μClamp1211P μClamp® 1-Line ESD Protection PROTECTION PRODUCTS Description Features µClamp® series of TVS arrays are designed to protect sensitive electronics from damage or latch-up due to ESD. They feature large cross-sectional area junctions for conducting high transient currents. They offer desirable characteristics for board level protection including fast response time, low operating and clamping voltage, and no device degradation. µClamp1211P is in a 2-pin SLP1006P2 package. measuring1.0 x 0.6 x 0.5mm. Leads are spaced at a pitch of 0.65mm and are finished with lead-free NiPdAu. Each device will protect one bidirectional line operating at ±12 volts. They may be used to meet the ESD immunity requirements of IEC 61000-4-2, Level 4 (±30kV air, ±30kV contact discharge). The combination of small size and high ESD surge capability makes them ideal for use in applications such as cellular phones, industrial equipment, and portable instrumentation. • High ESD withstand Voltage: +/-30kV (Contact) and +/-30kV (Air) per IEC 61000-4-2 • Ultra-small package(1.0 x 0.6 x 0.5mm) • Protects one I/O or power line • Low ESD clamping voltage • Working voltage: +/-12V • Low leakage current • Solid-state silicon-avalanche technology Mechanical Characteristics • • • • • • Applications • • • • • • Package Dimension SLP1006P2 package Pb-Free, Halogen Free, RoHS/WEEE Compliant Molding compound flammability rating: UL 94V-0 Lead Finish: NiPdAu Marking: Marking code Packaging: Tape and Reel Cellular Handsets & Accessories Industrial Equipment Notebooks & Handhelds Portable Instrumentation RS-232 Interfaces Peripherals Schematic & Pin Configuration SLP1006P2 (Bottom View) μClamp1211P Final Datasheet Revision date Rev 5 7/22/2015 www.semtech.com 1 of 8 Semtech Absolute Maximum Rating Rating Symbol Value Units Peak Pulse Power (tp = 8/20µs) PPK 200 W Peak Pulse Current (tp = 8/20µs) IPP 7 A ESD per IEC 61000-4-2 (Air)(1) ESD per IEC 61000-4-2 (Contact)(1) VESD ±15 ±8 kV Operating Temperature TJ -55 to +125 O Storage Temperature TSTG -55 to +150 O C C Electrical Characteristics (T=25OC unless otherwise specified) Parameter Symbol Conditions Min. Typ. Max. Units Reverse Stand-Off Voltage VRWM 12 V Reverse Breakdown Voltage VBR It = 1mA Reverse Leakage Current IR VRWM = 12V 1 Clamping Voltage VC IPP=1A, tp = 8/20μs 19 IPP=7A, tp = 8/20μs 28.5 Junction Capacitance CJ VR = 0V, f = 1MHz 25 13.3 V μA V pF Notes 1) Measured with a 20dB attenuator, 50 Ohm scope input impedance, 2GHz bandwidth. ESD gun return path connected to ESD ground plane. 2) Transmission Line Pulse Test (TLP) Settings: tp = 100ns, tr = 0.2ns, ITLP and V TLP averaging window: t1 = 70ns to t2 = 90ns. 3) Dynamic resistance calculated from ITLP = 4A to ITLP = 16A μClamp1211P Final Datasheet Revision Date Rev 5 7/22/2015 www.semtech.com 2 of 8 Semtech Typical Characteristics ESD Clamping (-8kV Contact per IEC 61000-4-2) Non-Repetitive Peak Pulse Power vs. Pulse Time 70 10 Measured with 50 Ohm scope input impedance, 2GHz bandwidth. Corrected for 50 Ohm, 20dB attenuator. ESD gun return path connected to ESD ground 60 Clamping Voltage (V) Peak Pulse Power - PPP (kW) TA = 25OC 1 0.1 50 40 30 20 10 0.01 DR040412-200 0.1 1 10 100 0 1000 Pulse Duration - tp (µs) Clamping Voltage - VC (V) Cuurent (A) 15 10 5 0 5 10 20 30 40 Time (ns) 50 60 70 80 25 20 0 10 30 Transmission Line Pulse Test (TLP) Settings: tp = 100ns, tr = 0.2ns, ITLP and VTLP averaging window: t1 = 70ns to t2 = 90ns 25 0 Clamping Voltage vs. Peak Pulse Current (tp=8/20μs) TLP Characteristic (Positive Pulse) 30 -10 15 20 25 30 35 20 15 10 5 TA = 25OC Waveform 8x20us 0 0 Voltage (V) 1 2 Capacitance vs. Reverse Voltage 3 4 5 6 Peak Pulse Current - IPP (A) 7 8 Insertion Loss 0 25 -5 -10 Insertion Loss (dB) Capacitance (Pf) 20 15 10 5 -15 -20 -25 -30 -35 f = 1 MHz 0 0 μClamp1211P Final Datasheet Revision Date 2 4 Rev 5 7/22/2015 6 8 10 Reverse Voltage-VR(V) 12 