Data Sheet μPG2185T6R R09DS0053EJ0300 Rev.3.00 Nov 22, 2012 GaAs Integrated Circuit SPDT Switch for 2 GHz to 6 GHz DESCRIPTION The μPG2185T6R is a GaAs MMIC SPDT (Single Pole Double Throw) switch which was designed for 2 GHz to 6 GHz applications, including dual-band wireless LAN. This device can operate frequency from 2 GHz to 6 GHz, having the low insertion loss and high isolation. This device is housed in a 6-pin plastic TSSON (Thin Shrink Small Out-line Non-leaded) (T6R) package and is suitable for high-density surface mounting. FEATURES <R> • Operating frequency • Switch control voltage • • • • : f = 2.0 to 6.0 GHz : Vcont (H) = 1.8 to 3.6 V (3.0 V TYP.) : Vcont (L) = −0.2 to 0.2 V (0 V TYP.) Low insertion loss : Lins1 = 0.40 dB TYP. @ f = 2.0 to 2.5 GHz, Vcont (H) = 3.0 V, Vcont (L) = 0 V : Lins2 = 0.50 dB TYP. @ f = 2.5 to 6.0 GHz, Vcont (H) = 3.0 V, Vcont (L) = 0 V High isolation : ISL1 = 26 dB TYP. @ f = 2.0 to 2.5 GHz, Vcont (H) = 3.0 V, Vcont (L) = 0 V : ISL2 = 25 dB TYP. @ f = 2.5 to 6.0 GHz, Vcont (H) = 3.0 V, Vcont (L) = 0 V Handling power : Pin (1 dB) = +30.5 dBm TYP. @ f = 2.5 GHz, Vcont (H) = 3.0 V, Vcont (L) = 0 V : Pin (1 dB) = +30.5 dBm TYP. @ f = 6.0 GHz, Vcont (H) = 3.0 V, Vcont (L) = 0 V High-density surface mounting : 6-pin plastic TSSON (T6R) package (1.0 × 1.0 × 0.37 mm) APPLICATIONS • Wireless LAN (IEEE802.11a/b/g/n) • UWB, near field communications ORDERING INFORMATION Part Number Order Number Package μPG2185T6R-E2 μPG2185T6R-E2-A 6-pin plastic TSSON (Pb-Free) Marking G8 Supplying Form • Embossed tape 8 mm wide • Pin 1, 6 face the perforation side of the tape • Qty 5 kpcs/reel Remark To order evaluation samples, please contact your nearby sales office. Part number for sample order: μPG2185T6R CAUTION Although this device is designed to be as robust as possible, ESD (Electrostatic Discharge) can damage this device. This device must be protected at all times from ESD. Static charges may easily produce potentials of several kilovolts on the human body or equipment, which can discharge without detection. Industry-standard ESD precautions must be employed at all times. The mark <R> shows major revised points. The revised points can be easily searched by copying an "<R>" in the PDF file and specifying it in the "Find what:" field. R09DS0053EJ0300 Rev.3.00 Nov 22, 2012 Page 1 of 9 μPG2185T6R PIN CONNECTIONS AND INTERNAL BLOCK DIAGRAM (Top View) 1 G8 2 3 (Bottom View) (Top View) 6 1 6 6 1 5 2 5 5 2 4 3 4 4 3 Pin No. Pin Name 1 2 3 4 5 6 OUTPUT1 GND OUTPUT2 Vcont2 INPUT Vcont1 Remark Exposed pad : GND TRUTH TABLE Vcont1 High Low Vcont2 Low High INPUT−OUTPUT1 OFF ON INPUT−OUTPUT2 ON OFF ABSOLUTE MAXIMUM RATINGS (TA = +25°C, unless otherwise specified) Parameter Switch Control Voltage Input Power Power Dissipation Operating Ambient Temperature Storage Temperature Note: Symbol Vcont Pin PD TA Tstg Ratings Unit Note V dBm mW °C °C +6.0 +31 150 −40 to +90 −55 to +150 ⎪Vcont1 − Vcont2⎪ ≤ 6.0 V RECOMMENDED OPERATING RANGE (TA = +25°C, unless otherwise specified) <R> Parameter Switch Control Voltage (H) Switch Control Voltage (L) Operating Frequency R09DS0053EJ0300 Rev.3.00 Nov 22, 2012 Symbol Vcont (H) Vcont (L) f MIN. 1.8 −0.2 2.0 TYP. 3.0 0 − MAX. 3.6 +0.2 6.0 Unit V V GHz Page 2 of 9 μPG2185T6R ELECTRICAL CHARACTERISTICS 1 (TA = +25°C, Vcont (H) = 3.0 V, Vcont (L) = 0 V, ZO = 50 Ω, DC blocking capacitors = 6 pF, unless otherwise specified) Parameter Insertion Loss 1 Insertion Loss 2 Isolation 1 (INPUT−OFF Port) Isolation 2 (INPUT−OFF Port) Symbol Lins1 Lins2 ISL1 ISL2 Test Conditions f = 2.0 to 2.5 GHz f = 2.5 to 6.0 GHz f = 2.0 to 2.5 GHz f = 2.5 to 6.0 GHz MIN. − − 23 22 TYP. 0.40 0.50 26 25 MAX. 0.60 0.80 − − Unit dB dB dB dB Isolation 3 (OUTPUT1−OUTPUT2) ISL3 f = 2.0 