RENESAS UPG2411T7C-E3

PreliminaryData Sheet
μPG2411T7C
R09DS0004EJ0100
Rev.1.00
Jun 17, 2010
GaAs Integrated Circuit
SPDT Switch for 2 GHz to 6 GHz
DESCRIPTION
The μPG2411T7C is a GaAs MMIC SPDT (Single Pole Double Throw) switch which was designed for 2 GHz to 6
GHz applications, including dual-band wireless LAN.
This device can operate at frequencies from 2 GHz to 6 GHz, having the low insertion loss and high isolation.
This device is housed in a 6-pin plastic RTSON (Rectangle Thin Small Out-line Non-leaded) package. And this
package is suitable for high-density surface mounting.
FEATURES
• Switch control voltage
•
•
•
•
: Vcont (H) = 3.0 V TYP.
: Vcont (L) = 0 V TYP.
Low insertion loss
: Lins = 0.50 dB TYP. @ f = 2.5 GHz
: Lins = 0.70 dB TYP. @ f = 6.0 GHz
High isolation
: ISL = 25 dB TYP. @ f = 2.5 GHz
: ISL = 25 dB TYP. @ f = 6.0 GHz
Handling power
: Pin (1 dB) = +30.5 dBm TYP. @ f = 2.5 GHz
: Pin (1 dB) = +30.5 dBm TYP. @ f = 6.0 GHz
High-density surface mounting : 6-pin plastic RTSON package (2.0 × 1.3 × 0.37 mm)
APPLICATIONS
• Wireless LAN (IEEE802.11a/b/g/n)
ORDERING INFORMATION
Part Number
μPG2411T7C-E3
Order Number
μPG2411T7C-E3-A
Package
6-pin plastic
RTSON
(Pb-Free)
Marking
G6G
Supplying Form
• Embossed tape 8 mm wide
• Pin 1, 2, 3 face the perforation side of the tape
• Qty 3 kpcs/reel
Remark To order evaluation samples, please contact your nearby sales office.
Part number for sample order: μPG2411T7C
CAUTION
Although this device is designed to be as robust as possible, ESD (Electrostatic Discharge) can damage this
device. This device must be protected at all times from ESD. Static charges may easily produce potentials of
several kilovolts on the human body or equipment, which can discharge without detection. Industry-standard
ESD precautions must be employed at all times.
R09DS0004EJ0100 Rev.1.00
Jun 17, 2010
Page 1 of 9
μPG2411T7C
PIN CONNECTIONS AND INTERNAL BLOCK DIAGRAM
(Top View)
(Top View)
1
G6G
2
3
(Bottom View)
6
RF1
1
Vcont1
6
6
1
5
GND
2
RFC
5
5
2
4
RF2
3
Vcont2
4
4
3
Pin No.
Pin Name
1
2
3
4
5
6
RF1
GND
RF2
Vcont2
RFC
Vcont1
Remark Exposed pad : GND
SW TRUTH TABLE
ON Path
RFC-RF1
RFC-RF2
Vcont1
High
Low
Vcont2
Low
High
ABSOLUTE MAXIMUM RATINGS (TA = +25°C, unless otherwise specified)
Parameter
Switch Control Voltage
Symbol
Vcont
Ratings
Note
+6.0
Unit
V
Pin
PD
TA
Tstg
+31.0
150
−40 to +90
−55 to +150
dBm
mW
°C
°C
Input Power
Power Dissipation
Operating Ambient Temperature
Storage Temperature
Note:
⎪Vcont1 − Vcont2⎪ ≤ 6.0 V
RECOMMENDED OPERATING RANGE (TA = +25°C, unless otherwise specified)
Parameter
Operating Frequency
Switch Control Voltage (H)
Switch Control Voltage (L)
Control Voltage Difference
Symbol
f
Vcont (H)
Vcont (L)
ΔVcont (H),
ΔVcont (L)
MIN.
2.0
2.8
−0.2
−0.1
TYP.
−
3.0
0
0
MAX.
