AN11270 Hardware description for POS Development Kit OM5597/RD2663 Rev. 1.0 — 6 August 2014 242610 Application note COMPANY PUBLIC Document information Info Content Keywords POS, Point of Sales, Reference design, RC663, TDA8026 Abstract This document describes the hardware of the Point of Sales Development kit (POS-DK). AN11270 NXP Semiconductors Hardware description for POS Development Kit OM5597/RD2663 Revision history Rev Date Description 1.0 Initial version 20140806 Contact information For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: [email protected] AN11270 Application note COMPANY PUBLIC All information provided in this document is subject to legal disclaimers. Rev. 1.0 — 6 August 2014 242610 © NXP B.V. 2014. All rights reserved. 2 of 29 AN11270 NXP Semiconductors Hardware description for POS Development Kit OM5597/RD2663 1. Introduction 1.1 Scope This document describes the basic functionality and electrical specifications of the OM5597 RD2663. The OM5597 RD2663 is designed for use in development purposes as demonstration hardware. It is designed to fulfill EMVCO 2.2b specifications. It is not designed to be a full hardware design reference especially the main board. The Design covers the contact and contactless communication. For that reason the mainboard contains 4 additional SAM slots and an Antenna around the Display. 1.2 1.2 General Description The reader RD2663 POS terminal is compliant to the ISO/IEC14443 and EMVCO 2.2b standard. It uses the NXP Cortex M3 LPC1768 μController. The contactless reader functionality is handled by the CLRC663 reader IC. On top of the contactless functionality an ISO 7816 part2/3 interface is implemented to communicate to a secure element. This is handled by the TDA8026 that is added on the reader board. The Mainboard provides several communication interfaces on board such as: USB (not used in the example) and RS232, Antenna Seriell / USB Display 5V Power connector CLRC663 LPC1768 TDA8026 Fig 1. Picture of the POS reader AN11270 Application note COMPANY PUBLIC All information provided in this document is subject to legal disclaimers. Rev. 1.0 — 6 August 2014 242610 © NXP B.V. 2014. All rights reserved. 3 of 29 AN11270 NXP Semiconductors Hardware description for POS Development Kit OM5597/RD2663 2. OM5597 RD2663 Hardware description 2.1 Hardware overview 2.1.1 Mainboard 2.1.1.1 Fig 2. Overview Mainboard top The mainboard contains the connectors for all modules as well as the power management (3.3V regulator and reverse voltage protection). In addition to that 4 SAM slots, for contact communication, are routed to the bottom layer of the main board. The pcb is a only 2 layer structure compared to the reader board that has a 4 layer structure. To optimize contactless performance the ground plain underneath the antenna is removed to avoid losses caused by eddy current. This is recommended in every contactless 13.56MHz design otherwise a significant amount of energy is wasted in that area. AN11270 Application note COMPANY PUBLIC All information provided in this document is subject to legal disclaimers. Rev. 1.0 — 6 August 2014 242610 © NXP B.V. 2014. All rights reserved. 4 of 29 AN11270 NXP Semiconductors Hardware description for POS Development Kit OM5597/RD2663 2.1.1.2 RS232 Connector Fig 3. Serial port schematics The serial port is used for flashing the POS Firmware and also as interface for the “comcom” tool. For further information’s on how to flash the Firmware see AN 11271. The serial interface of the µC is connected to a standard RS232 driver and receiver block. This block is connected to a DSUB-9 connector so the OM5597 RD2663 can be directly plugged to the serial port of a PC. Table 1. Pin AN11270 Application note COMPANY PUBLIC DSUB-9 Pinning for RS232 Signal D Voltage 1 DCD (Data Carrier Detect) O ± 3 – 12V 2 RD (Receive Data) O ± 3 – 12V 3 TD (Transmit Data) I ± 3 – 12V 4 DTR (Data Terminal Ready) I ± 3 – 12V 5 GND Pwr 6 DSR (Data Set Ready) O ± 3 – 12V 7 RTS (Ready To Send) I ± 3 – 12V 8 RTS (Ready To Send) O ± 3 – 12V 9 RI (IRQ) O ± 3 – 12V All information provided in this document is subject to legal disclaimers. Rev. 1.0 — 6 August 2014 242610 © NXP B.V. 2014. All rights reserved. 5 of 29 AN11270 NXP Semiconductors Hardware description for POS Development Kit OM5597/RD2663 2.1.1.3 USB and Power supply Fig 4. USB and Power supply The OM5597 RD2663 can be powered by USB or by using Power jack. If the power jack is used, the supply must deliver 5V. If the voltage is higher than 5V to USB or power jack theOM5597 RD2663 can be destroyed. AN11270 Application note COMPANY PUBLIC All information provided in this document is subject to legal disclaimers. Rev. 1.0 — 6 August 2014 242610 © NXP B.V. 2014. All rights reserved. 