SC286 Dual Channel 4A Synchronous Step-Down Regulator POWER MANAGEMENT Features Description Input Voltage Range — 2.9 to 5.5V Output Voltage Range — 0.8V to 3.3V Output Current — up to 4A for each channel Ultra-Small Footprint — <1mm Height Solution Switching Frequency — 1.6MHz Automatic Power Save Mode Efficiency Up to 95% Low Output Noise Across Load Range Excellent Transient Response Start Up into Pre-Bias Output Duty-Cycle Low Dropout Operation — 100% Shutdown Current — <1µA Externally Programmable Soft Start Time Power Good indicator Input Under-Voltage Lockout Output Over-Voltage, Current Limit Protection Over-Temperature Protection Thermally Enhanced 4 x 4 x 0.6 (mm) MLPQ-UT28 package Lead-free, Halogen free, and RoHS/WEEE compliant Applications Routers and Network Cards LCD TV Office Automation Printers The SC286 is a dual channel 4A synchronous step-down regulator designed to operate with an input voltage range of 2.9V to 5.5V. Each channel offers fifteen predetermined output voltages via separate control pins programmable from 0.8 to 3.3 Volts. The control pins allow for on-the-fly voltage changes, enabling system designers to implement dynamic power savings. The device is also capable of adjusting output voltage via an external resistor divider. The SC286 is optimized for maximum efficiency over a wide range of load currents. During full load operation, the device operates in PWM mode with fixed 1.6MHz oscillator frequency, allowing the use of small surface mount external components. As the load decreases, the regulator will transition into Power Save mode maintaining high efficiency. Connecting the control pins to logic low forces the device into shutdown mode reducing the supply current to less than 1μA. Connecting any of the control pins to logic high enables the converter and sets the output voltage according to Table 1. Other features include under-voltage lockout, programmable soft-start to limit in-rush current, power good indicator, over-temperature protection, and output short circuit protection. The SC286 is available in a thermally-enhanced, 4 x 4 x 0.6 (mm) MLPQ-UT28 package and has a rated temperature range of -40 to +85°C. Typical Application Circuit VINA CINA 22µF RPGOODA 100kΩ RAVINA 1Ω CAVINA 0.1µF LA 1.0µH PVINA AVINA SC286 AGNDA PGOODA VINB CINB 22µF RPGOODB 100kΩ RAVINB 1Ω CAVINB 0.1µF PVINB AVINB AGNDB CTL0A CTL1A CTL2A CTL3A Revision 2.0 PGOODB CTL0A CTL1A CTL2A CTL3A LXA VOUTA LB 1.0µH LXB VOUTB SSA PGNDA SSB PGNDB CTL0B CTL1B CTL2B CTL3B © 2011 Semtech Corporation CSSA 1nF COUTA 47µF COUTB 47µF VOUTA VOUTB CSSB 1nF CTL0B CTL1B CTL2B CTL3B SC286 LXA PGNDA VOUTB SSB PGOODB CTL3B Ordering Information LXA Pin Configuration 28 28 26 25 24 23 22 2 20 CTL1B AGNDA 3 19 CTL0B AVINA 4 18 AVINB CTL0A 5 17 AGNDB CTL1A 6 16 PVINB CTL2A 7 15 PVINB 10 11 12 13 Package SC286ULTRT(1)(2) 4 x 4 x 0.6 (mm) MLPQ-UT28 SC286EVB Evaluation Board Notes: (1) Available in tape and reel only. A reel contains 3,000 devices. (2) Device is lead-free, Halogen free, and RoHS/WEEE compliant. 14 LXB 9 LXB 8 PGNDB PVINA VOUTA CTL2B SSA 21 PGOODA 1 CTL3A PVINA Device 4 x 4 x 0.6 (mm) MLPQ-UT28 θJA = 32.5°C/W; θJC = 7°C/W Marking Information SC286 yyww XXXXX XXXXX yyww = Date code XXXXX = Semtech Lot number XXXXX = Semtech Lot number Table 1 – Output Voltage Settings for Each Channel CTL3A/B CTL2A/B CTL1A/V CTL0A/B Output Voltage 0 0 0 0 Shutdown 0 0 0 1 0.8 0 0 1 0 1.00 0 0 1 1 1.025 0 1 0 0 1.05 0 1 0 1 1.20 0 1 1 0 1.25 0 1 1 1 1.30 1 0 0 0 1.50 1 0 0 1 1.80 1 0 1 0 2.20 1 0 1 1 2.50 1 1 0 0 2.60 1 1 0 1 2.80 1 1 1 0 3.00 1 1 1 1 3.30 SC286 Absolute Maximum Ratings Recommended Operating Conditions PVINA/B and AVINA/B Supply Voltages (V) . . . -0.3 to +6.0 PVINA/B and AVINA/B Supply (V) . . . . . . . . . . 2.9 to +5.5 LXA, LXB (V) (1) . . . . . . . . . . . . . . . . -0.3 to PVIN +0.3V, 6V Max Maximum Output Current, Each Channel (A). . . . . . . . . 4.0 VOUTA, VOUTB (V). . . . . . . . . . . . . . . . . . . -0.3 to AVIN + 0.3 Input Capacitor, Each Channel (µF). . . . . . . . . . . . . . . . . . 