MAXIM MAX34565

19-6083; Rev 0; 12/11
MAX34565
12V Hot-Plug Switch in TDFN Package
General Description
The MAX34565 is a hot-plug controller for 12V power
rails. It is a completely integrated solution including the
required power-pass MOSFET device for 12V supplies.
During hot-plug, the device controls the supply output
voltage ramp (dV/dt) and limits the current at a usercontrolled level. The device also limits the output voltage
to protect downstream devices from overvoltage events.
The MAX34565 is offered in a latchoff version.
Applications
SCompletely Integrated Hot-Plug Functionality for
12V Power Rails
SOn-Board Power MOSFET
SNo High Power RSENSE Resistor Needed
SAdjustable Current Limit
SAdjustable Output Voltage Slew Rate
SThermal Fault Indication
SOutput Overvoltage Limiting
SOn-Board Thermal Protection
PCI/PCI Express®
InfiniBandTM/SM
Base Stations
RAID/Hard Drives
Servers
Switches/Routers
Features
SOn-Board Charge Pump
SLatchoff Version
Ordering Information appears at end of data sheet.
+12V
SUPPLY
Functional Diagram
VCC
UVLO
5V
REG
68mΩ
CHARGE
PUMP
LOAD
+12V
LOAD
ILIM
RILIM
CURRENT
LIMIT
OVERVOLTAGE
LIMIT
MAX34565
GND
VRAMP
CVRAMP
VOHT
17µA
EN/FAULT
1.4V
POR
BLANKING
THERMAL
LIMIT
VOLT
THERMAL RESET
PCI Express is a registered service mark of PCI-SIG Corp.
InfiniBand is a trademark and service mark of InfiniBand Trade Association.
For related parts and recommended products to use with this part, refer to: www.maxim-ic.com/MAX34565.related
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For pricing, delivery, and ordering information, please contact Maxim Direct at 1-888-629-4642,
or visit Maxim’s website at www.maxim-ic.com.
MAX34565
12V Hot-Plug Switch in TDFN Package
ABSOLUTE MAXIMUM RATINGS
(All voltages relative to GND.)
Voltage Range on VCC
Continuous..........................................................-0.3V to +18V
1ms.....................................................................-0.3V to +22V
Voltage Range on ILIM, VRAMP............... -0.3V to (VCC + 0.3V),
not to exceed +18V
Voltage on EN/FAULT..............................................-0.3V to +6V
12V Drain Current (TA = +25NC, 0.5sq in. pad)... 3.6A (continuous)
Continuous Power Dissipation (TA = +70NC)
TDFN (derate at 24.4mW/NC above +70NC)............1951.2mW
Operating Junction Temperature...................... -40NC to +150NC
Storage Temperature Range ........................... -55NC to +150NC
Lead Temperature (soldering, 10s).................................+300NC
Soldering Temperature (reflow).......................................+260NC
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect device reliability.
RECOMMENDED OPERATING CONDITIONS
(TJ = -40NC to +150NC, unless otherwise noted.)
PARAMETER
SYMBOL
VCC Voltage
VCC
RILIM Value
RILIM
EN/FAULT Low Level (LOAD
Disabled)
VOLT
EN/FAULT High Level (LOAD
Enabled)
VOHT
CONDITIONS
(Notes 1, 2)
MIN
TYP
MAX
UNITS
9
12
13.2
V
30
I
0.80
V
12
3.3
V
ELECTRICAL CHARACTERISTICS
(VCC = 12V, TJ = +25NC, unless otherwise noted.)
