SES5VD923-2U - SURGE Components, Inc

Surge Components, Inc.
1. DESCRIPTION
The SES5VD923-2U ESD protector is designed to replace multilayer
varistors (MLVs) in portable applications such as cell phones,
notebook computers, and PDA’s. They feature large cross-sectional
area junctions for conducting high transient currents, offer desirable
electrical characteristics for board level protection, such as fast
response time, lower operating voltage, lower clamping voltage and no
device degradation when compared to MLVs. The SES5VD923-2U
protects sensitive semiconductor components from damage or upset
due to electrostatic discharge (ESD) and other voltage induced
transient events. The SES5VD923-2U is available in a SOD-923
package with working voltages of 5 volt. It gives designer the flexibility
to protect one unidirectional line in applications where arrays are not
practical. Additionally, it may be “ sprinkled” around the board in
applications where board space is at a premium. It may be used to
meet the ESD immunity requirements of IEC 61000-4-2, Level 4
(±15kV air, ±8kV contact discharge)
2. FEATURE
a.
100 Watts peak pulse power (tp=8/20us)
b.
Transient protection for data lines to
IEC 61000-4-2(ESD)±25kV(air),±10kV(contact)
IEC 61000-4-4(EFT) 40A(5/50ns)
IEC 61000-4-5(Lightning) 24A(8/20us)
c.
Small package for use in portable electronics
d.
Suitable replacement for MLV’s in ESD protection applications
e.
Protect one I/O or power line
f.
Low clamping voltage
g.
Stand off voltage : 5V
h.
Low leakage current
i.
Solid-state silicon-avalanche technology
j.
Small body Outline Dimensions: 0.8mm*0.6mm*0.5mm
k.
Equivalent to 0402 package
2
95 East Jefryn Blvd
Deer Park, NY
11729
(631) 595-1818
Surge Components, Inc.
3. APPLICATION
l.
Cell Phone Handsets and Accessories
m. Personal Digital Assistants (PDA’s)
n.
Notebooks, Desktops, and Servers
o.
Portable Instrumentation
p.
Cordless Phones
q.
Digital Cameras
r.
Peripherals
s.
MP3 Players
4. ELECTRICAL CHARACTERISTICS PER LINE@25℃
℃(UNLESS OTHERWISE SPECIFIED)
Parameter
Symbol
Conditions
Min.
Typ.
Max.
Reverse stand-off voltage
VRWM
Reverse Breakdown voltage
VBR
Reverse Leakage Current
IR
Forward voltage
Units
5
V
6.8
7.2
V
VRWM =5V
0.005
1
µA
VF
IF=10mA
0.8
Clamping Voltage
VC
IPP =1A tp=8/20µs
9.0
V
Clamping Voltage
VC
IPP =5A tp=8/20µs
11.0
V
Junction Capacitance
Cj
VR =0V, f =1MHZ
40
55
pF
Junction Capacitance
Cj
VR =2.5V, f =1MHZ
30
40
pF
It =1mA
6.0
5. ABSOLUTE MAXIMUM RATING @25℃
℃
Rating
Symbol
Value
Units
Peak Pulse Power(tp=8/20µs)
PPP
100
W
Lead Soldering temperature
TL
260(10 sec)
℃
Operating Temperature
Tj
-55 to +125
℃
TSTG
-55 to +150
℃
Storage Temperature
3
95 East Jefryn Blvd
Deer Park, NY
11729
(631) 595-1818
Surge Components, Inc.
6.TYPICAL CHARACTERISTICS
4
95 East Jefryn Blvd
Deer Park, NY
11729
(631) 595-1818
Surge Components, Inc.
7. PROTECT PRODUCTS APPLICATIONS INFORMATION
■ Device Connection options
SES5VD923-2U is designed to protect one data, I/O, or power supply line. The device is unidirectional and may be used on
lines where the signal polarity is above ground. The cathode dot should be placed towards the line that is to be protected.
■
Circuit Board Layout recommendations for Suppression of ESD.
Good circuit board layout is critical for the suppression of ESD induced transients. The following guidelines are
recommended:
Place the TVS near the input terminals or connectors to restrict transient coupling
Minimize the path length between the TVS and the protected line.
Minimize all conductive loops including power and ground loops.
The ESD transient return path to ground should be kept as short as possible.
Never run critical signals near board edges.
Use ground planes whenever possible, for multiplayers printed-circuit boards, use ground vias.
Keep parallel signal paths to a minimum.
Avoid running protection conductors in parallel with unprotected conductor.
Minimize all printed-circuit board conductive loops including power and ground loops.
Avoid using shared transient return paths to a common ground point.
5
95 East Jefryn Blvd
Deer Park, NY
11729
(631) 595-1818
Surge Components, Inc.
8.PRODUCT DIMENSION AND PAD SIZE.
NOTES:
1.DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982
2.CONTROLLING DIMENSION: MILLIMETERS.
3.MAXIMUM
LEAD
THICKNESS
INCLUDES
LEAD
FINISH
THICKNESS.MINIMUM LEAD THICKNESS IS THE MINIMUM
THICKNESS OF BASE MATERIAL
DIM
MIN
0.36
0.15
0.07
0.75
0.55
0.95
0.05
A
b
c
D
E
HE
L
6
MILLIMETERS
NOM
MAX
0.40
0.43
0.20
0.25
0.12
0.17
0.80
0.85
0.60
0.65
1.00
1.05
0.10
0.15
MIN
0.014
0.006
0.003
0.030
0.022
0.037
0.002
INCHES
NOM
0.016
0.008
0.005
0.031
0.024
0.039
0.004
MAX
0.017
0.010
0.007
0.033
0.026
0.041
0.006
95 East Jefryn Blvd
Deer Park, NY
11729
(631) 595-1818