6.0
3.3
0.2
0.1
Unit
GHz
V
V
V
Note
Note:
ΔVcont (H) = Vcont1 (H) − Vcont2 (H)
ΔVcont (L) = Vcont1 (L) − Vcont2 (L)
R09DS0004EJ0100 Rev.1.00
Jun 17, 2010
Page 2 of 9
μPG2411T7C
ELECTRICAL CHARACTERISTICS
(TA = +25°C, Vcont (H) = 3.0 V, Vcont (L) = 0 V, ZO = 50 Ω, DC blocking capacitors = 8 pF,
unless otherwise specified)
Parameter
Insertion Loss
Symbol
Lins
Isolation
ISL
Return Loss
RL
1 dB Loss Compression
Note
Input Power
2nd Harmonics
Pin (1 dB)
2f0
3rd Harmonics
3f0
Switch Control Current
Switch Control Speed
Icont
tSW
Note:
Test Conditions
f = 2.4 to 2.5 GHz
f = 4.9 to 6.0 GHz
f = 2.4 to 2.5 GHz
f = 4.9 to 6.0 GHz
f = 2.4 to 2.5 GHz
f = 4.9 to 6.0 GHz
f = 2.5 GHz
f = 6.0 GHz
f = 2.5 GHz, Pin = +20 dBm
f = 6.0 GHz, Pin = +20 dBm
f = 2.5 GHz, Pin = +20 dBm
f = 6.0 GHz, Pin = +20 dBm
No RF input
50% CTL to 90/10% RF
MIN.
−
−
20
20
11
11
−
−
−
−
−
−
−
−
TYP.
0.50
0.70
25
25
17
17
+30.5
+30.5
80
70
80
70
0.1
20
MAX.
0.8
1.0
−
−
−
−
−
−
−
−
−
−
1.0
100
Unit
dB
dB
dB
dB
dB
dB
dBm
dBm
dBc
dBc
dBc
dBc
μA
ns
Pin (1 dB) is the measured input power level when the insertion loss increases 1 dB more than that of the linear
range.
CAUTION
It is necessary to use DC blocking capacitors with this device.
The value of DC blocking capacitors should be chosen to accommodate the frequency of operation,
bandwidth, switching speed and the condition with actual board of your system.
R09DS0004EJ0100 Rev.1.00
Jun 17, 2010
Page 3 of 9
μPG2411T7C
EVALUATION CIRCUIT
1 000 pF
C1
1
Vcont1
RF1
6
2
RFC
5
C1 Note
3
Vcont2
RF2
4
C1
1 000 pF
Note: C1: 8 pF
The application circuits and their parameters are for reference only and are not intended for use in actual design-ins.
APPLICATION INFORMATION
C1
Switch
C1
LESD
C1
• C1 are DC blocking capacitors external to the device.
The value may be tailored to provide specific electrical responses.
• The RF ground connections should be kept as short as possible and connected to directly to a good RF ground for
best performance.
• LESD provides a means to increase the ESD protection on a specific RF port, typically the port attached to the
antenna.
R09DS0004EJ0100 Rev.1.00
Jun 17, 2010
Page 4 of 9
μPG2411T7C
TYPICAL CHARACTERISTICS
(TA = +25°C, Vcont (H) = 3.0 V, Vcont (L) = 0 V, ZO = 50 Ω, DC blocking capacitors = 8 pF,
unless otherwise specified)
RFC-RF1/RF2
ISOLATION vs. FREQUENCY
RFC-RF1/RF2
INSERTION LOSS vs. FREQUENCY
0
–0.2
–5
–0.4
–10
Isolation ISL (dB)
–0.6
–0.8
–1.0
–1.2
–1.4
–25
–30
–35
–40
–1.8
–45
1
2
5
4
3
–50
0
6
1
2
5
4
3
6
Frequency f (GHz)
Frequency f (GHz)
RFC RETURN LOSS vs. FREQUENCY
RF1/RF2 RETURN LOSS vs. FREQUENCY
0
0
–5
–10
Return Loss RL (dB)
–5
–10
–15
–20
–25
–30
–35
–15
–20
–25
–30
–35
–40
–40
–45
–45
–50
0
1
2
5
4
3
–50
0
6
1
2
5
4
3
6
Frequency f (GHz)
Frequency f (GHz)
RFC-RF1/RF2
INSERTION LOSS, Icont vs. INPUT POWER
RFC-RF1/RF2
INSERTION LOSS, Icont vs. INPUT POWER
f = 2.5 GHz
Lins
–1.0
1.0
0
0.9
–0.5
0.8
–1.5
0.7
–2.0
0.6
–2.5
0.5
–3.0
0.4
–3.5
0.3
–4.0
0.2
Icont
–4.5
–5.0
18
20
22
24
26
28
30
0.1
32
0
34
Input Power Pin (dBm)
Insertion Loss Lins (dB)
0
–0.5
Switch Control Current Icont (μA)
Return Loss RL (dB)
–20
–1.6
–2.0
0
Insertion Loss Lins (dB)
–15
1.0
f = 6.0 GHz
–1.0
0.9
0.8
Lins
–1.5
0.7
–2.0
0.6
–2.5
0.5
–3.0
0.4
–3.5
0.3
–4.0
0.2
Icont
–4.5
–5.0
18
20
22
24
26
28
30
0.1
32
Switch Control Current Icont (μA)
Insertion Loss Lins (dB)
0
0
34
Input Power Pin (dBm)
Remark The graphs indicate nominal characteristics.