22 CTLxA, CTLxB pins (V). . . . . . . . . . . . . . . . . -0.3 to AVIN + 0.3 Output Capacitor, Each Channel (µF) . . . . . . 47 or 2 x 22 VOUTA, VOUTB Short Circuit Duration . . . . . . Continuous Output Inductor, Each Channel (µH) . . . . . . . . . . . . . . . . 1.0 ESD Protection Level(2) (kV) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 Thermal Information Thermal Resistance, Junction to Ambient(3) (°C/W) . . 32.5 Thermal Resistance, Junction to Case (°C/W) . . . . . . . . . . . 7 Maximum Junction Temperature (°C). . . . . . . . . . . . . . . +150 Storage Temperature Range (°C) . . . . . . . . . . . . -65 to +150 Peak IR Reflow Temperature (10s to 30s) (°C) . . . . . . . +260 Exceeding the absolute maximum ratings may result in permanent damage to the device and/or device malfunction. Operation outside of the parameters specified in the Electrical Characteristics section is not recommended. Notes: (1) Due to parasitic board inductance, the transient LX pin voltage at the point of measurement may appear larger than that which exists on silicon. The device is designed to tolerate the short duration transient voltages that will appear on the LX pin due to the deadtime diode conduction, for inductor currents up to the current limit setting of the device. (2) Tested according to JEDEC standard JESD22-A114-B. (3) Calculated from package in still air, mounted to 3 x 4.5 (in), 4 layer FR4 PCB with thermal vias under the exposed pad per JESD51 standards. Electrical Characteristics Unless specified: PVIN = AVIN = 5.0V, VOUT = 1.50V, CIN = 22µF, COUT = 2 x 22µF; L = 1.0µH; -40°C≤ TJ ≤ +125 °C; Per Channel Unless otherwise noted; Typical values are TA = +25 °C. Parameter Symbol Under-Voltage Lockout Conditions Min Typ Max Units Rising AVINA/B; PVINA/B=AVINA/B 2.70 2.80 2.90 V UVLO Hysteresis Output Voltage Tolerance(1) 300 ΔVOUT PVINA/B= AVINA/B= 2.9 to 5.5V; IOUT=0A -1.25 ILIMIT Peak LX current 5.0 IQ IOUTA/B = 0A 100 ISHDN CTL3-0A/B = AGNDA/B 1 High Side Switch Resistance(2) RDSON_P ILXA./B= 100mA, TJ= 25 °C 50 Low Side Switch Resistance(2) RDSON_N ILXA/B= -100mA, TJ= 25 °C 35 PVINA/B = AVINA/B= 5.5V; LXA/B= 0V; CTL3-0A/B = AGNDA/B 1 Current Limit Supply Current Shutdown Current LX Leakage Current (2) ILK(LX) PVINA/B = AVINA/B = 5.5V; LXA/B = 5.0V; CTL3-0A/B = AGNDA/B 6.0 mV +1.25 % 7.0 A µA 10 µA mΩ 10 µA -20 -1 SC286 Electrical Characteristics (continued) Parameter Symbol Conditions Load Regulation ΔVLOAD-REG PVINA/B = AVINA/B = 5.0V, IOUT=800mA to 4A Oscillator Frequency fOSC Soft-Start Charging Current(2) ISS Max ±0.3 1.275 1.600 Units % 1.925 MHz µA 1 A 10 Ω VOUTA/B rising 90 % Asserted 2 ms PGOODA/B= Low 20 µs tEN_DLY From CTLX Input High to SS starts rising 50 µs ICTLx CTLX =AVINA/B or AGNDA/B ICL_HOLD Impedance of PGOOD Low RPGOOD_LO PGOOD Threshold VPG_TH PGOOD Delay VPG_DLY CTLX Input Current(2) Typ +5 Foldback Holding Current CTLX Delay Min CTLX Input High Threshold VCTLx_HI CTLX Input Low Threshold VCTLx_LO Average LX Current -2.0 2.0 1.2 V 115 0.4 V 120 % VOUTA/B Over Voltage Protection VOVP Thermal Shutdown Temperature TSD 160 °C TSD_HYS 10 °C Thermal Shutdown Hysteresis 110 µA Notes: (1) The “Output Voltage Tolerance” includes output voltage accuracy, voltage drift over temperature and the line regulation. (2) A negative current means the current flows into the pin and a positive current means the current flows out from the pin. SC286 Pin Descriptions Pin # Pin Name Pin Function 1, 2 PVINA Input supply voltage for the converter power stage 3 AGNDA Ground connection for the internal circuitry — AGNDA needs to be connected to PGNDA directly. 4 AVINA Power supply for the internal circuitry — AVINA is required to be connected to PVINA through an R-C filter of 1Ω and 100nF. 5, 6, 7, 8 CTLXA Control bit — see Table 1 for decoding. These pins have 500kΩ internal pull-down resistors which are switched into the circuit whenever CTLXA is low or when the part is in under-voltage lockout. 