SSBR20100CT/ SSBR20100CTF Main Product Characteristics: IF 2×10A VRRM 100V Tj(max) 150℃ Vf(max) 0.8V TO220 TO220F SSBR20100CT SSBR20100CTF Schematic Diagram Features and Benefits: High Junction Temperature High ESD Protection High Forward & Reverse Surge capability Description: Schottky Barrier Rectifier designed for high frequency switch model power supplies such as adaptors and DC/DC convertors; this product special design for high forward and reverse surge capability Absolute Rating: Symbol VRRM VR(RMS) Characterizes Value Unit Peak Repetitive Reverse Voltage 100 V RMS Reverse Voltage 70 V Per diode 10 A Per device 20 A IF(AV) Average Forward Current IFSM Non Repetitive Surge Forward Current(tp=8.3ms sinusoidal) 180 A IRRM Peak Repetitive Reverse Surge Current(Tp=2us) 0.5 A TJ Maximum operation Junction Temperature Range -55~150 ℃ Tstg Storage Temperature Range -55~150 ℃ Value Unit TO220 2 ℃/W TO220F 4 ℃/W Thermal Resistance Symbol RθJC RθJC Characterizes Maximum Thermal Resistance Junction To Case(per leg) Electrical Characterizes @TA=25℃ unless otherwise specified Symbol Characterizes Min VR Reverse Breakdown Voltage VF Forward Voltage Drop IR Leakage Current ©Silikron Semiconductor CO., LTD. Typ Max 100 V 0.8 0.7 0.1 5 2013.3.21 www.silikron.com Unit V mA Version: 2.2 Test Condition IR=0.5mA IF=10A, TJ=25℃ IF=10A, TJ=125℃ VR=100V, TJ=25℃ VR=100V, TJ=125℃ page 1of8 SSBR20100CT/ SSBR20100CTF I-V Curves: Figure 1:Typical Forward Characteristics Figure 2:Typical Capacitance Characteristics Figure 3:Typical Reverse Characteristics ©Silikron Semiconductor CO., LTD. 2013.3.21 www.silikron.com Version: 2.2 page 2of8 SSBR20100CT/ SSBR20100CTF Mechanical Data: TO-220 -Option1- TO220 PACKAGE OUTLINE DIMENSION_GN Symbol A A1 A2 b b1 b2 C D D1 D2 E E1 ФP ФP1 e e1 L L1 L2 L3 L4 Q1 Dimension In Millimeters Min Nom Max 4.400 4.550 4.700 1.270 1.300 1.330 2.240 2.340 2.440 1.270 1.270 1.370 1.470 0.750 0.800 0.850 0.480 0.500 0.520 15.100 15.400 15.700 8.800 8.900 9.000 2.730 2.800 2.870 9.900 10.000 10.100 8.700 3.570 3.600 3.630 1.400 1.500 1.600 2.54BSC 5.08BSC 13.150 13.360 13.570 7.35REF Dimension In Inches Nom Max 0.179 0.185 0.051 0.052 0.092 0.096 0.050 0.054 0.058 0.031 0.033 0.020 0.021 0.606 0.618 0.350 0.354 0.110 0.113 0.394 0.398 0.343 0.142 0.143 0.059 0.063 0.1BSC 0.2BSC 0.518 0.526 0.534 0.29REF Min 0.173 0.050 0.088 0.050 0.030 0.019 0.594 0.346 0.107 0.390 0.141 0.055 2.900 1.650 3.000 1.750 3.100 1.850 0.114 0.065 0.118 0.069 0.122 0.073 0.900 1.000 1.100 0.035 0.039 0.043 0 5 0 7 0 9 5 0 0 90 7 Q2 Q3 0 5 50 0 7 70 0 9 90 0 5 50 0 7 70 90 90 Q4 10 30 50 10 30 50 ©Silikron Semiconductor CO., LTD. 2013.3.21 www.silikron.com Version: 2.2 page 3of8 SSBR20100CT/ SSBR20100CTF TO-220 -Option2- TO220 PACKAGE OUTLINE DIMENSION_2 Symbol A A1 A2 b b2 c D D1 DEP E E1 E2 ФP1 e e1 H1 L L1 L2 ФP Q ϴ1 ϴ2 Dimension In Millimeters Min Nom Max 4.400 4.550 4.700 1.270 1.300 1.330 2.350 2.425 2.500 0.770 0.900 1.170 1.360 0.480 0.500 0.520 15.400 15.600 15.800 9.000 9.100 9.200 0.050 0.125 0.200 9.800 10.000 10.200 8.700 9.800 10.000 10.200 1.400 1.500 1.600 2.54BSC 5.08BSC 6.400 6.500 6.600 12.750 13.200 13.650 3.300 2.5REF Dimension In Inches Nom Max 0.179 0.185 0.051 0.052 0.095 0.098 0.035 0.054 0.020 0.020 