ETC WINBOND

CONTENTS
Mobile RAM
Specialty DRAM
Flash Memory
03
05
06
07
09
12
13
15
16
17
27
28
28
Low Power SDR SDRAM
Low Power DDR SDRAM
Low Power DDR2 SDRAM
Pseudo SRAM (KGD)
SDRAM
DDR SDRAM
DDR2 SDRAM
DDR3 SDRAM
KGD
Serial Flash
Parallel Flash
NAND Flash
KGD
Mobile RAM
▪ Low Power SDR SDRAM
▪ Low Power DDR SDRAM
▪ Low Power DDR2 SDRAM
▪ Pseudo SRAM (KGD)
• The products listed above may not be available for all regions.Please
contact your local Winbound Sales Representative.
•
03
www.winbond.com
Low Power SDR SDRAM
Winbond’s LPSDR SDRAM(Low Power SDR SDRAM) product family is designed with specific features to reduce power
consumption, including Partial Array Self Refresh (PASR), Auto Temperature Compensated Self Refresh (ATCSR), Power
down mode, Deep power down mode and Programmable output buffer driving strength.
Note: If any request of KGD, please contact sales.
Low Power SDR SDRAM
Part No.
Density
Organization
Voltage
7E
W987D6HBGX
6I
W987D2HBJX
X16
128 Mbit
6E
166MHz, -25 to 85C
1.8V / 1.8V
X32
W988D2FBJX
W989D6CBGX
W989D2CBJX
W989D2KBJX
256 Mbit
6E
166MHz, -25 to 85C
1.8V / 1.8V
-
P
-
X32
166MHz, -25 to 85C
166MHz, -40 to 85C
133MHz, -25 to 85C
6E
X16
P
P
166MHz, -25 to 85C
6I
166MHz, -40 to 85C
7E
133MHz, -25 to 85C
512 Mbit
6E
6I
6E
6I
X32
X16
X32
1.8V / 1.8V
P
UD
54VFBGA
133MHz, -25 to 85C
6I
6E
P
90VFBGA
166MHz, -40 to 85C
7E
6I
W989D6KBGX
133MHz, -25 to 85C
133MHz, -25 to 85C
X16
6E
7E
Automotive
166MHz, -40 to 85C
7E
6I
Status1,2
54VFBGA
166MHz, -40 to 85C
166MHz, -25 to 85C
6I
W988D6FBGX
Package
133MHz, -25 to 85C
6E
7E
Speed Grade
166MHz, -25 to 85C
90VFBGA
54VFBGA
90VFBGA
166MHz, -40 to 85C
166MHz, -25 to 85C
166MHz, -40 to 85C
166MHz, -25 to 85C
166MHz, -40 to 85C
60VFBGA
90VFBGA
Status1: P= Mass Production, S (Time)= Samples (Ready Time), UD (Time)= Under Development (Ready Time), N= Not recommended for new designs
RoHS2: All Winbond products are "Green", Halogen-Free and RoHS compliant packaging. Refer to the datasheet for details and specifications.
Contact us: [email protected]
擔當
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04
Mobile RAM
Low Power DDR SDRAM
Winbond’s LPDDR SDRAM(Low Power DDR SDRAM) product family is designed with specific features to reduce power
consumption, including Partial Array Self Refresh (PASR), Auto Temperature Compensated Self Refresh (ATCSR), Power
down mode, Deep power down mode and Programmable output buffer driving strength.
Note: If any request of KGD, please contact sales.
Low Power DDR SDRAM
Part No.
Density
Organization
Voltage
6E
W947D6HBHX
W947D2HBJX
W948D6FBHX
1.8V / 1.8V
200MHz, -25 to 85C
166MHz, -40 to 85C
6E
166MHz, -25 to 85C
5E
200MHz, -25 to 85C
x16
6I
256 Mbit
5E
166MHz, -40 to 85C
1.8V / 1.8V
6I
W949D2KBJX
166MHz, -40 to 85C
5I
200MHz, -40 to 85C
166MHz, -25 to 85C
5E
200MHz, -25 to 85C
x16
6I
512 Mbit
5E
166MHz, -40 to 85C
1.8V / 1.8V
W94AD6KBHX
W94AD2KBJX
P
P
P
UD
UD(Q1/'13)
UD
90VFBGA
60VFBGA
166MHz, -25 to 85C
166MHz, -40 to 85C
200MHz, -25 to 85C
X16
512 Mbit
1.8V / 1.8V
X32
5I
5E
5E
-
60VFBGA
90VFBGA
200MHz, -40 to 85C
5E
5I
P
90VFBGA
200MHz, -40 to 85C
200MHz, -25 to 85C
x32
6I
5E
-
166MHz, -25 to 85C
6E
5I
P
60VFBGA
200MHz, -40 to 85C
200MHz, -25 to 85C
x32
5I
W949D6KBHX
Automotive
166MHz, -25 to 85C
200MHz, -40 to 85C
5I
Status1,2
200MHz, -40 to 85C
5I
6E
W949D2CBJX
166MHz, -40 to 85C
x32
6I
6E
W949D6CBHX
128 Mbit
5E
5I
W948D2FBJX
200MHz, -25 to 85C
x16
6I
6E
Package
166MHz, -25 to 85C
5E
5I
Speed Grade
200MHz, -25 to 85C
5I
1.8V / 1.8V
X32
200MHz, -25 to 85C
200MHz, -40 to 85C
X16
1Gbit
200MHz, -40 to 85C
200MHz, -40 to 85C
200MHz, -25 to 85C
200MHz, -40 to 85C
60VFBGA
90VFBGA
60VFBGA
90VFBGA
Status1: P= Mass Production, S (Time)= Samples (Ready Time), UD (Time)= Under Development (Ready Time), N= Not recommended for new designs
RoHS2: All Winbond products are "Green", Halogen-Free and RoHS compliant packaging. Refer to the datasheet for details and specifications.
Contact us: [email protected]
05
www.winbond.com
Low Power DDR2 SDRAM
Winbond’s LPDDR2 SDRAM(Low Power DDR2 SDRAM) product family is designed with specific features to reduce power
consumption, including Partial Array Self Refresh (PASR), Auto Temperature Compensated Self Refresh (ATCSR), Power
down mode, Deep power down mode and Programmable output buffer driving strength.
Note: If any request of KGD, please contact sales.
Low Power DDR2 SDRAM
Part No.
W979H6KBQX
W979H2KBQX
W97AH6KBQX
W97AH2KBQX
W97BH6KBQX
W97BH2KBQX
Density
3I
2I
3I
3I
2I
400MHz, -40 to 85C
333MHz, -40 to 85C
1.8V / 1.2V / 1.2V
x32
3I
2I
333MHz, -40 to 85C
x16
2I
x16
2Gbit
x32
Package
400MHz, -40 to 85C
x32
1Gbit
Speed Grade
333MHz, -40 to 85C
512 Mbit
2I
3I
Voltage
x16
3I
2I
Organization
400MHz, -40 to 85C
333MHz, -40 to 85C
400MHz, -40 to 85C
333MHz, -40 to 85C
400MHz, -40 to 85C
333MHz, -40 to 85C
400MHz, -40 to 85C
Status1,2
Automotive
UD(Q1/'13)
UD
UD(Q2/'13)
UD
UD(Q1/'13)
UD
168 PoP
168 PoP
168 PoP
168 PoP
168 PoP
168 PoP
Status1: P= Mass Production, S (Time)= Samples (Ready Time), UD (Time)= Under Development (Ready Time), N= Not recommended for new designs
RoHS2: All Winbond products are "Green", Halogen-Free and RoHS compliant packaging. Refer to the datasheet for details and specifications.