PARAMETER
SYMBOL
Supply Current
ICC
UVLO Rising
VUR
UVLO Falling
VUF
UVLO Hysteresis
VUH
CONDITIONS
MIN
TYP
MAX
UNITS
1.6
2.25
mA
7.5
8.0
8.5
V
6.5
7.0
7.5
V
(Note 3)
1
On-Resistance
RON
68
MOSFET Output Capacitance
COUT
400
Shutdown Junction Temperature
TSHDN
Thermal Hysteresis
THYS
Overvoltage Clamp
VOVC
Power-On Short-Circuit Current
Limit (Kelvin Sense)
ISCL
Operating Overload Current Limit
(Kelvin Sense)
IOVL
VRAMP Time
(0V to 12V)
tVRAMP
(Note 4)
+140
+155
V
88
pF
+175
40
RILIM = 15.4I (Note 4)
mI
NC
NC
13.5
15
16.5
V
2.75
3.44
4.25
A
RILIM = 24.9I
2.1
A
RILIM = 15.4I
4.6
A
RILIM = 24.9I
3.5
A
CVRAMP = 270pF
7
ms
CVRAMP = 470pF
12
ms
CVRAMP = 1000pF
25
ms
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MAX34565
12V Hot-Plug Switch in TDFN Package
ELECTRICAL CHARACTERISTICS (continued)
(VCC = 12V, TJ = +25NC, unless otherwise noted.)
PARAMETER
SYMBOL
EN/FAULT Fault Output Voltage
CONDITIONS
MIN
VFAULT
TYP
0.82
MAX
UNITS
1.95
V
Note 1: All voltages are referenced to ground. Currents entering the device are specified positive, and currents exiting the device
are negative.
Note 2: This supply range guarantees that the LOAD voltage is not clamped by the overvoltage limit.
Note 3: Supply current specified with no load on the LOAD pin.
Note 4: Guaranteed by design; not production tested.
Typical Operating Characteristics
(VCC = 12V, TJ = +25°C, unless otherwise noted.)
CURRENT LIMIT vs. TEMPERATURE
CURRENT LIMIT (A)
IOVL
4.0
3.5
ISCL
1.5
1.0
0.5
0
4
ISCL
3
2
18
21
24
27
20
40
60
80 100 120
70
60
15.6
15.4
15.2
40
80 100 120
TEMPERATURE (°C)
80 100 120
SUPPLY CURRENT vs. TEMPERATURE
2.0
1.8
1.6
1.2
1.0
0.8
0.2
0
60
60
0.4
10
14.8
40
0.6
20
10Ω LOAD
20
1.4
50
30
40
0
TEMPERATURE (°C)
ICC (mA)
RON (mΩ)
15.8
20
-40 -20
MAX34565 toc05
80
MAX34565 toc04
NO LOAD
0
ISCL
1.5
ON-RESISTANCE vs. TEMPERATURE
OVERVOLTAGE CLAMP vs. TEMPERATURE
-40 -20
2.0
TEMPERATURE (°C)
16.2
15.0
2.5
0
0
RILIM (Ω)
16.0
3.0
0.5
-40 -20
30
IOVL
1.0
0
15
RILIM = 24Ω
3.5
1
12
OVERVOLTAGE CLAMP (V)
4.0
MAX34565 toc03
IOVL
MAX34565 toc06
3.0
2.5
2.0
RILIM = 15Ω
5
CURRENT LIMIT vs. TEMPERATURE
4.5
CURRENT LIMIT (A)
MAX34565 toc01
5.5
5.0
4.5
CURRENT LIMIT (A)
6
MAX34565 toc02
CURRENT LIMIT vs. RILIM
6.0
0
-40 -20
0
20
40
60
80 100 120
TEMPERATURE (°C)
-40 -20
0
20
40
60
80 100 120
TEMPERATURE (°C)
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MAX34565
12V Hot-Plug Switch in TDFN Package
Typical Operating Characteristics (continued)
(VCC = 12V, TJ = +25°C, unless otherwise noted.)
TURN-ON WAVEFORMS
(VCC = 12V, EN/FAULT)
TURN-ON WAVEFORMS
(VCC = 12V, 10Ω RESISTIVE LOAD)
MAX34565 toc07
MAX34565 toc08
RILIM = 15Ω
2V/div
VCC
VCC
2V/div
LOAD
LOAD
500mA/div
EN/FAULT
LOAD CURRENT
5ms/div
5ms/div
TURN-ON WAVEFORMS
(VCC = 12V, 3300µF CAPACITIVE LOAD)
MAX34565 toc09
RILIM = 15Ω
2V/div
VCC
LOAD
LOAD CURRENT
1A/div
5ms/div
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MAX34565
12V Hot-Plug Switch in TDFN Package
Pin Configuration
TOP VIEW
LOAD LOAD LOAD LOAD LOAD
10
9
8
7
6
MAX34565
VCC/EP
+
1
2
3
4
GND VRAMP EN/ ILIM
FAULT
5
N.C.
