RENESAS 3850_05

3850 Group (Spec.A)
Standard characteristics
1 Standard characteristics
Standard characteristics described below are just examples of the 3850 Group (spec. A)’s characteristics
and are not guaranteed. For rated values, refer to “3.1 Electrical characteristics” of Datasheet.
1.1 Flash memory version power source current standard characteristics
Figure. 1 to Figure. 7 show flash memory version (M38507F8A) power source current standard characteristics.
Measuring conditions : 25 °C, f(X IN) = 12.5 MHz, in high-speed mode
Power source current Icc[mA]
12.0
10.0
Standard mode
8.0
Standard mode
Wait mode
6.0
4.0
Wait mode
2.0
0.0
2.0
2.5
3.0
3.5
4.0
4.5
5.0
5.5
Power source volage Vcc[V]
Fig. 1
Flash memory version power source current standard characteristics (in high-speed mode,
f(X IN) = 12.5 MHz)
Measuring conditions : 25 °C, f(X IN) = 8 MHz, in high-speed mode
Power source current Icc [mA]
12.0
10.0
8.0
6.0
Standard mode
Wait mode
Standard mode
4.0
2.0
Wait mode
0.0
2.0
2.5
3.0
3.5
4.0
4.5
5.0
5.5
Power source voltage Vcc[V]
Fig. 2
Flash memory version power source current standard characteristics (in high-speed mode,
f(X IN) = 8 MHz)
REJ99B1073-0100/Rev1.00
November 2005
Page 1 of 18
3850 Group (Spec.A)
Standard characteristics
Measuring conditions : 25 °C, f(X IN) = 4 MHz, in high-speed mode
Power source current Icc[mA]
12.0
10.0
8.0
Standard mode
Wait mode
6.0
4.0
Standard mode
Wait mode
2.0
0.0
2.0
2.5
3.0
3.5
4.0
4.5
5.0
5.5
Power source voltage Vcc[V]
Fig. 3
Flash memory version power source current standard characteristics (in high-speed mode,
f(X IN) = 4 MHz)
Measuring conditions : 25 °C, f(X IN) = 12.5 MHz, in middle-speed mode
Power source current Icc[mA]
5.0
4.0
3.0
Standard mode
Standard mode
Wait mode
2.0
1.0
Wait mode
0.0
2.0
2.5
3.0
3.5
4.0
4.5
5.0
5.5
Power source voltage Vcc[V]
Fig. 4
Flash memory version power source current standard characteristics (in middle-speed mode,
f(X IN) = 12.5 MHz)
REJ99B1073-0100/Rev1.00
November 2005
Page 2 of 18
3850 Group (Spec.A)
Standard characteristics
Measuring conditions : 25 °C, f(X IN) = 8 MHz, in middle-speed mode
Power source current Icc[mA]
5.0
4.0
3.0
Standard mode
Wait mode
Standard mode
2.0
1.0
Wait mode
0.0
2.0
2.5
3.0
3.5
4.0
4.5
5.0
5.5
Power source voltage Vcc[V]
Fig. 5
Flash memory version power source current standard characteristics (in middle-speed mode,
f(X IN) = 8 MHz)
Measuring conditions : 25 °C, f(X IN) = 4 MHz, in middle-speed mode
Power source current Icc[mA]
5.0
4.0
3.0
Standard mode
Wait mode
2.0
Standard mode
1.0
Wait mode
0.0
2.0
2.5
3.0
3.5
4.0
4.5
5.0
5.5
Power source voltage Vcc[V]
Fig. 6
Flash memory version power source current standard characteristics (in middle-speed mode,
f(X IN) = 4 MHz)
REJ99B1073-0100/Rev1.00
November 2005
Page 3 of 18
3850 Group (Spec.A)
Standard characteristics
Measuring conditions : 25 °C, f(X IN) = 32 kHz, in low-speed mode
Power source current Icc [µ
µ A]
µ
250
200
Standard mode
150
Standard mode
Wait mode
100
50
Wait mode
0
2.0
2.5
3.0
3.5
4.0
Power source voltage Vcc [V]
4.5
5.0
5.5
Fig. 7 Flash memory version power source current standard characteristics (in low-speed mode)
REJ99B1073-0100/Rev1.00
November 2005
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3850 Group (Spec.A)
Standard characteristics
1.2 Mask ROM version power source current standard characteristics
Figure. 8 – Figure. 14 show mask ROM version (M38503M2A, M38503M4A, M38504M6A, M38507M8A)
power source current standard characteristics.
