Solid State Drive HG3 Series - TOSHIBA Semiconductor & Storage

Solid State Drive HG3 Series
Key Features
•
•
•
•
•
•
High capacity in smallest size
Fast access and fast transfer rate
Low power consumption
High reliability
Intelligent Interface
Data integrity
Applications
• For General-purpose notebook PCs
Specifications and Features
Form Factor
Memory
Interface
Capacity
Performance
Supply Voltage
Power
Consumption
Temperature
Shock
Vibration
Reliability
2.5-type Case
1.8-type Case
Micro SATA Module
TOSHIBA® 32nm MLC NAND Flash Memory
ATA-8 ACS2, SATA revision 2.6 3Gb/s
64/128/256/512 GB
64/128/256 GB
64/128/256 GB
Maximum Data Read : 220 MB/s (Ave), Maximum Data Write : 180 MB/s (Ave)
5.0V ±5%
3.3V ±5%
3.3V ±5%
Active : 3.4W Typ.
Active : 2.9W Typ.
Active : 2.9W Typ.
Idle : 53mW Typ.
Idle : 47mW Typ.
Idle : 47mW Typ.
Operating : 0°C (Tc) – 70°C (Tc), Non-operating : -40°C – 85°C
1500G @ 0.5 ms
Operating / Non-operating : 20G @ 10-2,000Hz
Mean Time to Failure (MTTF) : 1,000,000 hours
Product Life : Approximately 5 years or 20,000 power on hours, whichever comes earlier
Size
100.0mm x 69.85mm x
78.5mm x 54.0mm x 5.0mm
77.13mm x 48.65mm x
9.5mm
4.75mm
Weight
51-58g typ.
48g typ.
16g typ.
More Features ・ Translation mode which enables any drive configuration
・ 28-bit LBA mode commands and 48-bit LBA mode commands support
・ Multi word DMA
・ Ultra-DMA
・ Advanced PIO mode
・ Data Set Management Command set (Trim) support
・ Automatic retries and corrections for read errors
・ FDE (Full Disk Encryption) (Optional) *1
Compliance
UL, CSA, TUV, KCC, FCC, BSMI, CE, C-Tick
NOTE: *1) The products with FDE option are subject to foreign exchange and foreign trade control laws.
Products and specifications discussed herein are for reference purposes
only and are subject to change without notice. All information discussed
herein is provided on an “as is” basis, without warranties of any kind.
Before creating and producing designs and using, customers must refer to
and comply with the latest versions of the product specifications.
Copyright © 2011 Toshiba Corporation. All rights reserved.
Solid State Drive HG3 Series Brochure Rev.1.1
1
Solid State Drive HG3 Series Brochure Rev.1.1
Ordering Information
THN SX X XXXG X X X
1
2 3
4
5 6 7
1.
Model Name
THN: Toshiba NAND drive
2.
Model Type
SN: Normal SSD, SF: FDE supported SSD (Optional)
3.
Controller Type C: Type C
4.
Capacity
064G / 128G / 256G / 512G / …
064G is 64GB, 128G is 128GB, 256G is 256GB and 512G is 512GB
(1 GB = 1,000,000,000 bytes)
5.
Form Factor
A: 1.8-type case, B: 2.5-type case (9.5mm height), M: Module type
6.
Host I/F Type
M: Micro SATA, S: Standard SATA
7.
NAND Process J: 32nm MLC
Product Line up
NOTE:
Product Number
Capacity
THNSxC064GBSJ
64 GB
THNSxC128GBSJ
128 GB
THNSxC256GBSJ
256 GB
THNSxC512GBSJ
512 GB
THNSxC064GAMJ
64 GB
THNSxC128GAMJ
128 GB
THNSxC256GAMJ
256 GB
THNSxC064GMMJ
64 GB
THNSxC128GMMJ
128 GB
THNSxC256GMMJ
256 GB
Form Factor
2.5-type 9.5mm case
1.8-type case
Micro SATA module
x: Refer to Chapter “Ordering Information”
Copyright © 2011 Toshiba Corporation.
All rights reserved.
2
Solid State Drive HG3 Series Brochure Rev.1.1
Contents
Ordering Information ................................................................................................................................................. 2
Product Line up .......................................................................................................................................................... 2
Contents..................................................................................................................................................................... 3
1.
General Description ........................................................................................................................................... 4
2.
Product Specifications ....................................................................................................................................... 4
2.1.
Capacity..................................................................................................................................................... 4
2.2.