R09DS0004EJ0100 Rev.1.00
Jun 17, 2010
Page 5 of 9
RFC-RF1/RF2
Pin (1 dB) vs. SWITCH CONTROL VOLTAGE (H)
34
33
f = 2.5 GHz
32
31
30
29
28
27
26
25
2.5 2.6 2.7 2.8 2.9 3.0 3.1 3.2 3.3 3.4 3.5 3.6
Switch Control Voltage (H) Vcont (H) (V)
1 dB Loss Compression Input Power Pin (1 dB) (dBm)
1 dB Loss Compression Input Power Pin (1 dB) (dBm)
μPG2411T7C
RFC-RF1/RF2
Pin (1 dB) vs. SWITCH CONTROL VOLTAGE (H)
34
33
f = 6.0 GHz
32
31
30
29
28
27
26
25
2.5 2.6 2.7 2.8 2.9 3.0 3.1 3.2 3.3 3.4 3.5 3.6
Switch Control Voltage (H) Vcont (H) (V)
Remark The graphs indicate nominal characteristics.
R09DS0004EJ0100 Rev.1.00
Jun 17, 2010
Page 6 of 9
μPG2411T7C
PACKAGE DIMENSIONS
6-PIN PLASTIC RTSON (UNIT: mm)
(Side View)
(Top View)
1.3±0.1
2.0±0.1
0.37+0.03
–0.05
(Bottom View)
(C0.15)
1.14±0.1
0.5±0.06
A
A
0.15+0.07
–0.05
0.08 MIN.
1.1±0.1
0.2±0.1
Remark A>0
( ): Reference value
R09DS0004EJ0100 Rev.1.00
Jun 17, 2010
Page 7 of 9
μPG2411T7C
RECOMMENDED SOLDERING CONDITIONS
This product should be soldered and mounted under the following recommended conditions. For soldering methods and
conditions other than those recommended below, contact your nearby sales office.
Soldering Method
Infrared Reflow
Partial Heating
Soldering Conditions
Peak temperature (package surface temperature)
Time at peak temperature
Time at temperature of 220°C or higher
Preheating time at 120 to 180°C
Maximum number of reflow processes
Maximum chlorine content of rosin flux (% mass)
: 260°C or below
: 10 seconds or less
: 60 seconds or less
: 120±30 seconds
: 3 times
: 0.2%(Wt.) or below
Peak temperature (terminal temperature)
: 350°C or below
Soldering time (per side of device)
: 3 seconds or less
Maximum chlorine content of rosin flux (% mass) : 0.2%(Wt.) or below
Condition Symbol
IR260
HS350
CAUTION
Do not use different soldering methods together (except for partial heating).
R09DS0004EJ0100 Rev.1.00
Jun 17, 2010
Page 8 of 9
μPG2411T7C
Caution
GaAs Products
This product uses gallium arsenide (GaAs).
GaAs vapor and powder are hazardous to human health if inhaled or ingested, so please observe
the following points.
• Follow related laws and ordinances when disposing of the product. If there are no applicable laws
and/or ordinances, dispose of the product as recommended below.
1. Commission a disposal company able to (with a license to) collect, transport and dispose of
materials that contain arsenic and other such industrial waste materials.
2. Exclude the product from general industrial waste and household garbage, and ensure that the
product is controlled (as industrial waste subject to special control) up until final disposal.
