 8% – 90% R.H. (No condensation) Non-operating Under Shipment NOTE: 8% – 95% R.H. (No condensation) *1 5% – 95% R.H. *1) Packed in Toshiba’s original shipping package 4.2. Shock and Vibration Table 4-3. Shock Condition Range Operating 1500G, 0.5 ms, half sine wave Non-operating 1500G, 0.5 ms, half sine wave Under Shipment *1 100 cm free drop NOTE: *1) Apply shocks in each direction of the drive’s three mutually perpendicular axes, one axis at a time. Packed in Toshiba’s original shipping package. Table 4-4. Vibration Condition Range Operating 20G Peak, 10-2,000Hz, (20min /Axis)x3 Axis Non-operating 20G Peak, 10-2,000Hz, (12Cycle /Axis)x3 Axis, x20min. Copyright © 2011 Toshiba Corporation. All rights reserved. 6 Solid State Drive HG3 Series Brochure Rev.1.1 5. Compliance TOSHIBA SSDs HG series comply with the following. Table 5-1. Compliance Title Description UL (Underwriters Laboratories) UL 60950-1 Region USA CSA (Canadian Standard Association) CSA-C22.2 No.60950-1 Canada *Included UL logo mark TÜV (Technischer Überwachungs Verein) EN 60950-1 Germany KCC KN22 (CISPR Pub. 22), (Korea Communication Commission) KN24 (CISPR Pub. 24) FCC FCC part 15 Subpart B Class B Korea USA BSMI (Bureau of Standards, Metrology and CNS13438(CISPR Pub. 22) Taiwan EN 55022, EN 55024 Europe Inspection) CE Mark Declaration of Conformity C-Tick AS/NZS CISPR Pub. 22 Class B Australia, New Zealand 6. Reliability Table 6-1. Reliability Parameter Value Mean Time to Failure 1,000,000 hours Product Life Approximately 5 years or 20,000 power on hours, whichever comes earlier Copyright © 2011 Toshiba Corporation. All rights reserved. 7 Solid State Drive HG3 Series Brochure Rev.1.1 7. Mechanical Specifications 7.1. 2.5-type Case Table 7-1. Weight and Dimensions Model Weight Width Height Length 69.85 mm 9.5 mm 100.0 mm THNSxC064GBSJ THNSxC128GBSJ 51 g Typ. THNSxC256GBSJ THNSxC512GBSJ 58 g Typ. Figure 7-1. 2.5-type Case Drive Dimension Copyright © 2011 Toshiba Corporation. All rights reserved. 8 Solid State Drive HG3 Series Brochure Rev.1.1 7.2. 1.8-type Case Table 7-2. Weight and Dimensions 1.8-type Case Weight Width Height Length 48 g Typ. 54.0 mm 5.0 mm 78.5 mm Figure 7-2. 1.8-type Case Drive Dimension Copyright © 2011 Toshiba Corporation. All rights reserved. 9 Solid State Drive HG3 Series Brochure Rev.1.1 7.3. Micro SATA Module Table 7-3. Weight and Dimensions Micro SATA Module Weight Width Height Length 16 g Typ. 48.65 mm 4.75 mm 77.13 mm Figure 7-3. Micro SATA Module Drive Dimension Copyright © 2011 Toshiba Corporation. All rights reserved. 10 Solid State Drive HG3 Series Brochure Rev.1.1 8. Interface Connector 8.1. 2.5-type Case Figure 8-1. 2.5-type Case Serial ATA Interface Connector Table 8-1. 2.5-type Case Drive Connecter Pin Assignment Signal segment key Signal Segment Power Segment U1 U2 U3 U4 S1 S2 S3 S4 S5 S6 S7 GND A+ A– GND B– B+ GND 2nd mate Differential Signal Pair A (Device Rx) Differential Signal Pair B (Device Tx) 2nd mate Signal segment “L” Central connector polarizer Power segment “L” V33 3.3V power (Unused) V33 3.3V power (Unused) V33 3.3V power pre-charge 2nd mate (Unused) GND GND GND V5 5V power pre-charge*2 2nd mate V5 5V power V5 5V power GND DAS/DSS*1 Reserved at ATA-8 GND 1st mate V12 12V power pre-charge 2nd mate (Unused) V12 12V power (Unused) V12 12V power (Unused) Power segment key P1 P2 P3 P4 P5 P6 P7 P8 P9 P10 P11 P12 P13 P14 P15 N.C. TX UX GND Not connected For test use, Not connected For test use, Not connected Note: *1) DAS/DSS signal is not used for this drive, *2) Direct connect to non pre-charge pins Copyright © 2011 Toshiba Corporation. All rights reserved. 11 Solid State Drive HG3 Series Brochure Rev.1.1 8.2. 1.8-type Case and Micro SATA Module Figure 8-2. Micro SATA Interface Connector Table 8-2. Pin Assignment on Micro SATA Connector Signal segment key Signal Segment Power Segment S1 S2 S3 S4 S5 S6 S7 P1 P2 P3 P4 P5 P6 P7 P8 P9 GND A+ A– GND B– B+ GND 2nd mate Differential Signal Pair A (Device Rx) Differential Signal Pair B (Device Tx) 2nd mate Signal segment “L” Central connector polarizer Power segment “L” V33 3.3V power V33 3.3V power pre-charge*1 2nd mate GND GND V5 5V power pre-charge 2nd mate (Unused) V5 5V power (Unused) R Reserved Key V Vendor Specific V Vendor Specific Power segment key Note: *1) Direct connect to non pre-charge pins Copyright © 2011 Toshiba Corporation. All rights reserved. 