Performance.............................................................................................................................................. 4
3.
Electrical Characteristics .................................................................................................................................... 5
3.1.
Supply Voltage........................................................................................................................................... 5
3.2.
Power Consumption.................................................................................................................................. 5
4.
Environmental Conditions ................................................................................................................................. 6
4.1.
Temperature and Humidity ....................................................................................................................... 6
4.2.
Shock and Vibration .................................................................................................................................. 6
5.
Compliance ........................................................................................................................................................ 7
6.
Reliability ........................................................................................................................................................... 7
7.
Mechanical Specifications ................................................................................................................................. 8
7.1.
2.5-type Case ............................................................................................................................................ 8
7.2.
1.8-type Case ............................................................................................................................................ 9
7.3.
Micro SATA Module ................................................................................................................................. 10
8.
Interface Connector......................................................................................................................................... 11
8.1.
2.5-type Case .......................................................................................................................................... 11
8.2.
1.8-type Case and Micro SATA Module ................................................................................................... 12
9.
10.
Command Descriptions ................................................................................................................................... 13
Revision History ........................................................................................................................................... 16
RESTRICTIONS ON PRODUCT USE ............................................................................................................................ 17
Copyright © 2011 Toshiba Corporation.
All rights reserved.
3
Solid State Drive HG3 Series Brochure Rev.1.1
1. General Description
The TOSHIBA SSD HG series is a memory storage device using NAND Flash Memories, which has no
mechanical moving parts and provides high performance and reliability.
The drive features an ATA-8 and Serial ATA revision 2.6 interface embedded controller that requires a
simplified adapter board for interfacing to a Serial ATA or Serial ATA compatible bus. The drive is
distinctive for its small and light body.
2. Product Specifications
2.1. Capacity
Table 2-1. User Addressable Sectors in LBA Mode
NOTE:
Formatted Capacity
Total Number of User Addressable Sectors in LBA Mode
64 GB
125,045,424
128 GB
250,069,680
256 GB
500,118,192
512 GB
1,000,215,216
1 GB (Gigabyte) = 1,000,000,000 bytes
Bytes per sector: 512 bytes
2.2. Performance
Table 2-2. Host Transfer Rate and Data Transfer Rate in Read/Write
Parameter
Transfer Rate
Host Transfer Rate
300 MB/s
Maximum Data Read
*1
220 MB/s (Ave.)
Maximum Data Write
*1
180 MB/s (Ave.)
NOTE:
*1) Under the condition of measurement with 128KB unit sequential access
Copyright © 2011 Toshiba Corporation.
All rights reserved.
4
Solid State Drive HG3 Series Brochure Rev.1.1
3. Electrical Characteristics
3.1. Supply Voltage
Table 3-1. Supply Voltage
2.5-type Case
Allowable voltage
Allowable noise/ripple
Micro SATA Module
5.0V ±5%
3.3V ±5%
100 mV p-p or less
100 mV p-p or less
2 –100 ms
2 –100 ms
Allowable supply rise time
NOTE:
1.8-type Case
The drive has over current protection circuit. (Rated current: 3.15A)
3.2. Power Consumption
Table 3-2. Power Consumption in 2.5-type Case Type
Operation
2.5-type Case
(@25°C)
THNSxC064GBSJ
THNSxC128GBSJ
THNSxC256GBSJ
THNSxC512GBSJ
Read *1
1.2W Typ.
1.4W Typ.
1.7W Typ.
1.8W Typ.
*1
2.8W Typ.
3.0W Typ.
3.3W Typ.
3.4W Typ.
51mW Typ.
52mW Typ.
52mW Typ.
53mW Typ.
51mW Typ.
52mW Typ.
52mW Typ.
53mW Typ.
50mW Typ.
52mW Typ.
52mW Typ.
53mW Typ.
Write
Idle
*2
Standby *3
Sleep
*3
Table 3-3. Power Consumption in 1.8-type Case Type and Micro SATA Module Type
Operation
(@25°C)
1.8-type Case / Micro SATA Module
THNSxC064GAMJ
THNSxC128GAMJ
THNSxC256GAMJ
THNSxC064GMMJ
THNSxC128GMMJ
THNSxC256GMMJ
Read
*1
1.1W Typ.
1.3W Typ.
1.5W Typ.
Write
*1
2.6W Typ.
2.7W Typ.
2.9W Typ.
47mW Typ.
47mW Typ.
47mW Typ.
47mW Typ.
47mW Typ.