14 -40 1.00E+00 www.semtech.com 1.00E+02 1.00E+04 1.00E+06 Frequecny (Hz) 1.00E+08 3 of 8 Semtech Application Information Circuit Diagram Device Connection Options This TVS diode is designed to protect one data, I/O, or power supply line. The device is bidirectional and may be used on lines where the signal polarity can go above and below ground. The device is symmetrical, and therefore, the orientation of the device is not critical. Circuit Board Layout Recommendations for Suppression of ESD. Good circuit board layout is critical for the suppression of ESD induced transients. The following guidelines are recommended: • Place the TVS near the input terminals or connectors to restrict transient coupling. • Minimize the path length between the TVS and the protected line. • Minimize all conductive loops including power and ground loops. • The ESD transient return path to ground should be kept as short as possible. • Never run critical signals near board edges. • Use ground planes whenever possible. μClamp1211P Final Datasheet Revision Date Rev 5 7/22/2015 www.semtech.com 4 of 8 Semtech Outline Drawing - SLP1006P2 A B D DIM E TOP VIEW A SEATING PLANE aaa C C A1 PIN 1 ID bbb A A1 b D E e L R N aaa bbb DIMENSIONS INCHES MILLIMETERS MIN NOM MAX MIN NOM MAX .016 .020 .022 0.40 0.50 0.55 .000 .001 .002 0.00 0.03 0.05 .018 .020 .022 0.45 0.50 0.55 .035 .039 .043 0.90 1.00 1.10 .020 .024 .028 0.50 0.60 0.70 .026 BSC 0.65 BSC .008 .010 .012 0.20 0.25 0.30 .002 .004 .006 0.05 0.10 0.15 2 2 .003 0.08 .004 0.10 SLP1006P2-1-R0 R bxN C A B 2x L e BOTTOM VIEW NOTES: 1. CONTROLLING DIMENSIONS ARE IN MILLIMETERS (ANGLES IN DEGREES). Land Pattern - SLP1006P2 DIMENSIONS Y (C) Z G X DIM C G X Y Z INCHES (.033) .012 .024 .022 .055 MILLIMETERS (0.85) 0.30 0.60 0.55 1.40 NOTES: 1. CONTROLLING DIMENSIONS ARE IN MILLIMETERS (ANGLES IN DEGREES). 2. THIS LAND PATTERN IS FOR REFERENCE PURPOSES ONLY. CONSULT YOUR MANUFACTURING GROUP TO ENSURE YOUR COMPANY'S MANUFACTURING GUIDELINES ARE MET. μClamp1211P Final Datasheet Revision Date Rev 5 7/22/2015 www.semtech.com 5 of 8 Semtech Tape and Reel Specification Paper Carrier Tape, 2mm Pitch Option S S S S S Plastic Carrier Tape, 4mm Pitch Option Pin 1 Location (Towards Sprocket Holes) Device Orientation in Tape Plastic Carrier Tape, 2mm Pitch Option μClamp1211P Final Datasheet Revision Date Rev 5 7/22/2015 www.semtech.com 6 of 8 Semtech Marking Code S PIN 1 ID Ordering Information Part Number Qty per Reel Pocket Pitch Tape Material Reel Size uClamp1211P. TCT uClamp1211P. TNT uClamp1211P. TFT 3,000 10,000 15,000 4mm 2mm 2mm μClamp1211P Final Datasheet Revision Date Rev 5 7/22/2015 Plastic Plastic Paper www.semtech.com 7” 7” 7” 7 of 8 Semtech IMPORTANT NOTICE Information relating to this product and the application or design described herein is believed to be reliable, however such information is provided as a guide only and Semtech assumes no liability for any errors in this document, or for the application or design described herein. Semtech reserves the right to make changes to the product or this document at any time without notice. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. Semtech warrants performance of its products to the specifications applicable at the time of sale, and all sales are made in accordance with Semtech’s standard terms and conditions of sale. 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Semtech reserves the right to make changes to, or discontinue any products described in this document without further notice. Semtech makes no warranty, representation or guarantee, express or implied, regarding the suitability of its products for any particular purpose. All rights reserved. © Semtech 2015 Contact Information Semtech Corporation 200 Flynn Road, Camarillo, CA 93012 Phone: (805) 498-2111, Fax: (805) 498-3804 www.semtech.com μClamp1211P Final Datasheet Revision date Rev 5 7/22/2015 8 of 8 Semtech