GaAs INTEGRATED CIRCUIT PG2415T6X 0.05 to 6.0 GHz SPDT SWITCH DESCRIPTION The PG2415T6X is a GaAs MMIC SPDT (Single Pole Double Throw) switch for 0.05 to 6.0 GHz applications, including dual-band wireless LAN. This device operates with dual control switching voltages of 2.7 to 3.3 V. This device can operate at frequencies from 0.05 to 6.0 GHz, with low insertion loss and high isolation. This device is housed in a 6-pin plastic TSON (Thin Small Out-line Non-leaded) (T6X) package and is suitable for high-density surface mounting. FEATURES • Switch control voltage : Vcont (H) = 3.0 V TYP. : Vcont (L) = 0 V TYP. • Low insertion loss : Lins = 0.45 dB TYP. @ f = 2.5 GHz : Lins = 0.55 dB TYP. @ f = 6.0 GHz • High isolation : ISL = 28 dB TYP. @ f = 2.5 GHz : ISL = 26 dB TYP. @ f = 6.0 GHz • Handling power : Pin (0.1 dB) = +31.0 dBm TYP. @ f = 2.0 to 6.0 GHz • High-density surface mounting : 6-pin plastic TSON (T6X) package (1.5 1.5 0.37 mm) APPLICATIONS • Dual-band wireless LAN etc. ORDERING INFORMATION Part Number Order Number Package Marking PG2415T6X-E2 PG2415T6X-E2-A 6-pin plastic TSON (T6X) G6E (Pb-Free) Supplying Form Embossed tape 8 mm wide Pin 1, 6 face the perforation side of the tape Qty 3 kpcs/reel Remark To order evaluation samples, please contact your nearby sales office. Part number for sample order: PG2415T6X-A Caution Although this device is designed to be as robust as possible, ESD (Electrostatic Discharge) can damage this device. This device must be protected at all times from ESD. Static charges may easily produce potentials of several kilovolts on the human body or equipment, which can discharge without detection. Industry-standard ESD precautions must be employed at all times. Document No. PG10797EJ01V0DS (1st edition) Date Published March 2010 NS PG2415T6X PIN CONNECTIONS AND INTERNAL BLOCK DIAGRAM Pin No. Pin Name 1 RF1 2 GND 3 RF2 4 Vcont2 5 RFC 6 Vcont1 Remark Exposed GND SW TRUTH TABLE Vcont1 Vcont2 RFC-RF1 RFC-RF2 High Low ON OFF Low High OFF ON ABSOLUTE MAXIMUM RATINGS (T A = +25C, unless otherwise specified) Parameter Symbol Switch Control Voltage Ratings Vcont +6.0 Unit Note V Input Power Pin +36 dBm Operating Ambient Temperature TA 45 to +85 C Storage Temperature Tstg 55 to +150 C Note Vcont1 Vcont2 6.0 V RECOMMENDED OPERATING RANGE (T A = +25C, unless otherwise specified) Parameter Symbol MIN. TYP. MAX. Unit f 0.05 6.0 GHz Switch Control Voltage (H) Vcont (H) 2.7 3.0 3.3 V Switch Control Voltage (L) Vcont (L) 0.2 0 0.2 V Control Voltage Difference Vcont (H), Vcont (L)Note 0.1 0 0.1 V Operating Frequency Note Vcont (H) = Vcont1 (H) Vcont2 (H) Vcont (L) = Vcont1 (L) Vcont2 (L) 2 Data Sheet PG10797EJ01V0DS pad : PG2415T6X ELECTRICAL CHARACTERISTICS (T A = +25C, Vcont (H) = 3.0 V, Vcont (L) = 0 V, ZO = 50 , DC blocking capacitors = 8 pF, unless otherwise specified) Parameter Insertion Loss 1 Symbol Lins1 Test Conditions f = 0.05 to 0.5 GHz Note 1 Note 2 MIN. TYP. MAX. Unit 0.35 dB 0.40 0.65 dB Insertion Loss 2 Lins2 f = 0.5 to 2.0 GHz Insertion Loss 3 Lins3 f = 2.0 to 2.5 GHz 0.45 0.70 dB Insertion Loss 4 Lins4 f = 2.5 to 3.8 GHz 0.55 0.80 dB Insertion Loss 5 Lins5 f = 3.8 to 6.0 GHz 0.55 0.80 dB 30 dB 25 28 dB Isolation 1 ISL1 f = 0.05 to 0.5 GHz Note 1 Note 2 Isolation 2 ISL2 f = 0.5 to 2.0 GHz Isolation 3 ISL3 f = 2.0 to 2.5 GHz 25 28 dB Isolation 4 ISL4 f = 2.5 to 3.8 GHz 25 28 dB Isolation 5 ISL5 f = 3.8 to 6.0 GHz 22 26 dB Return Loss 1 RL1 f = 0.05 to 0.5 GHz 20 dB 15 20 dB 15 20 dB 10 15 dB +32.0 dBm +31.0 dBm +36.0 dBm f = 2.0 to 6.0 GHz +35.0 dBm Return Loss 2 RL2 f = 0.5 to 2.0 GHz Return Loss 3 RL3 f = 2.0 to 2.5 GHz Return Loss 4 RL4 f = 2.5 to 6.0 GHz 0.1 dB Loss Compression Input Power 1 dB Loss Compression Input Power Pin (0.1 dB) Note 3 f = 0.5 to 2.0 GHz Note 1 Note 2 Note 2 f = 2.0 to 6.0 GHz Pin (1 dB) Note 4 f = 0.5 to 2.0 GHz Note 2 2nd Harmonics 2f0 f = 2.5 GHz, Pin = +20 dBm 80 dBc 3rd Harmonics 3f0 f = 2.5 GHz, Pin = +20 dBm 80 dBc Input 3rd Order Intercept Point IIP3 f = 2.5 GHz, Pin = +20 dBm +60 dBm Switch Control Current Icont No RF input 0.1 10 A Switch Control Speed tSW 50% CTL to 90/10% RF 50 250 ns Notes 1. DC blocking capacitors = 1 000 pF at f = 0.05 to 0.5 GHz 2. DC blocking capacitors = 56 pF at f = 0.5 to 2.0 GHz 3. Pin (0.1 dB) is the measured input power level when the insertion loss increases 0.1 dB more than that of the linear range. 