Measuring conditions : 25 °C, f(X IN) = 12.5 MHz, in high-speed mode
Power source current Icc [mA]
6.0
5.0
Standard mode
4.0
Standard mode
Wait mode
3.0
2.0
Wait mode
1.0
0.0
3.0
3.5
4.0
4.5
5.0
5.5
Power source voltage Vcc[V]
Fig. 8
Mask ROM version power source current standard characteristics (in high-speed mode,
f(X IN) = 12.5 MHz)
Measuring conditions : 25 °C, f(XIN) = 8 MHz, in high-speed mode
Power source current Icc [mA]
6.0
5.0
4.0
Standard mode
Standard mode
Wait mode
3.0
2.0
Wait mode
1.0
0.0
2
2.5
3
3.5
4
4.5
5
5.5
Power source voltage Vcc[V]
Fig. 9
Mask ROM version power source current standard characteristics (in high-speed mode,
f(X IN) = 8 MHz)
REJ99B1073-0100/Rev1.00
November 2005
Page 5 of 18
3850 Group (Spec.A)
Standard characteristics
Measuring conditions : 25 °C, f(X IN) = 4 MHz, in high-speed mode
Power source current Icc [mA]
6.0
5.0
4.0
Standard mode
Wait mode
3.0
Standard mode
2.0
Wait mode
1.0
0.0
2.0
2.5
3.0
3.5
4.0
4.5
5.0
5.5
Power source voltage Vcc[V]
Fig. 10 Mask ROM version power source current standard characteristics (in high-speed mode,
f(X IN) = 4 MHz)
Measuring conditions : 25 °C, f(XIN) = 12.5 MHz, in middle-speed mode
Power source current Icc [mA]
4.0
3.0
2.0
Standard mode
Wait mode
Standard mode
1.0
Wait mode
0.0
2.0
2.5
3.0
3.5
4.0
4.5
5.0
5.5
Power source voltage Vcc[V]
Fig. 11 Mask ROM version power source current standard characteristics (in middle-speed mode,
f(X IN) = 12.5 MHz)
REJ99B1073-0100/Rev1.00
November 2005
Page 6 of 18
3850 Group (Spec.A)
Standard characteristics
Measuring conditions : 25 °C, f(X IN) = 8 MHz, in middle-speed mode
Power source current Icc [mA]
4.0
3.0
Standard mode
Wait mode
2.0
Standard mode
1.0
Wait mode
0.0
2.0
2.5
3.0
3.5
4.0
4.5
5.0
5.5
Power source voltage Vcc[V]
Fig. 12 Mask ROM version power source current standard characteristics (in middle-speed mode,
f(X IN) = 8 MHz)
Measuring conditions : 25 °C, f(X IN) = 4 MHz, in middle-speed mode
Power source current Icc [mA]
4.0
3.0
Standard mode
Wait mode
2.0
Standard mode
1.0
Wait mode
0.0
2.0
2.5
3.0
3.5
4.0
4.5
5.0
5.5
Power source voltage Vcc[V]
Fig. 13 Mask ROM version power source current standard characteristics (in middle-speed mode,
f(X IN) = 4 MHz)
REJ99B1073-0100/Rev1.00
November 2005
Page 7 of 18
3850 Group (Spec.A)
Standard characteristics
Measuring conditions : 25 °C, f(X IN) = 32 kHz, in low-speed mode
35
Power source current Icc [µA]
30
25
20
Standard mode
Wait mode
Standard mode
15
10
Wait mode
5
0
2.0
2.5
3.0
3.5
4.0
4.5
5.0
5.5
Power source voltage Vcc [V]
Fig. 14 Mask ROM version power source current standard characteristics (in low-speed mode)
REJ99B1073-0100/Rev1.00
November 2005
Page 8 of 18
3850 Group (Spec.A)
Standard characteristics
1.3 Flash memory version port standard characteristics
Figure. 15, Figure. 16, Figure. 17 and Figure. 18 show flash memory version (M38507F8A) port standard
characteristics.
