® RT7020 0.3A/0.6A Half-Bridge Gate Driver General Description Features The RT7020 is a high-voltage gate driver IC with dual outputs. The IC, together with an external bootstrap network, drives dual N-MOSFETs or IGBTs in a half-bridge configuration with input voltage rail up to 600V. z Floating Channel Designed for Bootstrap Operation with Input Voltage up to 600V z The IC is equipped with a “common-mode dV/dt noise canceling technique” to provide high dV/dt immunity which enables stable operation under high dV/dt noise circumstances. Two Under-Voltage Lockout (UVLO) functions continuously monitor the bias voltages on VCC and BOOT-to-LX for preventing malfunction when the bias voltages are lower than the specified threshold voltages. A dead time control prevents shoot-through of the external power MOSFETs. The logic level of the PWM signal input pins are compatible with standard TTL logic level for ease of interfacing with controlling devices. z 300mA/600mA Sourcing/Sinking Current High dV/dt Immunity : ±50V/ns VCC and VBOOT − LX Supply Range from 10V to 20V Under-Voltage Lockout Functions for Both Channels Matched Propagation Delays Between Both Channels TTL Compatible Logic Input Internal Dead-Time Setting High-Side Output In-Phase with HIN Input Signal Low-Side Output Out of Phase with LIN Input Signal RoHS Compliant and Halogen Free z z z z z z z z Ordering Information RT7020 Package Type S : SOP-8 N : DIP-8 Applications z z z z PDP Scan Driver Fluorescent Lamp Ballast SMPS Motor Driver Lead Plating System G : Green (Halogen Free and Pb Free) Note : Richtek products are : ` RoHS compliant and compatible with the current requirements of IPC/JEDEC J-STD-020. ` Suitable for use in SnPb or Pb-free soldering processes. Simplified Application Circuit VCC Up to 600V RUGATE UGATE VCC BOOT C1 RT7020 LX PWM Signal LIN GND Copyright © 2013 Richtek Technology Corporation. All rights reserved. DS7020-00 October 2013 To Load HIN RLGATE LGATE is a registered trademark of Richtek Technology Corporation. www.richtek.com 1 RT7020 Marking Information Pin Configurations (TOP VIEW) RT7020GS RT7020GS : Product Number RT7020 GSYMDNN 8 VCC YMDNN : Date Code 2 7 UGATE LIN 3 6 LX GND 4 5 LGATE RT7020GN SOP-8 RT7020GN : Product Number RichTek RT7020 GNYMDNN BOOT HIN YMDNN : Date Code BOOT UGATE LX LGATE 8 7 6 5 2 3 4 VCC HIN LIN GND DIP-8 Functional Pin Description Pin No. Pin Name Pin Function SOP-8 DIP-8 1 1 VCC Supply Voltage Input. 2 2 HIN Logic Input for High-Side Gate Driver. 3 3 LIN Logic Input for Low-Side Gate Driver. 4 4 GND Logic Ground and Low-Side Driver Return. 5 5 LGATE Low-Side Driver Output. 6 6 LX Return for High-Side Gate Driver. 7 7 UGATE High-Side Driver Output. 8 8 BOOT Bootstrap Supply for High-Side Gate Driver. Copyright © 2013 Richtek Technology Corporation. All rights reserved. www.richtek.com 2 is a registered trademark of Richtek Technology Corporation. DS7020-00 October 2013 RT7020 Function Block Diagram BOOT BOOT-to-LX UVLO1 Under-Voltage Lockout Driver Pulse Generator Level Shifter Noise Filter R S UGATE Q LX UGATE High/Low VCC VCC HIN VCC UVLO2 Under-Voltage Lockout IIN+ Dead Time Control VCC IIN+ Driver LGATE High/Low LGATE Delay GND LIN Operation The RT7020 is a high-voltage gate driver for driving highside and low-side MOSFETs in a half-bridge configuration. The RT7020 uses ultra high voltage device and floating well to allow UGATE to drive external MOSFET operating up to 600V. When the HIN voltage is above the logic-high threshold, the UGATE voltage goes to turn on the external MOSFET. When the HIN voltage is below the logic-low threshold, the MOSFET is turned off. The operating behavior of the LGATE, controlled by the LIN pin, is like the behavior of the