uPG2408TB DS

DATA SHEET
GaAs INTEGRATED CIRCUIT
μPG2408TB
0.05 to 3.0 GHz SPDT SWITCH
DESCRIPTION
The μPG2408TB is a GaAs MMIC for L, S-band SPDT (Single Pole Double Throw) switch for 2.4 GHz wireless
LAN, mobile phone and other L, S-band applications.
This device operates with dual control switching voltages of 2.5 to 5.3 V. This device can operate at frequencies
from 0.05 to 3.0 GHz, with low insertion loss and high isolation.
This device is housed in a 6-pin super minimold package (SC-88/SOT-363 type), and is suitable for high-density
surface mounting.
FEATURES
• Switch control voltage
• Low insertion loss
• High isolation
: Vcont (H) = 3.0 V TYP.
: Vcont (L) = 0 V TYP.
: Lins = 0.40 dB TYP. @ f = 1.0 GHz
: Lins = 0.50 dB TYP. @ f = 2.5 GHz
: ISL = 27 dB TYP. @ f = 1.0 GHz
: ISL = 18 dB TYP. @ f = 2.5 GHz
• Handling power
: Pin (0.1 dB) = +29.0 dBm TYP. @ f = 0.5 to 3.0 GHz
• High-density surface mounting : 6-pin super minimold package (SC-88/SOT-363 type) (2.0 × 1.25 × 0.9 mm)
APPLICATIONS
• L, S-band digital cellular or cordless telephone
• W-LAN, WLL and BluetoothTM etc.
ORDERING INFORMATION
Part Number
μPG2408TB-E4
Order Number
μPG2408TB-E4-A
Package
6-pin super minimold
(SC-88/SOT-363 type)
(Pb-Free)
Marking
G5P
Supplying Form
• Embossed tape 8 mm wide
• Pin 4, 5, 6 face the perforation side of the tape
• Qty 3 kpcs/reel
Remark To order evaluation samples, please contact your nearby sales office.
Part number for sample order: μPG2408TB-A
Caution Although this device is designed to be as robust as possible, ESD (Electrostatic Discharge) can
damage this device. This device must be protected at all times from ESD. Static charges may
easily produce potentials of several kilovolts on the human body or equipment, which can
discharge without detection. Industry-standard ESD precautions must be employed at all times.
The information in this document is subject to change without notice. Before using this document, please
confirm that this is the latest version.
Not all products and/or types are available in every country. Please check with an Renesas Electronics
sales representative for availability and additional information.
Document No. PG10770EJ01V0DS (1st edition)
Date Published July 2009 NS
μPG2408TB
PIN CONNECTIONS AND INTERNAL BLOCK DIAGRAM
(Top View)
(Top View)
2
3
G5P
1
6
1
5
2
4
3
RF1
(Bottom View)
Vcont1
6
GND
RFC
RF2
Vcont2
6
1
5
5
2
4
4
3
Pin No.
Pin Name
1
RF1
2
GND
3
RF2
4
Vcont2
5
RFC
6
Vcont1
SW TRUTH TABLE
ON Path
Vcont1
Vcont2
RFC-RF1
Low
High
RFC-RF2
High
Low
ABSOLUTE MAXIMUM RATINGS (TA = +25°C, unless otherwise specified)
Parameter
Symbol
Switch Control Voltage
Ratings
Vcont
+6.0
Unit
V
Note
Input Power
Pin
+33.0
dBm
Operating Ambient Temperature
TA
−45 to +85
°C
Storage Temperature
Tstg
−55 to +150
°C
Note ⎪Vcont1 − Vcont2⎪ ≤ 6.0 V
RECOMMENDED OPERATING RANGE (TA = +25°C, unless otherwise specified)
Parameter
Symbol
MIN.
TYP.
MAX.
Unit
f
0.05
−
3.0
GHz
Switch Control Voltage (H)
Vcont (H)
2.5
3.0
5.3
V
Switch Control Voltage (L)
Vcont (L)
−0.2
0
0.2
V
Control Voltage Difference
ΔVcont (H),
ΔVcont (L)Note
−0.1
0
0.1
V
Operating Frequency
Note ΔVcont (H) = Vcont1 (H) − Vcont2 (H)
ΔVcont (L) = Vcont1 (L) − Vcont2 (L)
2
Data Sheet PG10770EJ01V0DS
μPG2408TB
ELECTRICAL CHARACTERISTICS
(TA = +25°C, Vcont (H) = 3.0 V, Vcont (L) = 0 V, DC blocking capacitors = 56 pF, unless otherwise specified)
Parameter
Symbol
Test Conditions
Note 1
MIN.
