RENESAS PS9307L2-E3

Preliminary Data Sheet
Specifications in this document are tentative and subject to change.
PS9307L,PS9307L2
R08DS0046EJ0001
Rev.0.01
Jan 25, 2012
0.6 A OUTPUT CURRENT, HIGH CMR, IGBT GATE DRIVE, 6-PIN SDIP PHOTOCOUPLER
DESCRIPTION
The PS9307L and PS9307L2 are optical coupled isolators containing a GaAlAs LED on the input side and a photo
diode, a signal processing circuit and a power output transistor on the output side on one chip.
The PS9307L and PS9307L2 are in 6-pin plastic SDIP (Shrink Dual In-line Package). The PS9307L2 has 8 mm
creepage distance. The mount area of 6-pin plastic SDIP is half size of 8-pin DIP.
The PS9307L and PS9307L2 are designed specifically for high common mode transient immunity (CMR) and high
switching speed. It is suitable for driving IGBTs and MOS FETs.
The PS9307L is lead bending type (Gull-wing) for surface mounting.
The PS9307L2 is lead bending type for long creepage distance (Gull-wing) for surface mount.
FEATURES
Long creepage distance (8 mm MIN.: PS9307L2)
Half size of 8-pin DIP
Peak output current (0.6 A MAX., 0.4 A MIN.)
High speed switching (tPLH, tPHL = 175 ns MAX.)
High common mode transient immunity (CMH, CML = ±50 kV/μs MIN.)
Operating Ambient Temperature (125 °C)
Embossed tape product : PS9307L-E3, PS9307L2-E3: 2 000 pcs/reel
Pb-Free product
Safety standards
• UL approved: No. E72422
• CSA approved: No. CA 101391 (CA5A, CAN/CSA-C22.2 60065, 60950)
• SEMKO approved: No. 1115598
• DIN EN60747-5-2 (VDE0884 Part2) approved: No. 40024069 (Option)
PIN CONNECTION
(Top View)
6
5
4
SHIELD
•
•
•
•
•
•
•
•
•
1
2
1. Anode
2. NC
3. Cathode
4. VEE
5. VO
6. VCC
3
APPLICATIONS
•
•
•
•
IGBT, Power MOS FET Gate Driver
Industrial inverter
AC Servo
PDP
R08DS0046EJ0001 Rev.0.01
Jan 25, 2012
Page 1 of 12
Preliminary document
Specifications in this document are tentative and subject to change.
PS9307L,PS9307L2
Chapter Title
PACKAGE DIMENSIONS (UNIT: mm)
Lead Bending Type (Gull-wing) For Surface Mount
PS9307L
4.58±0.3
6.8±0.25
(0.82)
9.7±0.3
0.25±0.15
0.2±0.15
3.5±0.2
3.7±0.25
7.62
1.27
0.4±0.1
0.8±0.25
0.25 M
Lead Bending Type (Gull-wing) For Long Creepage Distance (Surface Mount)
PS9307L2
4.58±0.3
6.8±0.25
(0.82)
11.5±0.3
1.27
0.4±0.1
R08DS0046EJ0001 Rev.0.01
Jan 25, 2012
0.25±0.15
0.2±0.15
3.5±0.2
3.7±0.25
7.62
0.75±0.25
0.25 M
Page 2 of 12
Preliminary document
Specifications in this document are tentative and subject to change.
PS9307L,PS9307L2
Chapter Title
PHOTOCOUPLER CONSTRUCTION
Parameter
Air Distance (MIN.)
Outer Creepage Distance (MIN.)
Isolation Distance (MIN.)
PS9307L
7 mm
7 mm
0.4 mm
PS9307L2
8 mm
8 mm
0.4 mm
MARKING EXAMPLE
R
9307
N131
Company Initial
Type Number
Assembly Lot
No. 1 pin Mark
N
1 31
Week Assembled
Year Assembled
(Last 1 Digit)
Rank Code
ORDERING INFORMATION
Part Number
Order Number
PS9307L
PS9307L-E3
PS9307L-AX
PS9307L-E3-AX
PS9307L2
PS9307L2-E3
PS9307L2-AX
PS9307L2-E3-AX
PS9307L-V
PS9307L-V-E3
PS9307L-V-AX
PS9307L-V-E3-AX
PS9307L2-V
PS9307L2-V-AX
PS9307L2-V-E3 PS9307L2-V-E3-AX
Note:
Solder Plating
Specification
Pb-Free
(Ni/Pd/Au)
Packing Style
20 pcs (Tape 20 pcs cut)
Embossed Tape 2 000
pcs/reel
20 pcs (Tape 20 pcs cut)
Embossed Tape 2 000
pcs/reel
20 pcs (Tape 20 pcs cut)
Embossed Tape 2 000
pcs/reel
20 pcs (Tape 20 pcs cut)
Embossed Tape 2 000
pcs/reel
Safety Standard
Approval
Standard
products
(UL, CSA,
SEMKO
approved)
Application
*1
Part Number
PS9307L
PS9307L2
DIN EN60747-5-2 PS9307L
(VDE0884 Part2)
approved
(Option)
PS9307L2
*1. For the application of the Safety Standard, following part number should be used.