UGATE. Copyright © 2013 Richtek Technology Corporation. All rights reserved. DS7020-00 October 2013 Under-Voltage Lockout (UVLO) Function When the VCC or BOOT-to-LX voltage is lower than the UVLO threshold, the UGATE and LGATE output will be disabled. Pulse Generator The pulse generator is used to transmit the HIN input signal to the UGATE driver. Dead-Time Control The dead-time control function is designed to prevent the high-side and low-side MOSFETs form shoot-through. is a registered trademark of Richtek Technology Corporation. www.richtek.com 3 RT7020 Absolute Maximum Ratings z z z z z z z z z z z z (Note 1) VCC Supply Voltage, VCC ---------------------------------------------------------------------------------LX to GND -----------------------------------------------------------------------------------------------------BOOT to LX, VBOOT−LX --------------------------------------------------------------------------------------UGATE to LX -------------------------------------------------------------------------------------------------LGATE to GND -----------------------------------------------------------------------------------------------HIN, LIN to GND ----------------------------------------------------------------------------------------------Allowable LX Voltage Slew Rate,dVLX/dt ---------------------------------------------------------------Power Dissipation, PD @ TA = 25°C −0.3 to 25V −0.3V to 625V −0.3V to 25V −0.3V to VBOOT−LX + 0.3V −0.3V to VCC + 0.3V −0.3V to VCC + 0.3V −50V/ns to 50V/ns SOP-8 ----------------------------------------------------------------------------------------------------------DIP-8 -----------------------------------------------------------------------------------------------------------Package Thermal Resistance (Note 2) SOP-8, θJA ----------------------------------------------------------------------------------------------------DIP-8, θJA ------------------------------------------------------------------------------------------------------Junction Temperature ---------------------------------------------------------------------------------------Lead Temperature (Soldering, 10 sec.) -----------------------------------------------------------------Storage Temperature Range ------------------------------------------------------------------------------- 0.53W 0.74W Recommended Operating Conditions z z z z z z z z 188°C/W 134.9°C/W 150°C 260°C −65°C to 150°C (Note 3) VCC Supply Voltage, VCC ---------------------------------------------------------------------------------BOOT-to-LX, VBOOT−LX --------------------------------------------------------------------------------------LX to GND -----------------------------------------------------------------------------------------------------UGATE to LX -------------------------------------------------------------------------------------------------LGATE to GND -----------------------------------------------------------------------------------------------HIN, LIN to GND ---------------------------------------------------------------------------------------------Junction Temperature Range ------------------------------------------------------------------------------Ambient Temperature Range ------------------------------------------------------------------------------- 10V to 20V 10V to 20V 0 to 600V 0 to VBOOT−LX 0 to VCC 0 to VCC −40°C to 125°C −40°C to 85°C Electrical Characteristics (VCC = VBOOT − LX = 15V, TA = 25°C, unless otherwise specified) Parameter Symbol Test Conditions Min Typ Max Unit VCC Under-Voltage Lockout Threshold (On) V THON_VCC 9 10.5 12 V VBOOT − LX Under-Voltage Lockout Threshold (On) V THON_BOOT 9 10.5 12 V VCC Under-Voltage Lockout Threshold (Off) V THOFF_VCC 8 9.5 11 