Contact us: [email protected]
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06
Mobile RAM
Pseudo SRAM (KGD)
Pseudo SRAM (Static Random Access Memory) consists of a DRAM macro core with a traditional SRAM interface; an
on-chip refresh circuit that frees the user from the need to take care of this task. Comparing to traditional CMOS SRAM,
PSRAM has advantage in higher density, higher speed, smaller die size, and DRAM compatible process.
Pseudo SRAM (KGD)
Part No.
Density
W965D6GKA
W955D6GKA
32 Mbit
Organization
Voltage
X16 CRAM
1.8V / 1.8V
Speed Grade
Status1,2
Automotive
-
P
-
X16 CRAM-ADM
1.8V / 1.8V
-
P
-
W955D6GKS
X16 CRAM-AADM
1.8V / 1.8V
-
P
-
W966D6HKA
X16 CRAM
1.8V / 1.8V
-
P
-
W956D6HKA
X16 CRAM-ADM
1.8V / 1.8V
-
P
-
X16 CRAM-AADM
1.8V / 1.8V
-
P
-
X16 CRAM-ADM
1.8V / 1.8V
-
P
-
W956D6KKS
X16 CRAM-AADM
1.8V / 1.8V
-
P
-
W956D6KKE
X16 CRAM-ADM_DDR
1.8V / 1.8V
-
P
-
W956D6KKW
X16 CRAM-AADM_DDR
1.8V / 1.8V
-
P
-
W967D6HKA
X16 CRAM
-
P
-
-
P
-
-
P
-
-
P
-
-
P
-
-
P
-
W956D6HKS
W956D6KKA
W957D6HKA
64 Mbit
128 Mbit
W957D6HKS
W958D6DKS
1.8V / 1.8V
133MHz / 70ns, -25 to 85C
133MHz / 70ns, -25 to 85C
X16 CRAM-AADM
W968D6DKA
W958D6DKA
X16 CRAM-ADM
133MHz / 70ns, -25 to 85C
Package
X16 CRAM
256Mbit
X16 CRAM-ADM
X16 CRAM-AADM
1.8V / 1.8V
133MHz / 70ns, -25 to 85C
Status1: P= Mass Production, S (Time)= Samples (Ready Time), UD (Time)= Under Development (Ready Time), N= Not recommended for new designs
RoHS2: All Winbond products are "Green", Halogen-Free and RoHS compliant packaging. Refer to the datasheet for details and specifications.
Contact us: [email protected]
07
www.winbond.com
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Specialty DRAM
▪ SDRAM
▪ DDR SDRAM
▪ DDR2 SDRAM
▪ DDR3 SDRAM
▪ KGD
• The products listed above may not be available for all regions.Please
contact your local Winbound Sales Representative.
09
www.winbond.com
SDRAM
Synchronous DRAM is designed to process data at the same clock speed as the CPU. Therefore, synchronous DRAM is
regarded as the core component that is used in high speed processing of large volumes of data. Currently, its usage is
expanding to various consumer electronics such as DTV, DSC, HDD and STB.
16Mb SDRAM
Part No.
W9816G6IB
W9816G6IH
Organization
1Mbit x16 1Mbit x16
2 Banks
2 Banks
Voltage
Speed Grade
3.3V±0.3V
-6/-6I
166 MHz
2.7V~3.6V
-7
143 MHz
3.3V±0.3V
-5
3.3V±0.3V
-6/-6I/-6A
166 MHz
2.7V~3.6V
-7/-7I
143 MHz
143 MHz
Status1,2
Automotive
VFBGA 60 Ball,
RoHS compliant
P
P
TSOP II 50-pin, 400 mil,
RoHS compliant
P
P
Status1,2
Automotive
Package
CL3
CL2
200 MHz
CL3
64Mb SDRAM
Part No.
W9864G2JB
W9864G2JH
Organization
2Mbit x32
2Mbit x32
4 Banks
4 Banks
Voltage
3.3V±0.3V
-6/-6I/-6K/-6A
166 MHz
2.7V~3.6V
-7/-7I
143 MHz
-5
200 MHz
-6/-6I/-6A
166 MHz
-7
143 MHz
-5
200 MHz
-6/-6I/-6A
166 MHz
2.7V~3.6V
-7/-7S
143 MHz
3.3V±0.3V
-6/-6I/-6A
166 MHz
2.7V~3.6V
-7
143 MHz
3.3V±0.3V
-6/-6I/-6A/-6K
166 MHz
3.3V±0.3V
2.7V~3.6V
W9864G6JH
4Mbit x16
4 Banks
W9864G6JB
4Mbit x16
4 Banks
W9864G6JT
4Mbit x16
4 Banks
Speed Grade
3.3V±0.3V
Package
CL3
TFBGA 90 Ball (8x13mm²),
RoHS compliant
P
P
CL3
TSOP II 86-pin,
RoHS compliant
P
P
CL3
TSOP II 54-pin, 400 mil,
RoHS compliant
P
P
CL3
VFBGA 60 Ball,
RoHS compliant
P
P
CL3
TFBGA 54 Ball,
RoHS compliant
P
P
Status1: P= Mass Production, S (Time)= Samples (Ready Time), UD (Time)= Under Development (Ready Time), N= Not recommended for new designs
RoHS2: All Winbond products are "Green", Halogen-Free and RoHS compliant packaging. Refer to the datasheet for details and specifications.
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Specialty DRAM
128Mb SDRAM
Part No.
W9812G6JH
W9812G6JB
Organization
8Mbit x16
8Mbit x16
4 Banks
4 Banks
Voltage
3.3V±0.3V
3.3V±0.3V
Speed Grade
-5
200 MHz
-6/-6I/-6A
166 MHz
-75
133 MHz
-6/-6I
166 MHz
-75/75I
133 MHz
Package
Status1,2
Automotive
CL3
TSOP II 54-pin, 400 mil,
RoHS compliant
P
P
CL3
TFBGA 54 Ball (8x8mm²),
RoHS compliant
P
P
256Mb SDRAM
Part No.
Organization
Voltage
3.3V±0.3V
W9825G2JB
W9825G6JH
8Mbit x32
16Mbit x16
4 Banks
4 Banks
Speed Grade
16Mbit x16
4 Banks
166 MHz
CL3
2.7V~3.6V
-75/75I
133 MHz
-5
200 MHz
-6/-6I/-6L/-6A
166 MHz
-6
-75/75L
W9825G6JB
3.3V±0.3V
Automotive
TFBGA 90 Ball,
ROHS compliant
P
P
TSOP II 54-pin, 400 mil - 0.80,
RoHS compliant
P
P
TFBGA 54 Ball (8x8mm²),
RoHS compliant
P
P
-6
-6I
3.3V±0.3V
Status1,2
Package
133 MHz
-6/-6I/-6A/-6K
166 MHz
-75
133 MHz
CL3
CL2
CL3
CL3
Status1: P= Mass Production, S (Time)= Samples (Ready Time), UD (Time)= Under Development (Ready Time), N= Not recommended for new designs'
RoHS2: All Winbond products are "Green", Halogen-Free and RoHS compliant packaging. Refer to the datasheet for details and specifications.
Winbond also provides Automotive DRAM.