R08DS0046EJ0001 Rev.0.01
Jan 25, 2012
Page 3 of 12
Preliminary document
Specifications in this document are tentative and subject to change.
PS9307L,PS9307L2
Chapter Title
ABSOLUTE MAXIMUM RATINGS (TA = 25°C, unless otherwise specified)
Diode
Parameter
Forward Current
Symbol
IF
Peak Transient Forward Current
(Pulse Width < 1 μs)
Reverse Voltage
Power Dissipation *1
Detector High Level Peak Output Current *2
Low Level Peak Output Current *2
Supply Voltage
Output Voltage
Power Dissipation *3
Isolation Voltage *4
Operating Frequency
Operating Ambient Temperature
Storage Temperature
Notes: *1.
*2.
*3.
*4.
IF (TRAN)
VR
PD
IOH (PEAK)
IOL (PEAK)
(VCC − VEE)
VO
PC
BV
f
TA
Tstg
Ratings
25
1.0
Unit
mA
A
5
45
0.6
0.6
0 to 35
0 to VCC
250
5 000
250
−40 to +125
−55 to +150
V
mW
A
A
V
V
mW
Vr.m.s.
kHz
°C
°C
Reduced to 1.2 mW/°C at TA = 110°C or more.
Maximum pulse width = 10 μs, Maximum duty cycle = 0.5%
Reduced to 3.9 mW/°C at TA = 85°C or more.
AC voltage for 1 minute at TA = 25°C, RH = 60% between input and output.
Pins 1-3 shorted together, 4-6 shorted together.
RECOMMENDED OPERATING CONDITIONS
Parameter
Supply Voltage
Forward Current (ON)
Forward Voltage (OFF)
Operating Ambient Temperature
R08DS0046EJ0001 Rev.0.01
Jan 25, 2012
Symbol
(VCC − VEE)
IF (ON)
VF (OFF)
TA
MIN.
10
8
−2
−40
TYP.
MAX.
30
12
0.8
125
Unit
V
mA
V
°C
Page 4 of 12
Preliminary document
Specifications in this document are tentative and subject to change.
PS9307L,PS9307L2
Chapter Title
ELECTRICAL CHARACTERISTICS (at RECOMMENDED OPERATING CONDITIONS,
VEE = GND, unless otherwise specified)
Diode
Detector
Coupled
Notes: *1.
*2.
*3.
*4.
Parameter
Forward Voltage
Reverse Current
Input Capacitance
High Level Output Current
Symbol
VF
IR
CIN
IOH
Low Level Output Current
IOL
High Level Output Voltage
Low Level Output Voltage
High Level Supply Current
Low Level Supply Current
VOH
VOL
ICCH
ICCL
Threshold Input Current
(L → H)
IFLH
Conditions
IF = 10 mA, TA = 25°C
VR = 3 V, TA = 25°C
f = 1 MHz, VF = 0 V
VO = (VCC − 4 V) *2
VO = (VCC − 10 V) *3
VO = (VEE + 2.5 V) *2
VO = (VEE + 10 V) *3
IF = 10 mA, IO = 100 mA *4
IF = 0 mA, IO = 100 mA
IF = 10 mA, IO = 0 mA
IF = 0 mA, IO = 0 mA
IO = 0 mA, VO > 5 V
Threshold Input Voltage
(H → L)
VFHL
IO = 0 mA, VO < 5 V
MIN.
1.3
TYP.*1
1.56
MAX.
1.8
10
30
0.2
0.4
0.7
0.2
0.4
0.7
VCC − 3.0 VCC − 1.7
0.4
1.2
1.3
2.1
Unit
V
μA
pF
A
A
1.0
2.0
2.0
5.0
0.8
V
V
mA
mA
mA
V
Typical values at TA = 25°C, VCC − VEE = 30 V.
Maximum pulse width = 50 μs, Maximum duty cycle = 0.2%.
Maximum pulse width = 10 μs, Maximum duty cycle = 0.5%.
VOH is measured with the DC load current in this testing.