47mW Typ.
47mW Typ.
47mW Typ.
47mW Typ.
Idle *2
Standby
Sleep
*3
*3
NOTE:
*1) The read/write current is specified 220 MB/s in read, 180 MB/s in write.
*2) The values are based on using S-ATA power management features.
The Slumber mode is used for
the idle mode power consumption measurements. In Idle mode, if a background write operation
occurs, the drive power consumption may temporally rise to that in write operation.
*3) The values are based on using S-ATA power management features. The Slumber mode is used for
Standby and Sleep modes power consumption measurements. In Standby mode, if a background write
operation occurs, the drive power consumption may temporally rise to that in write operation.
Copyright © 2011 Toshiba Corporation.
All rights reserved.
5
Solid State Drive HG3 Series Brochure Rev.1.1
4. Environmental Conditions
4.1. Temperature and Humidity
Table 4-1. Temperature
Condition
Range
Gradient
0°C (Tc) – 70°C (Tc)
30°C (Ta) / h maximum
Non-operating
-40°C – 85°C
30°C / h maximum
Under Shipment *2
-40°C – 85°C
30°C / h maximum
Operating
NOTE:
*1
*1) Ta: Ambient Temperature, Tc: Case Temperature
*2) Packed in Toshiba’s original shipping package
Table 4-2. Humidity
Condition
Range
Operating
8% – 90% R.H. (No condensation)
Non-operating
Under Shipment
NOTE:
8% – 95% R.H. (No condensation)
*1
5% – 95% R.H.
*1) Packed in Toshiba’s original shipping package
4.2. Shock and Vibration
Table 4-3. Shock
Condition
Range
Operating
1500G, 0.5 ms, half sine wave
Non-operating
1500G, 0.5 ms, half sine wave
Under Shipment *1
100 cm free drop
NOTE:
*1) Apply shocks in each direction of the drive’s three mutually perpendicular axes, one axis at a time.
Packed in Toshiba’s original shipping package.
Table 4-4. Vibration
Condition
Range
Operating
20G Peak, 10-2,000Hz, (20min /Axis)x3 Axis
Non-operating
20G Peak, 10-2,000Hz, (12Cycle /Axis)x3 Axis, x20min.
Copyright © 2011 Toshiba Corporation.
All rights reserved.
6
Solid State Drive HG3 Series Brochure Rev.1.1
5. Compliance
TOSHIBA SSDs HG series comply with the following.
Table 5-1. Compliance
Title
Description
UL
(Underwriters Laboratories)
UL 60950-1
Region
USA
CSA
(Canadian Standard Association)
CSA-C22.2 No.60950-1
Canada
*Included UL logo mark
TÜV
(Technischer Überwachungs Verein)
EN 60950-1
Germany
KCC
KN22 (CISPR Pub. 22),
(Korea Communication Commission)
KN24 (CISPR Pub. 24)
FCC
FCC part 15 Subpart B Class B
Korea
USA
BSMI
(Bureau of Standards, Metrology and
CNS13438(CISPR Pub. 22)
Taiwan
EN 55022, EN 55024
Europe
Inspection)
CE Mark
Declaration of Conformity
C-Tick
AS/NZS CISPR Pub. 22 Class B
Australia,
New Zealand
6. Reliability
Table 6-1. Reliability
Parameter
Value
Mean Time to Failure
1,000,000 hours
Product Life
Approximately 5 years or 20,000 power on hours, whichever comes earlier
Copyright © 2011 Toshiba Corporation.
All rights reserved.
7
Solid State Drive HG3 Series Brochure Rev.1.1
7. Mechanical Specifications
7.1. 2.5-type Case
Table 7-1. Weight and Dimensions
Model
Weight
Width
Height
Length
69.85 mm
9.5 mm
100.0 mm
THNSxC064GBSJ
THNSxC128GBSJ
51 g Typ.
THNSxC256GBSJ
THNSxC512GBSJ
58 g Typ.
Figure 7-1. 2.5-type Case Drive Dimension
Copyright © 2011 Toshiba Corporation.
All rights reserved.
8
Solid State Drive HG3 Series Brochure Rev.1.1
7.2. 1.8-type Case
Table 7-2. Weight and Dimensions
1.8-type Case
Weight
Width
Height
Length
48 g Typ.
54.0 mm
5.0 mm
78.5 mm
Figure 7-2. 1.8-type Case Drive Dimension
Copyright © 2011 Toshiba Corporation.
All rights reserved.
