WIREWOUND TYPE COMMON MODE FILTER W3 SERIES 1. PART NO. EXPRESSION : W3F900-RD-10 (a) Series code (e) R : Tape & Reel (a)(b)(c) (d) (b) Dimension code (f) Rated Current : D = 400mA (c) Material code (g) 10 : Lead Free (e)(f) (g) (d) Impedance code : 900 = 90 2. CONFIGURATION & DIMENSIONS : F E C A B 1 2 4 3 D2 H G2 2 D2 1 G1 4 3 L D1 D1 PCB Pattern Unit:m/m A B C D1 D2 E F G1 G2 H L 2.0±0.2 1.2±0.2 1.2±0.2 0.45 Typ. 0.40 Typ. 0.17 Typ. 0.27±0.05 1.10 Ref. 0.45 Ref. 1.25 Ref. 2.60 Ref. 3. SCHEMATIC : 1 2 4 3 4. MATERIALS : d (a) Core : Ferrite U Core (b) Wire : Enamelled Copper Wire a c (c) Terminal : Ag / Ni / Sn (d) Capsulate : Ferrite Cap b NOTE : Specifications subject to change without notice. Please check our website for latest information. 14.04.2009 SUPERWORLD ELECTRONICS (S) PTE LTD PG. 1 WIREWOUND TYPE COMMON MODE FILTER W3 SERIES 5. GENERAL SPECIFICATION : a) Operating temp. : -40°C to +85°C b) Storage temp. : -40°C to +85°C 6. ELECTRICAL CHARACTERISTICS : Part No. Common mode Impedance (ȍ) Test Frequency ( MHz ) DCR (ȍ) Max. Rated Current ( mA ) Rated Voltage ( Vdc ) Withstand Voltage ( Vdc ) IR (ȍ) Min. W3F900-RD-10 90±25% 100 0.30 400 50 125 10M W3F121-RD-10 120±25% 100 0.15 400 50 125 10M W3F161-RD-10 160±25% 100 0.35 350 50 125 10M W3F221-RC-10 220±25% 100 0.40 300 50 125 10M W3F371-RA-10 370±25% 100 0.50 100 50 125 10M 7. CHARACTERISTICS CURVES : W3F900-RD-10 WCM2012F2SF-900 W3F121-RD-10 WCM2012F2SF-121 1000 Common Mode 100 IMPEDANCE(Ohm) IMPEDANCE( Ohm) 1000 10 Normal Mode 1 Common Mode 100 10 Normal Mode 1 0.1 0.1 1 10 100 1000 1 10000 10 FREQUENCY(MHz) W3F161-RD-10 WCM2012F2SF-161 1000 10000 W 3F221-RC-10 WCM2012F2SF-221 1000 1000 Common Mode 100 10 Normal Mode 1 Common Mode 100 IMPEDANCE(Ohm) IMPEDANCE(Ohm) 100 FREQUENCY(M Hz) 10 Normal Mode 1 0.1 0.1 1 10 100 1000 10000 1 10 100 1000 10000 FREQUENCY( MHz) FREQUENCY(MHz) W3F371-RA-10 WCM2012F2S-361T01 10000 Common Mode 1000 100 Normal Mode 10 1 0.1 1 10 100 1000 NOTE : Specifications subject to change without notice. Please check our website for latest information. 14.04.2009 SUPERWORLD ELECTRONICS (S) PTE LTD PG. 2 WIREWOUND TYPE COMMON MODE FILTER W3 SERIES 8. RELIABILITY & TEST CONDITION : ITEM PERFORMANCE TEST CONDITION Electrical Characteristics Test Z (common mode) DCR HP-4291A + HP-16092A Refer to standard electrical characteristics list HP-4338B I.R. Zentech 702A (Ultra High Resistance Meter) Rated Current Applied the current to coils the impedance change should be less than ±25% to initial value and temperature rise should not be more than 30°C. Operating Temperature -40°C ~ +85°C Storage Temperature -40°C ~ +85°C Temperature Rise Test 30°C max. (ǻt) 1. Applied the allowed DC current. 2. Temperature measured by digital surface thermometer. Mechanical Performance Test Solderability Test More than 90% of termincal electrode should be covered with solder. Preheating Dipping 245°C 150°C 60 seconds Natural cooling 5±0.5 seconds After fluxing component shall be dipped in a melted solder bath at 245±5°C for 5 seconds. Solder Heat Resistance 1. Components should have not evidence of electrical and mechanical damage. 260°C Preheating Dipping Natural cooling 2. Impedance : within ±25% of initial value. 150°C 60 seconds 10±0.5 seconds Preheat : 150°C 60secs Solder : Sn-Ag3-Cu0.5 Solder temperature : 260±5°C Flux : rosin Dip time : 10±5 secs. Component Adhesion (Push Test) Size F (Kg) W4 (S) 0.8 (min.) W3 (S) 0.5 (min.) W4 (N) 0.8 (min.) W3 (N) 0.5 (min.) The device should be reflow solder (230±5°C for 10 secs.) to a tinned copper substrate. A dynometer force gauge should be applied the side of the component. The device must withstand F(Kg) without failure of the termination attached to component. Core Glass Epoxy Substrate with Copper Clad Component Adhesion (Pull Test) Size F (Kg) W4 (S) 0.8 (min.) W3 (S) 0.5 (min.) W4 (N) 0.8 (min.) W3 (N) 0.5 (min.) F 1. Insert 10cm wire into the remaining open eye bend, the ends of even wire lengths upward and wind together. 2. Terminal shall not be remarkably damaged. NOTE : Specifications subject to change without notice. Please check our website for latest information. 