Contact us: [email protected]
11
www.winbond.com
DDR SDRAM
DDR SDRAM or double-data-rate synchronous dynamic random access memory is a type of memory used in computers and
consumer electronics. It achieves greater bandwidth than the preceding single-data-rate SDRAM by transferring data on both
the rising and falling edges of the clock signal.
64Mb DDR
Part No.
W9464G6JH
Organization
4Mbitx16
Voltage
4 Banks
Speed Grade
Status1,2
Automotive
P
P
Status1,2
Automotive
TSOP II 66-pin,
RoHS compliant
P
P
TFBGA 60 Ball (8x13mm²),
RoHS compliant
P
P
Status1,2
Automotive
TSOP II 66-pin,
RoHS compliant
P
P
TFBGA 60 Ball,
RoHS compliant
P
P
Package
2.4V~2.7V
-4
250 MHz
CL3/CL4
2.5V±0.2V
-5/-5I
200 MHz
CL3
TSOP II 66-pin,
RoHS compliant
128Mb DDR
Part No.
Organization
Voltage
2.4V~2.7V
W9412G6JH
8Mbitx16
4 Banks
Speed Grade
-4
Package
250 MHz
CL3/CL4
200 MHz
CL3
-5/-5I/-5K
2.5V±0.2V
-6I
W9412G6JB
8Mbitx16
4 Banks
2.4V~2.7V
-4
250 MHz
CL3/CL4
2.5V±0.2V
-5/-5I
200 MHz
CL3
256Mb DDR
Part No.
Organization
W9425G6JH
16Mbitx16
4 Banks
W9425G6JB
16Mbitx16
4 Banks
Voltage
Speed Grade
Package
2.4V~2.7V
-4
250 MHz
CL3/CL4
2.5V ±0.2V
-5/-5I/-5A
200 MHz
CL3
2.5V ±0.2V
-5/-5I
200MHz
CL3
Status1: P= Mass Production, S (Time)= Samples (Ready Time), UD (Time)= Under Development (Ready Time), N= Not recommended for new designs
RoHS2: All Winbond products are "Green", Halogen-Free and RoHS compliant packaging. Refer to the datasheet for details and specifications.
Winbond also provides Automotive DRAM.
Contact us: [email protected]
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Specialty DRAM
DDR2 SDRAM
DDR2 SDRAM ( double-data-rate synchronous dynamic random access memory generation 2 ) is a type of memory used in
computers and consumer electronics. It achieves greater bandwidth than the preceding DDR SDRAM by higher clock rate
128Mb DDR2
Part No.
W9712G6KB
W9712G6KT
W9712G8JB
Organization
8Mbit x16
16Mbitx8
Voltage
4 Banks
4 Banks
Speed Grade
1.8V±0.1V
1.8V±0.1V
CL-tRCD-tRP
-18
DDR2-1066
7-7-7
-25
DDR2-800
5-5-5/6-6-6
-3
DDR2-667
5-5-5
-18
DDR2-1066
7-7-7
-25
DDR2-800
5-5-5/6-6-6
-3
DDR2-667
5-5-5
Status1,2
Automotive
TFBGA 84 Ball (8x12.5mm²),
RoHS compliant
P
P
WBGA 60 Ball (8x12.5mm²),
RoHS compliant
P
P
Package
256Mb DDR2
Part No.
Organization
W9725G2JB 8Mbit x32
Voltage
4 Banks 1.8V±0.1V
Speed Grade
-25
DDR2-800
5-5-5/6-6-6
-3
DDR2-667
5-5-5
-18
DDR2-1066
W9725G6KB
16Mbit x16 4 Banks 1.8V±0.1V -25/25I/25A/25K DDR2-800
W9725G6KT
-3
DDR2-667
W9725G8KB 32Mbitx8
4 Banks 1.8V±0.1V
CL-tRCD-tRP
Package
TFBGA 128 Ball(10.5X13.5 mm²),
RoHS compliant
P
P
WBGA 84 Ball (8X12.5 mm²),
RoHS compliant
P
P
WBGA 60 Ball (8X12.5 mm²),
RoHS compliant
P
P
7-7-7
5-5-5/6-6-6
5-5-5
-18
DDR2-1066
7-7-7
-25
DDR2-800
5-5-5/6-6-6
-3
DDR2-667
5-5-5
Status1: P= Mass Production, S (Time)= Samples (Ready Time), UD (Time)= Under Development (Ready Time), N= Not recommended for new designs
RoHS2: All Winbond products are "Green", Halogen-Free and RoHS compliant packaging. Refer to the datasheet for details and specifications.
13
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Status1,2 Automotive
512Mb DDR2
Part No.
Organization
W9751G6KB 32Mbitx16
W9751G8KB
Voltage
4 Banks
64Mbitx8
Speed Grade
1.8V±0.1V
4 Banks
1.8V±0.1V
Package
Status1,2
Automotive
WBGA 84 Ball (8X12.5 mm²),
RoHS compliant
P
P
WBGA 60 Ball (8X12.5 mm²),
RoHS compliant
P
P
Package
Status1,2
Automotive
WBGA 84 Ball (8x12.5mm²),
RoHS compliant
P
P
WBGA 60 Ball (8x12.5mm²),
RoHS compliant
P
P
CL-tRCD-tRP
-18
DDR2-1066
7-7-7
-25/25I/
25A/25K
DDR2-800
5-5-5/6-6-6
-3
DDR2-667
5-5-5
-18
DDR2-1066
7-7-7
-25/25I
DDR2-800
5-5-5/6-6-6
-3
DDR2-667
5-5-5
1Gb DDR2
Part No.
Organization
W971GG6KB 64Mbitx16
W971GG8KB 128Mbitx8
8 Banks
8 Banks
Voltage
1.8V±0.1V
1.8V±0.1V
Speed Grade
CL-tRCD-tRP
-18
DDR2-1066
6-6-6
-25/25I/
25L/25A/
25K
DDR2-800
5-5-5
-3
DDR2-667
5-5-5
-18
DDR2-1066
6-6-6
-25/25I/
25A/25K DDR2-800
5-5-5
-3
DDR2-667
5-5-5
2Gb DDR2
Part No.
W972GG6JB
W972GG8JB
Organization
128Mbitx16
256Mbitx8
8 Banks
8 Banks
Voltage
1.8V±0.1V
1.8V±0.1V
Speed Grade
CL-tRCD-tRP
-18
DDR2-1066
7-7-7
-25/25I/
25A/25K DDR2-800
5-5-5/6-6-6
-3/-3A
DDR2-667
5-5-5
-18
DDR2-1066
7-7-7
-25/25I
DDR2-800
5-5-5/6-6-6
-3
DDR2-667
5-5-5
Status1,2 Automotive
Package
WBGA 84 Ball (11x13mm²),
RoHS compliant
P
P
WBGA 60 Ball (11x11.5mm²),
RoHS compliant
P
P
Status1: P= Mass Production, S (Time)= Samples (Ready Time), UD (Time)= Under Development (Ready Time), N= Not recommended for new designs
RoHS2: All Winbond products are "Green", Halogen-Free and RoHS compliant packaging. Refer to the datasheet for details and specifications.
Winbond also provides Automotive DRAM.
Contact us: [email protected]
擔當
創新
群效
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14
Specialty DRAM
DDR3 SDRAM
DDR3 SDRAM ( double-data-rate synchronous dynamic random access memory generation 3 ) is a type of memory used in
electronics. Such as TV, STB, Network, BD-Player and so on.