TYP.
MAX.
Unit
−
0.40
0.55
dB
Insertion Loss 1
Lins1
f = 0.05 to 0.5 GHz
Insertion Loss 2
Lins2
f = 0.5 to 1.0 GHz
−
0.40
0.55
dB
Insertion Loss 3
Lins3
f = 1.0 to 2.0 GHz
−
0.48
0.63
dB
Insertion Loss 4
Lins4
f = 2.0 to 2.5 GHz
−
0.50
0.65
dB
Insertion Loss 5
Lins5
f = 2.5 to 3.0 GHz
−
0.56
0.70
dB
24
27
−
dB
Note 1
Isolation 1
ISL1
f = 0.05 to 0.5 GHz
Isolation 2
ISL2
f = 0.5 to 1.0 GHz
24
27
−
dB
Isolation 3
ISL3
f = 1.0 to 2.0 GHz
16
19
−
dB
Isolation 4
ISL4
f = 2.0 to 2.5 GHz
15
18
−
dB
Isolation 5
ISL5
f = 2.5 to 3.0 GHz
14
17
−
dB
15
20
−
dB
15
20
−
dB
15
20
−
dB
15
20
−
dB
+27.0
+29.0
−
dBm
f = 0.5 to 3.0 GHz
−
+29.0
−
dBm
f = 0.5 to 3.0 GHz, 2 tone,
−
+60
−
dBm
Input Return Loss 1
RLin1
f = 0.05 to 0.5 GHz
Input Return Loss 2
RLin2
f = 0.5 to 3.0 GHz
Output Return Loss 1
RLout1
f = 0.05 to 0.5 GHz
Output Return Loss 2
RLout2
f = 0.5 to 3.0 GHz
0.1 dB Loss Compression
Input Power
Pin (0.1 dB)
Note 2
Input 3rd Order Intercept Point
IIP3
Note 1
Note 1
f = 2.0/2.5 GHz
5 MHz spicing
Switch Control Current
Icont
No RF input
−
0.3
20
μA
Switch Control Speed
tSW
50% CTL to 90/10% RF
−
50
500
ns
Notes 1. DC blocking capacitors = 1 000 pF at f = 0.05 to 0.5 GHz
2. Pin (0.1 dB) is the measured input power level when the insertion loss increases 0.1 dB more than that of
linear range.
Caution It is necessary to use DC blocking capacitors with this device.
The value of DC blocking capacitors should be chosen to accommodate the frequency of
operation, bandwidth, switching speed and the condition with actual board of your system. The
range of recommended DC blocking capacitor value is less than 100 pF for frequencies above 0.5
GHz, and 1 000pF for frequencies above 0.5 GHz.
Data Sheet PG10770EJ01V0DS
3
μPG2408TB
EVALUATION CIRCUIT
C2
C1
1
Vcont1
RF1
6
2
RFC
5
C1 Note
3
Vcont2
RF2
4
C1
C2
Note C1 : 0.05 to 0.5 GHz
: 0.5 to 3.0 GHz
1 000 pF
56 pF
C2 : 1 000 pF
The application circuits and their parameters are for reference only and are not intended for use in actual design-ins.
APPLICATION INFORMATION
C1
Switch
C1
LESD
C1
• LESD provides a means to increase the ESD protection on a specific RF port, typically the port attached to the
antenna.
• The value may be tailored to provide specific electrical responses.
• The RF ground connections should be kept as short as possible and connected to directly to a good RF ground
for best performance.