14.04.2009 SUPERWORLD ELECTRONICS (S) PTE LTD PG. 3 WIREWOUND TYPE COMMON MODE FILTER W3 SERIES 8. RELIABILITY & TEST CONDITION : ITEM PERFORMANCE TEST CONDITION Reliabilty Test Temperature : 85±5°C Time : 500±12hr. Recovery : 4 to 24hrs of recovery under the standard condition after the removal from test chamber. High Temperature Life Test Low Temperature Life Test 1. Appearance : No damage. 2. Impedance : within ±25% of initial value. No disconnection or short circuit. Thermal Shock Temperature : -40±5°C Time : 500±12hr. Recovery : 4 to 24hrs of recovery under the standard condition after the removal from test chamber. Conditions of 1 cycle Step Temperature (°C) 1 -40±3 Times (min.) 30±3 2 Room Temperature Within 3 3 85±3 30±3 4 Room Temperature Within 3 Conditions of 1 cycle Total : 10 cycle Recovery : 4 to 24hrs of recovery under the standard condition after the removal from test chamber. Temperature : 40±5°C Humidity : 90 to 95% Applied current : Rated current Time : 500±12hr Recovery : 4 to 24hrs of recovery under the standard condition after the removal from test chamber. Humidity Resistance Random Vibration Test Appearance : Cracking, shipping and any other defects harmful to the characteristics should not be allowed. Impedance: within ±30% Frequency : 10-55-10Hz for 1 min. Amplitude : 1.52mm Directions & times : X, Y, Z directions for 2 hours. A period of 2 hours in each of 3 mutually perpendicular directions (Total 6 hours). NOTE : Specifications subject to change without notice. Please check our website for latest information. 14.04.2009 SUPERWORLD ELECTRONICS (S) PTE LTD PG. 4 WIREWOUND TYPE COMMON MODE FILTER W3 SERIES 9. SOLDERING AND MOUNTING : 9-1. Recommended PC Board Pattern 2 4 PC board should be designed so that products are not sufficient under mechanical stress as warping the board. Products shall be positioned in the sideway direction against the mechanical stress to prevent failure. 1.25 0.45 1 3 1.10 2.60 9-2. Soldering Mildly activated rosin fluxes are preferred. The minimum amount of solder can lead to damage from the stresses caused by the difference in coefficients of expansion between solder, chip and substrate. Our terminations are suitable for all wave and re-flow soldering systems. If hand soldering cannot be avoided, the preferred technique is the utilization of hot air soldering tools. 9-2.1 Solder Re-flow : Recommended temperature profiles for re-flow soldering in Figure 1. 9-2.2 Soldering Iron (Figure 2) : Products attachment with soldering iron is discouraged due to the inherent process control limitations. In the event that a soldering iron must be employed the following precautions are recommended. Note : a) Preheat circuit and products to 150°C. d) 1.0mm tip diameter (max) e) Use a 20 watt soldering iron with tip diameter of 1.0mm b) 280°C tip temperature (max) c) Never contact the ceramic with the iron tip f) Limit soldering time to 3 secs. Soldering Natural cooling Preheating TEMPERATURE °C TEMPERATURE °C Preheating 20~40s TP(260°C/10s max.) 217 200 150 60~150s 60~180s 480s max. 25 Soldering Natural cooling 260 245 150 Time(sec.) Gradual Cooling Over 2min. Figure 1. Re-flow Soldering Within 3s Figure 2. Wave Soldering TEMPERATURE °C Preheating Soldering 3s (max.) 350 Natural cooling 10s (max.) 330 150 Over 1min. Gradual Cooling Figure 3. Hand Soldering NOTE : Specifications subject to change without notice. Please check our website for latest information. 14.04.2009 SUPERWORLD ELECTRONICS (S) PTE LTD PG. 5 WIREWOUND TYPE COMMON MODE FILTER W3 SERIES 10. PACKAGING INFORMATION : 10-1. Reel Dimension D B C A 2±0.5 7" x 8mm 7" x 12mm Type A(mm) B(mm) 7" x 8mm 9.0±0.5 60.0±2.0 C(mm) D(mm) 13.5±0.5 178.0±2.0 13.5±0.5 R10.5 R1.9 R0.5 120° 10-2 Tape Dimension / 8mm D:1.5+0.1 Po:4±0.1 t P Ao A Series Size Bo(mm) Ao(mm) Ko(mm) P(mm) t(mm) W3 (S) 201212 2.35±0.10 1.50±0.10 1.45±0.10 4.0±0.1 0.22±0.05 W4 (S) 321620 3.50±0.10 1.88±0.10 2.10±0.10 4.0±0.1 0.22±0.05 W3 (N) 201209 2.50±0.10 1.60±0.10 1.25±0.10 4.0±0.1 0.22±0.05 W4 (N) 321615 3.50±0.10 1.88±0.10 1.80±0.10 4.0±0.1 0.22±0.05 Bo W:8.0±0.1 A F:3.5±0.05 E:1.75±0.1 P2:2±0.05 Ko Section A-A D1:1±0.1 10-1. Reel Dimension Chip Size W3 W4 Chip / Reel 2000 / 3000 2000 Inner Box 10000 / 15000 10000 Middle Box 50000 / 75000 50000 Carton 100000 / 150000 100000 NOTE : Specifications subject to change without notice. Please check our website for latest information. 14.04.2009 SUPERWORLD ELECTRONICS (S) PTE LTD PG. 6