It achieves greater bandwidth than the preceding DDR2 SDRAM by higher clock rate.
1Gb DDR3
Part No.
Organization
Voltage
W631GG6KB 64Mbitx16 8 Banks 1.5V±0.075V
W631GU6KB 64Mbitx16 8 Banks
1.283V
~1.45V
W631GG8KB 128Mbitx8 8 Banks 1.5V±0.075V
W631GU8KB 128Mbitx8 8 Banks
1.283V
~1.45V
Speed Grade
CL-tRCD-tRP
-11
DDR3-1866
13-13-13
-12/12I/12A/12K
DDR3-1600
11-11-11
-15/15I/15A/15K
DDR3-1333
9-9-9
-15/15I/15A/15K
DDR3-1333
9-9-9
-11
DDR3-1866
13-13-13
-12
DDR3-1600
11-11-11
-15/15I
DDR3-1333
9-9-9
-15/15I
DDR3-1333
9-9-9
Status1,2
Automotive
WBGA 96 Ball (9x13mm²),
RoHS compliant
P
P
WBGA 96 Ball (9x13mm²),
RoHS compliant
P
P
WBGA 78 Ball (8x10.5mm²),
RoHS compliant
P
P
WBGA 78 Ball (8x10.5mm²),
RoHS compliant
P
P
Package
2Gb DDR3
Part No.
Organization
W632GG6KB 128Mbitx16 8 Banks
Voltage
1.5V±0.075V
Speed Grade
CL-tRCD-tRP
-11
DDR3-1866
13-13-13
-12/12I
DDR3-1600
11-11-11
-15/15I/15A/15K DDR3-1333
9-9-9
W632GU6KB 128Mbitx16 8 Banks 1.283V ~1.45V -15/15I/15A/15K DDR3-1333
9-9-9
W632GG8KB 256Mbitx8 8 Banks
1.5V±0.075V
W632GU8KB 256Mbitx8 8 Banks 1.283V ~1.45V
-11
DDR3-1866
13-13-13
-12
DDR3-1600
11-11-11
-15
DDR3-1333
9-9-9
-15
DDR3-1333
9-9-9
Package
WBGA 96 Ball (9x13mm²),
RoHS compliant
P
S
WBGA 96 Ball (9x13mm²),
RoHS compliant
P
S
WBGA 78 Ball (8x10.5mm²),
RoHS compliant
P
S
WBGA 78 Ball (8x10.5mm²),
RoHS compliant
P
S
Status1: P= Mass Production, S (Time)= Samples (Ready Time), UD (Time)= Under Development (Ready Time), N= Not recommended for new designs
RoHS2: All Winbond products are "Green", Halogen-Free and RoHS compliant packaging. Refer to the datasheet for details and specifications.
15
www.winbond.com
Status1,2 Automotive
4Gb DDR3
Part No.
Organization
Voltage
Speed Grade
W634GG6LB 256Mbitx16
8 Banks 1.5V±0.075V
W634GU6LB 256Mbitx16
8 Banks
1.35V
Status1,2
Automotive
WBGA 96 Ball (9x13.5mm²),
RoHS compliant
P
-
WBGA 96 Ball (9x13.5mm²),
RoHS compliant
P
-
CL-tRCD-tRP
-12
DDR3-1600
11-11-11
-15
DDR3-1333
9-9-9
-15
DDR3-1333
9-9-9
Package
1Gb GDDR3
Part No.
Density
Organization
Voltage
W641GG2KB
1Gbit
32Mbit x32
1.8V ± 0.1V
Speed Grade
-12/-14
1G/800/700MHz
Package
Status1,2
Automotive
WBGA-136
P
-
Status1: P= Mass Production, S (Time)= Samples (Ready Time), UD (Time)= Under Development (Ready Time), N= Not recommended for new designs
RoHS2: All Winbond products are "Green", Halogen-Free and RoHS compliant packaging. Refer to the datasheet for details and specifications.
Winbond also provides Automotive DRAM.
Contact us: [email protected]
KGD
Fully Cover all Consumer Applications:
TV, STB, Networking, Storage, Printer, DSC/DV, GPS, Automotive…etc.
Providing KGD services to SiP customers with complete DRAM product portfolio such as SDRAM, DDR, DDR2, DDR3,
mSDR, mDDR, mDDR2 and PSRAM.
Wafer Level high speed test:
Up to DDR3 1600Mbps, DDR2 1066Mbps, DDR 500Mbps.
Winbond provides professional advices to KGD customers, including SiP package bonding & power/thermal, DRAM
simulation,…etc.
Excellent Quality Control:
100% Burn-In and Test.
AECQ-100, TS16949, ISO9001/14001, OHSAS18001 certificated for Automotive customers.
Product Life Time and Strong Engineering Support:
Owning a 12-inch Feb to guarantee stable long term support with EFA/PFA capability.
Contact us: [email protected]
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16
Flash Memory
▪ Serial Flash
▪ Parallel Flash
▪ NAND Flash
▪ KGD
• The products listed above may not be available for all regions.Please
contact your local Winbound Sales Representative.
•
17
www.winbond.com
SpiFlash® Memories with SPI, Dual-SPI, Quad-SPI and QPI
Winbond's W25X and W25Q SpiFlash® Multi-I/O Memories feature the popular Serial Peripheral Interface (SPI), densities
from 512K-bit to 512M-bit, small erasable sectors and the industry's highest performance. The W25X family supports
Dual-SPI effectively doubling standard SPI clock rates. The W25Q family is a "superset" of the 25X family with Dual-I/O
and Quad-I/O SPI for even higher performance. Clock rates up to 104MHz achieve an equivalent of 416MHz (50M-Byte/
S transfer rate) when using Quad-SPI. This is more than eight times the performance of ordinary Serial Flash (50MHz)
and even surpasses asynchronous Parallel Flash memories while using fewer pins and less space. Faster transfer rates
mean controllers can execute code (XIP) directly from the SPI interface or further improve boot time when shadowing
code to RAM. Additionally, some SpiFlash devices offer the new Quad Peripheral Interface (QPI) supporting true Quad
Commands for improved XIP performance and simpler controller circuitry. Additionally, new ultra-small form factor
packages are ideal for space constrained mobile and handheld applications.
Leading the Serial Flash Market in unit sales and revenue, Winbond TS16949 certified AEC-Q100 qualified memories
now support automotive applications. The automobile has transformed into the most sophisticated electronic device
in the market. Digital displays in automotive dashboards provide more information about the car, and improve safety.
Instant-on and real time 2D/3D image rendering is achieved with fast processors and SpiFlash memories. ADAS
(Advanced Driver Assist Systems), comfort, entertainment, and navigation is now available in the center console and
this is addressed with SpiFlash memories using small packages for space constrained systems and high density for
advanced applications.