Port P00 IOH-VOH characteristics (P-channel drive) [Ta = 25 °C]
(Same characteristics pins : P0, P1, P20, P21, P24–P27, P3, P4)
–50
–45
–40
–35
Vcc = 5.0 V
IOH –30
[mA] –25
Vcc = 4.0 V
–20
–15
Vcc = 2.7 V
–10
–5
0
0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
4.0
4.5
5.0
5.5
VOH [V]
Fig. 15 CMOS output port P-channel side characteristics (Ta = 25 °C)
Port P00 IOL-VOL characteristics (N-channel drive) [Ta = 25 °C]
(Same characteristics pins : P0, P20, P21, P24–P27, P3, P4)
50
Vcc=5.0V
45
40
35
IOL
[mA]
Vcc=4.0V
30
25
20
Vcc=2.7V
15
10
5
0
0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
4.0
4.5
5.0
5.5
VOL
Fig. 16 CMOS output port N-channel side characteristics (Ta = 25 °C)
REJ99B1073-0100/Rev1.00
November 2005
Page 9 of 18
3850 Group (Spec.A)
Standard characteristics
Port P22 IOL-VOL characteristics (N-channel drive) [Ta = 25 °C]
(Same characteristics pins : P22, P23)
50
45
Vcc=5.0V
40
35
IOL
[mA]
30
Vcc=4.0V
25
20
15
Vcc=2.7V
10
5
0
0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
4.0
4.5
5.0
5.5
VOL
Fig. 17 N-channel open-drain output port N-channel side characteristics (Ta = 25 °C)
Port P17 IOL-VOL characteristics (N-channel drive) [Ta = 25 °C]
(Same characteristics pins : P1)
100
90
Vcc = 5 V
80
70
IOL
[mA]
60
Vcc = 4.0 V
50
40
30
Vcc = 2.7 V
20
10
0
0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
4.0
4.5
5.0
5.5
VOL [V]
Fig. 18 CMOS large current output port N-channel side characteristics (Ta = 25 °C)
REJ99B1073-0100/Rev1.00
November 2005
Page 10 of 18
3850 Group (Spec.A)
Standard characteristics
1.4 Mask ROM version port standard characteristics
Figure. 19, Figure. 20, Figure. 21 and Figure. 22 show mask ROM version (M38503M2HA, M38503M4HA,
M38504M6A, M38507M8A) port standard characteristics.
Port P00 IOH -V OH characteristics (P-channel drive) [Ta = 25 °C]
(Same characteristics pins : P0, P1, P2 0, P21 , P24 -P27 , P3, P4)
-50
-45
Vcc=5.0V
-40
IOH [mA]
-35
Vcc=4.0V
-30
-25
-20
Vcc=2.7V
-15
-10
-5
0
0
0.5
1
1.5
2
2.5
3
3.5
4
4.5
5
5.5
VOH [V]
Fig. 19 CMOS output port P-channel side characteristics (Ta = 25 °C)
Port P0 0 I OL-V OL characteristics (N-channel drive) [Ta = 25 °C]
(Same characteristics pins : P0, P2 0, P21 , P24 -P27 , P3, P4)
50
45
40
Vcc=5.0V
35
IOL [mA]
30
Vcc=4.0V
25
20
Vcc=2.7V
15
10
5
0
0
0.5
1
1.5
2
2.5
3
3.5
4
4.5
5
5.5
VOL [V]
Fig. 20 CMOS output port N-channel side characteristics (Ta = 25 °C)
REJ99B1073-0100/Rev1.00
November 2005
Page 11 of 18
3850 Group (Spec.A)
Standard characteristics
Port P22 IOL-V OL characteristics (N-channel drive) [Ta = 25 °C]
(Same characteristics pins : P2 2, P2 3)
50
45
40
Vcc=5.0V
35
IOL [mA]
30
Vcc=4.0V
25
20
Vcc=2.7V
15
10
5
0
0
0.5
1
1.5
2
2.5
3
3.5
4
4.5
5
5.5
VOL [V]
Fig. 21 N-channel open-drain output port N-channel side characteristics (Ta = 25 °C)
Port P10 IOL-V OL characteristics (N-channel drive) [Ta = 25 °C]
(Same characteristics pins : P1)
100
90
80
70
Vcc=5.0V
IOL [mA]
60
50
Vcc=4.0V
40
30
Vcc=2.7V
20
10
0
0
0.5
1
1.5
2
2.5
3
3.5
4
4.5
5
5.5
VOL [V]
Fig. 22 CMOS large current output port N-channel side characteristics (Ta = 25 °C)
REJ99B1073-0100/Rev1.00
November 2005
Page 12 of 18
3850 Group (Spec.A)
Standard characteristics
1.5 A-D conversion standard characteristics
(1) Definition of A-D conversion accuracy
The A-D conversion accuracy is defined below.