9 PGOODA Power good indicator — when the output voltage reaches the PGOODA threshold, this pin will be open-drain (after the PGOODA delay), otherwise, it is pulled low internally. 10 SSA Soft Start — connect a soft-start capacitor to program the soft start time. There is a 5µA charging current flowing out of the pin. 11 VOUTA Output voltage sense pin 12 PGNDB Ground connection for converter power stage 13, 14 LXB 15, 16 PVINB Input supply voltage for the converter power stage 17 AGNDB Ground connection for the internal circuitry — AGNDB needs to be connected to PGNDB directly. 18 AVINB Power supply for the internal circuitry — AVINB is required to be connected to PVINB through an R-C filter of 1Ω and 100nF. 19, 20, 21, 22 CTLXB Control bit — see Table 1 for decoding. These pins have 500kΩ internal pull-down resistors which are switched into the circuit whenever CTLXB is low or when the part is in under-voltage lockout. 23 PGOODB Power good indicator — when the output voltage reaches the PGOODB threshold, this pin will be open-drain (after the PGOODB delay), otherwise, it is pulled low internally. 24 SSB Soft Start — connect a soft-start capacitor to program the soft start time. There is a 5µA charging current flowing out of the pin. 25 VOUTB Output voltage sense pin 26 PGNDA Ground connection for converter power stage 27, 28 LXA T Thermal Pad Switching node — connect an inductor between this pin and the output capacitor. Switching node — connect an inductor between this pin and the output capacitor. Thermal pad for heat sinking purposes — recommend to connect to PGND. It is not connected internally. SC286 Block Diagram Current Amp AVINA A PVINA B LXA 26 PGNDA 9 PGOODA C PVINB D LXB 12 PGNDB 23 PGOODB 4 Plimit Amp Oscillator and Slope Generator VOUTA Control Logic 11 PWM CTL0A CTL1A 5 6 CTL2A 7 CTL3A 8 SSA 10 AGNDA 3 Error Amp Voltage Select c Comp 500mV Ref PGOOD Detector Delay Current Amp AVINB 18 Plimit Amp Oscillator and Slope Generator VOUTB 25 CTL0B 19 Control Logic PWM CTL1B 20 CTL2B 21 CTL3B 22 SSB 24 AGNDB 17 Error Amp Voltage Select 500mV Ref NOTES: A = Pins 1,2 B = Pins 27, 28 c Comp PGOOD Detector Delay C = Pins 15, 16 D = Pins 13, 14 SC286 Typical Characteristics Circuit Conditions: CIN = 22µF/6.3V, COUT = 2 x 22µF/6.3V, CSS = 10nF. Unless otherwise noted, L = 1.0µH (TOKO: FDV0530S-1R0), each device Total Loss Efficiency TA = 25 °C 100 TA = 25 °C 2000 VIN = 5V; VOUT = 3.3V 95 1600 VIN = 5V; VOUT = 3.3V 85 VIN = 3V; VOUT = 1.5V 80 VIN = 3.3V; VOUT = 1.5V 1200 VIN = 5V; VOUT = 1.5V Loss (mW) Efficiency (%) 90 75 800 VIN = 5V; VOUT = 1.5V 70 400 65 60 0 0 0.1 Output current (A) 1.0 10.0 0 ILX = ±100mA, TA = 25°C 20 2.5 3.5 3.0 4.0 ILX = ±100mA, TA = 25°C 15 25 10 20 P-Channel Variation (%) Variation (%) 2.0 RDS(ON) Variation vs. Temperature 30 15 10 5 0 P-Channel -5 5 N-Channel -10 0 N-Channel -15 -5 -10 1.5 1.0 Output current (A) RDS(ON) Variation vs. Input Voltage 35 0.5 3.5 3.0 2.5 4.0 4.5 Input Voltage (V) 5.5 5.0 -20 -40 -15 35 10 Ambient Temperature (°C) 60 85 Load Regulation 2.0 TA = 25 °C Regulation (%) 1.5 VIN = 5V; VOUT = 1.5V VIN = 3.3V; VOUT = 1.5V 1.0 VIN = 5V; VOUT = 3.3V 0.5 0 -0.5 0 0.5 1 1.5 2 2.5 Output current (A) 3 3.5 4 4.5 SC286 Typical Characteristics (continued) Circuit Conditions: CIN = 22µF/6.3V, COUT = 2 x 22µF/6.3V, CSS = 10nF. Unless otherwise noted, L = 1.0µH (TOKO: FDV0530S-1R0), each device Output Voltage Ripple (VOUT=1.5V) Output Voltage Ripple (VOUT=1.5V) VIN = 5V, = IOUT = 0 VIN = 3.3V, = IOUT = 0 VOUT (50mV/div) VOUT (50mV/div) VIN (2V/div) VIN (2V/div) LX (2V/div) LX (2V/div) ISW (1A/div) ISW (1A/div) Time (500n������ s����� /div) Time (500n������ s����� /div) Output Voltage Ripple (VOUT=1.5V) @ Full Load Output Voltage Ripple (VOUT=1.5V) @ Full Load VIN = 3.3V, = IOUT = 4A VIN = 5V, = IOUT = 4A VOUT (10mV/div) VOUT (10mV/div) IL (1A/div) IL (1A/div) VIN (2V/div) VIN (2V/div) LX (1V/div) LX (1V/div) Time (500n������ s����� /div) Time (500n������ s����� /div) SC286 Typical Characteristics (continued) Circuit Conditions: CIN = 22µF/6.3V, COUT = 2 x 22µF/6.3V, CSS = 10nF. Unless