6 of 29 AN11270 NXP Semiconductors Hardware description for POS Development Kit OM5597/RD2663 Fig 5. Power supply 2 The 5V supply line is directly routed to the components and buffered with capacitors near the IC’s. So no 5V regulator is used on the OM5597 RD2663. Only to 3,3V regulators are used to deliver the needed power in case every part needs the maximum amount of power. AN11270 Application note COMPANY PUBLIC All information provided in this document is subject to legal disclaimers. Rev. 1.0 — 6 August 2014 242610 © NXP B.V. 2014. All rights reserved. 7 of 29 AN11270 NXP Semiconductors Hardware description for POS Development Kit OM5597/RD2663 2.1.1.4 JTAG interface Fig 6. JTAG interface Added to the serial port a JTAG interface is provided by the mainboard and connected to the LPC1768. The JTAG is only an optional feature, which is not used in this DEMO. AN11270 Application note COMPANY PUBLIC All information provided in this document is subject to legal disclaimers. Rev. 1.0 — 6 August 2014 242610 © NXP B.V. 2014. All rights reserved. 8 of 29 AN11270 NXP Semiconductors Hardware description for POS Development Kit OM5597/RD2663 2.1.1.5 SAM Fig 7. SAM The connection of the 4 SAM slots, mounted on the main board is shown exemplary in Fig 7. All card slots (SAM2-5) are connected in the same way to the TDA8026ET. Each SAM slot has a separate connection to the TDA so they can be used independent from each other. A fifth connector is mounted on the bottom layer of the reader board (J5 ) AN11270 Application note COMPANY PUBLIC All information provided in this document is subject to legal disclaimers. Rev. 1.0 — 6 August 2014 242610 © NXP B.V. 2014. All rights reserved. 9 of 29 AN11270 NXP Semiconductors Hardware description for POS Development Kit OM5597/RD2663 2.1.1.6 Fig 8. Connectors Module reader board connectors J1/J2 The connector J1 is on the left side of the main and reader board. The Jumper J2 is on the right side, near the key pad. AN11270 Application note COMPANY PUBLIC All information provided in this document is subject to legal disclaimers. Rev. 1.0 — 6 August 2014 242610 © NXP B.V. 2014. All rights reserved. 10 of 29 AN11270 NXP Semiconductors Hardware description for POS Development Kit OM5597/RD2663 Fig 9. LCD connector The OM5597/RD2663 is featured with a Himax HX8347D TFT Display. This display has 240RGB by 320 dots and is providing 262K colors. It is using a single chip driver. (see chapter 2.1.3) 2.1.1.7 PIN Pad Fig 10. PIN Pad As user interface a standard Pin Pad is used. AN11270 Application note COMPANY PUBLIC All information provided in this document is subject to legal disclaimers. Rev. 1.0 — 6 August 2014 242610 © NXP B.V. 2014. All rights reserved. 11 of 29 AN11270 NXP Semiconductors Hardware description for POS Development Kit OM5597/RD2663 2.1.2 Reader Board The reader module board contains the CLRC663, LPC1768 and TDA8026ET. That means it contains all major parts needed for a point of sales reader. The boar is a 4Layer design. The layout is done with Altium and is online available on OM559/RD2663 Web page. Top Layer Middle Layer 1 Fig 11. Reader module Top+ Middle Layer1 view AN11270 Application note COMPANY PUBLIC All information provided in this document is subject to legal disclaimers. Rev. 1.0 — 6 August 2014 242610 © NXP B.V. 2014. All rights reserved. 12 of 29 AN11270 NXP Semiconductors Hardware description for POS Development Kit OM5597/RD2663 Middle Layer 2 Bottom Layer Fig 12. Reader module Bottom+ Middle Layer2 view AN11270 Application note COMPANY PUBLIC All information provided in this document is subject to legal disclaimers. Rev. 1.0 — 6 August 2014 242610 © NXP B.V. 2014. All rights reserved. 13 of 29 AN11270 NXP Semiconductors Hardware description for POS Development Kit OM5597/RD2663 2.1.2.1 TDA Fig 13. TDA8026ET The OM5597/RD2663 is equipped with 5 contact slots for a SAM. All slots are used for a communication according ISO 7816-3. The TDA can handle up to 5 secure access modules and is connected via I2C to the LPC1768. AN11270 Application note COMPANY PUBLIC All information provided in this document is subject to legal disclaimers. Rev. 1.0 — 6 August 2014 242610 © NXP B.V. 2014. All rights reserved. 