●Relative accuracy
➀ Zero transition voltage (V0T)
This means an analog input voltage when the actual A-D conversion output data changes from “0”
to “1”.
➁ Full-scale transition voltage (VFST)
This means an analog input voltage when the actual A-D conversion output data changes from
“1023” to “1022”.
➂ Linearity error
This means a deviation from the lone between V0T and VFST of a converted value between V0T and
VFST.
➃ Differential non-linearity error
This means a deviation from the input potential difference required to change a converted value
between V 0T and V FST by 1 LSB of the 1 LSB at the relative accuracy.
●Absolute accuracy
This means a deviation from the ideal characteristics between 0 to V REF of actual A-D conversion
characteristics.
Output data
Full-scale transition voltage (VFST)
1023
1022
b
a
n+1
n
Actual A-D conversion
characteristics
c
Ideal line of A-D
conversion between
V0 to V1022
1
0
Vn
V0
V1
Zero transition voltage (V0T)
V1022
VREF
Analog voltage
Differential non-linearity error = b-a
a [LSB]
c
Linearity error = a [LSB]
1 LSB at relative accuracy =
Vn+1
VFST-V0T
1 LSB at absolute accuracy =
1022
VREF
1024
Vn : Analog input voltage when the output data changes
from “n” to “n + 1” (n = 0 to 1022)
a : 1 LSB at relative accuracy
b : Vn+1 –Vn
c : Difference between the aideal Vn and actual Vn
[LSB]
[LSB]
Fig. 23 Definition of A-D conversion accuracy
REJ99B1073-0100/Rev1.00
November 2005
Page 13 of 18
3850 Group (Spec.A)
Standard characteristics
(2) A-D conversion standard characteristics
Figure. 24 – Figure. 27 show the A-D conversion standard characteristics of flash memory version,
mask ROM version, and PROM version, respectively.
The thick lines of the graph indicate the absolute precision errors, These are expressed as the
deviation from the ideal value when the output code changes. For example, the change in output
code from 256 to 257 should occur at 1280 mV, but the measured value is 2.5 mV. Accordingly, the
measured point of change is 1280 + 2.5 = 1282.5 mV.
The thin lines of the graph indicate the input voltage width for which the output code is constant. For
example, the measured input voltage width for which the output code is 256 is 5.0 mV, so that the
differential non-linear error is 5.0 – 5.0 = 0 mV (0 LSB).
REJ99B1073-0100/Rev1.00
November 2005
Page 14 of 18
3850 Group (Spec.A)
Standard characteristics
38507F8A A-D CONV. ERROR & STEP WIDTH
= 5.12 [V] : VREF = 5.12 [V]
= 12 [MHz] : Ta = 25 [deg.]