otherwise noted, L = 1.0µH (TOKO: FDV0530S-1R0), each device Output Voltage Ripple (VOUT = 3.3V) @ No Load Output Voltage Ripple (VOUT = 3.3V) @ Full Load VIN = 5V, = IOUT = 4A; VOUT = 3.3V VIN = 5V, = IOUT = 0; VOUT = 3.3V VOUT (20mV/div) VOUT (50mV/div) VIN (2V/div) VIN (2V/div) LX (2V/div) ISW (1A/div) LX (2V/div) ISW (1A/div) Time (500n������ s����� /div) Time (500n������ s����� /div) Start Up (CTLX) — Full Load Start Up (CTLX) — No Load VIN = 5V, = IOUT = 0; VOUT = 1.5V VIN = 5V, = IOUT = 4A; VOUT = 1.5V VCTLx (5V/div) VCTLx (5V/div) PGOOD (5V/div) PGOOD (5V/div) VOUT (1V/div) VOUT (1V/div) IOUT (5V/div) IOUT (5V/div) Time (500n������ s����� /div) Time (500n������ s����� /div) SC286 Typical Characteristics (continued) Circuit Conditions: CIN = 22µF/6.3V, COUT = 2 x 22µF/6.3V, CSS = 10nF. Unless otherwise noted, L = 1.0µH (TOKO: FDV0530S-1R0), each device Start Up (CTLX) — Full Load Start Up (CTLX) — No Load VIN = 5V, = IOUT = 0; VOUT = 3.3V VIN = 5V, = IOUT = 0; VOUT = 3.3V VCTLx (5V/div) VCTLx (5V/div) PGOOD (5V/div) PGOOD (5V/div) VOUT (2V/div) VOUT (2V/div) IOUT (5A/div) IOUT (5A/div) Time (500µ������ s����� /div) Start Up into Pre-Biased Output (VOUT=1.5V) Time (500µ������ s����� /div) Start Up into Pre-Biased Output (VOUT=3.3V) VCTLx (5V/div) VCTLx (5V/div) PGOOD (5V/div) PGOOD (5V/div) VOUT (1V/div) VOUT (2V/div) IOUT (5V/div) IOUT (5V/div) Time (500n������ s����� /div) Time (500n������ s����� /div) Start Up into Output Short Circuit VIN = 5V LX (5V/div) VOUT (500mV/div) VSS (1V/div) ILX (2A/div) Time (500n������ s����� /div) 10 SC286 Typical Characteristics (continued) Circuit Conditions: CIN = 22µF/6.3V, COUT = 2 x 22µF/6.3V, CSS = 10nF. Unless otherwise noted, L = 1.0µH (TOKO: FDV0530S-1R0), each device Recovery from Short Circuit Output Short Circuit VIN = 5V; VOUT = 1.5V VIN = 5V; VOUT = 1.5V VLX (5V/div) VLX (5V/div) PGOOD (5V/div) VOUT (1V/div) PGOOD (5V/div) VOUT (1V/div) IOUT (5V/div) IOUT (2V/div) Time (20µ������ s����� /div) Time (20µ������ s����� /div) Output Short Circuit Recovery from Short Circuit VIN = 5V; VOUT = 3.3V VIN = 5V; VOUT = 3.3V VLX (5V/div) VLX (5V/div) VOUT (2V/div) PGOOD (5V/div) VOUT (2V/div) IOUT (2V/div) IOUT (5V/div) Time (20µ������ s����� /div) Time (20µ������ s����� /div) Transient Response (VOUT=1.5V, ISTEP=2A) Transient Response (VOUT=3.3V, ISTEP=2A) VIN = 5V; IOUT = 1A to 3A to 1A VIN = 5V; IOUT = 1A to 3A to 1A VOUT (100mV/div) VOUT (100mV/div) IOUT (1A/div) IOUT (1A/div) Time (20µ������ s����� /div) Time (20µ������ s����� /div) 11 SC286 Typical Characteristics (continued) Circuit Conditions: CIN = 22µF/6.3V, COUT = 2 x 22µF/6.3V, CSS = 10nF. Unless otherwise noted, L = 1.0µH (TOKO: FDV0530S-1R0), each device Transient Response (VOUT=1.5V, ISTEP=3A) Transient Response (VOUT=3.3V, ISTEP=3A) VOUT = 5V; IOUT = 0A to 3A to 0A VIN = 5V; IOUT = 0A to 3A to 0A VID Transition — Full Load VID Transition — No Load VIN = 5V; VOUT = 1.5V to 1.8V to 1.5V VIN = 5V; VOUT = 1.5V to 1.8V to 1.5V VOUT (200mV/div) VOUT (200mV/div) IOUT (2A/div) IOUT (2A/div) Time (400m������ s����� /div) Time (100m������ s����� /div) 12 SC286 Applications Information Detailed Description The SC286 is a two channel synchronous step-down PWM (Pulse Width Modulated), DC-DC converter utilizing a 1.6MHz fixed-frequency voltage mode architecture. Both channels are designed to operate in fixed-frequency PWM mode and will enter PSAVE (power save) mode at light loads to maximize efficiency. The switching frequency is chosen to minimize the size of the external inductor and capacitors while maintaining high efficiency. Both channels run independently Operation During normal operation, the PMOS MOSFET is activated on each rising edge of the internal oscillator. The period is set by the onboard oscillator when in PWM mode. The device has an internal synchronous NMOS rectifier and does not require a Schottky diode on the LX pin. The device operates as a buck converter in PWM mode with a fixed frequency of 1.6MHz at medium to high loads. At light loads the part will enter