14 of 29 AN11270 NXP Semiconductors Hardware description for POS Development Kit OM5597/RD2663 2.1.2.2 LPC1768 Fig 14. LPC1768 schematic The µC that is used in OM5597/RD2663 is a LPC1768FBD100. It is based on a ARM Cortex-M3 processor who is providing up to 512 kB on-chip flash programming memory and also up to 64 kB on-chip SRAM. AN11270 Application note COMPANY PUBLIC All information provided in this document is subject to legal disclaimers. Rev. 1.0 — 6 August 2014 242610 © NXP B.V. 2014. All rights reserved. 15 of 29 AN11270 NXP Semiconductors Hardware description for POS Development Kit OM5597/RD2663 2.1.2.3 CLRC663 + matching network Fig 15. RC663 For usability and debugging purpose all pins of the 663 are accessible and routed. Especially for debugging following pins are needed: (see also AN11019) AUX1 AUX2 Sigout AN11270 Application note COMPANY PUBLIC (TP4) (TP3) (TP12) All information provided in this document is subject to legal disclaimers. Rev. 1.0 — 6 August 2014 242610 © NXP B.V. 2014. All rights reserved. 16 of 29 AN11270 NXP Semiconductors Hardware description for POS Development Kit OM5597/RD2663 2.1.2.4 CLRC663 power supply Fig 16. Jumper The reader board provides the option to power the CLRC663 with 3,3V or 5V. The CLRC663 is supplied by VDD - Supply voltage, PVDD- pad supply and TVDD- Tx power supply. These three voltages are independent and can have different as well as the same supply voltage values. e.g. To operate with a 3.3V supplied Microcontroller, PVDD and VDD shall be 3.3V, to guarantee maximum field strength TVDD shall be 5V. Voltages between 3V to 5.5V can be applied to VDD, PVDD and TVDD. AN11270 Application note COMPANY PUBLIC All information provided in this document is subject to legal disclaimers. Rev. 1.0 — 6 August 2014 242610 © NXP B.V. 2014. All rights reserved. 17 of 29 AN11270 NXP Semiconductors Hardware description for POS Development Kit OM5597/RD2663 2.1.3 Display 2.1.3.1 Display board Two different types of displays can be used with this Reference design kit. Both differ only in the way of accessing them. To change the display the software also needs to be file GLCD.c provides the two drivers, with a compilation option: #define LCD_RM68050 #define LCD_HX8347D #define LCD_CONTROL (0) // For LCD PCB before 2011 05 23 (1) // For LCD PCB After 2011 05 23 LCD_HX8347D Fig 17. LCD type – Compiler option The LCD Type can be known with the build date, which is written below the LCD PCB: Fig 18. LCD PCB date If the date is 2011 05 23 (“LCD BOARD 230511”) or earlier, the value LCD_CONTROL must be defined equal to LCD_HX8347D. If the date is before 2011 05 23, LCD_CONTROL must be equal to LCD_RM68050. AN11270 Application note COMPANY PUBLIC All information provided in this document is subject to legal disclaimers. Rev. 1.0 — 6 August 2014 242610 © NXP B.V. 2014. All rights reserved. 18 of 29 AN11270 NXP Semiconductors Hardware description for POS Development Kit OM5597/RD2663 Fig 19. Display board The LCD Type can be known with the build date, which is written below the LCD PCB: If the date is 2011 05 23 (“LCD BOARD 230511”) or earlier, the value LCD_CONTROL must be defined equal to LCD_HX8347D. If the date is before 2011 05 23, LCD_CONTROL must be equal to LCD_RM68050. AN11270 Application note COMPANY PUBLIC All information provided in this document is subject to legal disclaimers. Rev. 1.0 — 6 August 2014 242610 © NXP B.V. 2014. All rights reserved. 19 of 29 AN11270 NXP Semiconductors Hardware description for POS Development Kit OM5597/RD2663 2.1.3.2 Display driver Fig 20. Display driver AN11270 Application note COMPANY PUBLIC All information provided in this document is subject to legal disclaimers. Rev. 1.0 — 6 August 2014 242610 © NXP B.V. 2014. All rights reserved. 20 of 29 AN11270 NXP Semiconductors Hardware description for POS Development Kit OM5597/RD2663 2.1.4 Antenna for contactless communication The antenna has 2 turns and is mounted around the Display. It has a size of 104mm x 104mm. The used size is not the minimum that can be achieved without an amplifier. It is chosen to have quite some margin left. Fig 21. Antenna for contactless communication 3. Antenna matching Antennas of different shapes must be individually matched to the CLRC663 family. The tuning is dependent on the requirements (environment, etc.) of the end application. The following subchapter explains matching recommendations for antennas with the form factor of 104mm x 104mm. The antenna size is not the smallest one that can be realized it is just to show the function and EMVCO capability of the CLRC 663. For more information’s on the optimization a detailed description can be found in AN11019 “Antenna Design Guide”. AN11270 Application note COMPANY PUBLIC All information provided in this document is subject to legal disclaimers. Rev. 1.0 — 6 August 2014 242610 © NXP B.V. 2014. All rights reserved. 