HCM1012GD900A05P

LOW PROFILE TYPE (Chip Common Mode Filter) Engineering Specification
HCM1012G Series
Features and Application
Powerful components with composite co-fired material to
solve
EMI
problem
for
high
speed differential
signal
transmission line as USB, and LVDS, without distortion to high
speed signal transmission
MIPI, MHL serial interface in mobile device.
PRODUCT DETAIL
Imp.Com.
(Ω)±25%
@100MHz
DCR
Max.
(Ω)
Rated
Current
Max.(m A)
Rated
Voltage
(V)
Insulation
Resistance
Min.(MΩ)
HCM1012GH900A05P
90
1.0
100
10
100
HCM1012GD900A05P
90
1.5
100
10
100
HCM1012GD670A05P
67
1.5
100
10
100
HCM1012GD900B05P
90
3.0
100
10
100
Part Number
◆
◆
◆
◆
Test Instruments
Agilent E4991A RF IMPEDANCE / MATERIAL ANALYZER
HP4338 MILLIOHMMETER
Agilent E5071C ENA SERIES NETWORK ANALYZER
Keithley 2410 1100V SOURCE METER
PART NUMBER CODE
HCM
1012
1
2
G □ 90 0
3 4 5
□
6 7
05
P
8
9
1: Series name
2: Dimensions L*W
3: Material code
4: Product identification number
5: Impedance value
6: Fixed decimal point (ex : 900=90Ω)
7: UN internal code
8: Dimension T (ex : 05=0.50mm)
9: Packaging style P – Embossed paper tape, 7”reel.
UN Semiconductor Co., Ltd.
www.unsemi.com.tw
@ UN Semiconductor Co., Ltd.
Revision December 18, 2014
2014
1/6
Specifications are subject to change without notice.
LOW PROFILE TYPE (Chip Common Mode Filter) Engineering Specification
HCM1012G Series
TYPICAL CHARACTERISTIC
HCM1012GH900A05
Fig1. IMPEDANCE vs. FREUQENCY CHARACTERISTICS
Fig2. INSERTION LOSS vs. FREUQENCY CHARACTERISTICS
HCM1012GD900A05
Fig3. IMPEDANCE vs. FREUQENCY CHARACTERISTICS
Fig4. INSERTION LOSS vs. FREUQENCY CHARACTERISTICS
UN Semiconductor Co., Ltd.
www.unsemi.com.tw
@ UN Semiconductor Co., Ltd.
Revision December 18, 2014
2014
2/6
Specifications are subject to change without notice.
LOW PROFILE TYPE (Chip Common Mode Filter) Engineering Specification
HCM1012G Series
HCM1012GD670A05
Fig5. IMPEDANCE vs. FREUQENCY CHARACTERISTICS
Fig6. INSERTION LOSS vs. FREUQENCY CHARACTERISTICS
HCM1012GD900B05
Fig7. IMPEDANCE vs. FREUQENCY CHARACTERISTICS
Fig8. INSERTION LOSS vs. FREUQENCY CHARACTERISTICS
UN Semiconductor Co., Ltd.
www.unsemi.com.tw
@ UN Semiconductor Co., Ltd.
Revision December 18, 2014
2014
3/6
Specifications are subject to change without notice.
LOW PROFILE TYPE (Chip Common Mode Filter) Engineering Specification
HCM1012G Series
SHARES AND DIMENSIONS
TYPE
Dimension
L
1.25±0.10
W
1.00±0.10
T
0.50±0.10
P
0.50±0.10
C1
0.30±0.10
C2
0.20±0.15
Unit : mm
CIRCUIT CONFIGURATION & LAYOUT PAD
TAPE AND REEL SPECIFICATIONS / TAPING DIMENSIONS
Type : Paper Carrier
Unit : mm
UN Semiconductor Co., Ltd.
Symbol
size
symbol
size
A
1.20±0.05
Po
4.00±0.10
B
1.45±0.05
P1
4.00±0.10
W
8.00±0.10
P2
2.00±0.05
E
1.75±0.05
Do
1.55±0.05
F
3.50±0.05
T
0.60±0.03
www.unsemi.com.tw
@ UN Semiconductor Co., Ltd.
Revision December 18, 2014
2014
4/6
Specifications are subject to change without notice.
LOW PROFILE TYPE (Chip Common Mode Filter) Engineering Specification
HCM1012G Series
REEL DIMENSIONS
STANDARD QUANTITY FOR PACKAGING
Packaging style : Taping
Reel packaging quantity : 4000 pcs/reel
Inner box : 5 reel/inner box
RECOMMENDED SOLDERING CONDITIONS
GENERAL TECHNICAL DATA
Opertation temperatur range : -40℃ ~ +85℃
Storage Condition : Less than 40℃ and 70% RH
Storage Time: 6 months Max.
Soldering method: Reflow or Wave Soldering
UN Semiconductor Co., Ltd.
www.unsemi.com.tw
@ UN Semiconductor Co., Ltd.
Revision December 18, 2014
2014
5/6
Specifications are subject to change without notice.
LOW PROFILE TYPE (Chip Common Mode Filter) Engineering Specification
HCM1012G Series
RELIABILITY AND TEST CONDITION
Test item
Test condition
A. Temperature : -40 ~ +85℃
B. Cycle : 100 cycles
C. Dwell time : 30minutes
Temperature Cycle
Measurement : at ambient
temperature 24 hrs after test
completion
Operational Life
Biased Humidity
Resistance to Solder
Heat
Steam Aging Test
A. Temperature : 85℃ ± 5℃
B. Test time : 1000 hrs
C. Apply current : full rated current
Criteria
A. No mechanical damage
B.Impedance value should be
within ± 20 % of the initial value
A. No mechanical damage
B.Impedance value should be
within ± 20 % of the initial value
Measurement : at ambient
temperature 24 hrs after test
completion
A. Temperature : 40 ± 2℃
B. Humidity : 90 ~ 95 % RH
C. Test time : 1000 hrs
D. Apply current : full rated current
Measurement : at ambient
temperature 24 hrs after test
completion
A. No mechanical damage
B. Impedance value should be
within ± 20 % of the initial value
A. Solder temperature : 260 ± 5℃
B. Flux : Rosin
C. DIP time : 10 ± 1 sec
A. More than 95 % of terminal
electrode should be covered
with new solder
B. No mechanical damage
C.Impedance value should be
within ± 20 % of the initial value
A. Temperature : 93 ± 2℃
B. Test time : 4 hrs
More than 95 % of terminal
electrode should be covered with
new solder
C. Solder temperature : 235 ± 5℃
D. Flux : Rosin
E. DIP time : 5 ± 1 sec
UN Semiconductor Co., Ltd.
www.unsemi.com.tw
@ UN Semiconductor Co., Ltd.
Revision December 18, 2014
2014
6/6
Specifications are subject to change without notice.