to 2.5 GHz 24 27 − dB Isolation 4 (OUTPUT1−OUTPUT2) Input Return Loss 1 Input Return Loss 2 Input Return Loss 3 Output Return Loss 1 Output Return Loss 2 Output Return Loss 3 0.1 dB Loss Compression Note Input Power ISL4 f = 2.5 to 6.0 GHz 24 27 − dB RLin1 RLin2 RLin3 RLout1 RLout2 RLout3 Pin (0.1 dB) f = 2.0 to 2.5 GHz f = 4.9 to 6.0 GHz f = 2.5 to 4.9 GHz f = 2.0 to 2.5 GHz f = 4.9 to 6.0 GHz f = 2.5 to 4.9 GHz f = 2.5 GHz f = 6.0 GHz 15 15 12 15 15 12 +26 +26 20 20 17 20 20 17 +29 +29 − − − − − − − − dB dB dB dB dB dB dBm dBm Pin (1 dB) f = 2.5 GHz f = 6.0 GHz f = 2.5 GHz No RF input 50% CTL to 90/10% RF − − − − − +30.5 +30.5 +50 0.1 20 − − − 1.0 100 dBm dBm dBm μA ns 1 dB Loss Compression Note Input Power rd Input 3 order Intercept Point Switch Control Current Switch Control Speed Note: IIP3 Icont tSW Pin (0.1 dB) is the measured input power level when the insertion loss increases 0.1 dB more than that of the linear range. Pin (1 dB) is the measured input power level when the insertion loss increases 1 dB more than that of the linear range. CAUTION It is necessary to use DC blocking capacitors with this device. The value of DC blocking capacitors should be chosen to accommodate the frequency of operation, bandwidth, switching speed and the condition with actual board of your system. R09DS0053EJ0300 Rev.3.00 Nov 22, 2012 Page 3 of 9 μPG2185T6R <R> ELECTRICAL CHARACTERISTICS 2 (TA = +25°C, Vcont (H) = 1.8 V, Vcont (L) = 0 V, ZO = 50 Ω, DC blocking capacitors = 6 pF, unless otherwise specified) Parameter Insertion Loss 1 Insertion Loss 2 Isolation 1 (INPUT−OFF Port) Isolation 2 (INPUT−OFF Port) Symbol Lins1 Lins2 ISL1 ISL2 Test Conditions f = 2.0 to 2.5 GHz f = 2.5 to 6.0 GHz f = 2.0 to 2.5 GHz f = 2.5 to 6.0 GHz MIN. − − 22 22 TYP. 0.40 0.50 26 25 MAX. 0.60 0.80 − − Unit dB dB dB dB Isolation 3 (OUTPUT1−OUTPUT2) ISL3 f = 2.0 to 2.5 GHz 22 27 − dB Isolation 4 (OUTPUT1−OUTPUT2) Input Return Loss 1 Input Return Loss 2 Input Return Loss 3 Output Return Loss 1 Output Return Loss 2 Output Return Loss 3 0.1 dB Loss Compression Note Input Power ISL4 f = 2.5 to 6.0 GHz 22 27 − dB RLin1 RLin2 RLin3 RLout1 RLout2 RLout3 Pin (0.1 dB) f = 2.0 to 2.5 GHz f = 4.9 to 6.0 GHz f = 2.5 to 4.9 GHz f = 2.0 to 2.5 GHz f = 4.9 to 6.0 GHz f = 2.5 to 4.9 GHz f = 2.5 GHz f = 6.0 GHz 15 15 12 15 15 12 +20 +19 20 20 17 20 20 17 +23 +23 − − − − − − − − dB dB dB dB dB dB dBm dBm Pin (1 dB) f = 2.5 GHz f = 6.0 GHz f = 2.5 GHz No RF input 50% CTL to 90/10% RF − − − − − +28 +27 +50 0.1 20 − − − 1.0 100 dBm dBm dBm μA ns 1 dB Loss Compression Note Input Power Input 3rd order Intercept Point Switch Control Current Switch Control Speed Note: IIP3 Icont tSW Pin (0.1 dB) is the measured input power level when the insertion loss increases 0.1 dB more than that of the linear range. Pin (1 dB) is the measured input power level when the insertion loss increases 1 dB more than that of the linear range. CAUTION It is necessary to use DC blocking capacitors with this device. The value of DC blocking capacitors should be chosen to accommodate the frequency of operation, bandwidth, switching speed and the condition with actual board of your system. R09DS0053EJ0300 Rev.3.00 Nov 22, 2012 Page 4 of 9 μPG2185T6R EVALUATION CIRCUIT Vcont1 INPUT Vcont2 1 000 pF 1 000 pF 6 pF 6 5 4 1 2 3 6 pF 6 pF OUTPUT1 OUTPUT2 The application circuits and their parameters are for reference only and are not intended for use in actual design-ins. <R> APPLICATION INFORMATION C1 Switch C1 LESD C1 • C1 are DC blocking capacitors external to the device. The value may be tailored to provide specific electrical responses. • The RF ground connections should be kept as short as possible and connected to directly to a good RF ground for best performance. • LESD