12 Solid State Drive HG3 Series Brochure Rev.1.1 9. Command Descriptions Table 9-1. Supported ATA Command Set Op-Code Command Description 00h NOP 06h DATA SET MANAGEMENT 10h RECALIBRATE 20h READ SECTOR(S) 21h READ SECTOR(S) without retry 24h READ SECTOR(S) EXT 25h READ DMA EXT 27h READ NATIVE MAX ADDRESS EXT 29h READ MULTIPLE EXT 2Fh READ LOG EXT 30h WRITE SECTOR(S) 31h WRITE SECTOR(S) without retry 34h WRITE SECTOR(S) EXT 35h WRITE DMA EXT 37h SET MAX ADDRESS EXT 39h WRITE MULTIPLE EXT 3Dh WRITE DMA FUA EXT 3Fh WRITE LOG EXT 40h READ VERIFY SECTOR(S) 41h READ VERIFY SECTOR(S) without retry 42h READ VERIFY SECTOR(S) EXT 45h WRITE UNCORRECTABLE EXT 47h READ LOG DMA EXT 57h WRITE LOG DMA EXT 70h SEEK 90h EXECUTE DEVICE DIAGNOSTIC 91h INITIALIZE DEVICE PARAMETERS 92h DOWNLOAD MICROCODE B0h SMART B0h D0h SMART READ DATA B0h D1h SMART READ ATTRIBUTE THRESHOLDS B0h D2h SMART ENABLE/DISABLE ATTRIBUTE AUTOSAVE B0h D3h SMART SAVE ATTRIBUTE VALUES Copyright © 2011 Toshiba Corporation. All rights reserved. 13 Solid State Drive HG3 Series Brochure Rev.1.1 Op-Code Command Description B0h D4h SMART EXECUTE OFF-LINE IMMEDIATE B0h D5h SMART READ LOG B0h D6h SMART WRITE LOG B0h D8h SMART ENABLE OPERATIONS B0h D9h SMART DISABLE OPERATIONS B0h DAh SMART RETURN STATUS B0h DBh SMART ENABLE/DISABLE AUTOMATIC OFF-LINE B1h DEVICE CONFIGURATION OVERLAY B1h C0h DEVICE CONFIGURATION RESTORE B1h C1h DEVICE CONFIGURATION FREEZE LOCK B1h C2h DEVICE CONFIGURATION IDENTIFY B1h C3h DEVICE CONFIGURATION SET C4h READ MULTILE C5h WRITE MULTIPLE C6h SET MULTIPLE MODE C8h READ DMA C9h READ DMA without retry CAh WRITE DMA CBh WRITE DMA without retry CEh WRITE MULTIPLE FUA EXT E0h STANDBY IMMEDIATE E1h IDLE IMMEDIATE E2h STANDBY E3h IDLE E4h READ BUFFER E5h CHECK POWER MODE E6h SLEEP E7h FLUSH CACHE E8h WRITE BUFFER EAh FLUSH CACHE EXT ECh IDENTIFY DEVICE EFh SET FEATURES EFh 02h Enable volatile write cache EFh 03h Set transfer mode EFh 05h Enable APM feature set EFh 10h Enable Serial ATA feature set EFh 10h 02h Enable DMA Auto-Active Copyright © 2011 Toshiba Corporation. All rights reserved. 14 Solid State Drive HG3 Series Brochure Rev.1.1 Op-Code Command Description EFh 10h 03h Enable DIPM transitions EFh 10h 06h Enable SSP EFh 55h Disable read look-ahead EFh 66h Disable reverting to P-On default EFh 82h Disable volatile write cache EFh 85h Disable APM feature set EFh 90h Disable Serial ATA feature set EFh 90h 02h Disable DMA Auto-Activate EFh 90h 03h Disable DIPM EFh 90h 06h Disable SSP EFh AAh Enable read look-ahead EFh CCh Enable reverting to P-On default F1h SECURITY SET PASSWORD F2h SECURITY UNLOACK F3h SECURITY ERASE PREPARE F4h SECURITY ERASE UNIT F5h SECURITY FREEZE LOCK F6h SECURITY DISABLE PASSWORD F8h READ NATIVE MAX ADDRESS F9h SET MAX ADDRESS F9h 01h SET MAX SET PASSWORD F9h 02h SET MAX LOCK F9h 03h SET MAX UNLOCK F9h 04h SET MAX FREEZE LOCK Copyright © 2011 Toshiba Corporation. All rights reserved. 15 Solid State Drive HG3 Series Brochure Rev.1.1 10. Revision History Rev. Description Date 1.0 Revised and enlarged edition of “Solid State Drives HG3 Series Product Brief Sep. 02, 2011 Rev.01” 1.1 Changed the title of this document Oct. 14, 2011 Changed into “-type” from “inch” in name of form factor Copyright © 2011 Toshiba Corporation. All rights reserved. 16 Solid State Drive HG3 Series Brochure Rev.1.1 RESTRICTIONS ON PRODUCT USE • Toshiba Corporation, and its subsidiaries and affiliates (collectively “TOSHIBA”), reserve the right to make changes to the information in this document, and related hardware, software and systems (collectively “Product”) without notice. • This document and any information herein may not be reproduced without prior written permission from TOSHIBA. Even with TOSHIBA’s written permission, reproduction is permissible only if reproduction is without alteration/omission. • Though TOSHIBA works continually to improve Product’s quality and reliability, Product can malfunction or fail. Customers are responsible for complying with safety standards and for providing adequate designs and safeguards for their hardware, software and systems which minimize risk and avoid situations in which a malfunction or failure of Product could cause loss of human life, bodily injury or damage to property, including data loss or corruption. Before creating and producing designs and using, customers must also refer to and comply with (a) the latest versions of all relevant TOSHIBA information, including without limitation, this document, the specifications, the