SWITCHING CHARACTERISTICS (at RECOMMENDED OPERATING CONDITIONS,
VEE = GND, unless otherwise specified)
Parameter
Symbol
Propagation Delay Time (L → H)
tPLH
Propagation Delay Time (H → L)
tPHL
Pulse Width Distortion (PWD)
|tPHL−tPLH|
tPHL−tPLH
Propagation Delay Time
(Difference Between Any Two
Products)
Rise Time
tr
Fall Time
tf
|CMH|
Common Mode Transient
Immunity at High Level Output
|CML|
Common Mode Transient
Immunity at Low Level Output
Conditions
Rg = 47 Ω, Cg = 3 nF,
f = 50 kHz,
Duty Cycle = 50%*2,
IF = 10 mA, VCC = 30 V
MIN.
40
40
TYP.*1
75
90
−120
30
30
MAX.
175
175
90
120
Unit
ns
ns
ns
ns
ns
ns
TA = 25°C, IF = 10 mA,
VCC = 30 V, VCM = 1.5 kV
50
kV/μs
TA = 25°C, IF = 0 mA,
VCC = 30 V, VCM = 1.5 kV
50
kV/μs
Notes: *1. Typical values at TA = 25°C, VCC−VEE = 30 V.
*2. This load condition is equivalent to the IGBT load at 1 200 V/25 A.
R08DS0046EJ0001 Rev.0.01
Jan 25, 2012
Page 5 of 12
Preliminary document
Specifications in this document are tentative and subject to change.
PS9307L,PS9307L2
Chapter Title
TEST CIRCUIT
Fig. 2 IOL Test Circuit
Fig. 1 IOH Test Circuit
VCC =
10 to 30 V
1
6
2
5
0.1 μ F
VCC =
10 to 30 V
1
6
2
5
3
4
0.1 μ F
IOH
IOL
4V
3
IF =
8 to 12 mA
SHIELD
4
2.5 V
SHIELD
Fig. 4 VOL Test Circuit
Fig. 3 VOH Test Circuit
VCC =
10 to 30 V
1
VCC =
10 to 30 V
1
6
6
0.1 μ F
5
2
3
IF =
8 to 12 mA
SHIELD
4
0.1 μ F
VOH
100 mA
VOL
5
2
3
SHIELD
Fig. 5 IFLH Test Circuit
100 mA
4
Fig. 6 ICCH/ICCL Test Circuit
VCC =
10 to 30 V
1
VCC =
10 to 30 V
1
6
6
0.1 μ F
5
2
IF
3
SHIELD
4
0.1 μ F
VO > 5 V
5
2
3
SHIELD
4
ICCL : IF = 0 mA
ICCH : IF = 10 mA
R08DS0046EJ0001 Rev.0.01
Jan 25, 2012
Page 6 of 12
Preliminary document
Specifications in this document are tentative and subject to change.
PS9307L,PS9307L2
Chapter Title
Fig. 7 tPLH, tPHL, tr, tf Test Circuit and Wave Forms
VCC =
10 to 30 V
IF = 10 mA
1
6
IF
0.1 μ F
10 kHz
50% DUTY
CYCLE
5
2
3
47 Ω
3 nF
tf
90%
50%
10%
VOUT
4
SHIELD
tr
VO
tPLH
tPHL
Fig. 8 CMR Test Circuit and Wave Forms
IF A
VCC = 30 V
1
6
0.1 μ F
B
5
2
3
4
SHIELD
+
−
1 500 V
90%
VCM
VO
10%
tr
VO
(Switch A: IF = 10 mA)
VO
(Switch B: IF = 0 mA)
tf
VOH
26 V
1V
VOL
VCM = 1.5 kV
Remarks 1. Common Mode Transient Immunity at High Level Output is the maximum value of dVCM/dt at which the
output remains High Level (e.g. VO > 15 V).
2. Common Mode Transient Immunity at Low Level Output is the maximum value of dVCM/dt at which the
output remains Low Level (e.g. VO < 1.0 V).
R08DS0046EJ0001 Rev.0.01
Jan 25, 2012
Page 7 of 12
Preliminary document
Specifications in this document are tentative and subject to change.
PS9307L,PS9307L2
Chapter Title
TAPING SPECIFICATIONS (UNIT: mm)
7.5±0.1
1.5 +0.1
–0
4.5 MAX.
10.2±0.1
4.0±0.1
16.0±0.3
2.0±0.1
1.75±0.1
Outline and Dimensions (Tape)
1.5 +0.1
–0
0.35
8.0±0.1
4.05±0.1
5.08±0.1
Tape Direction
PS9307L-E3
Outline and Dimensions (Reel)
R 1.0
100±1.0
2.0±0.5
13.0±0.2
330±2.0
2.0±0.5
21.0±0.8
17.5±1.0
21.5±1.0
Packing: 2 000 pcs/reel
R08DS0046EJ0001 Rev.0.01
Jan 25, 2012
15.9 to 19.4
Outer edge of
flange
Page 8 of 12
Preliminary document
Specifications in this document are tentative and subject to change.