4
Data Sheet PG10770EJ01V0DS
μPG2408TB
ILLUSTRATION OF THE TEST CIRCUIT ASSEMBLED ON EVALUATION BOARD
Vcont1
Vc1
RF1
OUT 1
C2
C
1
IN
C1
C
2
C1
G5P
RFC
C1
C2
C
1
C1
C2
OUT 2
RF2
Vc2
6pin SMM SPDT SW
Vcont2
USING THE NEC EVALUATION BOARD
Symbol
C1
C2
Test Conditions
Values
f = 0.05 to 0.5 GHz
1 000 pF
f = 0.5 to 3.0 GHz
56 pF
1 000 pF
Data Sheet PG10770EJ01V0DS
5
μPG2408TB
TYPICAL CHARACTERISTICS (TA = +25°C, DC blocking capacitors = 56 pF, unless otherwise specified)
RFC-RF1/RF2
ISOLATION vs. FREQUENCY
RFC-RF1/RF2
INSERTION LOSS vs. FREQUENCY
0
–0.1
Vcont (H) = 3.0 V
–5
–0.2
Isolation ISL (dB)
Insertion Loss Lins (dB)
Vcont (H) = 3.0 V
–0.3
–0.4
–10
–15
–20
–25
–30
–0.5
–35
–0.6
0.0
0.5
1.0
1.5
2.0
2.5
–40
0.0
3.0
2.0
2.5
3.0
RFC-RF1/RF2
INPUT RETURN LOSS vs. FREQUENCY
RFC-RF1/RF2
OUTPUT RETURN LOSS vs. FREQUENCY
0
Output Return Loss RLout (dB)
–5
–10
–15
–20
–25
–30
0.0
0.5
1.0
1.5
2.0
2.5
Vcont (H) = 3.0 V
–5
–10
–15
–20
–25
–30
0.0
3.0
0.5
1.0
1.5
2.0
2.5
Frequency f (GHz)
Frequency f (GHz)
RFC-RF1/RF2 INSERTION LOSS,
Icont vs. SWITCH CONTROL VOLTAGE (H)
RFC-RF1/RF2 ISOLATION vs.
SWITCH CONTROL VOLTAGE (H)
6
f = 2.5 GHz
Icont: No RF Input
–0.3
f = 2.5 GHz
5
4
–0.4
Lins
–0.5
3
–0.6
2
Icont
1
–0.7
–0.8
2.0
2.5
3.0
3.5
4.0
4.5
3.0
0
0
5.0
–5
Isolation ISL (dB)
–0.2
Switch Control Current Icont (μA)
Input Return Loss RLin (dB)
1.5
Frequency f (GHz)
Vcont (H) = 3.0 V
Insertion Loss Lins (dB)
1.0
Frequency f (GHz)
0
–10
–15
–20
–25
–30
–35
–40
2.0
2.5
3.0
3.5
4.0
4.5
Switch Control Voltage (H) Vcont (H) (V)
Switch Control Voltage (H) Vcont (H) (V)
Remark The graphs indicate nominal characteristics.
6
0.5
Data Sheet PG10770EJ01V0DS
5.0
μPG2408TB
RFC-RF1/RF2 OUTPUT RETURN LOSS vs.
SWITCH CONTROL VOLTAGE (H)
RFC-RF1/RF2 INPUT RETURN LOSS vs.
SWITCH CONTROL VOLTAGE (H)
0
0
Output Return Loss RLout (dB)
Input Return Loss RLin (dB)
–10
–15
–20
–25
–30
–35
–40
–45
0.1 dB Loss Compression Input Power Pin (0.1 dB) (dBm)
2.5
3.0
3.5
4.0
4.5
–10
–15
–20
–25
–30
–35
–40
–45
–50
2.0
5.0
2.5
3.0
3.5
4.0
4.5
Switch Control Voltage (H) Vcont (H) (V)
Switch Control Voltage (H) Vcont (H) (V)
RFC-RF1/RF2 Pin (0.1 dB) vs.