Tiny Serial Flash Packages
Winbond Industrial and Automotive Grade Memory
Temperature
Range
Part#
Example
industrial
industrial Plus
Automotive
Grade 3
Automotive
Grade 2
-40℃~85℃
-40℃~105℃
-40℃~85℃
-40℃~105℃
W25Q80BVSSIG W25Q80BVSSJG W25Q80BVSSBG W25Q80BVSSAG
AEC-Q100
Compliant
No
No
Yes
Yes
Change
Control
(PPAP)
No
No
Optional
Optional
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18
Flash Memory
W25X SpiFlash Family
- Serial Peripheral Interface (SPI), Dual Output SPI
- Uniform 4KB, 32KB & 64KB erase
W25Q SpiFlash Family
- 512K-bit to 512M-bit, superset compatible with 25X
- SPI, Dual-SPI, Quad-SPI and QPI (for some devices)
- Uniform 4KB, 32KB & 64KB erase
- Erase and Program Suspend/Resume
- Quad Page Program
- Security: Lock-down, ID#, OTP Registers
- Serial Flash Discoverable Parameters (SFDP)
High Performance
- 104MHz Clock, 416MHz Quad-SPI (50MB/S)
- >8X speed of most Serial Flash
- Fast-boot or execute code (XIP) from SPI
Voltage & Package Options
- 3V, 2.5V and 1.8V operation
- Space saving packages: 8-pin SOIC, WSON, DIP,
USON, WLBGA(CSP), TSSOP
16-pin SOIC, 24-ball TFBGA
- Known Good Die (KGD) Wafers
Wide Range of Applications
- PCs, DVD, BluRay, WLAN, DSL/Cable Modem, Printers,
- Hard Disk Drives, Set Top Box, LCD-TV, Mobile Phones,
- Bluetooth, GPS, MP3, Meters, DSP, FPGAs and more
19
www.winbond.com
SpiFlash W25X & W25Q Memory Overview & Selection Guide
Serial Flash
Status1,2 Automotive
Part No.
Density
Organization
Voltage
Temp.
Speed
Package(s)
W25X05CL
512Kbit
(64KB)
256 pages,
4KB sectors,
32/64KB blocks,
Fast Write,
Dual SPI
2.3V - 3.6V
and
2.7V - 3.6V
-40 to +85
50/104MHz
(208MHz Dual-SPI)
SOIC8 150mil, VSOP8 150mil,
WSON 6X5mm4, USON8 2X3mm,
TSSOP8 173mil
P
-
W25Q05CL4
512Kbit
(64KB)
256 pages,
4KB sectors,
32/64KB blocks,
Fast Write,
Dual/Quad SPI
2.3V - 3.6V
and
2.7V - 3.6V
-40 to +85
104MHz
(208/416MHz Dual/
Quad-SPI)
SOIC8 150mil, VSOP8 150mil,
WSON 6X5mm, USON8 2X3mm,
TSSOP8 173mil
P
-
W25X10BV
1Mbit
(128KB)
512 pages,
4KB sectors,
32/64KB blocks,
Dual SPI
2.7V - 3.6V
-40 to +85
104MHz
(208MHz Dual-SPI)
SOIC8 150mil, WSON 6X5mm4,
VSOP8 150mil, USON8 2X3mm
N
-
W25X10CL
1Mbit
(128KB)
512 pages,
4KB sectors,
32/64KB blocks,
Fast Write,
Dual SPI
2.3V - 3.6V
and
2.7V - 3.6V
-40 to +85
50/104MHz
(208MHz Dual-SPI)
SOIC8 150mil, VSOP8 150mil,
WSON 6X5mm4, USON8 2X3mm,
TSSOP8 173mil
P
-
W25Q10CL
1Mbit
(128KB)
512 pages,
4KB sectors,
32/64KB blocks,
Fast Write,
Dual/Quad SPI
2.3V - 3.6V
and
2.7V - 3.6V
-40 to +85
104MHz
(208/416MHz Dual/
Quad-SPI)
SOIC8 150mil, VSOP8 150mil,
WSON 6X5mm, USON8 2X3mm,
TSSOP8 173mil
P
-
W25X20BV
2Mbit
(256KB)
1024 pages,
4KB sectors,
32/64KB blocks,
Dual SPI
2.7V - 3.6V
-40 to +85
104MHz
(208MHz Dual-SPI)
SOIC8 150mil, WSON 6X5mm,
USON8 2X3mm
N
-
W25X20BL
2Mbit
(256KB)
1024 pages,
4KB sectors,
32/64KB blocks,
Dual SPI
2.3V - 3.6V
-40 to +85
50/104MHz
(208MHz Dual-SPI)
SOIC8 150mil, WSON 6X5mm,
VSOP8 150mil, USON8 2X3mm
N
-
W25X20CV
(Automotive
Only)
2Mbit
(256KB)
1024 pages,
4KB sectors,
32/64KB blocks,
Fast Write,
Dual SPI
2.3V - 3.6V
-40 to +85
-40 to +105
50/104MHz
(208MHz Dual-SPI)
SOIC8 150mil, WSON 6X5mm,
SOIC8 208mil, USON8 2X3mm
-
P
4
Status1: P= Mass Production, S (Time)= Samples (Ready Time), UD (Time)= Under Development (Ready Time), N= Not recommended for new designs
RoHS2: All Winbond products are "Green", Halogen-Free and RoHS compliant packaging. Refer to the datasheet for details and specifications.
Enhanced3 = SFDP, Security Registers, Program/Erase Suspend/Resume, Word Read Quad I/O, Burst Read with Wrap, Non-Volatile & Volatile Registers,
Complement Array Protection
W25Q05CL/10CL/20CL/40CL4: Please contact Winbond for avaliability of these products and the 6x5mm WSON package.
Contact us: [email protected]
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Flash Memory
SpiFlash W25X & W25Q Memory Overview & Selection Guide
Serial Flash
Density
Organization
Voltage
Temp.
Speed
W25X20CL
2Mbit
(256KB)
1024 pages,
4KB sectors,
32/64KB blocks,
Fast Write,
Dual SPI
2.3V - 3.6V
and
2.7V - 3.6V
-40 to +85
50/104MHz
(208MHz Dual-SPI)
SOIC8 150mil, WSON 6X5mm,
VSOP8 150mil, USON8 2X3mm
P
-
2Mbit
(256KB)
1024 pages,
4KB sectors,
32/64KB blocks,
Fast Write,
Dual/Quad SPI
2.3V - 3.6V
and
2.7V - 3.6V
-40 to +85
104MHz
(208/416MHz Dual/
Quad-SPI)
SOIC8 150mil, WSON 6X5mm,
VSOP8 150mil, USON8 2X3mm
P
-
W25Q20BW
2Mbit
(256KB)
1024 pages,
4KB sectors,
32/64KB blocks,
Dual/Quad SPI,
Fast Write,
Enhanced3
1.65V -1.95V
-40 to +85
80MHz
(160/320MHz Dual/
Quad-SPI)
SOIC8 150mil, WSON 6X5mm,
VSOP8 150mil, USON8 2X3mm
P
-
W25X40BV
4Mbit
(512KB)
2048 pages,
4KB sectors,
32/64KB blocks,
Dual SPI
2.7V - 3.6V
-40 to +85
80/104MHz
(208MHz Dual-SPI)
SOIC8 150mil, SOIC8 208mil,
WSON 6X5mm, PDIP8 300mil,
VSOP8 150mil, USON8 2X3mm
N
-
W25X40BL
4Mbit
(512KB)
2048 pages,
4KB sectors,
32/64KB blocks,
Dual SPI
2.3V - 3.6V
-40 to +85
50/104MHz
(208MHz Dual-SPI)
SOIC8 150mil, SOIC8 208mil,
WSON 6X5mm, PDIP8 300mil,
VSOP8 150mil, USON8 2X3mm
N
-
W25X40CV
(Automotive
Only)
4Mbit
(512KB)
2048 pages,
4KB sectors,
32/64KB blocks,
Fast Write,
Dual SPI
2.7V - 3.6V
-40 to +85
-40 to +105
50/104MHz
(208MHz Dual-SPI)
SOIC8 150mil, WSON 6X5mm,
SOIC8 208mil, USON8 2X3mm
-
P
W25X40CL
4Mbit
(512KB)
2048 pages,
4KB sectors,
32/64KB blocks,
Fast Write,
Dual SPI
2.3V - 3.6V
and
2.7V - 3.6V
-40 to +85
50/104MHz
(208MHz Dual-SPI)
SOIC8 150mil, SOIC8 208mil,
WSON 6X5mm, PDIP8 300mil,
VSOP8 150mil, USON8 2X3mm
P
-
W25Q40BV
4Mbit
(512KB)
2048 pages,
4KB sectors,
32/64KB blocks,
Dual/Quad-SPI
Enhanced3
2.7V - 3.6V
-40 to +85
80/104MHz
(160/320MHzDual/
Quad-SPI)
SOIC8 150mil, SOIC8 208mil,
WSON 6X5mm, PDIP8 300mil,
VSOP8 150mil, USON8 2X3mm
N
-
W25Q20CL
4
Package(s)
Status1: P= Mass Production, S (Time)= Samples (Ready Time), UD (Time)= Under Development (Ready Time), N= Not recommended for new designs
RoHS2: All Winbond products are "Green", Halogen-Free and RoHS compliant packaging. Refer to the datasheet for details and specifications.
