SSFN2569 Main Product Characteristics: VDSS -20V RDS(on) 55mΩ (typ.) ID -3.4A D1 G1 G2 S1 Bottom View Features and Benefits: S2 Schematic diagram DFN 3x2-8L D2 Advanced MOSFET process technology Special designed for PWM, load switching and general purpose applications Ultra low on-resistance with low gate charge Fast switching and reverse body recovery 150℃ operating temperature Description: It utilizes the latest processing techniques to achieve the high cell density and reduces the on-resistance with high repetitive avalanche rating. These features combine to make this design an extremely efficient and reliable device for use in power switching application and a wide variety of other applications. Absolute max Rating: Symbol Parameter Max. ID @ TC = 25°C Continuous Drain Current, VGS @ 10V① -3.4 IDM Pulsed Drain Current② -17 Power Dissipation③ 1.7 W Linear Derating Factor 0.014 W/°C VDS Drain-Source Voltage -20 V VGS Gate-to-Source Voltage ±8 V -55 to +150 °C PD @TC = 25°C TJ TSTG Operating Junction and Storage Temperature Range Units A Thermal Resistance Symbol Characterizes Typ. Max. Units RθJC Junction-to-case③ — 74 ℃/W RθJA Junction-to-ambient (t ≤ 10s) ④ — 60 ℃/W ©Silikron Semiconductor CO., LTD. 2013.06.07 www.silikron.com Version: 1.0 page 1 of 6 SSFN2569 Electrical Characterizes @TA=25℃ Symbol Parameter V(BR)DSS Drain-to-Source breakdown voltage RDS(on) Static Drain-to-Source on-resistance VGS(th) Gate threshold voltage IDSS Drain-to-Source leakage current IGSS Gate-to-Source forward leakage Qg unless otherwise specified Min. Typ. Max. Units -20 — — V — 55 80 — 78 105 -0.45 — -1.0 — — 1 — — 50 — — 100 — — -100 Total gate charge — 6.5 — Qgs Gate-to-Source charge — 1.1 — Qgd Gate-to-Drain("Miller") charge — 2.2 — td(on) Turn-on delay time — 4.7 — tr Rise time — 10 — td(off) Turn-Off delay time — 28 — tf Fall time — 20 — Ciss Input capacitance — 645 — Coss Output capacitance — 86 — Crss Reverse transfer capacitance — 38 — mΩ V μA nA Conditions VGS = 0V, ID = -250μA VGS=-4.5V,ID = -2.9A VGS=-2.5V,ID = -2.2A VDS = VGS, ID = -250μA VDS = -20V,VGS = 0V TJ = 125℃ VGS =8V VGS = -8V ID =-2.6A, nC VDS=-16V, VGS =-4.5V ns VGS=-4.5V, VDS=-16V, ID = -2.6A,RGEN=2Ω VGS = 0V pF VDS = -16V ƒ = 1MHz Source-Drain Ratings and Characteristics Symbol IS ISM Parameter Continuous Source Current (Body Diode) Pulsed Source Current (Body Diode) Min. Typ. Max. Units — — -3.4 A — — -17 A Conditions MOSFET symbol D showing the integral reverse G p-n junction diode. VSD Diode Forward Voltage — — -1.2 V IS=-1.1A, VGS=0V trr Reverse Recovery Time — 17 — ns TJ = 25°C, IF =1A, Qrr Reverse Recovery Charge — 8.6 — nC di/dt = 100A/μs ©Silikron Semiconductor CO., LTD. 2013.06.07 www.silikron.com Version: 1.0 page 2 of 6 S SSFN2569 Test circuits and Waveforms EAS test circuit: Gate charge test circuit: S Switching time test circuit: Switch Waveforms: Notes: ①Calculated continuous current based on maximum allowable junction temperature. ②Repetitive rating; pulse width limited by max. junction temperature. ③The power dissipation PD is based on max. junction temperature, using junction-to-case thermal resistance. ④The value of RθJA is measured with the device mounted on 1 in 2 FR-4 board with 2oz. Copper, in a still air environment with TA =25°C ©Silikron Semiconductor CO., LTD. 2013.06.07 www.silikron.com Version: 1.0 page 3 of 6 SSFN2569 Mechanical Data: DFN 3X2_8L PACKAGE OUTLINE DIMENSION Symbol A A1 A3 D E b L e Dimension In Millimeters Nom Max 0.750 0.800 0.050 0.200REF 2.950 3.000 3.050 1.950 2.000 2.050 0.250 0.300 0.350 0.280 0.350 0.420 0.650BSC Min 0.700 0.000 ©Silikron Semiconductor CO., LTD. Min 0.028 0.000 0.116 0.077 0.010 0.016 2013.06.07 www.silikron.com Dimension In Inches Nom 0.030 0.008REF 0.118 0.079 0.012 0.014 0.026BSC Version: 1.0 Max 0.031 0.002 0.120 0.081 0.014 0.017 page 4 of 6 SSFN2569 Ordering and Marking Information Device Marking: SSFN2569 Package (Available) DFN3X2-8L Operating Temperature Range C : -55 to 150 ºC Devices per Unit Package Type Units/ Tapes/Inner Tape Box Units/Inner Inner Box Boxes/Carton Box Units/Carton Box DFN3X2-8L 3000 15000 60000 5 4 Reliability Test Program Test Item Conditions Duration Sample Size High Temperature Reverse Bias(HTRB) High Temperature Gate Bias(HTGB) Tj=125℃ or 150℃ @ 80% of Max VDSS/VCES/VR 168 hours 500 hours 1000 hours 3 lots x 77 devices Tj=125℃ or 150℃ @ 100% of Max VGSS 168 hours 500 hours 1000 hours 3 lots x 77 devices ©Silikron Semiconductor CO., LTD. 2013.06.07 www.silikron.com Version: 1.0 page 5 of 6 SSFN2569 ATTENTION: ■ ■ ■ ■ ■ ■ ■ ■ Any and all Silikron products described or contained herein do not have specifications that can handle applications that require extremely high levels of reliability, such as life-support systems, aircraft's control systems, or other applications whose failure can be reasonably expected to result in serious physical and/or material damage. 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Customer Service Worldwide Sales and Service: [email protected] Technical Support: [email protected] Suzhou Silikron Semiconductor Corp. Building 11A Suchun Industrial Square, 428# Xinglong Street, Suzhou P.R. China TEL: (86-512) 62560688 FAX: (86-512) 65160705 E-mail: [email protected] ©Silikron Semiconductor CO., LTD. 2013.06.07 www.silikron.com Version: 1.0 page 6 of 6