V VBOOT − LX Under-Voltage Lockout Threshold (Off) V THOFF_BOOT 8 9.5 11 V VCC Under-Voltage Lockout Hysteresis V HYS_VCC -- 1 -- V VBOOT − LX Under-Voltage Lockout Hysteresis V HYS_BOOT -- 1 -- V Copyright © 2013 Richtek Technology Corporation. All rights reserved. www.richtek.com 4 is a registered trademark of Richtek Technology Corporation. DS7020-00 October 2013 RT7020 Parameter Symbol Test Conditions Typ Max Unit -- -- 50 μA LX Leakage Current ILK VCC Quiescent Current IQ_VCC -- 220 400 μA BOOT-to-LX Quiescent Current IQ_BOOT−LX -- 100 200 μA VCC Operating Current IP_VCC -- -- 600 μA BOOT-to-LX Operating Current IP_ BOOT−LX -- -- 600 μA 2.5 -- -- -- -- 0.8 -- 50 200 HIN, LIN Input Voltage UGATE, LGATE Output Voltage VBOOT = V LX = 600V Min Frequency = 20kHz, UGATE = LGATE = Open Logic-High VIH Logic-Low VIL High-Lev el VOH Low-Level VOL Sinking Current = 2mA, V BOOT − VUGATE, V CC − VLGATE Sinking Current = 2mA, VUGATE−LX, V LGATE V mV -- 20 100 Logic-High IIN+ HIN = VCC, LIN = GND -- 2 10 Logic-Low HIN = GND, LIN = VCC −1 -- -- UGATE and LGATE Sourcing IO+ Current UGATE = LX, LGATE = GND, Current pulse width < 10μs, Low duty -- 290 -- UGATE and LGATE Sinking Current UGATE = LX, LGATE = GND, Current pulse width < 10μs, Low duty -- 600 -- Min Typ Max Unit -- 680 820 ns -- 150 300 ns HIN Input Current IIN− IO− μA mA Dynamic Electrical Characteristics (Note 4) (VCC = VBOOT − LX = 15V, LX = GND, CL = 1000pF, TA = 25°C, unless otherwise specified) Parameter Symbol Test Conditions Turn-on Delay t ON Turn-off Delay t OFF Turn-on Rising Time tR -- 70 170 ns Turn-off Falling Time tF -- 35 90 ns Dead-Time t Dead -- 520 650 ns V LX = 0 or 600V (Note 5) Note 1. Stresses beyond those listed “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions may affect device reliability. Note 2. θJA is measured at TA = 25°C on a high effective thermal conductivity four-layer test board per JEDEC 51-7. Note 3. The device is not guaranteed to function outside its operating conditions. Note 4. Please refer to the Timing Diagram and Dynamic Waveforms in the Application Information. Note 5. Turn-off Delay for VLX = 600V is guaranteed by design. Copyright © 2013 Richtek Technology Corporation. All rights reserved. DS7020-00 October 2013 is a registered trademark of Richtek Technology Corporation. www.richtek.com 5 RT7020 Typical Application Circuit VCC Up to 600V 1 UGATE VCC RT7020 2 HIN 3 LIN 4 GND Copyright © 2013 Richtek Technology Corporation. All rights reserved. www.richtek.com 6 RUGATE BOOT 8 C1 PWM Signal 7 LX 6 LGATE 5 To Load RLGATE is a registered trademark of Richtek Technology Corporation. DS7020-00 October 2013 RT7020 Typical Operating Characteristics Turn-On Delay Time vs. Temperature Turn-On Delay Time vs. VCC 800 Turn-On Delay Time (ns)1 Turn-On Delay Time (ns)1 800 700 LGATE 600 UGATE 500 700 600 LGATE UGATE 500 TA = 25°C 400 400 -50 -25 0 25 50 75 100 125 10 12 14 18 20 Turn-Off Delay Time vs. VCC Turn-Off Delay Time vs. Temperature 400 400 Turn-Off Delay Time (ns) Turn-Off Delay Time (ns) 16 VCC (V) Ambient Temperature (°C) 300 200 LGATE 100 UGATE 300 200 LGATE 100 UGATE TA = 25°C 0 0 -50 -25 0 25 50 75 100 125 10 12 16 18 20 Turn-On Rising Time vs. VCC Turn-On Rising Time vs. Temperature 160 Turn-On Rising Time (ns)1 160 Turn-On Rising Time (ns)1 14 VCC (V) Ambient Temperature (°C) 120 UGATE 80 LGATE 40 120 UGATE 80 LGATE 40 TA = 25°C 0 0 -50 -25 0 25 50 75 100 Ambient Temperature (°C) Copyright © 2013 Richtek Technology Corporation. All rights reserved. DS7020-00 October 2013 125 10 12 14 16 18 20 VCC (V) is a registered trademark of Richtek Technology Corporation. www.richtek.com 7 RT7020 Turn-Off Falling Time vs. VCC Turn-Off Falling Time vs. Temperature 50 Turn-Off