Zero transition voltage
Full-scale transition voltage
Differential non-linearity error
Linearity error
Absolute accuracy
:
7. 188 [mV]
: 5122. 500 [mV]
:
-3. 911 [mV]
:
6. 245 [mV]
: 11. 562 [mV]
-. 781 [LSB]
1. 248 [LSB]
2. 312 [LSB]
Error
1LSB Width (Absolute accuracy error)
ERROR/1LSB WIDTH (mV)
15
10
5
0
-5
-10
-15
0
16
32
48
64
80
96
112
304
320
336
352
368
128
STEP No.
144
160
176
192
208
224
240
256
400
416
432
448
464
480
496
512
656
672
688
704
720
736
752
768
912
928
944
960
976
992
1008
1024
)
ERROR/1LSB WIDTH (mV)
15
(
10
5
0
-5
-10
-15
256
272
288
384
15
)
ERROR/1LSB WIDTH (mV)
STEP No.
(
10
5
0
-5
-10
-15
512
528
544
560
576
592
608
624
640
15
)
ERROR/1LSB WIDTH (mV)
STEP No.
O /
S
(
10
5
0
-5
-10
-15
768
784
800
816
832
848
864
880
896
STEP No.
Fig. 24 Flash memory version (M38507F8A) A-D conversion standard characteristics (X IN=12MHz)
REJ99B1073-0100/Rev1.00
November 2005
Page 15 of 18
3850 Group (Spec.A)
Standard characteristics
M38507F8A A-D CONVERTER ERROR & STEP WIDTH MEASUREMENT
VCC = 5.12 [V], VREF = 5.12 [V]
XIN = 8 [MHz], Ta = 25 [deg.]
ERROR/1LSB WIDTH (mV)
Zero transition voltage
Full-scale transition voltage
Differential non-linearity error
Linearity error
Absolute accuracy
:
10.625 [mV]
: 5122.812 [mV]
:
1.719 [mV]
:
–5.659 [mV]
:
8.906 [mV]
: 0.344 [LSB]
: –1.131 [LSB]
: 1.781 [LSB]
: Error (Absolute accuracy error)
: 1LSB Width
15.0
10.0
5.0
0.0
–5.0
–10.0
–15.0
0
16
32
48
64
80
96
112
128
144
160
176
192
208
224
240
256
416
432
448
464
480
496
512
672
688
704
720
736
752
768
928
944
960
976
992
1008 1024
ERROR/1LSB WIDTH (mV)
STEP No.
15.0
10.0
5.0
0.0
–5.0
–10.0
–15.0
256
272
288
304
320
336
352
368
384
400
ERROR/1LSB WIDTH (mV)
STEP No.
15.0
10.0
5.0
0.0
–5.0
–10.0
–15.0
512
528
544
560
576
592
608
624
640
656
ERROR/1LSB WIDTH (mV)
STEP No.
15.0
10.0
5.0
0.0
–5.0
–10.0
–15.0
768
784
800
816
832
848
864
880
896
912
STEP No.
Fig. 25 Flash memory version (M38507F8A) A-D conversion standard characteristics (X IN=8MHz)
REJ99B1073-0100/Rev1.00
November 2005
Page 16 of 18
3850 Group (Spec.A)
Standard characteristics
M38503M2A, M38503M4A, M38504M6A, M38507M8A A-D CONV. ERROR & STEP WIDTH
Vcc = 5. 12 [V] : VREF = 5. 12 [V]
XIN
= 12 [MHz] : Ta = 25 [deg.]
Zero transition voltage
Full-scale transition voltage
Differential non-linearity error
Linearity error
Absolute accuracy
:
:
:
:
:
-2500 [mV]
5110. 000 [mV]
-4. 846 [mV]
11. 411 [mV]
-7. 500 [mV]
-. 969 [LSB]
-2. 281 [LSB]
-1. 500 [LSB]
Error
1LSB Width (Absolute accuracy error)
ERROR/1LSB WIDTH (mV)
20
15
10
5
0
-5
-10
-15
-20
0
16
32
48
64
80
96
112
128
144
160
176
192
208
224
240
256
400
416
432
448
464
480
496
512
656
672
688
704
720
736
752
768
912
928
944
960
976
992
1008
1024
STEP No.
ERROR/1LSB WIDTH (mV)
20
15
10
5
0
-5
-10
-15
-20
256
272
288
304
320
336
352
368
384
STEP No.