Enhanced3 = SFDP, Security Registers, Program/Erase Suspend/Resume, Word Read Quad I/O, Burst Read with Wrap, Non-Volatile & Volatile Registers,
Complement Array Protection
W25Q05CL/10CL/20CL/40CL4: Please contact Winbond for avaliability of these products and the 6x5mm WSON package.
Contact us: [email protected]
21
Status1,2 Automotive
Part No.
www.winbond.com
Serial Flash
Part No.
W25Q40BL
W25Q40CL4
W25Q40BW
W25Q80BV
W25Q80BL
W25Q80BW
SpiFlash W25X & W25Q Memory Overview & Selection Guide
Organization
Voltage
Temp.
Speed
4Mbit
(512KB)
2048 pages,
4KB sectors,
32/64KB blocks,
Dual/Quad SPI,
Fast Write,
Enhanced3
2.3V - 3.6V
-40 to +85
50/80MHz
(100/200MHz Dual/
Quad-SPI)
SOIC8 150mil, SOIC8 208mil,
WSON 6X5mm, PDIP8 300mil,
VSOP8 150mil, USON8 2X3mm
N
-
4Mbit
(512KB)
2048 pages,
4KB sectors,
32/64KB blocks,
Dual/Quad SPI
Fast Write,
Enhanced3
2.3V - 3.6V
and
2.7V - 3.6V
-40 to +85
104MHz
(208/416MHz Dual/
Quad-SPI)
SOIC8 150mil, SOIC8 208mil,
WSON 6X5mm, PDIP8 300mil,
VSOP8 150mil, USON8 2X3mm
P
-
4Mbit
(512KB)
2048 pages,
4KB sectors,
32/64KB blocks,
Dual/Quad-SPI
Fast Write,
Enhanced3
1.65V -1.95V
-40 to +85
80MHz
(160/320MHzDual/
Quad-SPI)
SOIC8 150mil, SOIC8 208mil,
WSON 6X5mm, VSOP8 150mil,
USON8 2X3mm
P
-
8Mbit
(1MB)
4096 pages,
4KB sectors,
32/64KB blocks,
Dual/Quad-SPI
Enhanced3
-40 to +85
-40 to +105
80/104MHz
(160/320MHzDual/
Quad-SPI)
SOIC8 150mil, SOIC8 208mil,
WSON 6X5mm, PDIP8 300mil,
VSOP8 150mil, VSOP8 208mil,
USON8 2X3mm,
TFBGA24 8x6mm (8x6 Matrix),
TFBGA24 8x6mm (5x5 Matrix)
P
P
8Mbit
(1MB)
4096 pages,
4KB sectors,
32/64KB blocks,
Dual/Quad SPI,
Fast Write,
Enhanced3
2.3V - 3.6V
-40 to +85
50/80MHz
(100/200MHz Dual/
Quad-SPI)
SOIC8 150mil, SOIC8 208mil,
WSON 6X5mm, PDIP8 300mil,
VSOP8 150mil, VSOP8 208mil,
USON8 2X3mm
P
-
8Mbit
(1MB)
4096 pages,
4KB sectors,
32/64KB blocks,
Dual/Quad SPI,
Fast Write
Enhanced3
1.65V -1.95V
-40 to +85
80MHz
(160/320MHz Dual/
Quad-SPI)
SOIC8 150mil, SOIC8 208mil,
WSON 6X5mm, VSOP8 150mil,
VSOP8 208mil, WLBGA8
P
-
2.7V - 3.6V
Package(s)
Status1,2 Automotive
Density
Status1: P= Mass Production, S (Time)= Samples (Ready Time), UD (Time)= Under Development (Ready Time), N= Not recommended for new designs
RoHS2: All Winbond products are "Green", Halogen-Free and RoHS compliant packaging. Refer to the datasheet for details and specifications.
Enhanced3 = SFDP, Security Registers, Program/Erase Suspend/Resume, Word Read Quad I/O, Burst Read with Wrap, Non-Volatile & Volatile Registers,
Complement Array Protection
W25Q05CL/10CL/20CL/40CL4: Please contact Winbond for avaliability of these products and the 6x5mm WSON package.
Contact us: [email protected]
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Flash Memory
SpiFlash W25X & W25Q Memory Overview & Selection Guide
Serial Flash
Part No.
W25Q16CV
W25Q16DV
W25Q16CL
W25Q16DW
Density
Organization
16Mbit
(2MB)
8192 pages,
4KB sectors,
32/64KB blocks,
Dual/Quad-SPI
Enhanced3
16Mbit
(2MB)
8192 pages,
4KB sectors,
32/64KB blocks,
Dual/Quad-SPI
Enhanced3
16Mbit
(2MB)
8192 pages,
4KB sectors,
32/64KB blocks,
Dual/Quad SPI,
Enhanced3
16Mbit
(2MB)
8192 pages,
4KB sectors,
32/64KB blocks,
Dual/Quad
SPI,QPI,
Enhanced3
Voltage
2.7V - 3.6V 2.7V - 3.6V
2.3V - 3.6V
1.65V -1.95V
Temp.
Speed
Package(s)
-40 to +85
-40 to +105
80/104MHz
(160/320MHz Dual/
Quad-SPI)
SOIC8 150mil, SOIC8 208mil,
SOIC16 300mil, WSON 6X5mm, PDIP8 300mil,
TFBGA24 6X8mm (4x6 Matrix),
TFBGA24 6X8mm (5x5 Matrix),
VSOP8 150mil, VSOP8 208mil
-40 to +85
-40 to +105
80/104MHz
(160/320MHz Dual/
Quad-SPI)
SOIC8 150mil, SOIC8 208mil,
SOIC16 300mil, WSON 6X5mm, PDIP8 300mil,
TFBGA24 6X8mm (4x6 Matrix),
TFBGA24 6X8mm (5x5 Matrix),
VSOP8 150mil, VSOP8 208mil
P
-
-40 to +85
50/80MHz
(100/200MHz Dual/
Quad-SPI)
SOIC8 150mil, SOIC8 208mil,
SOIC16 300mil, WSON 6X5mm, PDIP8 300mil,
TFBGA24 6X8mm (4x6 Matrix),
TFBGA24 6X8mm (5x5 Matrix),
VSOP8 150mil, VSOP8 208mil
P
-
-40 to +85
-40 to +105
104MHz
(208/416MHz Dual/
Quad-SPI)
SOIC8 150mil, SOIC8 208mil,
SOIC16 300mil, WSON 6X5mm, TFBGA24 6X8mm (4x6 Matrix),
TFBGA24 6X8mm (5x5 Matrix),
VSOP8 150mil, VSOP8 208mil,
USON8 4x3mm, WLBGA8
P
P
Status1: P= Mass Production, S (Time)= Samples (Ready Time), UD (Time)= Under Development (Ready Time), N= Not recommended for new designs
RoHS2: All Winbond products are "Green", Halogen-Free and RoHS compliant packaging. Refer to the datasheet for details and specifications.