Falling Time (ns) Turn-Off Falling Time (ns) 50 40 30 LGATE 20 UGATE 10 40 30 LGATE 20 UGATE 10 TA = 25°C 0 0 -50 -25 0 25 50 75 100 10 125 12 14 Ambient Temperature (°C) 800 800 VLGATE Rising − VUGATE Falling 400 18 20 Dead-Time vs. VCC 1000 Dead-Time (ns) Dead-Time (ns) Dead-Time vs. Temperature 1000 600 16 VCC (V) VUGATE Rising − VLGATE Falling 600 VLGATE Rising − VUGATE Falling 400 200 200 0 0 VUGATE Rising − VLGATE Falling TA = 25°C -50 -25 0 25 50 75 100 10 125 12 VCC Operating Current vs. Temperature 16 18 20 VCC Operating Current vs. VCC 600 VCC Operating Current (µA) 600 VCC Operating Current (µA) 14 VCC (V) Ambient Temperature (°C) 500 400 300 200 100 500 400 300 200 100 TA = 25°C 0 0 -50 -25 0 25 50 75 100 Ambient Temperature (°C) Copyright © 2013 Richtek Technology Corporation. All rights reserved. www.richtek.com 8 125 10 12 14 16 18 20 VCC (V) is a registered trademark of Richtek Technology Corporation. DS7020-00 October 2013 RT7020 VBOOT - LX Operating Current vs. VBOOT-LX 300 VBOOT - LX Operating Current (µA) 1 VBOOT - LX Operating Current (µA) 1 VBOOT - LX Operating Current vs. Temperature 240 180 120 60 300 240 180 120 60 TA = 25°C 0 0 -50 -25 0 25 50 75 100 125 10 12 14 Ambient Temperature (°C) 20 3.0 Logic-High Input Voltage (V) LX Leakage Current (uA) 1 18 Logic-High Threshold Voltage vs. Temperature LX Leakage Current vs. Temperature 15 12 9 6 3 2.5 HIN 2.0 LIN 1.5 1.0 0 -50 -25 0 25 50 75 100 -50 125 -25 Logic-High Threshold Voltage vs. VCC 25 50 75 100 125 Logic-Low Threshold Voltage vs. Temperature 3.0 Logic-Low Threshold Voltage (V) 2.0 2.5 HIN 2.0 LIN 1.5 TA = 25°C 1.0 1.8 1.6 HIN 1.4 LIN 1.2 1.0 10 12 14 16 18 VCC (V) Copyright © 2013 Richtek Technology Corporation. All rights reserved. DS7020-00 0 Ambient Temperature (°C) Ambient Temperature (°C) Logic-High Threshold Voltage (V)1 16 VBOOT-LX (V) October 2013 20 -50 -25 0 25 50 75 100 125 Ambient Temperature (°C) is a registered trademark of Richtek Technology Corporation. www.richtek.com 9 RT7020 Logic-Low Threshold Voltage vs. VCC High-Level Output Voltage vs. Temperature 100 High-Level Output Voltage (mV)1 Logic-Low Threshold Voltage (V) 2.0 1.8 1.6 HIN 1.4 LIN 1.2 TA = 25°C 1.0 80 VCC − VLGATE 60 VBOOT − VUGATE 40 20 0 10 12 14 16 18 20 -50 -25 VCC (V) 50 75 100 125 Low-Level Output Voltage vs. Temperature 25 100 Low-Level Output Voltage (mV) High-Level Output Voltage (mV)1 25 Ambient Temperature (°C) High-Level Output Voltage vs. VCC or VBOOT-LX 80 VCC − VLGATE 60 40 VBOOT − VUGATE 20 TA = 25°C 20 VLGATE 15 VUGATE-LX 10 5 0 0 10 12 14 16 18 -50 20 -25 VCC or VBOOT-LX (V) 0 25 50 75 100 125 Ambient Temperature (°C) Output Sourcing Current vs. Temperature Low-Level Output Voltage vs. VCC or VBOOT-LX 600 Output Sourcing Current (mA)1 25 Low-Level Output Voltage (mV) 0 20 VLGATE 15 VUGATE-LX 10 5 TA = 25°C 500 400 LGATE 300 UGATE 200 100 0 0 10 12 14 16 18 VCC or VBOOT-LX (V) Copyright © 2013 Richtek Technology Corporation. All rights reserved. www.richtek.com 10 20 -50 -25 0 25 50 75 100 125 Junction Temperature (°C) is a registered trademark of Richtek Technology Corporation. DS7020-00 October 2013 RT7020 Output Sourcing Current vs. VCC or VBOOT-LX Output Sinking Current vs. Temperature 1000 Output Sink Current (mA)1 Output Sourcing Current (mA)1 600 500 400 LGATE 300 UGATE 200 100 800 UGATE 600 LGATE 400 200 TA = 25°C 0 0 10 12 14 16 18 -50 20 -25 VCC or VBOOT-LX (V) 25 50 75 100 125 VTHON_VCC / VTHOFF_VCC vs. Temperature Output Sinking Current vs. VCC or VBOOT-LX 1000 15 800 UGATE 600 LGATE VTHON_VCC / VTHOFF_VCC (V) Output Sinking Current (mA)1 0 Junction Temperature (°C) 400 200 12 V THON_VCC 9 VTHOFF_VCC 6 3 TA = 25°C 0 0 10 12 14 16 18 20 -50 -25 VCC or VBOOT-LX (V) VTHON_BOOT / VTHOFF_BOOT