PSAVE mode to maximize efficiency. If the output load current increases enough to cause VOUT to decrease below the PSAVE exit threshold (VOUT -4%), the device automatically exits PSAVE and operates in continuous PWM mode. Note that the PSAVE high and low threshold levels are both set at or above V OUT to minimize undershoot when the SC286 exits PSAVE. Figure 1 illustrates the transitions from PWM mode to PSAVE mode and back to PWM mode. Load Demand (IOUT ) VOUT +2% VOUT BURST VOUT -4% Power Save Mode Operation When the load current decreases below the PSAVE threshold, PWM switching stops and each channel automatically enters PSAVE mode. This threshold varies depending upon the input voltage and output voltage setting, optimizing efficiency for all possible load currents. While in PSAVE mode, output voltage regulation is controlled by a series of bursts in switching. During a burst, the inductor current is limited to a peak value which controls the on-time of the PMOS switch. After reaching this peak, the PMOS switch is disabled and the inductor current is forced to near 0mA. Switching bursts continue until the output voltage climbs to VOUT +2% or until the PSAVE current limit is reached. Switching is then stopped to eliminate switching losses, enhancing overall efficiency. Switching resumes when the output voltage reaches the lower threshold of VOUT and continues until the upper threshold again is reached. Note that the output voltage is regulated hysteretically while in PSAVE mode between VOUT and VOUT + 2%. The period and duty cycle while in PSAVE mode are solely determined by VIN and VOUT until PWM mode resumes. This can result in the switching frequency being much lower than the PWM mode frequency. OFF VLX PWM Mode at Medium / High Load PSAVE EXIT PSAVE Mode at Light Load PWM Mode at Medium / High Load Time Figure 1 — Transitions between PWM and PSAVE Modes Protection Features The SC286 provides the following protection features for each independent channel: • • • • Current Limit Over-Voltage Protection Soft-Start Operation Thermal Shutdown Current Limit & OCP The internal PMOS power device in the switching stage for each channel is protected by a current limit feature. If the inductor current is above the PMOS current limit for 16 consecutive cycles, the part enters foldback current limit mode and the output current is limited to the current limit holding current (ICL_HOLD) which is approximately 1A. 13 SC286 Applications Information (continued) Under this condition, the output voltage will be the product of ICL_HOLD and the load resistance. When the load presented falls below the current limit holding level, the output will charge to the upper PSAVE voltage threshold and return to normal operation. The SC286 is capable of sustaining an indefinite short circuit without damage. During soft start, if current limit has occurred before the SS voltage has reached 400mV, the part enters foldback current limit mode. Foldback current limit mode will be disabled during softstart after the SS voltage is higher than 400mV. VINA CINA 22µF The SC286 has fifteen pre-determined output voltage values which can be individually selected for each channel by programming the CTL input pins (see Table 1 — Output Voltage Settings). Each CTL pin has an active 500kΩ internal pull-down resistor. The 500kΩ resistor is switched in circuit whenever the CTL input voltage is below the input threshold, or when the part is in under voltage lockout. It is recommended to tie all high CTL pins together and use an external pull-up resistor to AVIN if there is no enable signal or if the enable input is an open drain/collector signal. The CTL pins may be driven by a microprocessor to allow dynamic voltage adjustment for systems that reduce the supply voltage when entering sleep states. Avoid all zeros being present on the CTL pins when changing programmable output voltages as this would disable the device. SC286 is also capable of regulating a different (higher) output voltage, which is not shown in the