PS9307L,PS9307L2
Chapter Title
11.5±0.1
1.5 +0.1
–0
4.5 MAX.
12.0±0.1
4.0±0.1
24.0±0.3
2.0±0.1
1.75±0.1
Outline and Dimensions (Tape)
2.0 +0.1
–0
8.0±0.1
0.35
4.05±0.1
5.08±0.1
Tape Direction
PS9307L2-E3
Outline and Dimensions (Reel)
R 1.0
100±1.0
2.0±0.5
13.0±0.2
330±2.0
2.0±0.5
21.0±0.8
25.5±1.0
29.5±1.0
Packing: 2 000 pcs/reel
R08DS0046EJ0001 Rev.0.01
Jan 25, 2012
23.9 to 27.4
Outer edge of
flange
Page 9 of 12
Preliminary document
Specifications in this document are tentative and subject to change.
PS9307L,PS9307L2
Chapter Title
RECOMMENDED MOUNT PAD DIMENSIONS (UNIT: mm)
B
C
D
A
Part Number
Lead Bending
A
B
C
D
PS9307L
lead bending type (Gull-wing)
for surface mount
9.2
1.27
0.8
2.2
PS9307L2
lead bending type (Gull-wing)
for long creepage distance (surface mount)
10.2
1.27
0.8
2.2
R08DS0046EJ0001 Rev.0.01
Jan 25, 2012
Page 10 of 12
Preliminary document
Specifications in this document are tentative and subject to change.
PS9307L,PS9307L2
Chapter Title
NOTES ON HANDLING (UNIT: mm)
CAUTIONS REGARDING NOISE
Be aware that when voltage is applied suddenly between the photocoupler’s input and output at startup, the output
transistor may enter the on state, even if the voltage is within the absolute maximum ratings.
USAGE CAUTIONS
1. This product is weak for static electricity by designed with high-speed integrated circuit so protect against static
electricity when handling.
2. Board designing
(1) By-pass capacitor of more than 0.1 μF is used between VCC and GND near device. Also, ensure that the distance
between the leads of the photocoupler and capacitor is no more than 10 mm.
(2) When designing the printed wiring board, ensure that the pattern of the IGBT collectors/emitters is not too close
to the input block pattern of the photocoupler.
If the pattern is too close to the input block and coupling occurs, a sudden fluctuation in the voltage on the IGBT
output side might affect the photocoupler’s LED input, leading to malfunction or degradation of characteristics.
(If the pattern needs to be close to the input block, to prevent the LED from lighting during the off state due to
the abovementioned coupling, design the input-side circuit so that the bias of the LED is reversed, within the
range of the recommended operating conditions, and be sure to thoroughly evaluate operation.)
(3) Pin 2 (which is an NC*1 pin) can either be connected directly to the GND pin on the LED side or left open.
Unconnected pins should not be used as a bypass for signals or for any other similar purpose because this may
degrade the internal noise environment of the device.
Note: *1. NC: Non-Connection (No Connection).
3. Make sure the rise/fall time of the forward current is 0.5 μs or less.
4. In order to avoid malfunctions, make sure the rise/fall slope of the supply voltage is 3 V/μs or less.
5. Avoid storage at a high temperature and high humidity.
R08DS0046EJ0001 Rev.0.01
Jan 25, 2012
Page 11 of 12
Preliminary document
Specifications in this document are tentative and subject to change.
PS9307L,PS9307L2
Caution
GaAs Products
Chapter Title
This product uses gallium arsenide (GaAs).
GaAs vapor and powder are hazardous to human health if inhaled or ingested, so please observe
the following points.
• Follow related laws and ordinances when disposing of the product. If there are no applicable laws
and/or ordinances, dispose of the product as recommended below.
1. Commission a disposal company able to (with a license to) collect, transport and dispose of
materials that contain arsenic and other such industrial waste materials.
2. Exclude the product from general industrial waste and household garbage, and ensure that the
product is controlled (as industrial waste subject to special control) up until final disposal.
• Do not burn, destroy, cut, crush, or chemically dissolve the product.
• Do not lick the product or in any way allow it to enter the mouth.
R08DS0046EJ0001 Rev.0.01
Jan 25, 2012
Page 12 of 12
Revision History
PS9307L,PS9307L2 Preliminary Data Sheet
Rev.
Date
Page
0.01
Jan 25, 2012
−
Description
Summary
First edition issued
All trademarks and registered trademarks are the property of their respective owners.
C-1
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Tel: +60-3-7955-9390, Fax: +60-3-7955-9510
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11F., Samik Lavied' or Bldg., 720-2 Yeoksam-Dong, Kangnam-Ku, Seoul 135-080, Korea
Tel: +82-2-558-3737, Fax: +82-2-558-5141
© 2012 Renesas Electronics Corporation. All rights reserved.
Colophon 1.1