9
Solid State Drive HG3 Series Brochure Rev.1.1
7.3. Micro SATA Module
Table 7-3. Weight and Dimensions
Micro SATA Module
Weight
Width
Height
Length
16 g Typ.
48.65 mm
4.75 mm
77.13 mm
Figure 7-3. Micro SATA Module Drive Dimension
Copyright © 2011 Toshiba Corporation.
All rights reserved.
10
Solid State Drive HG3 Series Brochure Rev.1.1
8. Interface Connector
8.1. 2.5-type Case
Figure 8-1. 2.5-type Case Serial ATA Interface Connector
Table 8-1. 2.5-type Case Drive Connecter Pin Assignment
Signal segment key
Signal
Segment
Power
Segment
U1
U2
U3
U4
S1
S2
S3
S4
S5
S6
S7
GND
A+
A–
GND
B–
B+
GND
2nd mate
Differential Signal Pair A (Device Rx)
Differential Signal Pair B (Device Tx)
2nd mate
Signal segment “L”
Central connector polarizer
Power segment “L”
V33
3.3V power (Unused)
V33
3.3V power (Unused)
V33
3.3V power pre-charge 2nd mate (Unused)
GND
GND
GND
V5
5V power pre-charge*2 2nd mate
V5
5V power
V5
5V power
GND
DAS/DSS*1 Reserved at ATA-8
GND
1st mate
V12
12V power pre-charge 2nd mate (Unused)
V12
12V power (Unused)
V12
12V power (Unused)
Power segment key
P1
P2
P3
P4
P5
P6
P7
P8
P9
P10
P11
P12
P13
P14
P15
N.C.
TX
UX
GND
Not connected
For test use, Not connected
For test use, Not connected
Note: *1) DAS/DSS signal is not used for this drive, *2) Direct connect to non pre-charge pins
Copyright © 2011 Toshiba Corporation.
All rights reserved.
11
Solid State Drive HG3 Series Brochure Rev.1.1
8.2. 1.8-type Case and Micro SATA Module
Figure 8-2. Micro SATA Interface Connector
Table 8-2. Pin Assignment on Micro SATA Connector
Signal segment key
Signal
Segment
Power
Segment
S1
S2
S3
S4
S5
S6
S7
P1
P2
P3
P4
P5
P6
P7
P8
P9
GND
A+
A–
GND
B–
B+
GND
2nd mate
Differential Signal Pair A (Device Rx)
Differential Signal Pair B (Device Tx)
2nd mate
Signal segment “L”
Central connector polarizer
Power segment “L”
V33
3.3V power
V33
3.3V power pre-charge*1 2nd mate
GND
GND
V5
5V power pre-charge 2nd mate (Unused)
V5
5V power (Unused)
R
Reserved
Key
V
Vendor Specific
V
Vendor Specific
Power segment key
Note: *1) Direct connect to non pre-charge pins
Copyright © 2011 Toshiba Corporation.
All rights reserved.
12
Solid State Drive HG3 Series Brochure Rev.1.1
9. Command Descriptions
Table 9-1. Supported ATA Command Set
Op-Code
Command Description
00h
NOP
06h
DATA SET MANAGEMENT
10h
RECALIBRATE
20h
READ SECTOR(S)
21h
READ SECTOR(S) without retry
24h
READ SECTOR(S) EXT
25h
READ DMA EXT
27h
READ NATIVE MAX ADDRESS EXT
29h
READ MULTIPLE EXT
2Fh
READ LOG EXT
30h
WRITE SECTOR(S)
31h
WRITE SECTOR(S) without retry
34h
WRITE SECTOR(S) EXT
35h
WRITE DMA EXT
37h
SET MAX ADDRESS EXT
39h
WRITE MULTIPLE EXT
3Dh
WRITE DMA FUA EXT
3Fh
WRITE LOG EXT
40h
READ VERIFY SECTOR(S)
41h
READ VERIFY SECTOR(S) without retry
42h
READ VERIFY SECTOR(S) EXT
45h
WRITE UNCORRECTABLE EXT
47h
READ LOG DMA EXT
57h
WRITE LOG DMA EXT
70h
SEEK
90h
EXECUTE DEVICE DIAGNOSTIC
91h
INITIALIZE DEVICE PARAMETERS
92h
DOWNLOAD MICROCODE
B0h
SMART
B0h
D0h
SMART READ DATA
B0h
D1h
SMART READ ATTRIBUTE THRESHOLDS
B0h
D2h
SMART ENABLE/DISABLE ATTRIBUTE AUTOSAVE
B0h
D3h
SMART SAVE ATTRIBUTE VALUES
Copyright © 2011 Toshiba Corporation.