Table 1, via an external resistor divider for each channel. There will be a typical 2μA current flowing into the VOUTA/B pin. The typical schematic for an adjustable output voltage option from the standard 1.0V with CTLXA/B = [0010], is shown in Figure 2. RFB1A/B and RFB2A/B are used to adjust the desired output voltage. If the RFB2A/B current is such that the 2μA VOUTA/B pin current can be ignored, then RFB1A/ B can be found using the next equation. RFB2A/B needs to be low enough in value for the current through the resistor chain to be at least 20μA in order to ignore the VOUTA/B pin current. RAVINA 1Ω CAVINA 0.1µF PVINA L SC286 AVINA AGNDA VINB CINB 22µF RPGOODA 100kΩ RAVINB 1Ω CAVINB 0.1µF VOUTA LXA CFFA RFB1A VOUTA PGOODA RFB2A 10kΩ RFB1A = (VOUTA -1) x RFB2A for CTLAX = 0010 (1.0V) PVINB AVINB COUTA L VOUTB LXB AGNDB CFFB RFB1B COUTB PGOODB Enable A CTL0A VOUTB CTL1A RFB2B 10kΩ RFB1B = (VOUTB -1) x RFB2B for CTLBX = 0010 (1.0V) CTL2A Over-Voltage Protection In the event of a 15% over-voltage on each independent output, the PWM drive is disabled with the LX pin floating. Switching does not resume until the output voltage falls below the nominal VOUT regulation voltage. Programmable Output Voltage RPGOODA 100kΩ CTL3A Enable B SSA PGNDA CTL0B CTL1B CTL2B CTL3B SSB PGNDB CSS 1nF CSS 1nF Figure 2 — Output Voltage Programming R FB1 VOUT VOSTD u R FB2 VOSTD where VOSTD is the pre-determined output voltage via the CTL pins. CFF is needed to maintain good transient response performance. The correct value of CFF can be found using the following equation. CFF [nF] 2 VOUT 0.5 VOSTD 2 .5 u u( ) R FB1 [k:] u VOUT VOSTD VOSTD 0.5 To simplify the design, it is recommended to program the desired output voltage from a standard 1.0V as shown in Figure 2 with a proper CFF calculated from Equation 2. For programming the output voltage from other standard voltages, RFB1, RFB2 and CFF need to be adjusted to conform to the previous equations. Maximum Power Dissipation Each channel of SC286 has its own ΘJA of 32.5°C/W when only one channel is in operation. Since both channels are within the same package, there is about 50% of the heat generated which will be transferred to the adjacent channel. The equivalent total thermal impedance will be higher when the neighboring channel is also in operation. 14 SC286 Applications Information (continued) To guarantee an operating junction temperature of less than 125°C, Figure 3 shows the maximum allowable total power loss versus temperature. The curve is based upon the junction temperature of either channel reaching a maximum of 125°C. Each channel of SC286 can support up to 4A load current. Figure 4 shows the maximum allowable power loss in channel B versus power loss in channel A for a range of temperatures. 4.5 Total Power Loss (W) 4 VIN = 5V; VOUT = 1.2V 3.5 3 2.5 25 35 45 55 65 75 Ambient Temperature (°C) 85 95 105 Figure 3 — Maximum allowable total loss versus temperature for a maximum junction temperature of 125°C 1.8 Power Loss of Channel B (W) 1.6 TA = 25°C 1.4 TA = 55°C TA = 70°C 1.2 1 TA = 85°C 0.8 When all CTL pins for a channel are low, the device will run in shutdown mode, drawing less than 1μA from the input power supply. The internal switches and band-gap voltage will be immediately turned off. Thermal Shutdown The device has an independent thermal shutdown feature for each channel to protect the SC286 if the junction temperature exceeds 160°C. During thermal shutdown, the on-chip power devices are disabled, floating the LX output. When the temperature drops by 10°C, it will initiate a soft start cycle to resume normal operation. Under-Voltage Lockout VIN = 5V; VOUT = 3.3V VIN = 3.3V; VOUT = 1.2V 2 Shut Down Under-Voltage Lockout (UVLO) is enabled when the input voltage for each channel drops below the UVLO threshold. This prevents the device from entering an ambiguous state in which regulation cannot be maintained. Hysteresis of approximately 300mV is included to prevent chattering near the threshold. When the AVIN voltage rises back