0.614 0.622 0.358 0.362 0.005 0.008 0.394 0.402 0.343 0.394 0.402 0.059 0.063 0.1BSC 0.2BSC 0.252 0.256 0.260 0.502 0.520 0.537 0.130 0.098REF Min 0.173 0.050 0.093 0.030 0.046 0.019 0.606 0.354 0.002 0.386 0.386 0.055 3.570 2.730 3.600 2.800 3.630 2.870 0.141 0.107 0.142 0.110 0.143 0.113 50 70 90 50 70 90 0 0 0 0 0 1 ©Silikron Semiconductor CO., LTD. 3 5 2013.3.21 www.silikron.com 1 Version: 2.2 3 5 page 0 4of8 SSBR20100CT/ SSBR20100CTF TO-220F -Option1- TO220F PACKAGE OUTLINE DIMENSION_GN ФP1 ФP2 Dimension In Millimeters Min Nom Max 9.960 10.160 10.360 9.840 10.040 10.240 6.800 7.000 7.200 4.600 4.700 4.800 2.440 2.540 2.640 2.660 2.760 2.860 0.600 0.700 0.800 0.500 15.780 15.870 15.980 8.970 9.170 9.370 6.500 6.700 6.800 2.54BSC 3.080 3.180 3.280 1.400 1.500 1.600 0.900 1.000 1.100 ФP3 L L1 L2 Q1 Q2 b1 b2 b3 0.100 12.780 2.970 0.830 o 3 43o 1.180 0.760 - Symbol E E1 E2 A A1 A2 A3 c D D1 H1 e ФP ©Silikron Semiconductor CO., LTD. 0.200 12.980 3.170 0.930 o 5 45o 1.280 0.800 - 0.300 13.180 3.370 1.030 o 7 47o 1.380 0.840 1.420 2013.3.21 www.silikron.com Dimension In Inches Nom 0.400 0.395 0.276 0.185 0.100 0.109 0.028 0.020 0.625 0.361 0.264 0.10BSC 0.121 0.125 0.055 0.059 0.035 0.039 Min 0.392 0.387 0.268 0.181 0.096 0.105 0.024 0.621 0.353 0.256 0.004 0.503 0.117 0.033 o 3 43o 0.046 0.030 - Version: 2.2 0.008 0.511 0.125 0.037 o 5 45o 0.050 0.031 - Max 0.408 0.403 0.283 0.189 0.104 0.113 0.031 0.629 0.369 0.268 0.129 0.063 0.043 0.012 0.519 0.133 0.041 o 7 47o 0.054 0.033 0.056 page 5of8 SSBR20100CT/ SSBR20100CTF TO-220F -Option2- TO220F PACKAGE OUTLINE DIMENSION_2 A A1 A2 A3 b b1 b2 c D E e F Ф h h1 h2 L L1 L2 Min 4.300 2.800 2.500 0.500 1.100 1.500 0.500 9.960 14.800 0.000 28.000 1.700 1.900 Nom 1.300 REF. 2.540 TYP. 2.700 REF. 3.500 REF. 0.800 REF, 0.500 REF. - ©Silikron Semiconductor CO., LTD. Max 4.700 Min 0.169 3.200 2.900 0.750 1.350 1.750 0.750 10.360 15.200 0.110 0.098 0.020 0.043 0.059 0.020 0.392 0.583 0.300 0.000 28.400 1.900 2.100 1.102 0.067 0.075 2013.3.21 www.silikron.com Nom 0.051 REF. 0.100 TYP. 0.106 REF. 0.138 REF. 0.031 REF. 0.020 REF. - Version: 2.2 page Max 0.185 0.126 0.114 0.030 0.053 0.069 0.030 0.408 0.598 0.012 1.118 0.075 0.083 6of8 SSBR20100CT/ SSBR20100CTF Ordering and Marking Information Device Marking: SSBR20100CT & SSBR20100CTF Package (Available) TO-220&TO220F Operating Temperature Range C : -55 to 150 ºC Devices per Unit Package Type Units/ Tubes/Inner Tube Box Units/Inner Box Inner Units/ Boxes/Carton Carton Box Box TO220 TO220F 50 20 1000 6 6000 50 20 1000 6 6000 Reliability Test Program Test Item High Temperature Reverse Bias(HTRB) Conditions Duration Sample Size Tj=125℃ to 150℃ @ 80% of Max VDSS/VCES/VR 168 hours 500 hours 1000 hours 3 lots x 77 devices ©Silikron Semiconductor CO., LTD. 2013.3.21 www.silikron.com Version: 2.2 page 7of8 SSBR20100CT/ SSBR20100CTF ATTENTION: ■ ■ ■ ■ ■ ■ ■ ■ ■ Any and all Silikron products described or contained herein do not have specifications that can handle applications that require extremely high levels of reliability, such as life-support systems, aircraft's control systems, or other applications whose failure can be reasonably expected to result in serious physical and/or material damage. Consult with your Silikron representative