ERROR/1LSB WIDTH (mV)
20
15
10
5
0
-5
-10
-15
-20
512
528
544
560
576
592
608
624
640
STEP No.
ERROR/1LSB WIDTH (mV)
20
15
10
5
0
-5
-10
-15
-20
768
784
800
816
832
848
864
880
896
STEP No.
Fig. 26 Mask ROM version (M38503M2A, M38503M4A, M38504M6A, M38507M8A) A-D conversion standard
characteristics (X IN=12MHz)
REJ99B1073-0100/Rev1.00
November 2005
Page 17 of 18
3850 Group (Spec.A)
Standard characteristics
M38503M2A, M38503M4A, M38504M6A, M38507M8A A-D CONV. ERROR & STEP WIDTH
Vcc = 5. 12 [V] : VREF = 5. 12 [V]
XIN
= 8 [MHz] : Ta = 25 [deg.]
Zero transition voltage
Full-scale transition voltage
Differential non-linearity error
Linearity error
Absolute accuracy
:
:
:
:
:
11. 250 [mV]
5119. 375 [mV]
-3. 592 [mV]
-8. 252 [mV]
6. 250 [mV]
-. 719 [LSB]
-1. 651 [LSB]
1. 250 [LSB]
Error
1LSB Width (Absolute accuracy error)
ERROR/1LSB WIDTH (mV)
20
15
10
5
0
-5
-10
-15
-20
0
16
32
48
64
80
96
112
128
144
160
176
192
208
224
240
256
400
416
432
448
464
480
496
512
656
672
688
704
720
736
752
768
912
928
944
960
976
992
1008
1024
STEP No.
ERROR/1LSB WIDTH (mV)
20
15
10
5
0
-5
-10
-15
-20
256
272
288
304
320
336
352
368
384
STEP No.
ERROR/1LSB WIDTH (mV)
20
15
10
5
0
-5
-10
-15
-20
512
528
544
560
576
592
608
624
640
STEP No.
ERROR/1LSB WIDTH (mV)
20
15
10
5
0
-5
-10
-15
-20
768
784
800
816
832
848
864
880
896
STEP No.
Fig. 27 Mask ROM version (M38503M2A, M38503M4A, M38504M6A, M38507M8A) A-D conversion standard
characteristics (X IN=8MHz)
REJ99B1073-0100/Rev1.00
November 2005
Page 18 of 18
To our customers,
Old Company Name in Catalogs and Other Documents
On April 1st, 2010, NEC Electronics Corporation merged with Renesas Technology
Corporation, and Renesas Electronics Corporation took over all the business of both
companies. Therefore, although the old company name remains in this document, it is a valid
Renesas Electronics document. We appreciate your understanding.
Renesas Electronics website: http://www.renesas.com
April 1st, 2010
Renesas Electronics Corporation
Issued by: Renesas Electronics Corporation (http://www.renesas.com)
Send any inquiries to http://www.renesas.com/inquiry.
Notice
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All information included in this document is current as of the date this document is issued. Such information, however, is
subject to change without any prior notice. Before purchasing or using any Renesas Electronics products listed herein, please
confirm the latest product information with a Renesas Electronics sales office. Also, please pay regular and careful attention to
additional and different information to be disclosed by Renesas Electronics such as that disclosed through our website.
Renesas Electronics does not assume any liability for infringement of patents, copyrights, or other intellectual property rights
of third parties by or arising from the use of Renesas Electronics products or technical information described in this document.
No license, express, implied or otherwise, is granted hereby under any patents, copyrights or other intellectual property rights
of Renesas Electronics or others.
You should not alter, modify, copy, or otherwise misappropriate any Renesas Electronics product, whether in whole or in part.
Descriptions of circuits, software and other related information in this document are provided only to illustrate the operation of
semiconductor products and application examples. You are fully responsible for the incorporation of these circuits, software,
and information in the design of your equipment. Renesas Electronics assumes no responsibility for any losses incurred by
you or third parties arising from the use of these circuits, software, or information.