TDFN
(3mm x 3mm)
Pin Description
PIN
NAME
1
GND
FUNCTION
2
VRAMP
Voltage Ramp Control. A capacitor connected to this pin determines the voltage ramp of the LOAD
output during turn-on according to the equation tVRAMP = 25E6 x CVRAMP for voltage ramp from 0
to 12V. This pin can be left open circuit for a minimum ramp time.
3
EN/FAULT
Enable/Fault. This pin is a multiple function digital input-output pin. When this pin is externally pulled
low, the MOSFET is turned off. When this pin is left open or not externally driven, the internal pullup
reference pulls the input high, and the MOSFET is allowed to turn on. Note: Do not use an
external pullup on this pin. If the device experiences a thermal fault, this pin becomes an output that
is pulled internally to a mid-level voltage, VFAULT.
4
ILIM
Supply Current Limit Adjust. A resistor from this pin to LOAD determines the current limit for the
pass connection.
5
N.C.
No Connection. Do not connect any signal to this pin.
Ground Connection
6
7
8
LOAD
Load Output. N-channel power MOSFET source connection.
9
10
—
VCC/EP
12V Supply Input/Exposed Pad. Power-supply input and n-channel power MOSFET drain connection. Should be connected to a large trace or plane. The EP also acts as a heatsink, and can
dissipate heat from the device.
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MAX34565
12V Hot-Plug Switch in TDFN Package
The MAX34565 is a self-contained hot-plug switch
intended to be used on +12V power buses to limit
through current and to control the power-up outputvoltage ramp. The device begins to operate when VCC
exceeds the undervoltage lockout level, VUR. At this
level, the enable circuit and EN/FAULT pin become
active. Once the device has been enabled by exceeding VOLT on the EN/FAULT pin, a gate voltage is applied
to the power MOSFET, allowing current to begin flowing
from the VCC pad to LOAD.
The device contains an on-board 68mI n-channel power
MOSFET that is actively closed-loop controlled to ensure
that an adjustable current limit is not exceeded. The
maximum allowable current through the device is determined by an external resistor connected to the ILIM pin.
The device also contains the ability to control the powerup output-voltage ramp. A capacitor connected to the
VRAMP pin sets the desired voltage ramp rate. The
output voltage is unconditionally clamped to keep input
overvoltage stresses from harming the load. The device
has an on-board temperature sensor with hysteresis.
If operating conditions cause the device to exceed an
internal thermal limit, the device unconditionally shuts
down and latches off while waiting for a power-on reset.
In the event of thermal shutdown, the device drives the
EN/FAULT pin to an intermediate voltage, VFAULT.
Undervoltage Lockout
When voltage is applied to VCC, the undervoltage lockout
rising limit, VUR, must be exceeded before the MOSFET
circuit is enabled. When the voltage on VCC drops below
VUF, the current through the MOSFET is blocked. Note
that to allow current to pass through to the LOAD pins,
VCC must exceed VUR and the voltage on EN/FAULT
must exceed VOHT.
the device’s output is disabled. If the internal temperature of the device exceeds TSHDN, a thermal fault
occurs and the device drives EN/FAULT to VFAULT.
See Figure 1 for the EN/FAULT signal levels.
An open-drain device should be connected to the EN/
FAULT pin for proper operation. Because the device
pulls EN/FAULT to VFAULT (a three-state condition) in the
event of thermal shutdown, this pin should not be connected to an external pullup device. See Figure 2 for a
typical application circuit.