4. Pin (1 dB) is the measured input power level when the insertion loss increases 1 dB more than that of the linear range. Caution It is necessary to use DC blocking capacitors with this device. The value of DC blocking capacitors should be chosen to accommodate the frequency of operation, bandwidth, switching speed and the condition with actual board of your system. Data Sheet PG10797EJ01V0DS 3 PG2415T6X EVALUATION CIRCUIT Note C1 : 0.05 to 0.5 GHz 1 000 pF : 0.5 to 2.0 GHz 56 pF : 2.0 to 6.0 GHz 8 pF The application circuits and their parameters are for reference only and are not intended for use in actual design-ins. APPLICATION INFORMATION • C1 are DC blocking capacitors external to the device. The value may be tailored to provide specific electrical responses. • The RF ground connections should be kept as short as possible and connected to directly to a good RF ground for best performance. • LESD provides a means to increase the ESD protection on a specific RF port, typically the port attached to the antenna. 4 Data Sheet PG10797EJ01V0DS PG2415T6X TYPICAL CHARACTERISTICS (T A = +25C, Vcont (H) = 3.0 V, Vcont (L) = 0 V, ZO = 50 , DC blocking capacitors = 8 pF, unless otherwise specified) Remark The graphs indicate nominal characteristics. Data Sheet PG10797EJ01V0DS 5 PG2415T6X Remark The graphs indicate nominal characteristics. 6 Data Sheet PG10797EJ01V0DS PG2415T6X MOUNTING PAD AND SOLDER MASK LAYOUT DIMENSIONS 6-PIN PLASTIC TSON (UNIT: mm) Remark The mounting pad and solder mask layouts in this document are for reference only. When designing PCB, please consider workability of mounting, solder joint reliability, prevention of solder bridge and so on, in order to optimize the design. Data Sheet PG10797EJ01V0DS 7 PG2415T6X PACKAGE DIMENSIONS 6-PIN PLASTIC TSON (T6X) (UNIT: mm) 8 Data Sheet PG10797EJ01V0DS PG2415T6X RECOMMENDED SOLDERING CONDITIONS This product should be soldered and mounted under the following recommended conditions. For soldering methods and conditions other than those recommended below, contact your nearby sales office. Soldering Method Infrared Reflow Partial Heating Soldering Conditions Condition Symbol Peak temperature (package surface temperature) : 260C or below Time at peak temperature : 10 seconds or less Time at temperature of 220C or higher : 60 seconds or less Preheating time at 120 to 180C : 12030 seconds Maximum number of reflow processes : 3 times Maximum chlorine content of rosin flux (% mass) : 0.2%(Wt.) or below Peak temperature (terminal temperature) : 350C or below Soldering time (per side of device) : 3 seconds or less Maximum chlorine content of rosin flux (% mass) : 0.2%(Wt.) or below IR260 HS350 Caution Do not use different soldering methods together (except for partial heating). Data Sheet PG10797EJ01V0DS 9 PG2415T6X Caution GaAs Products This product uses gallium arsenide (GaAs). GaAs vapor and powder are hazardous to human health if inhaled or ingested, so please observe the following points. • Follow related laws and ordinances when disposing of the product. If there are no applicable laws and/or ordinances, dispose of the product as recommended below. 1. Commission a disposal company able to (with a license to) collect, transport and dispose of materials that contain arsenic and other such industrial waste materials. 2. Exclude the product from general industrial waste and household garbage, and ensure that the product is controlled (as industrial waste subject to special control) up until final disposal. • Do not burn, destroy, cut, crush, or chemically dissolve the product. • Do not lick the product or in any way allow it to enter the mouth. 10 Data Sheet PG10797EJ01V0DS NOTICE 1. Descriptions of circuits, software and other related information in this document are provided only to illustrate the operation of semiconductor products and application examples. You are fully responsible for the incorporation of these circuits, software, and information in the design of your equipment. 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