NAND Flash Part Numbering System

NAND Flash Part Numbering System
Micron's part numbering system is available at www.micron.com/support/designsupport/documents/png
MT
29F
2G
08
A
A
A
A
A
WP -
xx
xx
x
ES
:
A
Micron Technology
Design Revision
Single-Supply Flash
29F = NAND Flash
29E = Enterprise NAND Flash
Production Status
Blank = Production
ES = Engineering Samples
QS = Qualification Samples
MS = Mechanical Sample
Density
1G = 1Gb
2G = 2Gb
4G = 4Gb
8G = 8Gb
16G = 16Gb
32G = 32Gb**
64G = 64Gb**
128G = 128Gb**
256G = 256Gb
512G = 512Gb
1T = 1Tb
2T = 2Tb
4T = 4Tb
**Wafers are available in this density.
Features
E = Internal ECC enabled
M = Media
R = MLC+ features
S = Security features
X = Product Longevity Program
Z = Polyimide (if applicable)
Operating Temperature Range*
Blank = Commercial (0°C to +70°C)
AAT = Automotive Grade (–40°C to +105°C)
AIT = Automotive Industrial (–40°C to +85°C)
IT = Extended (–40°C to +85°C) (AKA ET)
WT = Wireless Temp (–25°C to +85°C)
*Wafers support only the 0°C to +70°C temperature range
Device Width
01 = 1 bit
08 = 8 bits
16 = 16 bits
Level
Mark
A
C
E
Speed Grade
Blank = Async only
12 = 166MT/s
10 = 200 MT/s
6 = 333 MT/s
5 = 400MT/s
4 = 533MT/s
3 = 667MT/s
Level
SLC
MLC
TLC
Classification
Mark
A
B
D
E
F
G
J
K
L
M
Q
R
T
U
V
Die
1
1
2
2
2
3
4
4
4
4
8
8
16
8
16
nCE
0
1
1
2
2
3
2
2
4
4
4
2
8
4
8
RnB
0
1
1
2
2
3
2
2
4
4
4
2
4
4
4
I/O Channels
1
1
1
2
1
3
1
2
4
2
4
2
2
2
4
Operating Voltage Range
A = VCC: 3.3V (2.70–3.60V), VCCQ: 3.3V (2.70–3.60V)
B = 1.8V (1.70–1.95V)
C = VCC: 3.3V (2.70–3.60V), VCCQ: 1.8V (1.70–1.95V)
E = VCC: 3.3V (2.70–3.60V), VCCQ: 3.3V (2.70–3.60V) or 1.8V (1.70–1.95V)
F = VCC: 3.3V (2.50–3.60V), VCCQ: 1.2V (1.14–1.26V)
G = VCC: 3.3V (2.60–3.60V) , VCCQ: 1.8V (1.70–1.95V)
H = VCC: 3.3V (2.50–3.60V), VCCQ: 1.2V (1.14–1.26) or 1.8V (1.70–1.95V)
J = VCC: 3.3V (2.50–3.60V), VCCQ: 1.8V (1.70–1.95V)
K = VCC: 3.3V (2.60–3.60V), VCCQ 3.3V (2.60–3.60V)
L = VCC: 3.3V (2.60–3.60V), VCCQ: 3.3V (2.60–3.60V) or 1.8V (1.70–1.95V)
Package Code (dimensions in mm)**
WP = 48-pin TSOP I (CPL version)
WC = 48-pin TSOP I (OCPL version)
C5 = 52-pad VLGA, 14 x 18 x 1.0 (SDP/DDP/QDP)
G1 = 272-ball VBGA, 14 x 18 x 1.0 (SDP, DDP, 3DP, QDP)
G2 = 272-ball TBGA, 14 x 18 x 1.3 (QDP, 8DP)
G6 = 272-ball LBGA, 14 x 18 x 1.5 (16DP)
H1 = 100-ball VBGA, 12 x 18 x 1.0
H2 = 100-ball TBGA, 12 x 18 x 1.2
H3 = 100-ball LBGA, 12 x 18 x 1.4 (8DP)
H4 = 63-ball VFBGA, 9 x 11 x 1.0
HC = 63-ball VFBGA, 10.5 x 13 x 1.0
H6 = 152-ball VBGA, 14 x 18 x 1.0 (SDP, DDP)
H7 = 152-ball TBGA, 14 x 18 x 1.2 (QDP)
H8 = 152-ball LBGA, 14 x 18 x 1.4 (8DP)
H9 = 100-ball LBGA, 12 x 18 x 1.6 (16DP)
J1 = 132-ball VBGA, 12 x 18 x 1.0 (SDP, DDP)
J2 = 132-ball TBGA, 12 x 18 x 1.2 (QDP)
J3 = 132-ball LBGA, 12 x 18 x 1.4 (8DP)
J4 = 132-ball VBGA, 12 x 18 x 1.0 (SDP, DDP)
J5 = 132-ball TBGA, 12 x 18 x 1.2 (QDP)
J6 = 132-ball LBGA, 12 x 18 x 1.4 (8DP)
J7 = 152-ball LBGA, 14 x 18 x 1.5 (16DP)
J9 = 132-ball LBGA, 12mm x 18mm x 1.5mm (16DP)
**Wafers are available for some products, please contact Micron for
more information.
All NAND packages are Pb-free.
Interface
Mark Interface
A
B
C
D
Async only
Sync/Async
Sync only
SPI
Generation Feature Set
A = 1st set of device features
B = 2nd set of device features (rev only if different than 1st set)
C = 3rd set of device features (rev only if different)
D = 4th set of device features (rev only if different)
etc.
Rev. 3/25/14
© 2014 Micron Technology, Inc.
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Products and specifications are subject to change without notice. Dates are estimates only.