All rights reserved.
13
Solid State Drive HG3 Series Brochure Rev.1.1
Op-Code
Command Description
B0h
D4h
SMART EXECUTE OFF-LINE IMMEDIATE
B0h
D5h
SMART READ LOG
B0h
D6h
SMART WRITE LOG
B0h
D8h
SMART ENABLE OPERATIONS
B0h
D9h
SMART DISABLE OPERATIONS
B0h
DAh
SMART RETURN STATUS
B0h
DBh
SMART ENABLE/DISABLE AUTOMATIC OFF-LINE
B1h
DEVICE CONFIGURATION OVERLAY
B1h
C0h
DEVICE CONFIGURATION RESTORE
B1h
C1h
DEVICE CONFIGURATION FREEZE LOCK
B1h
C2h
DEVICE CONFIGURATION IDENTIFY
B1h
C3h
DEVICE CONFIGURATION SET
C4h
READ MULTILE
C5h
WRITE MULTIPLE
C6h
SET MULTIPLE MODE
C8h
READ DMA
C9h
READ DMA without retry
CAh
WRITE DMA
CBh
WRITE DMA without retry
CEh
WRITE MULTIPLE FUA EXT
E0h
STANDBY IMMEDIATE
E1h
IDLE IMMEDIATE
E2h
STANDBY
E3h
IDLE
E4h
READ BUFFER
E5h
CHECK POWER MODE
E6h
SLEEP
E7h
FLUSH CACHE
E8h
WRITE BUFFER
EAh
FLUSH CACHE EXT
ECh
IDENTIFY DEVICE
EFh
SET FEATURES
EFh
02h
Enable volatile write cache
EFh
03h
Set transfer mode
EFh
05h
Enable APM feature set
EFh
10h
Enable Serial ATA feature set
EFh
10h
02h
Enable DMA Auto-Active
Copyright © 2011 Toshiba Corporation.
All rights reserved.
14
Solid State Drive HG3 Series Brochure Rev.1.1
Op-Code
Command Description
EFh
10h
03h
Enable DIPM transitions
EFh
10h
06h
Enable SSP
EFh
55h
Disable read look-ahead
EFh
66h
Disable reverting to P-On default
EFh
82h
Disable volatile write cache
EFh
85h
Disable APM feature set
EFh
90h
Disable Serial ATA feature set
EFh
90h
02h
Disable DMA Auto-Activate
EFh
90h
03h
Disable DIPM
EFh
90h
06h
Disable SSP
EFh
AAh
Enable read look-ahead
EFh
CCh
Enable reverting to P-On default
F1h
SECURITY SET PASSWORD
F2h
SECURITY UNLOACK
F3h
SECURITY ERASE PREPARE
F4h
SECURITY ERASE UNIT
F5h
SECURITY FREEZE LOCK
F6h
SECURITY DISABLE PASSWORD
F8h
READ NATIVE MAX ADDRESS
F9h
SET MAX ADDRESS
F9h
01h
SET MAX SET PASSWORD
F9h
02h
SET MAX LOCK
F9h
03h
SET MAX UNLOCK
F9h
04h
SET MAX FREEZE LOCK
Copyright © 2011 Toshiba Corporation.
All rights reserved.
15
Solid State Drive HG3 Series Brochure Rev.1.1
10.
Revision History
Rev.
Description
Date
1.0
Revised and enlarged edition of “Solid State Drives HG3 Series Product Brief
Sep. 02, 2011
Rev.01”
1.1
Changed the title of this document
Oct. 14, 2011
Changed into “-type” from “inch” in name of form factor
Copyright © 2011 Toshiba Corporation.
All rights reserved.
16
Solid State Drive HG3 Series Brochure Rev.1.1
RESTRICTIONS ON PRODUCT USE
• Toshiba Corporation, and its subsidiaries and affiliates (collectively “TOSHIBA”), reserve the right to make changes to the information
in this document, and related hardware, software and systems (collectively “Product”) without notice.
• This document and any information herein may not be reproduced without prior written permission from TOSHIBA. Even with
TOSHIBA’s written permission, reproduction is permissible only if reproduction is without alteration/omission.