provides a means to increase the ESD protection on a specific RF port, typically the port attached to the antenna. R09DS0053EJ0300 Rev.3.00 Nov 22, 2012 Page 5 of 9 μPG2185T6R MOUNTING PAD AND SOLDER MASK LAYOUT DIMENSIONS 6-PIN PLASTIC TSSON (T6R) (UNIT: mm) MOUNTING PAD 0.15 0.225 0.15 0.125 0.15 0.65 1.2 0.15 0.45 0.35 0.35 1.2 SOLDER MASK 0.13 0.15 0.225 0.75 1.15 0.13 0.6 0.13 0.45 0.35 0.35 0.75 1.15 Solder thickness : 0.08 mm Remark The mounting pad and solder mask layouts in this document are for reference only. R09DS0053EJ0300 Rev.3.00 Nov 22, 2012 Page 6 of 9 μPG2185T6R PACKAGE DIMENSIONS 6-PIN PLASTIC TSSON (T6R) (UNIT: mm) (Top View) 1.0±0.1 1.0±0.1 (Bottom View) 0.15+0.07 –0.05 A 0.08 MIN. A 0.15+0.07 –0.05 A A 0.45 ±0.1 0.35±0.06 0.35±0.06 1.0±0.1 0.08 MIN. 1.0±0.1 0.13±0.07 0.175±0.075 0.37+0.03 –0.05 0.23±0.07 Remark A > 0 R09DS0053EJ0300 Rev.3.00 Nov 22, 2012 Page 7 of 9 μPG2185T6R RECOMMENDED SOLDERING CONDITIONS This product should be soldered and mounted under the following recommended conditions. For soldering methods and conditions other than those recommended below, contact your nearby sales office. Soldering Method Infrared Reflow <R> Partial Heating Soldering Conditions Peak temperature (package surface temperature) Time at peak temperature Time at temperature of 220°C or higher Preheating time at 120 to 180°C Maximum number of reflow processes Maximum chlorine content of rosin flux (% mass) : 260°C or below : 10 seconds or less : 60 seconds or less : 120±30 seconds : 3 times : 0.2% (Wt.) or below Peak temperature (terminal temperature) : 350°C or below Soldering time (per side of device) : 3 seconds or less Maximum chlorine content of rosin flux (% mass) : 0.2% (Wt.) or below Condition Symbol IR260 HS350 CAUTION Do not use different soldering methods together (except for partial heating). R09DS0053EJ0300 Rev.3.00 Nov 22, 2012 Page 8 of 9 μPG2185T6R Caution GaAs Products This product uses gallium arsenide (GaAs). GaAs vapor and powder are hazardous to human health if inhaled or ingested, so please observe the following points. • Follow related laws and ordinances when disposing of the product. If there are no applicable laws and/or ordinances, dispose of the product as recommended below. 1. Commission a disposal company able to (with a license to) collect, transport and dispose of materials that contain arsenic and other such industrial waste materials. 2. Exclude the product from general industrial waste and household garbage, and ensure that the product is controlled (as industrial waste subject to special control) up until final disposal. • Do not burn, destroy, cut, crush, or chemically dissolve the product. • Do not lick the product or in any way allow it to enter the mouth. R09DS0053EJ0300 Rev.3.00 Nov 22, 2012 Page 9 of 9 μPG2185T6R Data Sheet Revision History Rev. 1.00 2.00 3.00 Date May 30, 2008 Aug 22, 2008 Nov 22, 2012 Description Summary Page − − All p.1 p.2 p.4 p.5 p.8 First Edition Issued Second Edition Issued The format of Renesas Electronics Corporation is applied to this data sheet. The value of Switch control voltage ( Vcont (H) ) is changed to “1.8 to 3.6 V”. The minimum and maximum values of Switch control voltage ( Vcont (H) ) are changed to 1.8 V and 3.6V, respectively. ELECTRICAL CHARACTERISTICS 2 is added. APPLICATION INFORMATION is added. The “Wave Soldering” is deleted from RECOMMENDED SOLDERING CONDITIONS. All trademarks and registered trademarks are the property of their respective owners. C-1 Notice 1. Descriptions of circuits, software and other related information in this document are provided only to illustrate the operation of semiconductor products and application examples. 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