Difference among various products of 3822 Group Renesas Technology Corporation Renesas LSI Design Corporation Renesas Solutions Corporation Products effected - Emulator MCU M38227RFS - One-time PROM version M38223E4FP/GP/HP, M38227ECFP/HP - Mask ROM version Standard version M38222M2-XXXFP/GP/HP, M38223M4-XXXFP/GP/HP - Mask ROM version M version M38223M4MXXXFP/GP/HP, M38224M6MXXXFP/HP - Mask ROM version H version M38223M4HXXXFP/HP, M38224M6HXXXFP/HP, M38227M8HXXXFP/HP, M38227MCHXXXFP/HP, M38227MCDXXXFP - Mask ROM version A version M38223M4A-XXXFP/HP, M38224M6A-XXXFP/HP, M38227M8A-XXXFP/HP, M38227MCA-XXXFP/HP Precaution - When Mask ROM version, One-time PROM version and memory size differ in one group, actual values such as an electrical characteristics, operation margin, A-D conversion accuracy, noise immunity, and noise radiation may differ from the ideal values due to the difference in the manufacturing processes. When these products are used switching, perform system evaluation for each product of every after confirming product specification. - This document shows difference, some specifications and standards, not for all. Be sure to refer to the most current data sheet as for the latest detailed specification and an electrical characteristics. Code : Difference of 3822 Group Rev. 2.00 Date : Sep.8, 2003 Page : 2 of 12 1. Difference among various products of 3822 Group ROM/RAM size[byte] Mask ROM version (Standard version) One-time PROM version Mask ROM version (M version) Mask ROM version (H version) Mask ROM version (A version) 8K/384,16K/512,48K/1K 16K/512,24K/640 16K/512, 24K/640, 32K/1K, 48K/1K 16K/512, 24K/640, 32K/1K, 48K/1K M38223M4M : 80P6N, 80P6Q, 80P6S M38224M6M:80P6N,80P6Q 80P6N,80P6Q Å M38223E4 : 80P6N, 80P6Q, 80P6S M38227EC:80P6N,80P6Q Package Oscillation circuit constants Hysteresis characteristics (See 3.section) The oscillation circuit constants of XIN-XOUT, XCIN-XCOUT will depend on each product. Almost fixed Circuit structure of the peripheral function input pins Vpp power supply pin connection (P40) Absolute Maximum ratings Power source voltage(Vcc) Output voltage at segment output Serial resistor (5kΩ) is necessary.Make the length of Serial resistor is unnecessary. wiring which is connected to the Vpp pin as short as possible. It protects input noise. Å Å -0.3V to 7.0V Å -0.3V to 6.5V Å -0.3V to VL3+0.3V Å -0.3V to VL3 Å See 6.section Power supply(Vcc) / Main-clock input oscillation frequency Timer X,Y input frequency (Max.) f(CNTR0),f(CNTR1) Å See 4.section Power source current RAM retention voltage (Min.) It depends on the power supply and becomes narrow. Å See 7.1. and 7.2. section 2.0V Å 2.5<=Vcc<=4.0V : (2 x Vcc - 4) MHz 4.0<=Vcc<=5.5V : 4 MHz 1.8V Å 2.2<=Vcc<=4.0V : (10 x Vcc - 4)/9 MHz 4.0<=Vcc<=5.5V : 4 MHz 2.0<=Vcc<=4.0V : (Vcc) MHz 4.0<=Vcc<=5.5V : 4 MHz absolute accuracy of A-D converter See 7.2. section LCD display circuit See 5.1. section 1.8<=Vcc<=2.0V : ( 5 x Vcc - 8) MHz 2.0<=Vcc<=4.0V : (Vcc) MHz 4.0<=Vcc<=4.5V : (2 x Vcc - 4) MHz 4.5<=Vcc<=5.5V : 5 MHz Code : Difference of 3822 Group Rev. 2.00 Date : Sep.8, 2003 Page : 3 of 12 2. Oscillation circuit constants The oscillation circuit constants of XIN-XOUT, XCIN-XCOUT will depend on each product of Mask ROM version (Standard version, M version, H