UM4401 4 Line ESD/EMI Protection for Color LCD Interfaces UM4401 DFN8 2.1×1.6 General Description The UM4401 is a low pass filter array with integrated TVS diodes. It is designed to suppress unwanted EMI/RFI signals and provide electrostatic discharge (ESD) protection in portable electronic equipment. This state-of-the-art device utilizes silicon-avalanche technology for superior clamping performance and DC electrical characteristics. It has been optimized for protection of color LCD panels in cellular phones and other portable electronics. The device consists of four identical circuits comprised of TVS diodes for ESD protection, and a RC network for EMI filtering. A series resistor value of 100Ω and a capacitance value of 10pF are used to achieve 25dB minimum attenuation from 800 MHz to 2.5GHz. The TVS diodes provide effective suppression of ESD voltages in excess of ±15kV (air discharge) and ±8kV (contact discharge) per IEC 61000-4-2, level 4. The UM4401 is in a 8-pin, RoHS compliant DFN8 package. It measures 2.1mm×1.6mm. The leads are spaced at a pitch of 0.5mm and are finished with lead-free Ni Pd. The small package makes it ideal for use in portable electronics such as cell phones, digital still cameras, and PDAs. Applications Features EMI Filtering and ESD Protection for Data Lines Wireless Phones Handheld Products Notebook Computers LCD Displays Pin Configurations EMI/RFI Filter with Integrated TVS for ESD Protection ESD Protection to IEC 61000-4-2 (ESD) Level 4, ±15kV (Air), ±8kV (Contact) 25dB Minimum Attenuation: 800MHz to 2.5GHz Working Voltage: 5V Resistor: 100Ω ±15% Typical Capacitance: 10pF (VR = 2.5V) Solid-State Technology DFN8 Package: 2.1mm×1.6 mm Moisture Sensitivity Level 1 Top View 1 8 Cd Cd Cd Cd Cd Cd Cd Cd 2 7 3 6 4 5 M: Month Code UM4401 DFN8 2.1×1.6 ________________________________________________________________________ http://www.union-ic.com Rev.02 Dec.2014 1/6 UM4401 Ordering Information Part Number Packaging Type Marking Code UM4401 DFN8 2.1×1.6 4401 Shipping Qty 3000pcs/7Inch Tape & Reel Absolute Maximum Ratings (Note 1) Symbol Parameter Value Unit TJ Junction Temperature 125 °C PR Steady State Power per Resistor @ 25℃ 328 mW TOP Operating Temperature Range -40 to 85 °C TSTG Storage Temperature Range -55 to 150 °C 260 °C TL Maximum Lead Temperature for Soldering Note 1: Maximum ratings are those values beyond which device damage can occur. Maximum ratings applied to the device are individual stress limit values (not normal operating conditions) and are not valid simultaneously. If these limits are exceeded, device functional operation is not implied, damage may occur and reliability may be affected. Electrical Characteristics (TJ = 25°C unless otherwise noted) Symbol VRWM VBR IR Parameter Reverse Stand-Off Voltage Reverse Breakdown Voltage Reverse Leakage Current Total Series Resistance Test Conditions It = 1.0mA 6 .0 Typ 7.0 VRWM = 3.3V IR=10mA Each Line Input to GND, Each Line Cd Total Capacitance VR = 0V, f = 1MHz Input to GND, Each Line Cd Total Capacitance VR = 2.5V, f = 1MHz Above this frequency, Cut-Off Frequency f3dB appreciable attenuation (Note 2) occurs Note 2: 50Ω source and 50Ω load termination. RA Min Max Unit 5.0 V 8.0 V 100 nA 85 100 115 Ω 16 20 24 pF 9 10 12 pF 150 MHz ________________________________________________________________________ http://www.union-ic.com Rev.02 Dec.2014 2/6 UM4401 Typical Operating Characteristics Typical Insertion Loss S21 Analog Crosstalk Curve (S41) -5 -30 -10 -35 -15 -40 S41(dB) S21 (dB) -20 -25 -30 -45 -50 -35 -40 -55 -45 -60 1E7 1E8 1E7 1E9 1E8 1E9 Frequency(Hz) FREQUENCY (Hz) Typical Resistance vs. Temperature Capacitance vs. Reverse Voltage 104 1.0 103 0.9 101 Cj(Vr)/Cj(Vr=0) Resistance(ohm) 102 100 99 98 0.8 