UPG2409T6X

GaAs INTEGRATED CIRCUIT
PG2409T6X
HIGH POWER SPDT SWITCH FOR WiMAXTM
DESCRIPTION
The PG2409T6X is a GaAs MMIC high power SPDT (Single Pole Double Throw) switch which were designed for
WiMAX.
This device can operate frequency from 0.05 to 6.0 GHz, having the low insertion loss and high isolation.
This device is housed in a 6-pin plastic TSON (Thin Small Out-line Non-leaded) (T6X) package.
And this
package is suitable for high-density surface mounting.
FEATURES
• Switch control voltage
: Vcont (H) = 3.0 V TYP.
: Vcont (L) = 0 V TYP.
• Low insertion loss
: Lins = 0.45 dB TYP. @ f = 2.5 GHz
: Lins = 0.55 dB TYP. @ f = 3.8 GHz
: Lins = 0.65 dB TYP. @ f = 6.0 GHz
• High isolation
: ISL = 30 dB TYP. @ f = 2.5 GHz
: ISL = 30 dB TYP. @ f = 3.8 GHz
: ISL = 27 dB TYP. @ f = 6.0 GHz
• Handling power
: Pin (1 dB) = +36.0 dBm TYP. @ f = 0.05 to 6.0 GHz
• High-density surface mounting : 6-pin plastic TSON (T6X) package (1.5  1.5  0.37 mm)
APPLICATIONS
• WiMAX and wireless LAN (IEEE802.11a/b/g/n)
ORDERING INFORMATION
Part Number
PG2409T6X-E2
Order Number
PG2409T6X-E2-A
Package
6-pin plastic TSON
(T6X) (Pb-Free)
Marking
G5R
Supplying Form
 Embossed tape 8 mm wide
 Pin 1, 6 face the perforation side of the tape
 Qty 3 kpcs/reel
Remark To order evaluation samples, please contact your nearby sales office.
Part number for sample order: PG2409T6X-A
Caution Although this device is designed to be as robust as possible, ESD (Electrostatic
Discharge) can damage this device. This device must be protected at all times from ESD. Static
charges may easily produce potentials of several kilovolts on the human body or equipment, which
can discharge without detection. Industry-standard ESD precautions must be employed at all times.
Document No. PG10773EJ01V0DS (1st edition)
Date Published July 2009 NS
PG2409T6X
PIN CONNECTIONS AND INTERNAL BLOCK DIAGRAM
Pin No.
Pin Name
1
RF1
2
GND
3
RF2
4
Vcont2
5
RFC
6
Vcont1
Remark Exposed
GND
SW TRUTH TABLE
Vcont1
Vcont2
RFC-RF1
RFC-RF2
High
Low
ON
OFF
Low
High
OFF
ON
ABSOLUTE MAXIMUM RATINGS (T A = +25C, unless otherwise specified)
Parameter
Symbol
Switch Control Voltage
Ratings
Vcont
+6.0
Unit
Note
V
Input Power
Pin
+36
dBm
Operating Ambient Temperature
TA
45 to +85
C
Storage Temperature
Tstg
55 to +150
C
Note Vcont1  Vcont2  6.0 V
RECOMMENDED OPERATING RANGE (T A = +25C, unless otherwise specified)
Parameter
Symbol
MIN.
TYP.
MAX.
Unit
f
0.05

6.0
GHz
Switch Control Voltage (H)
Vcont (H)
2.7
3.0
3.3
V
Switch Control Voltage (L)
Vcont (L)
0.2
0
0.2
V
Control Voltage Difference
Vcont (H),
Vcont (L)Note
0.1
0
0.1
V
Operating Frequency
Note Vcont (H) = Vcont1 (H)  Vcont2 (H)
Vcont (L) = Vcont1 (L)  Vcont2 (L)
2
Data Sheet PG10773EJ01V0DS
pad
:
PG2409T6X
ELECTRICAL CHARACTERISTICS
(T A = +25C, Vcont (H) = 3.0 V, Vcont (L) = 0 V, ZO = 50 , DC blocking capacitors = 8 pF, unless
otherwise specified)
Parameter
Insertion Loss 1
Symbol
Lins1
Test Conditions
f = 0.05 to 0.5 GHz
Note 1
Note 2
MIN.
TYP.
MAX.
Unit

0.35

dB

0.40
0.65
dB
Insertion Loss 2
Lins2
f = 0.5 to 2.0 GHz
Insertion Loss 3
Lins3
f = 2.0 to 2.5 GHz

