NAND Flash Part Numbering System Micron's part numbering system is available at www.micron.com/support/designsupport/documents/png MT 29F 2G 08 A A A A A WP - xx xx x ES : A Micron Technology Design Revision Single-Supply Flash 29F = NAND Flash 29E = Enterprise NAND Flash Production Status Blank = Production ES = Engineering Samples QS = Qualification Samples MS = Mechanical Sample Density 1G = 1Gb 2G = 2Gb 4G = 4Gb 8G = 8Gb 16G = 16Gb 32G = 32Gb** 64G = 64Gb** 128G = 128Gb** 256G = 256Gb 512G = 512Gb 1T = 1Tb 2T = 2Tb 4T = 4Tb **Wafers are available in this density. Features E = Internal ECC enabled M = Media R = MLC+ features S = Security features X = Product Longevity Program Z = Polyimide (if applicable) Operating Temperature Range* Blank = Commercial (0°C to +70°C) AAT = Automotive Grade (–40°C to +105°C) AIT = Automotive Industrial (–40°C to +85°C) IT = Extended (–40°C to +85°C) (AKA ET) WT = Wireless Temp (–25°C to +85°C) *Wafers support only the 0°C to +70°C temperature range Device Width 01 = 1 bit 08 = 8 bits 16 = 16 bits Level Mark A C E Speed Grade Blank = Async only 12 = 166MT/s 10 = 200 MT/s 6 = 333 MT/s 5 = 400MT/s 4 = 533MT/s 3 = 667MT/s Level SLC MLC TLC Classification Mark A B D E F G J K L M Q R T U V Die 1 1 2 2 2 3 4 4 4 4 8 8 16 8 16 nCE 0 1 1 2 2 3 2 2 4 4 4 2 8 4 8 RnB 0 1 1 2 2 3 2 2 4 4 4 2 4 4 4 I/O Channels 1 1 1 2 1 3 1 2 4 2 4 2 2 2 4 Operating Voltage Range A = VCC: 3.3V (2.70–3.60V), VCCQ: 3.3V (2.70–3.60V) B = 1.8V (1.70–1.95V) C = VCC: 3.3V (2.70–3.60V), VCCQ: 1.8V (1.70–1.95V) E = VCC: 3.3V (2.70–3.60V), VCCQ: 3.3V (2.70–3.60V) or 1.8V (1.70–1.95V) F = VCC: 3.3V (2.50–3.60V), VCCQ: 1.2V (1.14–1.26V) G = VCC: 3.3V (2.60–3.60V) , VCCQ: 1.8V (1.70–1.95V) H = VCC: 3.3V (2.50–3.60V), VCCQ: 1.2V (1.14–1.26) or 1.8V (1.70–1.95V) J = VCC: 3.3V (2.50–3.60V), VCCQ: 1.8V (1.70–1.95V) K = VCC: 3.3V (2.60–3.60V), VCCQ 3.3V (2.60–3.60V) L = VCC: 3.3V (2.60–3.60V), VCCQ: 3.3V (2.60–3.60V) or 1.8V (1.70–1.95V) Package Code (dimensions in mm)** WP = 48-pin TSOP I (CPL version) WC = 48-pin TSOP I (OCPL version) C5 = 52-pad VLGA, 14 x 18 x 1.0 (SDP/DDP/QDP) G1 = 272-ball VBGA, 14 x 18 x 1.0 (SDP, DDP, 3DP, QDP) G2 = 272-ball TBGA, 14 x 18 x 1.3 (QDP, 8DP) G6 = 272-ball LBGA, 14 x 18 x 1.5 (16DP) H1 = 100-ball VBGA, 12 x 18 x 1.0 H2 = 100-ball TBGA, 12 x 18 x 1.2 H3 = 100-ball LBGA, 12 x 18 x 1.4 (8DP) H4 = 63-ball VFBGA, 9 x 11 x 1.0 HC = 63-ball VFBGA, 10.5 x 13 x 1.0 H6 = 152-ball VBGA, 14 x 18 x 1.0 (SDP, DDP) H7 = 152-ball TBGA, 14 x 18 x 1.2 (QDP) H8 = 152-ball LBGA, 14 x 18 x 1.4 (8DP) H9 = 100-ball LBGA, 12 x 18 x 1.6 (16DP) J1 = 132-ball VBGA, 12 x 18 x 1.0 (SDP, DDP) J2 = 132-ball TBGA, 12 x 18 x 1.2 (QDP) J3 = 132-ball LBGA, 12 x 18 x 1.4 (8DP) J4 = 132-ball VBGA, 12 x 18 x 1.0 (SDP, DDP) J5 = 132-ball TBGA, 12 x 18 x 1.2 (QDP) J6 = 132-ball LBGA, 12 x 18 x 1.4 (8DP) J7 = 152-ball LBGA, 14 x 18 x 1.5 (16DP) J9 = 132-ball LBGA, 12mm x 18mm x 1.5mm (16DP) **Wafers are available for some products, please contact Micron for more information. All NAND packages are Pb-free. Interface Mark Interface A B C D Async only Sync/Async Sync only SPI Generation Feature Set A = 1st set of device features B = 2nd set of device features (rev only if different than 1st set) C = 3rd set of device features (rev only if different) D = 4th set of device features (rev only if different) etc. Rev. 3/25/14 © 2014 Micron Technology, Inc. Micron and the Micron logo are trademarks of Micron Technology, Inc. Products and specifications are subject to change without notice. Dates are estimates only.