to the turn-on threshold and CTLX is high, the soft-start mode is initiated. Power Good The power good (PGOOD) for each channel is an opendrain output. When the output voltage for each channel drops below 10% of the nominal voltage, the PGOOD pin for that channel is pulled low after a 20μs delay. During start-up, PGOOD will be asserted 1.8ms (typ.) after the output voltage reaches 90% of the final regulation voltage. The faults of over voltage, fold-back current limit mode and thermal shutdown will force PGOOD low after a 20µs delay. When recovering from a fault, PGOOD will be asserted 2ms (typ.) after Vout reaches 90% of the final regulation voltage. 0.6 0.4 0.2 0 0 0.2 0.4 0.6 0.8 1 1.2 Power Loss of Channel A (W) 1.4 1.6 1.8 Figure 4 — Maximum allowable power loss in channel B versus power loss in channel A for a range of temperatures (both channels same current) 15 SC286 Applications Information (continued) Soft-Start The soft-start mode is activated for each channel after AVIN reaches it’s UVLO voltage threshold and CTLXA/B is set high to enable the part. Recovery from a thermal shutdown event will also activate the soft start sequence. The soft-start mode controls the slew-rate of the output voltage during start-up thus limiting in-rush current on the input supply. During start-up, the reference voltage for the error amplifier is clamped by the voltage on SS pin. The output voltage slew rate during soft-start is determined by the value of the external capacitor connected to the SS pin and the internal 5µA charging current. The device requires a minimum soft-start time from enable to final regulation in the order of 200µs, including the 50µs enable delay. As a result the soft start capacitor, Css, should be higher than 1.5nF. During start up, the chip operates in forced PWM mode. In general, the inductor is chosen to set the inductor ripple current to approximately 30% of the maximum output current. It is recommended to use a typical inductor value of 1μH to 2.2μH with output ceramic capacitors of 44μF or higher capacitance. Lower inductance should be considered in applications where faster transient response is required. More output capacitance will reduce the output deviation for a particular load transient. When using low inductance, the maximum peak inductor current at any condition (normal operation and start up) can not exceed 5A which is the guaranteed minimum current limit. The saturation current rating of the inductor needs to be at least larger than the peak inductor current which is the maximum output current plus half of inductor ripple current. 100% Duty-Cycle Operation SC286 is capable of operating at 100% duty-cycle. When the difference between the input voltage and output voltage is less than the minimum dropout voltage, the PMOS switch is turned completely on, operating in 100% duty-cycle. The minimum dropout voltage is the output current multiplied by the on-resistance of the internal PMOS switch and the DC-resistance of the inductor when the PMOS switch is on continuously. Output L-C filter Selection SC286 has fixed internal loop-gain compensation for each channel. It is optimized for X5R or X7R ceramic output capacitors and an output L-C filter corner frequency of less than 34kHz. The output L-C corner frequency can be determined by the following equation. 1 fC 2S L u C OUT 16 SC286 Applications Information (continued) PCB Layout Considerations The layout diagram in Figure 5 shows a recommended top-layer PCB for the SC286 and supporting components. Figure 6 shows the bottom layer for this PCB. Fundamental layout rules must be followed since the layout is critical for achieving the performance specified in the Electrical Characteristics table. Poor layout can degrade the performance of the DC-DC converter and can contribute to EMI problems, ground bounce, and resistive voltage losses. Poor regulation and instability can result. The following guidelines are recommended when developing a PCB layout: 1. The input capacitor, CIN (for applicable channel) should be placed within 1mm of the PVIN and PGND pins. This capacitor provides a low impedance loop for the pulsed currents present at the buck converter’s input. Use short wide traces to connect as closely to the IC as possible. This will minimize EMI and input voltage ripple by localizing the high frequency current pulses. 