21 of 29 AN11270 NXP Semiconductors Hardware description for POS Development Kit OM5597/RD2663 3.1 Antenna Matching of OM5597/RD2663 This chapter explains the matching of the 2turn antenna for the OM5597/RD2663. The used matching impedance at 13.56MHz is Rmatch ≈ 31Ohm. This impedance value is chosen because of the needed field strength. Related to the antenna size it is not needed to drive the maximum amount of power to full fill EMVCO volume. For smaller antennas a lower impedance value can be needed. The value needs to be adapted to the requirements of EMVCO. That means if the antenna is smaller a Rmatch of around 20 ohm can be needed. To find the right value it is recommended to check the field strength according to the standard in a maximum distance (4cm (all positions)) to see if it can be reached. If not lower the Rmatch until the proper field strength is reached. Added to that, the ITvdd needs to be checked to do net exceed the limits (200mA) of CLRC663. In the case the chip is at the maximum power level but the field strength is not high enough typically a bigger antenna or a booster is needed. The following Fig shows the target matching for this antenna. The matching is described below. Fig 22. Matching impedance diagram for POS antenna AN11270 Application note COMPANY PUBLIC All information provided in this document is subject to legal disclaimers. Rev. 1.0 — 6 August 2014 242610 © NXP B.V. 2014. All rights reserved. 22 of 29 AN11270 NXP Semiconductors Hardware description for POS Development Kit OM5597/RD2663 3.2 Matching components The following components have been used on the OM5597/RD2663 Fig 23. Matching part of the CLRC663 The EMC filter is determined with: Rres EMC ≈ 22MHz L1,2 = 470nH C8,9,19,20 = 56pF+56pF These values have been chosen because of better pulse shape in terms of undershoots and monotony that is restricted by EMVCO Components in Fig 23 AN11270 Application note COMPANY PUBLIC Component name on OM5597/RD2663 (Fig 15) Rq= 3,9 Ω R26,27, 10,11 C1 = 47pF C10,11 C2 = 120 +27pF C12,13 = 120pF / C14,15 = 27pF All information provided in this document is subject to legal disclaimers. Rev. 1.0 — 6 August 2014 242610 © NXP B.V. 2014. All rights reserved. 23 of 29 AN11270 NXP Semiconductors Hardware description for POS Development Kit OM5597/RD2663 3.3 Analog results The following results are related to the analog contactless test that has been made by CETECOM. It is a short overview of the performance that have been reached with the contactless part of the OM5597/RD2663 3.3.1 Field strength Table 2. AN11270 Application note COMPANY PUBLIC Field strength measurements z r f Vov min Vov max Vov Verdict 0 0 0 3.1 8.1 5,186 PASS 0 1 0 3.1 8.1 5,204 PASS 0 1 3 3.1 8.1 5,173 PASS 0 1 6 3.1 8.1 5,197 PASS 0 1 9 3.1 8.1 4,878 PASS 1 0 0 3.05 8.1 5,047 PASS 1 2 0 3.05 8.1 4,784 PASS 1 2 3 3.05 8.1 5,143 PASS 1 2 6 3.05 8.1 4,810 PASS 1 2 9 3.05 8.1 4,856 PASS 2 0 0 3.0 8.1 4,604 PASS 2 2 0 3.0 8.1 4,200 PASS 2 2 3 3.0 8.1 4,497 PASS 2 2 6 3.0 8.1 4,220 PASS 2 2 9 3.0 8.1 4,307 PASS 3 0 0 2.775 8.1 3,947 PASS 3 2 0 2.775 8.1 3,533 PASS 3 2 3 2.775 8.1 3,660 PASS 3 2 6 2.775 8.1 3,551 PASS 3 2 9 2.775 8.1 3,606 PASS 4 0 0 2.55 8.1 3,237 PASS 4 1 0 2.55 8.1 3,078 PASS 4 1 3 2.55 8.1 3,120 PASS 4 1 6 2.55 8.1 3,097 PASS 4 1 9 2.55 8.1 3,101 PASS All information provided in this document is subject to legal disclaimers. Rev. 1.0 — 6 August 2014 242610 © NXP B.V. 2014. All rights reserved. 24 of 29 AN11270 NXP Semiconductors Hardware description for POS Development Kit OM5597/RD2663 3.3.2 Waveform (1) Type A Waveform test (2) Type B Waveform test Fig 24. Waveform type A/B AN11270 Application note COMPANY PUBLIC All information provided in this document is subject to legal disclaimers. Rev. 1.0 — 6 August 2014 242610 © NXP B.V. 2014. All rights reserved. 25 of 29 AN11270 NXP Semiconductors Hardware description for POS Development Kit OM5597/RD2663 4. Legal information provide appropriate design and operating safeguards to minimize the risks associated with their applications and products. 4.1 Definitions Draft — The document is a draft version only. The content is still under internal review and subject to formal approval, which may result in modifications or additions. NXP Semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall have no liability for the consequences of use of such information. 