• Though TOSHIBA works continually to improve Product’s quality and reliability, Product can malfunction or fail. Customers are
responsible for complying with safety standards and for providing adequate designs and safeguards for their hardware, software and
systems which minimize risk and avoid situations in which a malfunction or failure of Product could cause loss of human life, bodily
injury or damage to property, including data loss or corruption. Before creating and producing designs and using, customers must also
refer to and comply with (a) the latest versions of all relevant TOSHIBA information, including without limitation, this document, the
specifications, the data sheets and application notes for Product and the precautions and conditions set forth in the “TOSHIBA
Semiconductor Reliability Handbook” and (b) the instructions for the application that Product will be used with or for. Customers are
solely responsible for all aspects of their own product design or applications, including but not limited to (a) determining the
appropriateness of the use of this Product in such design or applications; (b) evaluating and determining the applicability of any
information contained in this document, or in charts, diagrams, programs, algorithms, sample application circuits, or any other
referenced documents; and (c) validating all operating parameters for such designs and applications. TOSHIBA ASSUMES NO
LIABILITY FOR CUSTOMERS’ PRODUCT DESIGN OR APPLICATIONS.
• Product is intended for use in general electronics applications (e.g., computers, personal equipment, office equipment, measuring
equipment, industrial robots and home electronics appliances) or for specific applications as expressly stated in this document.
Product is neither intended nor warranted for use in equipment or systems that require extraordinarily high levels of quality and/or
reliability and/or a malfunction or failure of which may cause loss of human life, bodily injury, serious property damage or serious public
impact (“Unintended Use”). Unintended Use includes, without limitation, equipment used in nuclear facilities, equipment used in the
aerospace industry, medical equipment, equipment used for automobiles, trains, ships and other transportation, traffic signaling
equipment, equipment used to control combustions or explosions, safety devices, elevators and escalators, devices related to electric
power, and equipment used in finance-related fields. Do not use Product for Unintended Use unless specifically permitted in this
document.
• Do not disassemble, analyze, reverse-engineer, alter, modify, translate or copy Product, whether in whole or in part.
• Product shall not be used for or incorporated into any products or systems whose manufacture, use, or sale is prohibited under any
applicable laws or regulations.
• The information contained herein is presented only as guidance for Product use. No responsibility is assumed by TOSHIBA for any
infringement of patents or any other intellectual property rights of third parties that may result from the use of Product. No license to
any intellectual property right is granted by this document, whether express or implied, by estoppel or otherwise.
• ABSENT A WRITTEN SIGNED AGREEMENT, EXCEPT AS PROVIDED IN THE RELEVANT TERMS AND CONDITIONS OF SALE
FOR PRODUCT, AND TO THE MAXIMUM EXTENT ALLOWABLE BY LAW, TOSHIBA (1) ASSUMES NO LIABILITY
WHATSOEVER, INCLUDING WITHOUT LIMITATION, INDIRECT, CONSEQUENTIAL, SPECIAL, OR INCIDENTAL DAMAGES OR
LOSS, INCLUDING WITHOUT LIMITATION, LOSS OF PROFITS, LOSS OF OPPORTUNITIES, BUSINESS INTERRUPTION AND
LOSS OF DATA, AND (2) DISCLAIMS ANY AND ALL EXPRESS OR IMPLIED WARRANTIES AND CONDITIONS RELATED TO
SALE, USE OF PRODUCT, OR INFORMATION, INCLUDING WARRANTIES OR CONDITIONS OF MERCHANTABILITY, FITNESS
FOR A PARTICULAR PURPOSE, ACCURACY OF INFORMATION, OR NONINFRINGEMENT.
• Do not use or otherwise make available Product or related software or technology for any military purposes, including without limitation,
for the design, development, use, stockpiling or manufacturing of nuclear, chemical, or biological weapons or missile technology
products (mass destruction weapons). Product and related software and technology may be controlled under the Japanese Foreign
Exchange and Foreign Trade Law and the U.S. Export Administration Regulations. Export and re-export of Product or related software
or technology are strictly prohibited except in compliance with all applicable export laws and regulations.
• Product may include products subject to foreign exchange and foreign trade control laws.
• Please contact your TOSHIBA sales representative for details as to environmental matters such as the RoHS compatibility of Product.
Please use Product in compliance with all applicable laws and regulations that regulate the inclusion or use of controlled substances,
including without limitation, the EU RoHS Directive. TOSHIBA assumes no liability for damages or losses occurring as a result of
noncompliance with applicable laws and regulations.
Copyright © 2011 Toshiba Corporation.
All rights reserved.
17