0.7 0.6 f=1M 97 0.5 96 0.4 -40 -20 0 20 40 60 80 Temperature(Celsiur scale) ESD Clamping (+8KV Contact) 0 1 2 3 4 5 Reverse Voltage - Vr(V) ESD Clamping (-8KV Contact) ________________________________________________________________________ http://www.union-ic.com Rev.02 Dec.2014 3/6 UM4401 Applications Information Device Connection The UM4401 is comprised of four identical circuits each consisting of a low pass filter for EMI/RFI suppression and dual TVS diodes for ESD protection. The device is in a 8-pin DFN package. Electrical connection is made to the 8 pins located at the bottom of the device. A center tab serves as the ground connection. The device has a flow through design for easy layout. Pin connections are noted in Figure 1. All path lengths should be kept as short as possible to minimize the effects of parasitic inductance in the board traces. Recommendations for the ground connection are given below. Ground Connection Recommendation Parasitic inductance present in the board layout will affect the filtering performance of the device. As frequency increases, the effect of the inductance becomes more dominant. This effect is given by Equation 1. Pin 1-4 Identification Input Lines 5-8 Output Lines Center Tab Ground Equation 1: The Impedance of an Inductor at Frequency XLF XLF(L,f ) = 2×л×f ×L Where: L= Inductance (H) f = Frequency (Hz) Via connections to the ground plane form rectangular wire loops or ground loop inductance as shown in Figure 2. Ground loop inductance can be reduced by using multiple vias to make the connection to the ground plane. Bringing the ground plane closer to the signal layer (preferably the next layer) also reduces ground loop inductance. Multiple vias in the device ground pad will result in a lower inductive ground loop over two exterior vias. Vias with a diameter d are separated by a distance y run between layers separated by a distance x. The inductance of the loop path is given by Equation 2. Thus, decreasing distance x and y will reduce the loop inductance and result in better high frequency filter characteristics. Where: d = Diameter of the wire (in) x = Length of wire loop (in) y = Breath of wire loop (in) ________________________________________________________________________ http://www.union-ic.com Rev.02 Dec.2014 4/6 UM4401 Package Information UM4401: DFN8 2.1×1.6 A Outline Drawing Side View A3 A1 Symbol D D2 L E E2 Pin1 ID C0.2*45 e b Bottom View D E D2 E2 A A1 A3 b L e DIMENSIONS MILLIMETERS Min Typ Max 2.05 2.10 2.175 1.55 1.60 1.675 1.60 1.70 1.80 0.30 0.40 0.50 0.545 0.575 0.605 0 0.02 0.05 0.13TYP 0.20 0.25 0.30 0.275 0.325 0.375 0.50TYP Land Pattern NOTES: 1. Compound dimension: 2.10×1.60; 2. Unit: mm; 3.General tolerance ±0.05mm unless otherwise specified; 4. The layout is just for reference. Tape and Reel Orientation ________________________________________________________________________ http://www.union-ic.com Rev.02 Dec.2014 5/6 UM4401 IMPORTANT NOTICE The information in this document has been carefully reviewed and is believed to be accurate. Nonetheless, this document is subject to change without notice. Union assumes no responsibility for any inaccuracies that may be contained in this document, and makes no commitment to update or to keep current the contained information, or to notify a person or organization of any update. Union reserves the right to make changes, at any time, in order to improve reliability, function or design and to attempt to supply the best product possible. Union Semiconductor, Inc Add: Unit 606, No.570 Shengxia Road, Shanghai 201210 Tel: 021-51093966 Fax: 021-51026018 Website: www.union-ic.com ________________________________________________________________________ http://www.union-ic.com Rev.02 Dec.2014 6/6