4.2 Disclaimers Limited warranty and liability — Information in this document is believed to be accurate and reliable. However, NXP Semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. In no event shall NXP Semiconductors be liable for any indirect, incidental, punitive, special or consequential damages (including - without limitation lost profits, lost savings, business interruption, costs related to the removal or replacement of any products or rework charges) whether or not such damages are based on tort (including negligence), warranty, breach of contract or any other legal theory. Notwithstanding any damages that customer might incur for any reason whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards customer for the products described herein shall be limited in accordance with the Terms and conditions of commercial sale of NXP Semiconductors. Right to make changes — NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. This document supersedes and replaces all information supplied prior to the publication hereof. Suitability for use — NXP Semiconductors products are not designed, authorized or warranted to be suitable for use in life support, life-critical or safety-critical systems or equipment, nor in applications where failure or malfunction of an NXP Semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage. NXP Semiconductors accepts no liability for inclusion and/or use of NXP Semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer’s own risk. Applications — Applications that are described herein for any of these products are for illustrative purposes only. NXP Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. Customers are responsible for the design and operation of their applications and products using NXP Semiconductors products, and NXP Semiconductors accepts no liability for any assistance with applications or customer product design. It is customer’s sole responsibility to determine whether the NXP Semiconductors product is suitable and fit for the customer’s applications and products planned, as well as for the planned application and use of customer’s third party customer(s). Customers should AN11270 Application note COMPANY PUBLIC NXP Semiconductors does not accept any liability related to any default, damage, costs or problem which is based on any weakness or default in the customer’s applications or products, or the application or use by customer’s third party customer(s). Customer is responsible for doing all necessary testing for the customer’s applications and products using NXP Semiconductors products in order to avoid a default of the applications and the products or of the application or use by customer’s third party customer(s). NXP does not accept any liability in this respect. Export control — This document as well as the item(s) described herein may be subject to export control regulations. Export might require a prior authorization from competent authorities. Evaluation products — This product is provided on an “as is” and “with all faults” basis for evaluation purposes only. 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The foregoing limitations, exclusions and disclaimers shall apply to the maximum extent permitted by applicable law, even if any remedy fails of its essential purpose. 4.3 Licenses Purchase of NXP ICs with NFC technology Purchase of an NXP Semiconductors IC that complies with one of the Near Field Communication (NFC) standards ISO/IEC 18092 and ISO/IEC 21481 does not convey an implied license under any patent right infringed by implementation of any of those standards. 4.4 Trademarks Notice: All referenced brands, product names, service names and trademarks are property of their respective owners. All information provided in this document is subject to legal disclaimers. Rev. 1.0 — 6 August 2014 242610 © NXP B.V. 2014. All rights reserved. 26 of 29 AN11270 NXP Semiconductors Hardware description for POS Development Kit OM5597/RD2663 5. List of figures Fig 1. Fig 2. Fig 3. Fig 4. Fig 5. Fig 6. Fig 7. Fig 8. Fig 9. Fig 10. Fig 11. Fig 12. Fig 13. Fig 14. Fig 15. Fig 16. Fig 17. Fig 18. Fig 19. Fig 20. Fig 21. Fig 22. Fig 23. Fig 24. Picture of the POS reader ................................. 3 Mainboard top ................................................... 4 Serial port schematics ....................................... 5 USB and Power supply ..................................... 6 Power supply 2 ................................................. 7 JTAG interface .................................................. 8 SAM .................................................................. 9 Module reader board connectors J1/J2........... 10 LCD connector ................................................ 