0.45
0.70
dB
Insertion Loss 4
Lins4
f = 2.5 to 3.8 GHz

0.55
0.80
dB
Insertion Loss 5
Lins5
f = 3.8 to 6.0 GHz

0.65
0.90
dB

30

dB
25
30

dB
Isolation 1
ISL1
f = 0.05 to 0.5 GHz
Note 1
Note 2
Isolation 2
ISL2
f = 0.5 to 2.0 GHz
Isolation 3
ISL3
f = 2.0 to 2.5 GHz
25
30

dB
Isolation 4
ISL4
f = 2.5 to 3.8 GHz
25
30

dB
Isolation 5
ISL5
f = 3.8 to 6.0 GHz
22
27

dB
Return Loss 1
RL1
f = 0.05 to 0.5 GHz

20

dB
15
20

dB
15
20

dB
10
15

dB

+34.0

dBm

+36.0

dBm
+34.0
+36.0

dBm
Return Loss 2
RL2
f = 0.5 to 2.0 GHz
Return Loss 3
RL3
f = 2.0 to 2.5 GHz
Return Loss 4
RL4
f = 2.5 to 6.0 GHz
0.1 dB Loss Compression
Input Power
Note 2
Note 2
Pin (0.1 dB)
f = 0.5 to 6.0 GHz
Pin (1 dB)
f = 0.05 to 0.5 GHz
Note 3
1 dB Loss Compression
Input Power
Note 1
Note 4
f = 0.5 to 6.0 GHz
Note 1
Note 2
2nd Harmonics
2f0
f = 2.5 GHz, Pin = +30 dBm

70

dBc
3rd Harmonics
3f0
f = 2.5 GHz, Pin = +30 dBm

70

dBc
Input 3rd Order Intercept Point
IIP3
f = 2.5 GHz

+60

dBm
Switch Control Current
Icont
No RF input

0.1
10
A
Switch Control Speed
tSW
50% CTL to 90/10% RF

100
250
ns
Notes 1. DC blocking capacitors = 1 000 pF at f = 0.05 to 0.5 GHz
2. DC blocking capacitors = 56 pF at f = 0.5 to 2.0 GHz
3. Pin (0.1 dB) is the measured input power level when the insertion loss increases 0.1 dB more than that of
the linear range.
4. Pin (1 dB) is the measured input power level when the insertion loss increases 1 dB more than that of the
linear range.
Caution It is necessary to use DC blocking capacitors with this device.
Data Sheet PG10773EJ01V0DS
3
PG2409T6X
EVALUATION CIRCUIT
Note C1 : 0.05 to 0.5 GHz 1 000 pF
: 0.5 to 2.0 GHz
56 pF
: 2.0 to 6.0 GHz
8 pF
The application circuits and their parameters are for reference only and are not intended for use in actual design-ins.
APPLICATION INFORMATION
• C1 are DC blocking capacitors external to the device.
The value may be tailored to provide specific electrical responses.
• The RF ground connections should be kept as short as possible and connected to directly to a good RF ground
for best performance.
• LESD provides a means to increase the ESD protection on a specific RF port, typically the port attached to the
antenna.
4
Data Sheet PG10773EJ01V0DS
PG2409T6X
TYPICAL CHARACTERISTICS (TA = +25C, DC blocking capacitors = 8 pF, unless otherwise specified)
Remark The graphs indicate nominal characteristics.
Data Sheet PG10773EJ01V0DS
5
PG2409T6X
Remark The graphs indicate nominal characteristics.
6
Data Sheet PG10773EJ01V0DS
PG2409T6X
MOUNTING PAD AND SOLDER MASK LAYOUT DIMENSIONS
6-PIN PLASTIC TSON (UNIT: mm)
Remark The mounting pad and solder mask layouts in this document is for reference only.
When designing PCB, please consider workability of mounting, solder joint reliability, prevention of
solder bridge and so on, in order to optimize the design.
Data Sheet PG10773EJ01V0DS
7
PG2409T6X
PACKAGE DIMENSIONS
6-PIN PLASTIC TSON (T6X) (UNIT: mm)
8
Data Sheet PG10773EJ01V0DS
PG2409T6X
RECOMMENDED SOLDERING CONDITIONS
This product should be soldered and mounted under the following recommended conditions.
For soldering
methods and conditions other than those recommended below, contact your nearby sales office.
Soldering Method
Infrared Reflow
Partial Heating
Soldering Conditions
Condition Symbol
Peak temperature (package surface temperature)
: 260C or below
Time at peak temperature
: 10 seconds or less
Time at temperature of 220C or higher
: 60 seconds or less
Preheating time at 120 to 180C
: 12030 seconds
Maximum number of reflow processes
: 3 times
Maximum chlorine content of rosin flux (% mass)
: 0.2%(Wt.) or below
Peak temperature (terminal temperature)
: 350C or below
Soldering time (per side of device)
: 3 seconds or less
Maximum chlorine content of rosin flux (% mass)
: 0.2%(Wt.) or below
IR260
HS350
Caution Do not use different soldering methods together (except for partial heating).
Data Sheet PG10773EJ01V0DS
9
PG2409T6X
Caution GaAs Products
This product uses gallium arsenide (GaAs).
GaAs vapor and powder are hazardous to human health if inhaled or ingested, so please observe the
following points.
• Follow related laws and ordinances when disposing of the product. If there are no applicable laws
and/or ordinances, dispose of the product as recommended below.
1. Commission a disposal company able to (with a license to) collect, transport and dispose of
materials that contain arsenic and other such industrial waste materials.
2. Exclude the product from general industrial waste and household garbage, and ensure that the
product is controlled (as industrial waste subject to special control) up until final disposal.
• Do not burn, destroy, cut, crush, or chemically dissolve the product.
• Do not lick the product or in any way allow it to enter the mouth.
10
Data Sheet PG10773EJ01V0DS
NOTICE
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