• Do not burn, destroy, cut, crush, or chemically dissolve the product.
• Do not lick the product or in any way allow it to enter the mouth.
R09DS0004EJ0100 Rev.1.00
Jun 17, 2010
Page 9 of 9
μPG2411T7C Data Sheet
Revision History
Rev.
1.00
Date
Jun 17, 2010
Description
Summary
Page
−
First edition issued
All trademarks and registered trademarks are the property of their respective owners.
C-1
Notice
1.
All information included in this document is current as of the date this document is issued. Such information, however, is subject to change without any prior notice. Before purchasing or using any Renesas
Electronics products listed herein, please confirm the latest product information with a Renesas Electronics sales office. Also, please pay regular and careful attention to additional and different information to
be disclosed by Renesas Electronics such as that disclosed through our website.
2.
Renesas Electronics does not assume any liability for infringement of patents, copyrights, or other intellectual property rights of third parties by or arising from the use of Renesas Electronics products or
technical information described in this document. No license, express, implied or otherwise, is granted hereby under any patents, copyrights or other intellectual property rights of Renesas Electronics or
others.
3.
You should not alter, modify, copy, or otherwise misappropriate any Renesas Electronics product, whether in whole or in part.
4.
Descriptions of circuits, software and other related information in this document are provided only to illustrate the operation of semiconductor products and application examples. You are fully responsible for
the incorporation of these circuits, software, and information in the design of your equipment. Renesas Electronics assumes no responsibility for any losses incurred by you or third parties arising from the
use of these circuits, software, or information.
5.
When exporting the products or technology described in this document, you should comply with the applicable export control laws and regulations and follow the procedures required by such laws and
regulations. You should not use Renesas Electronics products or the technology described in this document for any purpose relating to military applications or use by the military, including but not limited to
the development of weapons of mass destruction. Renesas Electronics products and technology may not be used for or incorporated into any products or systems whose manufacture, use, or sale is
prohibited under any applicable domestic or foreign laws or regulations.
6.
Renesas Electronics has used reasonable care in preparing the information included in this document, but Renesas Electronics does not warrant that such information is error free. Renesas Electronics
7.
Renesas Electronics products are classified according to the following three quality grades: "Standard", "High Quality", and "Specific". The recommended applications for each Renesas Electronics product
assumes no liability whatsoever for any damages incurred by you resulting from errors in or omissions from the information included herein.
depends on the product's quality grade, as indicated below. You must check the quality grade of each Renesas Electronics product before using it in a particular application. You may not use any Renesas
Electronics product for any application categorized as "Specific" without the prior written consent of Renesas Electronics. Further, you may not use any Renesas Electronics product for any application for
which it is not intended without the prior written consent of Renesas Electronics. Renesas Electronics shall not be in any way liable for any damages or losses incurred by you or third parties arising from the
use of any Renesas Electronics product for an application categorized as "Specific" or for which the product is not intended where you have failed to obtain the prior written consent of Renesas Electronics.
The quality grade of each Renesas Electronics product is "Standard" unless otherwise expressly specified in a Renesas Electronics data sheets or data books, etc.
"Standard":
Computers; office equipment; communications equipment; test and measurement equipment; audio and visual equipment; home electronic appliances; machine tools;
personal electronic equipment; and industrial robots.
"High Quality": Transportation equipment (automobiles, trains, ships, etc.); traffic control systems; anti-disaster systems; anti-crime systems; safety equipment; and medical equipment not specifically
designed for life support.
"Specific":
Aircraft; aerospace equipment; submersible repeaters; nuclear reactor control systems; medical equipment or systems for life support (e.g. artificial life support devices or systems), surgical
implantations, or healthcare intervention (e.g. excision, etc.), and any other applications or purposes that pose a direct threat to human life.
8.
You should use the Renesas Electronics products described in this document within the range specified by Renesas Electronics, especially with respect to the maximum rating, operating supply voltage
range, movement power voltage range, heat radiation characteristics, installation and other product characteristics. Renesas Electronics shall have no liability for malfunctions or damages arising out of the
use of Renesas Electronics products beyond such specified ranges.
9.