11 PIN Pad........................................................... 11 Reader module Top+ Middle Layer1 view....... 12 Reader module Bottom+ Middle Layer2 view . 13 TDA8026ET .................................................... 14 LPC1768 schematic ........................................ 15 RC663 ............................................................. 16 Jumper ............................................................ 17 LCD type – Compiler option ............................ 18 LCD PCB date ................................................ 18 Display board .................................................. 19 Display driver .................................................. 20 Antenna for contactless communication ......... 21 Matching impedance diagram for POS antenna ........................................................... 22 Matching part of the CLRC663........................ 23 Waveform type A/B ......................................... 25 AN11270 Application note COMPANY PUBLIC All information provided in this document is subject to legal disclaimers. Rev. 1.0 — 6 August 2014 242610 © NXP B.V. 2014. All rights reserved. 27 of 29 AN11270 NXP Semiconductors Hardware description for POS Development Kit OM5597/RD2663 6. List of tables Table 1. DSUB-9 Pinning for RS232 ............................... 5 AN11270 Application note COMPANY PUBLIC All information provided in this document is subject to legal disclaimers. Rev. 1.0 — 6 August 2014 242610 © NXP B.V. 2014. All rights reserved. 28 of 29 AN11270 NXP Semiconductors Hardware description for POS Development Kit OM5597/RD2663 7. Contents 1. 1.1 1.2 2. 2.1 2.1.1 2.1.1.1 2.1.1.2 2.1.1.3 2.1.1.4 2.1.1.5 2.1.1.6 2.1.1.7 2.1.2 2.1.2.1 2.1.2.2 2.1.2.3 2.1.2.4 2.1.3 2.1.3.1 2.1.3.2 2.1.4 3. 3.1 3.2 3.3 3.3.1 3.3.2 4. 4.1 4.2 4.3 4.4 5. 6. 7. Introduction ......................................................... 3 Scope ................................................................. 3 1.2 General Description ..................................... 3 OM5597 RD2663 Hardware description ............. 4 Hardware overview ............................................ 4 Mainboard .......................................................... 4 Overview ............................................................ 4 RS232 Connector............................................... 5 USB and Power supply ...................................... 6 JTAG interface ................................................... 8 SAM ................................................................... 9 Connectors ....................................................... 10 PIN Pad ............................................................ 11 Reader Board ................................................... 12 TDA .................................................................. 14 LPC1768 .......................................................... 15 CLRC663 + matching network ......................... 16 CLRC663 power supply ................................... 17 Display ............................................................. 18 Display board ................................................... 18 Display driver ................................................... 20 Antenna for contactless communication........... 21 Antenna matching ............................................. 21 Antenna Matching of OM5597/RD2663 ........... 22 Matching components ...................................... 23 Analog results .................................................. 24 Field strength ................................................... 24 Waveform ......................................................... 25 Legal information .............................................. 26 Definitions ........................................................ 26 Disclaimers....................................................... 26 Licenses ........................................................... 26 Trademarks ...................................................... 26 List of figures..................................................... 27 List of tables ...................................................... 28 Contents ............................................................. 29 Please be aware that important notices concerning this document and the product(s) described herein, have been included in the section 'Legal information'. © NXP B.V. 2014. All rights reserved. For more information, visit: http://www.nxp.com For sales office addresses, please send an email to: [email protected] Date of release: 6 August 2014 242610 Document identifier: AN11270