version, A version) and One-time PROM version. So that the product used for mass production obtains the stabilized operation clock on the user system and its condition, contact the resonator manufacturer and select the resonator and oscillation circuit constants. Be careful especially when range of voltage and temperature is wide. We recommend to design the circuit in consideration of the wiring pattern of the feed-back resistor, the dumping resistor and the load capacity in advance. We publish the reference-use oscillation circuit parameters in Renesas Technology home page. http://www.renesas.com/en/38000 Code : Difference of 3822 Group Rev. 2.00 Date : Sep.8, 2003 Page : 4 of 12 3. Hysteresis characteristic (VIL) Conventional type (VIH) Conventional type (VIL) New type (VIH) New type VIH/VIL[V] 3.5 Conventional type 3.0 Conventional type 2.5 Emulator MCU O One-time PROM version O Standard version 2.0 1.5 Mask ROM M version version H version 1.0 A version New type O O O O NEW type 0.5 0.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 Power source voltage [V] 5.0 5.5 Note: Data described here are characteristic examples. The data values are not guaranteed. Code : Difference of 3822 Group Rev. 2.00 Date : Sep.8, 2003 Page : 5 of 12 4. Circuit structure of the peripheral function input pins Type A : Input level of port does not always correspond with it of the peripheral function input pin. Direction register Pxi Data bus Type B : Input level of port corresponds with it of the peripheral function input pin. (The port input also has hysteresis.) Port latch Peripheral function input Type A Type A O One-time PROM version O Standard version Direction register Pxi Data bus Emulator MCU Port latch Mask ROM M version version H version O O A version Peripheral function input Type B Type B O O Pins ; P20 to P27, P42/INT0, P43/INT1, P44/RXD, P46/SCLK, P50/INT2, P51/INT3, P54/CNTR0, P55/CNTR1, P57/ADT Code : Difference of 3822 Group Rev. 2.00 Date : Sep.8, 2003 Page : 6 of 12 5.1. LCD display circuit type Data bus LCDCK asynchronous type LCDRAM Address 004016 Segment driver SEG0 Segment driver SEG1 LCDRAM write signal LCDCK asynchronous type block diagram COM2 COM1 COM3 COM0 LCDCK asynchronous type VL3 SEG0 Address 004016 Lower = 00112 VSS LCDCK LCDRAM write signal Lower 00012 Emulator MCU O One-time PROM version O Standard version O M version O Lower 00102 Lower 00112 Lower 00112 LCDCK asynchronous type Example of SEG output waveform by LCDRAM writing timing (1/3 bias, 4 duty) LCDCK synchronous type Mask ROM version Data bus LCDRAM Address 004016 LCDRAM write signal COM3 SEG0 Address 004016 Lower = 00112 synchronous circuit Segment driver SEG0 H version synchronous circuit Segment driver SEG1 A version LCDCK synchronous type O O Synchronous signal:LCDCK Figure 1:Synchronous type block diagram COM2 COM1 COM0 VL3 Waveform No change Turn off for 4 LCDCK cycles VSS LCDCK LCDRAM write signal Lower 00012 Lower 00112 Lower 00102 Lower 00112 Figure 2:Synchronous type Example of SEG output waveform by LCDRAM writing timing (1/3 bias , 4 duty) Code : Difference of 3822 Group Rev. 2.00 Date : Sep.8, 2003 Page : 7 of 12 5.2. LCD power supply pins M38223E4 VL3 falling voltage =2.2V M38227EC M38224M6H VL3 falling voltage =2.2V M38224M6A VL3 falling voltage =2.5V VL3 falling voltage =1.4V VL3 Note: Data described here are characteristic examples. The data values are not guaranteed. <Measure condition> VL3 -Only SEG exclusive pins output the LCD drive waveform. -PORT pins shared with LCD outputs are selected as PORT function. -COM and SEG pins are open.