vs. Temperature 25 50 75 100 125 VHYS_VCC vs. Temperature 2.0 15 12 VTHON_BOOT 1.5 VHYS_VCC (V) VTHON_BOOT / VTHOFF_BOOT (V) 0 Ambient Temperature (°C) 9 VTHOFF_BOOT 6 1.0 0.5 3 0.0 0 -50 -25 0 25 50 75 100 Ambient Temperature (°C) Copyright © 2013 Richtek Technology Corporation. All rights reserved. DS7020-00 October 2013 125 -50 -25 0 25 50 75 100 125 Ambient Temperature (°C) is a registered trademark of Richtek Technology Corporation. www.richtek.com 11 RT7020 VHYS_BOOT vs. Temperature 2.0 VHYS_BOOT (V) 1.5 1.0 0.5 0.0 -50 -25 0 25 50 75 100 125 Ambient Temperature (°C) Copyright © 2013 Richtek Technology Corporation. All rights reserved. www.richtek.com 12 is a registered trademark of Richtek Technology Corporation. DS7020-00 October 2013 RT7020 Application Information Timing Diagram and Dynamic Waveforms 90% VUGATE Figure 1 is the RT7020 input/output timing diagram, and Figure 2 is a definition of dynamic characteristics. You can know those definitions and the relationship between input and output from these figures. For example : tON, 10% tDead tDead 90% VLGATE 10% tOFF, tR, tF... Figure 3. Deadtime Definition VHIN Matched Propagation Delays between Both Channels VLIN Because the IC internal level shifter circuit causes the propagation delay of the high-side output signal, shown in Figure 4. The RT7020 adds a propagation delay matching circuit in the low-side logic circuit, so that highside and low-side output signals approximately synchronization. VUGATE VLGATE Figure 1. Input/Output Timing Diagram BOOT VHIN 50% tON tR BOOT-to-LX UVLO1 Under-Voltage Lockout 50% Pulse Generator tOFF Level Shifter Noise Filter R S Driver UGATE Q LX tF 90% VUGATE 10% UGATE High/Low 10% IIN+ VLIN 50% tON tR 50% IIN+ 90% VLGATE 10% Dead Time Control VCC tOFF VCC VCC HIN VCC UVLO2 Under-Voltage Lockout LGATE High/Low Driver LGATE Delay GND LIN tF 10% Figure 4. Propagation Delay Matching Circuit Figure 2. Dynamic Electrical Characteristics Definition Thermal Considerations Deadtime, tDead To avoid the simultaneous conduction of high-side and low-side power switches cause shoot through, the switching operation of the IC control circuit introduces a deadtime function. In the deadtime period, even if the input sends another power switch conduction signal, the control circuit will remain closed drive state. Figure 3 illustrates the definition of deadtime and the relationship between the high-side and low-side gate signals. Copyright © 2013 Richtek Technology Corporation. All rights reserved. DS7020-00 October 2013 For continuous operation, do not exceed absolute maximum junction temperature. The maximum power dissipation depends on the thermal resistance of the IC package, PCB layout, rate of surrounding airflow, and difference between junction and ambient temperature. The maximum power dissipation can be calculated by the following formula : PD(MAX) = (TJ(MAX) − TA) / θJA is a registered trademark of Richtek Technology Corporation. www.richtek.com 13 RT7020 where TJ(MAX) is the maximum junction temperature, TA is the ambient temperature, and θJA is the junction to ambient thermal resistance. For recommended operating condition specifications, the maximum junction temperature is 125°C. The junction to ambient thermal resistance, θJA, is layout dependent. For SOP-8 package, the thermal resistance, θJA, is 188°C/W on a standard JEDEC 51-7 four-layer thermal test board.For DIP-8 package, the thermal resistance, θJA, is 134.9°C/ W on a standard JEDEC 51-7 four-layer thermal test board. The maximum power dissipation at TA = 25°C can be calculated by the following formula : Layout Consideration A proper PCB layout for power supply can reduce unnecessary waveform noise and electromagnetic