uClamp0512Z Ultra Small μClamp® 2-Line ESD Protection PROTECTION PRODUCTS - Z-PakTM Description Features High ESD withstand Voltage: +/-15kV (Contact), μClamp TVS diodes are designed to protect sensitive electronics from damage or latch-up due to ESD. They are designed to replace multilayer varistors (MLVs) in portable applications such as cell phones, notebook computers, and other portable electronics. They feature large cross-sectional area junctions for conducting high transient currents. These devices offers desirable characteristics for board level protection including fast response time, low operating and clamping voltage, and no device degradation. μClamp®0512Z features extremely good ESD protection characteristics highlighted by low typical dynamic resistance, low peak ESD clamping voltage, and high ESD withstand voltage (+/-15kV contact per IEC 61000-4-2). Low typical capacitance (5pF at VR=0V) minimizes loading on sensitive cirucuits. Each device will protect two data lines operating at 5 Volts. μClamp®0512Z is in a 3-pin SLP0603P3X3A package measuring 0.6 x 0.3 mm with a nominal height of only 0.25mm. The leads partially extend up the side of the package for ease of soldering and are finished with lead-free NiAu. The combination of small size and high ESD surge capability makes them ideal for use in portable applications such as cellular phones, digital cameras, and tablets. ® +/-17kV (Air) per IEC 61000-4-2 Able to withstand over 1000 ESD strikes per IEC 61000-4-2 Level 4 1 pack age Ultra-small 020 0201 package Protects two data lines Low reverse current: <3nA typical (VR=5V) Working voltage: +/- 5V Low capacitance: 5pF typical Extremely low dynamic resistance: 0.63 Ohms (Typ) Solid-state silicon-avalanche technology Mechanical Characteristics SLP0603P3X3A package Pb-Free, Halogen Free, RoHS/WEEE Compliant Nominal Dimensions: 0.6 x 0.3 x 0.25 mm Lead Finish: NiAu Molding compound flammability rating: UL 94V-0 Marking : Marking code + dot matrix date code Packaging : Tape and Reel Applications Nominal Dimensions Cellular Handsets & Accessories Keypads, Side Keys, Audio Ports Portable Instrumentation Digital Lines Tablet PC Schematic 0.62 1 3 0.32 0.260 BSC 0.10 0.250 2 Nominal Dimensions (in mm) Revision 1/24/2014 1 www.semtech.com uClamp0512Z PROTECTION PRODUCTS Absolute Maximum Rating R ating Symbol Value Units Peak Pulse Power (tp = 8/20μs) Pp k 30 Watts Maximum Peak Pulse Current (tp = 8/20μs) Ip p 2 Amps VESD +/- 17 +/- 15 kV TJ -40 to +125 °C TSTG -55 to +150 °C ESD per IEC 61000-4-2 (Air)1 ESD per IEC 61000-4-2 (Contact)1 Operating Temperature Storage Temperature Electrical Characteristics (T=25oC) Parameter Symbol Conditions Minimum Reverse Stand-Off Voltage VRWM Between any two pins Reverse Breakdown Voltage V BR It = 1mA Between any two pins Reverse Leakage Current IR VRWM = 5V, T=25°C Between any two pins Clamping Voltage VC IPP = 2A, tp = 8/20μs Between any two pins ESD Clamping Voltage2 VC IPP = 4A, tlp = 0.2/100ns Pin 1 to 2 or 3 to 2 12.5 V ESD Clamping Voltage2 VC IPP = 16A, tlp = 0.2/100ns Pin 1 to 2 or 3 to 2 20 V Dynamic Resistance2, 3 RD tp = 100ns Pin 1 to 2 or 3 to 2 0.63 Ohms Junction Capacitance Cj VR = 0V f = 1MHz Between any two pins 5 6 Typical Maximum Units 5 V 8.2 9.5 V 3 50 nA 15 V 7 pF Notes 1)ESD gun return path connected to ESD ground reference plane. 2)Transmission Line Pulse Test (TLP) Settings: tp = 100ns, tr = 0.2ns, ITLP and VTLP averaging window: t1 = 70ns to t2 = 90ns. 3) Dynamic resistance calculated from ITLP = 4A to ITLP = 16A © 2013 Semtech Corporation 2 www.semtech.com uClamp0512Z PROTECTION PRODUCTS Typical Characteristics Clamping Voltage vs. Peak Pulse Current (tp=8/20us) Non-Repetitive Peak Pulse Power vs. Pulse Time 20 1000 Peak Pulse Power - PPP (W) TA = 25OC 15 Peak Clamping Voltage ‐ VC (V) 100 10 DR040412-30 1 0.1 1 10 10 5 TA = 25OC Waveform: tp= 8x20us 0 100 0 0.5 1 1.5 Peak Pulse Current ‐ IPP (A) Pulse Duration - tp (µs) Junction Capacitance vs. Reverse Voltage 2.5 TLP Characteristic 30 6.0 5.0 25 4.0 20 TLP Current (A) Junction Capacitance ‐ CJ (pF) 2 3.0 2.0 Transmission Line Pulse Test (TLP) Settings: tp = 100ns, tr = 0.2ns, ITLP and VTLP averaging window: t1 = 70ns to t2 = 90ns Pin 1 to Pin 2 and Pin 3 to Pin 2 Pin 1 to Pin 3 15 10 5 1.0 f = 1MHz 0 0.0 0 1 2 Voltage (V) 3 4 0 5 10 15 20 25 30 35 Clamping Voltage (V) ESD Clamping (+8kV Contact per IEC 61000-4-2) ESD Clamping (-8kV Contact per IEC 61000-4-2) 40 5 Pin 1 to Pin3 35 Pin 1 to Pin2 and Pin 3 to Pin 2 30 25 20 15 10 5 Measured with 50 Ohm scope input impedance, 2GHz bandwidth. Corrected for 50 Ohm, 20dB attenuator. ESD gun return path connected to ESD ground plane. 0 Measured with 50 Ohm scope input impedance, 2GHz bandwidth. Corrected for 50 Ohm, 20dB attenuator. ESD gun return path connected to ESD ground plane. 0 Clamping Voltage ‐ VC (V) Clamping Voltage ‐ VC (V) 5 ‐5 ‐10 ‐15 ‐20 ‐25 ‐30 Pin 1 to Pin2 and Pin 3 to Pin 2 ‐35 Pin 1 to Pin3 ‐40 ‐5 ‐10 0 10 20 © 2013 Semtech Corporation 30 40 Time (ns) 50 60 70 ‐10 80 3 0 10 20 30 40 Time (ns) 50 60 70 80 www.semtech.com uClamp0512Z PROTECTION PRODUCTS Typical Characteristics Analog Cross Talk Typical Insertion Loss S21 0 0 ‐10 ‐5 ‐20 ‐10 Insertion Loss ‐ IL (dB) Insertion Loss ‐ IL (dB) ‐30 ‐15 ‐20 ‐25 ‐30 ‐40 ‐50 ‐60 ‐70 ‐80 ‐90 ‐100 ‐35 0 3 30 Frequency (MHz) 300 0.3 3000 3 30 300 3000 Frequency (MHz) Applications Information Assembly Guidelines The small size of this device means that some care must be taken during the mounting process to insure reliable solder joints. The figure at the right details Semtech’s recommended aperture based on the assembly guidelines detailed in the table below. Note that these are only recommendations and should serve only as a starting point for design since there are many factors that affect the assembly process. Exact manufacturing parameters will require some experimentation to get the desired solder application. Assembly Parameter Laser cut, Electro-polished Aper ture shape Rectangular with rounded corners Solder Paste Type Solder Reflow Profile PCB Solder Pad Design PCB Pad Finish © 2013 Semtech Corporation 0.130 0.450 R ecommendation Solder Stencil Design Solder Stencil Thickness 0.325 0.220 0.170 Stencil opening for solder print Solder Mask 0.100 mm (0.004") Land Pattern Type 4 size sphere or smaller All Dimensions are in mm Recommended Mounting Pattern (All dimensions are in mm) Per JEDEC J-STD-020 N on-Solder mask defined OSP OR N iAu 4 www.semtech.com uClamp0512Z PROTECTION PRODUCTS Outline Drawing - SLP0603P3X3A B D A DIMENSIONS MILLIMETERS DIM MIN NOM MAX A A1 b D E e L N aaa bbb E TOP VIEW 0.050 TYP 0.235 0.250 0.265 0.005 0.015 0.050 0.290 0.32 0.350 0.590 0.62 0.650 0.290 0.32 0.350 0.260 BSC 0.090 0.10 0.120 3 0.08 0.10 A SEATING PLANE aaa C C A1 bxN bbb C A B e LxN BOTTOM VIEW NOTES: 1. CONTROLLING DIMENSIONS ARE IN MILLIMETERS(ANGLES IN DEGREES). Land Pattern - SLP0603P3X3A Z Y1 DIMENSIONS DIM C G X Y Y1 Z X G MILLIMETERS (0.275) 0.113 0.430 0.200 0.125 0.750 Y (C) NOTES: 1. CONTROLLING DIMENSIONS ARE IN MILLIMETERS (ANGLES IN DEGREES). 2. THIS LAND PATTERN IS FOR REFERENCE PURPOSES ONLY. CONSULT YOUR MANUFACTURING GROUP TO ENSURE YOUR COMPANY'S MANUFACTURING GUIDELINES ARE MET. © 2013 Semtech Corporation 5 www.semtech.com uClamp0512Z PROTECTION PRODUCTS Marking Code Ordering Information Y Part Number Qty per Reel Pocket Pitch Reel Size uClamp0512Z.TFT 15,000 2mm 7 Inch Note: MicroClamp, uClamp and μClamp are trademarks of Semtech Corporation Note: Device is electrically symmetrical Carrier Tape Specification Y Y Y Date Code Location (Towards Sprocket Holes) Device Orientation in Tape © 2013 Semtech Corporation 6 www.semtech.com uClamp0512Z PROTECTION PRODUCTS Contact Information Semtech Corporation Protection Products Division 200 Flynn Rd., Camarillo, CA 93012 Phone: (805)498-2111 FAX (805)498-3804 © 2013 Semtech Corporation 7 www.semtech.com