Although Renesas Electronics endeavors to improve the quality and reliability of its products, semiconductor products have specific characteristics such as the occurrence of failure at a certain rate and
malfunctions under certain use conditions. Further, Renesas Electronics products are not subject to radiation resistance design. Please be sure to implement safety measures to guard them against the
possibility of physical injury, and injury or damage caused by fire in the event of the failure of a Renesas Electronics product, such as safety design for hardware and software including but not limited to
redundancy, fire control and malfunction prevention, appropriate treatment for aging degradation or any other appropriate measures. Because the evaluation of microcomputer software alone is very difficult,
please evaluate the safety of the final products or system manufactured by you.
10. Please contact a Renesas Electronics sales office for details as to environmental matters such as the environmental compatibility of each Renesas Electronics product. Please use Renesas Electronics
products in compliance with all applicable laws and regulations that regulate the inclusion or use of controlled substances, including without limitation, the EU RoHS Directive. Renesas Electronics assumes
no liability for damages or losses occurring as a result of your noncompliance with applicable laws and regulations.
11. This document may not be reproduced or duplicated, in any form, in whole or in part, without prior written consent of Renesas Electronics.
12. Please contact a Renesas Electronics sales office if you have any questions regarding the information contained in this document or Renesas Electronics products, or if you have any other inquiries.
(Note 1)
(Note 2)
"Renesas Electronics" as used in this document means Renesas Electronics Corporation and also includes its majority-owned subsidiaries.
"Renesas Electronics product(s)" means any product developed or manufactured by or for Renesas Electronics.
http://www.renesas.com
SALES OFFICES
Refer to "http://www.renesas.com/" for the latest and detailed information.
Renesas Electronics America Inc.
2880 Scott Boulevard Santa Clara, CA 95050-2554, U.S.A.
Tel: +1-408-588-6000, Fax: +1-408-588-6130
Renesas Electronics Canada Limited
1101 Nicholson Road, Newmarket, Ontario L3Y 9C3, Canada
Tel: +1-905-898-5441, Fax: +1-905-898-3220
Renesas Electronics Europe Limited
Dukes Meadow, Millboard Road, Bourne End, Buckinghamshire, SL8 5FH, U.K
Tel: +44-1628-585-100, Fax: +44-1628-585-900
Renesas Electronics Europe GmbH
Arcadiastrasse 10, 40472 Düsseldorf, Germany
Tel: +49-211-6503-0, Fax: +49-211-6503-1327
Renesas Electronics (China) Co., Ltd.
7th Floor, Quantum Plaza, No.27 ZhiChunLu Haidian District, Beijing 100083, P.R.China
Tel: +86-10-8235-1155, Fax: +86-10-8235-7679
Renesas Electronics (Shanghai) Co., Ltd.
Unit 204, 205, AZIA Center, No.1233 Lujiazui Ring Rd., Pudong District, Shanghai 200120, China
Tel: +86-21-5877-1818, Fax: +86-21-6887-7858 / -7898
Renesas Electronics Hong Kong Limited
Unit 1601-1613, 16/F., Tower 2, Grand Century Place, 193 Prince Edward Road West, Mongkok, Kowloon, Hong Kong
Tel: +852-2886-9318, Fax: +852 2886-9022/9044
Renesas Electronics Taiwan Co., Ltd.
7F, No. 363 Fu Shing North Road Taipei, Taiwan, R.O.C.
Tel: +886-2-8175-9600, Fax: +886 2-8175-9670
Renesas Electronics Singapore Pte. Ltd.
1 harbourFront Avenue, #06-10, keppel Bay Tower, Singapore 098632
Tel: +65-6213-0200, Fax: +65-6278-8001
Renesas Electronics Malaysia Sdn.Bhd.
Unit 906, Block B, Menara Amcorp, Amcorp Trade Centre, No. 18, Jln Persiaran Barat, 46050 Petaling Jaya, Selangor Darul Ehsan, Malaysia
Tel: +60-3-7955-9390, Fax: +60-3-7955-9510
Renesas Electronics Korea Co., Ltd.
11F., Samik Lavied' or Bldg., 720-2 Yeoksam-Dong, Kangnam-Ku, Seoul 135-080, Korea
Tel: +82-2-558-3737, Fax: +82-2-558-5141
© 2010 Renesas Electronics Corporation. All rights reserved.
Colophon 1.0