LOAD
ENABLED
EN/FAULT SIGNAL
Detailed Description
THERMAL
SHUTDOWN/
FAULT
VOHT
VFAULT
LOAD
DISABLED
VOLT
Figure 1. EN/FAULT Signal Levels
12V
VCC
LOAD
MAX34565
RILIM
EN/FAULT
ILIM
Enable/Fault Function (EN/FAULT)
The EN/FAULT pin can be used to control the output
of the device and to indicate that a thermal fault has
occurred. The voltage level of the EN/FAULT pin is
compared to two internal sources: voltage on limit
(VOHT) and voltage off limit (VOLT). When VCC is above
VUR and the voltage level on EN/FAULT exceeds VOHT,
the voltage ramp circuit turns on, enabling the device’s
output. When the voltage on EN/FAULT is below VOLT,
GND
VRAMP
ENABLE
Figure 2. Typical Application Circuit
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MAX34565
12V Hot-Plug Switch in TDFN Package
Output-Voltage Ramp (VRAMP)
Direct and Kelvin Current Sensing
The voltage ramp circuit uses an operational amplifier to
control the gate bias of the n-channel power MOSFET.
When the voltage on EN/FAULT is below VOLT, a FET
is used to keep CVRAMP discharged, which forces the
output voltage to GND. Once the voltage on EN/FAULT
is above VOHT, an internal current source begins to
charge the external capacitor, CVRAMP, connected to the
VRAMP pin. The amplifier controls the gate of the power
MOSFET so that the LOAD output voltage divided by
two tracks the rising voltage level of CVRAMP. The output
voltage continues to ramp until it reaches either the input
VCC level or the overvoltage clamp limits.
The current limit circuit can be biased in one of two ways:
direct sensing or Kelvin sensing. Using direct sensing,
the sense resistor is connected between the ILIM pin and
the LOAD pins (Figure 3). Because the bond wires of all
five LOAD pins are in parallel, the on-resistance is slightly
lower. Using Kelvin sensing, only one of the LOAD pins
is connected to the ILIM pin through the sense resistor
(Figure 4). Using this circuit, the voltage on the die is
sensed, negating any impact of the bond wire resistance.
Because four LOAD pins are connected in parallel, the
on-resistance is slightly higher.
Overvoltage Limit
The device enters a thermal shutdown state when the
temperature of the power MOSFET reaches or exceeds
TSHDN, approximately +155NC. When TSHDN is exceeded, the thermal-limiting circuitry disables the device
using the enable circuitry. The EN/FAULT pin is driven to
VFAULT. The device is offered in two different versions:
an autoretry version and a latchoff version.
The overvoltage-limiting clamp monitors the VRAMP
voltage level compared to an internal voltage reference.
When the voltage on VRAMP exceeds VOVC/2, the gate
voltage of the n-channel power MOSFET is reduced,
limiting the voltage on LOAD to VOVC even as VCC
increases. If the device is in overvoltage for an extended
period of time, the device may overheat and enter thermal shutdown. This is caused by the power created by
the voltage drop across the power MOSFET and the load
current.
Current Limit
The load current is continuously monitored during the
initial voltage ramping (ISCL) and during normal operation (IOVL). If the current exceeds the current limit that is
set by the external resistance at ILIM, the gate voltage
of the power MOSFET is decreased, reducing the output
current to the set current limit. Current is limited by the
device comparing the voltage difference between the
LOAD and ILIM pins to an internal reference voltage.
When the output power is initially ramping up, the current
limit is ISCL. Once the voltage ramping is complete, the
current limit is IOVL. The lower ISCL current limit protects
the source if there is a dead short on initial power-up. If
the high current is maintained, the device will heat up
and the internal temperature will eventually reach TSHDN.
The device act as a fuse and automatically disable the
current flowing to the load when the temperature of the
power MOSFET has exceeded the shutdown junction
temperature, TSHDN.
Thermal Shutdown
ILOAD
LOAD
LOAD
TO APPLICATION
LOAD
MAX34565
LOAD
LOAD
RLIM
ILIM
Figure 3. Direct Sensing Circuit
ILOAD
LOAD
LOAD
TO APPLICATION
LOAD
MAX34565
LOAD
LOAD
RLIM
ILIM
Figure 4. Kelvin Sensing Circuit
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MAX34565
12V Hot-Plug Switch in TDFN Package
Latchoff Version
Once the latchoff version has entered thermal shutdown,
it does not attempt to turn back on. The only way to turn
this device back on is to cycle the power to the device.