Enhanced3 = SFDP, Security Registers, Program/Erase Suspend/Resume, Word Read Quad I/O, Burst Read with Wrap, Non-Volatile & Volatile Registers,
Complement Array Protection
W25Q05CL/10CL/20CL/40CL4: Please contact Winbond for avaliability of these products and the 6x5mm WSON package.
Contact us: [email protected]
23
www.winbond.com
Status1,2 Automotive
N
P
Serial Flash
Part No.
W25Q32BV
W25Q32FV
W25Q32DW
W25Q32FW
SpiFlash W25X & W25Q Memory Overview & Selection Guide
Density
Organization
32Mbit
(4MB)
16384 pages,
4KB sectors,
32/64KB blocks,
Dual/Quad-SPI
Enhanced3
32Mbit
(4MB)
16384 pages,
4KB sectors,
32/64KB blocks,
Dual/Quad-SPI,
QPI,
Enhanced3
Voltage
Status1,2 Automotive
Speed
Package(s)
80/104MHz
(208/320MHz Dual/
Quad-SPI)
SOIC8 208mil, SOIC16 300mil,
WSON 6X5mm, TFBGA24 6X8mm (4x6 Matrix),
TFBGA24 6X8mm (5x5 Matrix),
VSOP8 208mil, WSON8 8X6mm,
PDIP8 300mil
N
P
-40 to +85
-40 to +105
104MHz
(208/320MHz Dual/
Quad-SPI)
SOIC8 208mil, SOIC16 300mil,
WSON 6X5mm, WSON8 8X6mm,
PDIP8 300mil, TFBGA24 6X8mm (4x6 Matrix),
TFBGA24 6X8mm (5x5 Matrix),
VSOP8 208mil
P
UD
32Mbit
(4MB)
16384 pages,
4KB sectors,
32/64KB blocks,
Dual/Quad
SPI,QPI,
Enhanced3
-40 to +85
1.65V -1.95V
-40 to +105
104MHz
(208/416MHz Dual/
Quad-SPI)
SOIC8 208mil, SOIC16 300mil,
WSON 6X5mm, WSON8 8X6mm,
TFBGA24 6X8mm (4x6 Matrix),
TFBGA24 6X8mm (5x5 Matrix),
VSOP8 208mil
N
UD
32Mbit
(4MB)
16384 pages,
4KB sectors,
32/64KB blocks,
Dual/Quad
SPI,QPI,
Enhanced3
-40 to +85
1.65V -1.95V
-40 to +105
104MHz
(208/416MHz Dual/
Quad-SPI)
SOIC8 208mil, SOIC16 300mil,
WSON 6X5mm, WSON8 8X6mm,
TFBGA24 6X8mm (4x6 Matrix),
TFBGA24 6X8mm (5x5 Matrix),
USON8 4x3mm, VSOP8 208mil
UD
UD
2.7V - 3.6V
2.7V - 3.6V
Temp.
-40 to +85
-40 to +105
Status1: P= Mass Production, S (Time)= Samples (Ready Time), UD (Time)= Under Development (Ready Time), N= Not recommended for new designs
RoHS2: All Winbond products are "Green", Halogen-Free and RoHS compliant packaging. Refer to the datasheet for details and specifications.
Enhanced3 = SFDP, Security Registers, Program/Erase Suspend/Resume, Word Read Quad I/O, Burst Read with Wrap, Non-Volatile & Volatile Registers,
Complement Array Protection
W25Q05CL/10CL/20CL/40CL4: Please contact Winbond for avaliability of these products and the 6x5mm WSON package.
Contact us: [email protected]
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Flash Memory
SpiFlash W25X & W25Q Memory Overview & Selection Guide
Serial Flash
Part No.
W25Q64CV
W25Q64FV
W25Q64DW
W25Q64FW
Temp.
Speed
Package(s)
Status1,2
Automotive
-40 to +85
-40 to +105
80MHz
(160/320MHz Dual/
Quad-SPI)
SOIC8 208mil, SOIC16 300mil,
WSON 6X5mm, WSON8 8X6mm,
PDIP8 300mil,
TFBGA24 6X8mm (4x6 Matrix),
TFBGA24 6X8mm (5x5 Matrix),
VSOP8 208mil
N
P
-40 to +85
-40 to +105
104MHz
(208/416MHz Dual/
Quad-SPI)
SOIC8 208mil, SOIC16 300mil,
WSON 6X5mm, WSON8 8X6mm,
PDIP8 300mil,
TFBGA24 6X8mm (4x6 Matrix),
TFBGA24 6X8mm (5x5 Matrix),
VSOP8 208mil
P
UD
64Mbit
(8MB)
32768 pages,
4KB sectors,
32/64KB blocks,
Dual/Quad
SPI,QPI,
Enhanced3
-40 to +85
1.65V -1.95V
-40 to +105
104MHz
(208/416MHz Dual/
Quad-SPI)
SOIC8 208mil, SOIC16 300mil,
WSON 6X5mm, WSON8 8X6mm,
TFBGA24 6X8mm (4x6 Matrix),
TFBGA24 6X8mm (5x5 Matrix),
VSOP8 208mil
N
UD
64Mbit
(8MB)
32768 pages,
4KB sectors,
32/64KB blocks,
Dual/Quad
SPI,QPI,
Enhanced3
-40 to +85
1.65V -1.95V
-40 to +105
104MHz
(208/416MHz Dual/
Quad-SPI)
SOIC8 208mil, SOIC16 300mil,
WSON 6X5mm, WSON8 8X6mm,
TFBGA24 6X8mm (4x6 Matrix),
TFBGA24 6X8mm (5x5 Matrix),
USON 4x3mm, VSOP8 208mil
P
UD
Density
Organization
64Mbit
(8MB)
32768 pages,
4KB sectors,
32/64KB blocks,
Dual/Quad-SPI
Enhanced3
64Mbit
(8MB)
32768 pages,
4KB sectors,
32/64KB blocks,
Dual/Quad-SPI,
QPI
Enhanced3
Voltage
2.7V - 3.6V
2.7V - 3.6V
Status1: P= Mass Production, S (Time)= Samples (Ready Time), UD (Time)= Under Development (Ready Time), N= Not recommended for new designs
RoHS2: All Winbond products are "Green", Halogen-Free and RoHS compliant packaging. Refer to the datasheet for details and specifications.