nearest you before using any Silikron products described or contained herein in such applications. Silikron assumes no responsibility for equipment failures that result from using products at values that exceed, even momentarily, rated values (such as maximum ratings, operating condition ranges, or other parameters) listed in products specifications of any and all Silikron products described or contained herein. Specifications of any and all Silikron products described or contained herein stipulate the performance, characteristics, and functions of the described products in the independent state, and are not guarantees of the performance, characteristics, and functions of the described products as mounted in the customer’s products or equipment. To verify symptoms and states that cannot be evaluated in an independent device, the customer should always evaluate and test devices mounted in the customer’s products or equipment. Silikron Semiconductor CO.,LTD. strives to supply high-quality high-reliability products. However, any and all semiconductor products fail with some probability. It is possible that these probabilistic failures could give rise to accidents or events that could endanger human lives, that could give rise to smoke or fire, or that could cause damage to other property. When designing equipment, adopt safety measures so that these kinds of accidents or events cannot occur. Such measures include but are not limited to protective circuits and error prevention circuits for safe design, redundant design, and structural design. In the event that any or all Silikron products(including technical data, services) described or contained herein are controlled under any of applicable local export control laws and regulations, such products must not be exported without obtaining the export license from the authorities concerned in accordance with the above law. No part of this publication may be reproduced or transmitted in any form or by any means, electronic or mechanical, including photocopying and recording, or any information storage or retrieval system, or otherwise, without the prior written permission of Silikron Semiconductor CO.,LTD. Information (including circuit diagrams and circuit parameters) herein is for example only ; it is not guaranteed for volume production. Silikron believes information herein is accurate and reliable, but no guarantees are made or implied regarding its use or any infringements of intellectual property rights or other rights of third parties. Any and all information described or contained herein are subject to change without notice due to product/technology improvement, etc. When designing equipment, refer to the "Delivery Specification" for the Silikron product that you intend to use. This catalog provides information as of Dec, 2008. Specifications and information herein are subject to change without notice. Customer Service Worldwide Sales and Service: [email protected] Technical Support: [email protected] Suzhou Silikron Semiconductor Corp. 11A, 428 Xinglong Street, Suzhou Industrial Park, P.R.China TEL: (86-512) 62560688 FAX: (86-512) 65160705 E-mail: [email protected] ©Silikron Semiconductor CO., LTD. 2013.3.21 www.silikron.com Version: 2.2 page 8of8