When power is reapplied ton the VCC pad, the junction
temperature needs to be less than TSHDN for the device
to be enabled.
Applications Information
RILIM. To greatly reduce this offset, it is recommended
that one of the LOAD pins have a dedicated connection
to ILIM though RILIM, and not be used to pass the LOAD
current, ILOAD (Figure 6). This would leave four LOAD
pins to pass ILOAD, which should be sufficient. Because
there is only a small amount of current passed from this
lone LOAD pin to ILIM, there is a negligible voltage offset
applied to the internal comparator. This method is the
best way to attain an accurate current limit for ILOAD.
Exposed Pad (VCC)
The exposed pad is the voltage supply pin for the device
and should be connected to a large trace or plane. The
exposed pad also acts as a heatsink, and can dissipate
heat from the device.
Decoupling Capacitors
It is of utmost importance to properly bypass the device’s
supply pins. A decoupling capacitor absorbs the energy
stored in the supply and board parasitic inductance when
the FET is turned off, thereby reducing the magnitude of
overshoot of VCC. This can be accomplished by using a
high-quality (low ESR, low ESL) ceramic capacitor soldered directly between the VCC and GND connections.
Any series resistance with this bypass capacitor lowers
its effectiveness and is not recommended. A minimum
0.5FF ceramic capacitor is required (Figure 4). However,
depending on the parasitic inductances present in the
end application, a larger capacitor could be necessary.
Current Limiting Resistor
A small resistor (2I to 10I) in series with the GND pin of
the device limits current flow during momentary reverse
avalanche break down, and consequently limits total
parasitic charge injected into the device (Figure 5). If this
method is used, it is imperative that the bypass capacitor be directly across chip VCC and ground connections,
though not through this resistor.
LOAD and ILIM Connections
Small parasitic resistances in the bond wires of the LOAD
pins and in the traces connected to the LOAD pins can
result in a voltage offset while current is flowing. Since
the voltage drop across RILIM is used to set the ISCL and
IOVL limits, this induced offset can increase the value of
ISCL and IOVL from the specified values for any given
VCC
0.5µF
MINIMUM
REQUIRED
MAX34565
GND
2Ω TO 10Ω
RECOMMENDED
BOARD GROUND
Figure 5. Power Conditioning Circuit
LOAD
TO APPLICATION
LOAD
LOAD
MAX34565
LOAD
LOAD
RLIM
ILIM
Figure 6. LOAD and ILIM Connections
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MAX34565
12V Hot-Plug Switch in TDFN Package
Ordering Information
PART
TEMP RANGE
THERMAL SHUTDOWN
PIN-PACKAGE
MAX34565ETB+
-40NC to +150NC
Latchoff
10 TDFN-EP*
MAX34565ETB+T
-40NC to +150NC
Latchoff
10 TDFN-EP*
+Denotes a lead(Pb)-free/RoHS-compliant package.
T = Tape and reel.
*EP = Exposed pad.
Package Information
For the latest package outline information and land patterns (footprints), go to www.maxim-ic.com/packages. Note that a “+”, “#”, or
“-” in the package code indicates RoHS status only. Package drawings may show a different suffix character, but the drawing pertains
to the package regardless of RoHS status.
PACKAGE TYPE
PACKAGE CODE
OUTLINE NO.
LAND PATTERN NO.
10 TDFN-EP
T1033+2
21-0137
90-0061
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MAX34565
12V Hot-Plug Switch in TDFN Package
Revision History
REVISION
NUMBER
REVISION
DATE
0
12/11
DESCRIPTION
Initial release
PAGES
CHANGED
—
Maxim cannot assume responsibility for use of any circuitry other than circuitry entirely embodied in a Maxim product. No circuit patent licenses are implied.
Maxim reserves the right to change the circuitry and specifications without notice at any time. The parametric values (min and max limits) shown in the Electrical
Characteristics table are guaranteed. Other parametric values quoted in this data sheet are provided for guidance.
Maxim Integrated Products, 120 San Gabriel Drive, Sunnyvale, CA 94086 408-737-7600
© 2011
Maxim Integrated Products 10
Maxim is a registered trademark of Maxim Integrated Products, Inc.