Enhanced3 = SFDP, Security Registers, Program/Erase Suspend/Resume, Word Read Quad I/O, Burst Read with Wrap, Non-Volatile & Volatile Registers,
Complement Array Protection
W25Q05CL/10CL/20CL/40CL4: Please contact Winbond for avaliability of these products and the 6x5mm WSON package.
Contact us: [email protected]
25
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Serial Flash
SpiFlash W25X & W25Q Memory Overview & Selection Guide
Status1,2 Automotive
Part No.
Density
Organization
Voltage
Temp.
Speed
Package(s)
W25Q128BV
128Mbit
(16MB)
65536 pages,
4KB sectors,
32/64KB blocks,
Dual/Quad-SPI
Enhanced3
2.7V - 3.6V
-40 to +85
-40 to +105
70/104MHz
(208/280MHz Dual/
Quad-SPI)
SOIC16 300mil, WSON8 8X6mm,
TFBGA24 6X8mm (4x6 Matrix),
TFBGA24 6X8mm (5x5 Matrix)
N
P
128Mbit
(16MB)
65536 pages,
4KB sectors,
32/64KB blocks,
Dual/Quad-SPI,
QPI,
Enhanced3
-40 to +85
-40 to +105
104MHz
(208/416MHz Dual/
Quad-SPI)
SOIC8 208mil, SOIC16 300mil,
WSON 6X5mm, WSON8 8X6mm,
PDIP8 300mil,
TFBGA24 6X8mm (4x6 Matrix),
TFBGA24 6X8mm (5x5 Matrix),
VSOP8 208mil
P
UD
128Mbit
(16MB)
65536 pages,
4KB sectors,
32/64KB blocks,
Dual/Quad-SPI,
QPI,
Enhanced3
-40 to +85
1.65V -1.95V
-40 to +105
104MHz
(208/416MHz Dual/
Quad-SPI)
SOIC8 208mil, SOIC16 300mil,
WSON 6X5mm, WSON8 8X6mm,
TFBGA24 6X8mm (4x6 Matrix),
TFBGA24 6X8mm (5x5 Matrix),
VSOP8 208mil
P
UD
256Mbit
(32MB)
131072 pages,
4KB sectors,
32/64KB blocks,
Dual/Quad-SPI,
QPI,
Enhanced3
2.7V - 3.6V
-40 to +85
-40 to +105
104MHz
(208/416MHz Dual/
Quad-SPI)
SOIC16 300mil, WSON8 8X6mm,
TFBGA24 6X8mm (4x6 Matrix),
TFBGA24 6X8mm (5x5 Matrix)
P
UD
512Mbit
(64MB)
262144pages,
4KB sectors,
32/64KB blocks,
Dual/Quad-SPI,
QPI,
Enhanced3
2.7V - 3.6V
-40 to +85
-40 to +105
104MHz
(208/416MHz Dual/
Quad-SPI)
SOIC16 300mil, WSON8 8X6mm,
TFBGA24 6X8mm (4x6 Matrix),
TFBGA24 6X8mm (5x5 Matrix)
UD
UD
W25Q128FV
W25Q128FW
W25Q256FV
W25Q512JV
2.7V - 3.6V
Status1: P= Mass Production, S (Time)= Samples (Ready Time), UD (Time)= Under Development (Ready Time), N= Not recommended for new designs
RoHS2: All Winbond products are "Green", Halogen-Free and RoHS compliant packaging. Refer to the datasheet for details and specifications.
Enhanced3 = SFDP, Security Registers, Program/Erase Suspend/Resume, Word Read Quad I/O, Burst Read with Wrap, Non-Volatile & Volatile Registers,
Complement Array Protection
W25Q05CL/10CL/20CL/40CL4: Please contact Winbond for avaliability of these products and the 6x5mm WSON package.
Contact us: [email protected]
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Flash Memory
Parallel Flash Memory –W29GL Family
Winbond’s W29GL family of 3-Volt Page-Mode Parallel Flash memories are offered in densities from 32Mb to 512Mb
and support industry standard interfaces, architectures and packages. They are drop-in replacements to the popular
“x29GL” products available in the industry, with no firmware change. The W29GL family also offers faster program and
erase times, which can improve production throughput and enable faster firmware updates. Winbond’s Parallel Flash
products are ideal for a wide variety of applications requiring the higher performance of a parallel bus width and
page mode operation.
W29GL Page Mode Parallel Flash Family
- 32Mb to 512Mb densities
- Compatible with Industry Standard x29GL products
- 2.7V to 3.6V operation; also supports VIO at 1.8V
- x8/x16 data bus configuration
- 70/90ns read access time, 25ns page mode access time
- Provides many sector protection mechanisms
* Offers additional security of code/data
Package Options
- Industry standard packages for 32Mb & 64Mb densities
* 48-pin TSOP (Top/Bottom Boot)
* 48-ball VFBGA (Top/Bottom Boot)
* 56-pin TSOP (High/Low Sector protect)
* 64-ball LFBGA (Top/Bottom Boot, High/Low Sector protect)
- Industry standard packages for 128Mb to 512Mb densities
* 56-pin TSOP (High/Low Sector protect) * 64-ball LFBGA (High/Low Sector protect) Special Features
- Drop-in replacement of Industry Standard x29GL
* No firmware change needed
- Saves 40% erase time and 60% program time
* Improves production throughput
* Faster firmware updates
Wide Range of Applications
- Networking, Storage, Set-Top-Box, DSL and Cable modems
- Wireless routers, Digital TV, Industrial, Automotive
- PC peripherals, Printer, Mobile phones, Cameras and more
27
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Parallel Flash
Part No.
Parallel Flash Product Selection Guide (Page Mode Parallel Flash)
Speed
Remark
Package
Status1,2
Automotive
70ns
Top Boot
Bottom Boot
High Sector
Low Sector
TSOP 563
LFBGA 643
TSOP 48
TFBGA 48
P
UD
-40 to +85
70ns
Top Boot
Bottom Boot
High Sector
Low Sector
TSOP 56
LFBGA 64
TSOP 48
TFBGA 48
P
UD
3V/3.3V
-40 to +85
90ns
High Sector
Low Sector
TSOP 56
LFBGA 64
P
UD
32Mbit x 8/
16Mbit x 16
3V/3.3V
-40 to +85
90ns
High Sector
Low Sector
TSOP 56
LFBGA 64
UD
UD
32Mbit x 8/
16Mbit x 16
3V/3.3V
-40 to +85
90ns
High Sector
Low Sector
TSOP 56
LFBGA 64
UD
UD
Density
Organization
32Mbit
4Mbit x 8/
2Mbit x 16
W29GL064C
64Mbit
8Mbit x 8/
4Mbit x 16
3V/3.3V
W29GL128C
128Mbit
16Mbit x 8/
8Mbit x 16
W29GL256C3
256Mbit
W29GL512C3
512Mbit
W29GL032C
Voltage
3V/3.3V
Temp.
-40 to +85
Status1: P= Mass Production, S (Time)= Samples (Ready Time), UD (Time)= Under Development (Ready Time), N= Not recommended for new designs
RoHS2: All Winbond products are "Green", Halogen-Free and RoHS compliant packaging. Refer to the datasheet for details and specifications.
Availability3: Please contact Winbond for avaliability of these products and packages.
Contact us: [email protected]
NAND Flash
We will be offering SLC NAND Flash products starting in 2013. For further information please contact Winbond sales.
[email protected]
KGD
We offer various KGD type Parallel Flash and Serial Flash, further information please contact
[email protected]
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Product Selection
Guide 2013
Note
29
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