(No load) SEG0 -All data of LCDRAM is 55h. Voltage falling occurs in every LCDCK cycle (1)Shorten the wiring pattern in right diagram. (2)Connect condensers to the LCD power supply pin and Vss with the shortest possible wiring to steady voltage level. (reference value:0.1µF to 0.33µF). VL3 measurement point 5.0V 360Ω M3822X VL3 4.98V(Note) 36kΩ VL2 3.32V(Note) 36kΩ VL1 1.66V(Note) 36kΩ Note: Theoretical voltage value Code : Difference of 3822 Group Rev. 2.00 Date : Sep.8, 2003 Page : 8 of 12 6. Electrical characteristics (Power source current) Symbol Parameter Icc Power source current Test conditions Mask ROM ver. Mask ROM (Standard, M, H ver.) ver. One-time PROM ver. (A ver.) Unit Typ. Max. Typ. Max. High-speed mode, Vcc = 5V, f(XIN) = 10MHz, f(XCIN) = 32.768kHz Output transistors “off”, A-D converter in operating - - 5.0 10 mA High-speed mode, Vcc = 5V, f(XIN) = 8MHz, f(XCIN) = 32.768 kHz Output transistors “off”, A-D converter in operating 6.4 13 3.0 6.0 mA High-speed mode, Vcc = 5V, f(XIN) = 8MHz (in WIT state), f(XCIN) = 32.768kHz, Output transistors “off”, A-D converter stop 1.6 3.2 0.8 1.6 mA Low-speed mode, Vcc = 5V, Ta =< 55°C, f(XIN) = stopped f(XCIN) = 32.768kHz, Output transistors “off” 25 36 13 26 µA Low-speed mode, Vcc = 5V, Ta =25°C, f(XIN) = stopped f(XCIN) = 32.768kHz(in WIT state), Output transistors “off” 7.0 14 5.5 11 µA Low-speed mode, Vcc = 3V, Ta =< 55°C, f(XIN) = stopped f(XCIN) = 32.768kHz, Output transistors “off” 15 22 8 16 µA Low-speed mode, Vcc = 3V, Ta =25°C, f(XIN) = stopped f(XCIN) = 32.768kHz(in WIT state), Output transistors “off” 4.5 9.0 4.0 8.0 µA All oscillation stopped (in STP state), Ta =25°C, Output transistors “off” 0.1 1.0 0.1 1.0 µA All oscillation stopped (in STP state), Ta =85°C, Output transistors “off” - 10 - 10 µA Code : Difference of 3822 Group Rev. 2.00 Date : Sep.8, 2003 Page : 9 of 12 Memo Code : Difference of 3822 Group Rev. 2.00 Date : Sep.8, 2003 Page : 10 of 12 7.1. Internal-clock vs. Vcc (Except A-D converter) : Mask ROM version (A ver.) : Mask ROM version (H ver.) : Mask ROM version (M ver.) : Mask ROM version (Standard ver.) One-time PROM version (2xVcc)-4 5MHz Internal system clock Φ Vcc 4MHz (10xVcc-4)/9 2MHz 1MHz 0.75MHz 2.2V 2.5V 1.8V 2.0V 4.0V 4.5V Code : Difference of 3822 Group Rev. 2.00 Date : Sep.8, 2003 5.5V Vcc Page : 11 of 12 7.2. External-clock vs. Vcc (A-D converter in operating) : Mask ROM version (A ver.) : Mask ROM version (H ver.) : Mask ROM version (Standard, M ver.) 2LSB One-time PROM version 3LSB 10MHz (4xVcc)-8 2xVcc f(XIN) 8MHz 4.4MHz (12xVcc)-22 2MHz 500kHz 2.0V 2.2V 3.0V 4.0V 4.5V 5.0V 5.5V Vcc Code : Difference of 3822 Group Rev. 2.00 Date : Sep.8, 2003 Page : 12 of 12 To our customers, Old Company Name in Catalogs and Other Documents On April 1st, 2010, NEC Electronics Corporation merged with Renesas Technology Corporation, and Renesas Electronics Corporation took over all the business of both companies. 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