When exporting the products or technology described in this document, you should comply with the applicable export control
laws and regulations and follow the procedures required by such laws and regulations. You should not use Renesas
Electronics products or the technology described in this document for any purpose relating to military applications or use by
the military, including but not limited to the development of weapons of mass destruction. Renesas Electronics products and
technology may not be used for or incorporated into any products or systems whose manufacture, use, or sale is prohibited
under any applicable domestic or foreign laws or regulations.
Renesas Electronics has used reasonable care in preparing the information included in this document, but Renesas Electronics
does not warrant that such information is error free. Renesas Electronics assumes no liability whatsoever for any damages
incurred by you resulting from errors in or omissions from the information included herein.
Renesas Electronics products are classified according to the following three quality grades: “Standard”, “High Quality”, and
“Specific”. The recommended applications for each Renesas Electronics product depends on the product’s quality grade, as
indicated below. You must check the quality grade of each Renesas Electronics product before using it in a particular
application. You may not use any Renesas Electronics product for any application categorized as “Specific” without the prior
written consent of Renesas Electronics. Further, you may not use any Renesas Electronics product for any application for
which it is not intended without the prior written consent of Renesas Electronics. Renesas Electronics shall not be in any way
liable for any damages or losses incurred by you or third parties arising from the use of any Renesas Electronics product for an
application categorized as “Specific” or for which the product is not intended where you have failed to obtain the prior written
consent of Renesas Electronics. The quality grade of each Renesas Electronics product is “Standard” unless otherwise
expressly specified in a Renesas Electronics data sheets or data books, etc.
“Standard”:
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Computers; office equipment; communications equipment; test and measurement equipment; audio and visual
equipment; home electronic appliances; machine tools; personal electronic equipment; and industrial robots.
“High Quality”: Transportation equipment (automobiles, trains, ships, etc.); traffic control systems; anti-disaster systems; anticrime systems; safety equipment; and medical equipment not specifically designed for life support.
“Specific”:
Aircraft; aerospace equipment; submersible repeaters; nuclear reactor control systems; medical equipment or
systems for life support (e.g. artificial life support devices or systems), surgical implantations, or healthcare
intervention (e.g. excision, etc.), and any other applications or purposes that pose a direct threat to human life.
You should use the Renesas Electronics products described in this document within the range specified by Renesas Electronics,
especially with respect to the maximum rating, operating supply voltage range, movement power voltage range, heat radiation
characteristics, installation and other product characteristics. Renesas Electronics shall have no liability for malfunctions or
damages arising out of the use of Renesas Electronics products beyond such specified ranges.
Although Renesas Electronics endeavors to improve the quality and reliability of its products, semiconductor products have
specific characteristics such as the occurrence of failure at a certain rate and malfunctions under certain use conditions. Further,
Renesas Electronics products are not subject to radiation resistance design. Please be sure to implement safety measures to
guard them against the possibility of physical injury, and injury or damage caused by fire in the event of the failure of a
Renesas Electronics product, such as safety design for hardware and software including but not limited to redundancy, fire
control and malfunction prevention, appropriate treatment for aging degradation or any other appropriate measures. Because
the evaluation of microcomputer software alone is very difficult, please evaluate the safety of the final products or system
manufactured by you.
Please contact a Renesas Electronics sales office for details as to environmental matters such as the environmental
compatibility of each Renesas Electronics product. Please use Renesas Electronics products in compliance with all applicable
laws and regulations that regulate the inclusion or use of controlled substances, including without limitation, the EU RoHS
Directive. Renesas Electronics assumes no liability for damages or losses occurring as a result of your noncompliance with
applicable laws and regulations.
This document may not be reproduced or duplicated, in any form, in whole or in part, without prior written consent of Renesas
Electronics.
Please contact a Renesas Electronics sales office if you have any questions regarding the information contained in this
document or Renesas Electronics products, or if you have any other inquiries.
(Note 1) “Renesas Electronics” as used in this document means Renesas Electronics Corporation and also includes its majorityowned subsidiaries.
(Note 2) “Renesas Electronics product(s)” means any product developed or manufactured by or for Renesas Electronics.