data sheets and application notes for Product and the precautions and conditions set forth in the “TOSHIBA Semiconductor Reliability Handbook” and (b) the instructions for the application that Product will be used with or for. Customers are solely responsible for all aspects of their own product design or applications, including but not limited to (a) determining the appropriateness of the use of this Product in such design or applications; (b) evaluating and determining the applicability of any information contained in this document, or in charts, diagrams, programs, algorithms, sample application circuits, or any other referenced documents; and (c) validating all operating parameters for such designs and applications. TOSHIBA ASSUMES NO LIABILITY FOR CUSTOMERS’ PRODUCT DESIGN OR APPLICATIONS. • Product is intended for use in general electronics applications (e.g., computers, personal equipment, office equipment, measuring equipment, industrial robots and home electronics appliances) or for specific applications as expressly stated in this document. Product is neither intended nor warranted for use in equipment or systems that require extraordinarily high levels of quality and/or reliability and/or a malfunction or failure of which may cause loss of human life, bodily injury, serious property damage or serious public impact (“Unintended Use”). Unintended Use includes, without limitation, equipment used in nuclear facilities, equipment used in the aerospace industry, medical equipment, equipment used for automobiles, trains, ships and other transportation, traffic signaling equipment, equipment used to control combustions or explosions, safety devices, elevators and escalators, devices related to electric power, and equipment used in finance-related fields. Do not use Product for Unintended Use unless specifically permitted in this document. • Do not disassemble, analyze, reverse-engineer, alter, modify, translate or copy Product, whether in whole or in part. • Product shall not be used for or incorporated into any products or systems whose manufacture, use, or sale is prohibited under any applicable laws or regulations. • The information contained herein is presented only as guidance for Product use. No responsibility is assumed by TOSHIBA for any infringement of patents or any other intellectual property rights of third parties that may result from the use of Product. No license to any intellectual property right is granted by this document, whether express or implied, by estoppel or otherwise. • ABSENT A WRITTEN SIGNED AGREEMENT, EXCEPT AS PROVIDED IN THE RELEVANT TERMS AND CONDITIONS OF SALE FOR PRODUCT, AND TO THE MAXIMUM EXTENT ALLOWABLE BY LAW, TOSHIBA (1) ASSUMES NO LIABILITY WHATSOEVER, INCLUDING WITHOUT LIMITATION, INDIRECT, CONSEQUENTIAL, SPECIAL, OR INCIDENTAL DAMAGES OR LOSS, INCLUDING WITHOUT LIMITATION, LOSS OF PROFITS, LOSS OF OPPORTUNITIES, BUSINESS INTERRUPTION AND LOSS OF DATA, AND (2) DISCLAIMS ANY AND ALL EXPRESS OR IMPLIED WARRANTIES AND CONDITIONS RELATED TO SALE, USE OF PRODUCT, OR INFORMATION, INCLUDING WARRANTIES OR CONDITIONS OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE, ACCURACY OF INFORMATION, OR NONINFRINGEMENT. • Do not use or otherwise make available Product or related software or technology for any military purposes, including without limitation, for the design, development, use, stockpiling or manufacturing of nuclear, chemical, or biological weapons or missile technology products (mass destruction weapons). Product and related software and technology may be controlled under the Japanese Foreign Exchange and Foreign Trade Law and the U.S. Export Administration Regulations. Export and re-export of Product or related software or technology are strictly prohibited except in compliance with all applicable export laws and regulations. • Product may include products subject to foreign exchange and foreign trade control laws. • Please contact your TOSHIBA sales representative for details as to environmental matters such as the RoHS compatibility of Product. Please use Product in compliance with all applicable laws and regulations that regulate the inclusion or use of controlled substances, including without limitation, the EU RoHS Directive. TOSHIBA assumes no liability for damages or losses occurring as a result of noncompliance with applicable laws and regulations. Copyright © 2011 Toshiba Corporation. All rights reserved. 17