LOW PROFILE TYPE (Chip Common Mode Filter) Engineering Specification MCM1012B Series Features and Application Powerful components with composite co-fired material to solve EMI problem for high speed differential signal transmission line as USB, and LVDS, without distortion to high speed signal transmission MIPI, MHL serial interface in mobile device. PRODUCT DETAIL Imp.Com. (Ω)±25% @100MHz DCR Max. (Ω) Rated Current Max.(m A) Rated Voltage (V) Withstand Voltage (V) Insulation Resistance Min.(MΩ) MCM1012B360F06BP 36 0.50 300 10 25 200 MCM1012B670F06BP 67 0.50 300 10 25 200 MCM1012B900F06BP 90 0.60 300 10 25 200 Part Number ◆ ◆ ◆ ◆ Test Instruments Agilent E4991A RF IMPEDANCE / MATERIAL ANALYZER HP4338 MILLIOHMMETER Agilent E5071C ENA SERIES NETWORK ANALYZER Keithley 2410 1100V SOURCE METER PART NUMBER CODE MCM 1012 B 1 2 3 1: Series name 2: Dimensions L*W 3: Material code 4: Impedance(Ω) ±25% 5: Fixed Decimal Point 6: Rated Current Code A=50mA B=80mA G=400mA H=500mA 90 0 4 F 06 B 5 6 7 P 8 9 (ex：900=90Ω) C=100mA D=150mA E=200mA I=600mA J=700mA K=800mA F=300mA 7: Dimension T (ex : 06=0.60mm) 8:Soldering:Green Parts:A-Soldering Lead-FREE B-Lead-Free for whole chip 9: Packaging style P – Embossed paper tape, 7”reel. UN Semiconductor Co., Ltd. www.unsemi.com.tw @ UN Semiconductor Co., Ltd. Revision December 18, 2014 2014 1/6 Specifications are subject to change without notice. LOW PROFILE TYPE (Chip Common Mode Filter) Engineering Specification MCM1012B Series TYPICAL CHARACTERISTIC MCM1012B360F06BP Fig1. IMPEDANCE vs. FREUQENCY CHARACTERISTICS Fig2. INSERTION LOSS vs. FREUQENCY CHARACTERISTICS MCM2012B670F06BP Fig3. IMPEDANCE vs. FREUQENCY CHARACTERISTICS Fig4. INSERTION LOSS vs. FREUQENCY CHARACTERISTICS UN Semiconductor Co., Ltd. www.unsemi.com.tw @ UN Semiconductor Co., Ltd. Revision December 18, 2014 2014 2/6 Specifications are subject to change without notice. LOW PROFILE TYPE (Chip Common Mode Filter) Engineering Specification MCM1012B Series MCM1012B900F06BP Fig6. INSERTION LOSS vs. FREUQENCY CHARACTERISTICS Fig5. IMPEDANCE vs. FREUQENCY CHARACTERISTICS SHARES AND DIMENSIONS TYPE Dimension L 1.25±0.10 W 1.00±0.10 T 0.60±0.10 P 0.50±0.10 C1 0.30±0.10 C2 0.20±0.15 Unit : mm MEASURING CIRCUITS UN Semiconductor Co., Ltd. www.unsemi.com.tw @ UN Semiconductor Co., Ltd. Revision December 18, 2014 2014 3/6 Specifications are subject to change without notice. LOW PROFILE TYPE (Chip Common Mode Filter) Engineering Specification MCM1012B Series CIRCUIT CONFIGURATION & LAYOUT PAD TAPE AND REEL SPECIFICATIONS / TAPING DIMENSIONS Type : Paper Carrier Unit : mm UN Semiconductor Co., Ltd. Symbol size symbol size A 1.20±0.05 Po 4.00±0.10 B 1.45±0.05 P1 4.00±0.10 W 8.00±0.10 P2 2.00±0.05 E 1.75±0.05 Do 1.55±0.05 F 3.50±0.05 T 0.60±0.03 www.unsemi.com.tw @ UN Semiconductor Co., Ltd. Revision December 18, 2014 2014 4/6 Specifications are subject to change without notice. LOW PROFILE TYPE (Chip Common Mode Filter) Engineering Specification MCM1012B Series REEL DIMENSIONS STANDARD QUANTITY FOR PACKAGING Packaging style : Taping Reel packaging quantity : 4000 pcs/reel Inner box : 5 reel/inner box RECOMMENDED SOLDERING CONDITIONS GENERAL TECHNICAL DATA Opertation temperatur range : -40℃ ~ +85℃ Storage Condition : Less than 40℃ and 70% RH Storage Time: 6 months Max. Soldering method: Reflow or Wave Soldering UN Semiconductor Co., Ltd. www.unsemi.com.tw @ UN Semiconductor Co., Ltd. Revision December 18, 2014 2014 5/6 Specifications are subject to change without notice. LOW PROFILE TYPE (Chip Common Mode Filter) Engineering Specification MCM1012B Series RELIABILITY AND TEST CONDITION Test item Test condition A. Temperature : -40 ~ +85℃ B. Cycle : 100 cycles C. Dwell time : 30minutes Temperature Cycle Measurement : at ambient temperature 24 hrs after test completion Criteria A. No mechanical damage B. Impedance value should be within ± 20 % of the initial value Operational Life A. Temperature : 85℃ ± 5℃ B. Test time : 1000 hrs A. No mechanical damage C. Apply current : full rated current B. Impedance value should be Measurement : at ambient within ± 20 % of the initial temperature 24 hrs after test value completion Biased Humidity A. Temperature : 40 ± 2℃ B. Humidity : 90 ~ 95 % RH A. No mechanical damage C. Test time : 1000 hrs B. Impedance value should be D. Apply current : full rated current within ± 20 % of the initial Measurement : at ambient value temperature 24 hrs after test completion A. Solder temperature : 260 ± 5℃ Resistance to Solder B. Flux : Rosin Heat C. DIP time : 10 ± 1 sec Steam Aging Test A. Temperature : 93 ± 2℃ B. Test time : 4 hrs(MCA) Others : 8 hrs C. Solder temperature : 235 ± 5℃ D. Flux : Rosin E. DIP time : 5 ± 1 sec UN Semiconductor Co., Ltd. A. More than 95 % of terminal electrode should be covered with new solder B. No mechanical damage C .Impedance value should be within ± 20 % of the initial value More than 95 % of terminal electrode should be covered with new solder www.unsemi.com.tw @ UN Semiconductor Co., Ltd. Revision December 18, 2014 2014 6/6 Specifications are subject to change without notice.