2. Keep the LX pin traces as short as possible to minimize pickup of high frequency switching edges to other parts of the circuit. COUT and L (for applicable channel) should be connected as close as possible between the LX and PGND pins, with a direct return to the PGND pin from COUT. The gap between the LX trace and the other traces should be at least 0.25mm (10 mils). 3. Route the output voltage feedback/sense path away from the inductor and LX node to minimize noise and magnetic interference. 4. Use a ground plane referenced to the SC286 PGND pin. Use several vias to connect to the component side ground to further reduce noise and interference on sensitive circuit nodes. 5. If possible, minimize the resistance from the VOUT and PGND pins to the load (for applicable channel). This will reduce the voltage drop on the ground plane and improve the load regulation. And it will also improve the overall efficiency by reducing the copper losses on the output and ground planes. 6. The filter capacitor, CAVIN, should be placed as close to the AVIN and AGND pins as possible. This reduces noise coupling into the internal circuit. Figure 5 — Recommended PCB Layout (Top Layer) Figure 6 — Recommended PCB Layout (Bottom Layer) 17 SC286 Outline Drawing – 4x4 MLPQ-UT28 DIMENSIONS A D PIN 1 INDICATOR (LASER MARK) DIM B A A1 A2 b D D1 E E1 e L N aaa bbb E A2 A aaa INCHES MIN .020 .000 .006 .154 .100 .154 .100 .012 NOM MAX .024 .001 (.006) .008 .010 .157 .161 .104 .108 .157 .161 .104 .108 .016 BSC .016 .020 28 .003 .004 MILLIMETERS MIN 0.50 0.00 NOM (0.152) 0.15 0.20 3.90 4.00 2.55 2.65 3.90 4.00 2.55 2.65 0.40 BSC 0.30 0.40 28 0.08 0.10 MAX 0.60 0.02 0.25 4.10 2.75 4.10 2.75 0.50 SEATING C C A1 PLANE LxN D1 E/2 E1 2 1 N e bxN D/2 bbb C A B NOTES: 1. CONTROLLING DIMENSIONS ARE IN MILLIMETERS (ANGLES IN DEGREES). 2. COPLANARITY APPLIES TO THE EXPOSED PAD AS WELL AS THE TERMINALS. 18 SC286 Land Pattern – 4x4 MLPQ-UT28 K DIMENSIONS (C) G H DIM INCHES MILLIMETERS C (.156) (3.95) G .122 3.10 H .104 2.65 K .104 2.65 P .016 0.40 X .008 0.20 Y .033 0.85 Z .189 4.80 Z Y X P NOTES: 1. 2. CONTROLLING DIMENSIONS ARE IN MILLIMETERS (ANGLES IN DEGREES). THIS LAND PATTERN IS FOR REFERENCE PURPOSES ONLY. CONSULT YOUR MANUFACTURING GROUP TO ENSURE YOUR COMPANY'S MANUFACTURING GUIDELINES ARE MET. 3. THERMAL VIAS IN THE LAND PATTERN OF THE EXPOSED PAD SHALL BE CONNECTED TO A SYSTEM GROUND PLANE. FAILURE TO DO SO MAY COMPROMISE THE THERMAL AND/OR FUNCTIONAL PERFORMANCE OF THE DEVICE. 4. SQUARE PACKAGE-DIMENSIONS APPLY IN BOTH X AND Y DIRECTIONS. 19 SC286 © Semtech 2011 All rights reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner. The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license under patent or other industrial or intellectual property rights. Semtech assumes no responsibility or liability whatsoever for any failure or unexpected operation resulting from misuse, neglect improper installation, repair or improper handling or unusual physical or electrical stress including, but not limited to, exposure to parameters beyond the specified maximum ratings or operation outside the specified range. SEMTECH PRODUCTS ARE NOT DESIGNED, INTENDED, AUTHORIZED OR WARRANTEDTO BE SUITABLE FOR USE IN LIFE-SUPPORT APPLICATIONS, DEVICES OR SYSTEMS OR OTHER CRITICAL APPLICATIONS. INCLUSION OF SEMTECH PRODUCTS IN SUCH APPLICATIONS IS UNDERSTOOD TO BE UNDERTAKEN SOLELY AT THE CUSTOMER’S OWN RISK. Should a customer purchase or use Semtech products for any such unauthorized application, the customer shall indemnify and hold Semtech and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs damages and attorney fees which could arise. 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