SWITCH CONTROL VOLTAGE (H)
RFC-RF1/RF2 INSERTION LOSS,
Icont vs. INPUT POWER
5.0
6
0
36
f = 2.5 GHz
–0.5
34
Insertion Loss Lins (dB)
0.1 dB Loss Compression Input Power Pin (0.1 dB) (dBm)
–50
2.0
f = 2.5 GHz
–5
32
30
28
f = 2.5 GHz
Vcont (H) = 3.0 V
Lins
–1.0
4
–1.5
3
–2.0
2
1
–2.5
26
5
Switch Control Current Icont (μA)
f = 2.5 GHz
–5
Icont
24
2.0
2.5
3.0
3.5
4.0
4.5
5.0
–3.0
15
20
25
30
0
35
Input Power Pin (dBm)
Switch Control Voltage (H) Vcont (H) (V)
RFC-RF1/RF2
Pin (0.1 dB) vs. FREQUENCY
38
DC blocking capacitors:
f = 0.5 to 3.0 GHz 56 pF
f < 0.5 GHz
1 000 pF
36
34
32
Vcont (H) = 3.0 V
30
28
26
24
22
20
0.0
0.5
1.0
1.5
2.0
2.5
3.0
Frequency f (GHz)
Remark The graphs indicate nominal characteristics.
Data Sheet PG10770EJ01V0DS
7
μPG2408TB
MOUNTING PAD LAYOUT DIMENSIONS
6-PIN SUPER MINIMOLD (SC-88/SOT-363 type) (UNIT: mm)
1.9
0.8
0.4
0.65
0.65
Remark The mounting pad layout in this document is for reference only.
When designing PCB, please consider workability of mounting, solder joint reliability, prevention of solder
bridge and so on, in order to optimize the design.
8
Data Sheet PG10770EJ01V0DS
μPG2408TB
PACKAGE DIMENSIONS
6-PIN SUPER MINIMOLD (SC-88/SOT-363 type) (UNIT: mm)
2.1±0.1
0.2+0.1
–0.05
0.65
0.65
1.3
Data Sheet PG10770EJ01V0DS
0.15+0.1
–0.05
0 to 0.1
0.7
0.1 MIN.
0.9±0.1
2.0+0.15
–0.20
1.25±0.1
9
μPG2408TB
RECOMMENDED SOLDERING CONDITIONS
This product should be soldered and mounted under the following recommended conditions.
For soldering
methods and conditions other than those recommended below, contact your nearby sales office.
Soldering Method
Infrared Reflow
Wave Soldering
Soldering Conditions
Condition Symbol
Peak temperature (package surface temperature)
: 260°C or below
Time at peak temperature
: 10 seconds or less
Time at temperature of 220°C or higher
: 60 seconds or less
Preheating time at 120 to 180°C
: 120±30 seconds
Maximum number of reflow processes
: 3 times
Maximum chlorine content of rosin flux (% mass)
: 0.2%(Wt.) or below
Peak temperature (molten solder temperature)
: 260°C or below
Time at peak temperature
: 10 seconds or less
IR260
WS260
Preheating temperature (package surface temperature) : 120°C or below
Partial Heating
Maximum number of flow processes
: 1 time
Maximum chlorine content of rosin flux (% mass)
: 0.2%(Wt.) or below
Peak temperature (terminal temperature)
: 350°C or below
Soldering time (per side of device)
: 3 seconds or less
Maximum chlorine content of rosin flux (% mass)
: 0.2%(Wt.) or below
Caution Do not use different soldering methods together (except for partial heating).
10
Data Sheet PG10770EJ01V0DS
HS350
μPG2408TB
Caution
GaAs Products
This product uses gallium arsenide (GaAs).
GaAs vapor and powder are hazardous to human health if inhaled or ingested, so please observe
the following points.
• Follow related laws and ordinances when disposing of the product. If there are no applicable laws
and/or ordinances, dispose of the product as recommended below.
1. Commission a disposal company able to (with a license to) collect, transport and dispose of
materials that contain arsenic and other such industrial waste materials.
2. Exclude the product from general industrial waste and household garbage, and ensure that the
product is controlled (as industrial waste subject to special control) up until final disposal.
• Do not burn, destroy, cut, crush, or chemically dissolve the product.
• Do not lick the product or in any way allow it to enter the mouth.
NOTICE
1.
Descriptions of circuits, software and other related information in this document are provided only to illustrate the operation of semiconductor products and
application examples. You are fully responsible for the incorporation of these circuits, software, and information in the design of your equipment. California
Eastern Laboratories and Renesas Electronics assumes no responsibility for any losses incurred by you or third parties arising from the use of these circuits,
software, or information.
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not warrant that such information is error free. California Eastern Laboratories and Renesas Electronics assumes no liability whatsoever for any damages
incurred by you resulting from errors in or omissions from the information included herein.
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