interference problems to ensure proper system operation, please refer to the following PCB layout considerations: ` For the high voltage and high current loop layout of power supply should be as thick and short. Avoid excessive layout generated parasitic inductance and resistors to cause significant noise. ` In order to shorten the length of IC layout, you need to consider the relative placement for IC and the power switches. It is recommended that the power switches placed in a symmetrical manner, and the IC close to high-side and low-side elements. ` In order to reduce the noise coupling, it is recommended that the ground layout should not be placed under or near the high voltage floating side. ` The layout between high-side and low-side power switches should be thick and straight, avoiding the formation of long loops. Too long distance will increase the loop area, and electromagnetic interference suppression capabilities would be affected. However, too short distance may cause overheating situation. It is necessary to consider the most appropriate way. ` Refer to typical application circuit, the VCC capacitor (C1), BOOT to LX capacitor (CBOOT), and bootstrap diode (DBOOT) need to be placed as close to the IC as possible to minimize parasitic inductance and resistance. The CBOOT selected range is from 0.1μF to 0.47μF, and the VCC capacitor (C1) is greater than ten times CBOOT. It is recommended to use fast or ultra fast reverse recovery time bootstrap diode DBOOT. ` In Figure 5, the LX pin voltage drop can be improved by adding RLX (RLX = 1 to 10Ω), because the dv/dt is affected by (RLX + RUGATE). PD(MAX) = (125°C − 25°C) / (188°C/W) = 0.53W for SOP-8 package PD(MAX) = (125°C − 25°C) / (134.9°C/W) = 0.74W for DIP-8 package The maximum power dissipation depends on the operating ambient temperature for fixed T J(MAX) and thermal resistance, θJA. The derating curve in Figure 5 allows the designer to see the effect of rising ambient temperature on the maximum power dissipation. Maximum Power Dissipation (W)1 1.0 Four-Layer PCB 0.9 DIP-8 0.8 0.7 0.6 SOP-8 0.5 0.4 0.3 0.2 0.1 0.0 0 25 50 75 100 125 Ambient Temperature (°C) Figure 5. Derating Curve of Maximum Power Dissipation Copyright © 2013 Richtek Technology Corporation. All rights reserved. www.richtek.com 14 is a registered trademark of Richtek Technology Corporation. DS7020-00 October 2013 RT7020 VCC +VDC+ DBOOT BOOT CBOOT RUGATE Q1 UGATE RLX LX Figure 5. LX Pin Resister ` If the gate current loop opens circuit for some factors, at this time, the current flows through the gate loop via the power MOSFET drain-to-gate parasitic capacitor. The current will charge the gate-to-source parasitic capacitor to result in power MOSFET wrong action. The power switches can be damaged or burned out, the resisters (about least 10kΩ) are connected between the gate and source pin can prevent malfunction of the power switches. ` The selection of larger parasitic capacitor power switch or gate resister may result in too long turn-off time making the high-side and low-side power switches shoot through. In order to prevent the situation, reverse parallel with diodes (DUGATE & DLGATE) in the RUGATE and RLGATE (shown in Figure 6), providing a fast discharge path for the power switches in a short time to complete the closing operation. VCC +VDC+ DBOOT BOOT CBOOT DUGATE RUGATE Q1 UGATE To Load LX DLGATE RLGATE LGATE Q2 Figure 6. Reverse Parallel with Diodes Copyright © 2013 Richtek Technology Corporation. All rights reserved. DS7020-00 October 2013 is a registered trademark of Richtek Technology Corporation. www.richtek.com 15 RT7020 Outline Dimension H A M J B F C I D Dimensions In Millimeters Dimensions In Inches Symbol Min Max Min Max A 4.801 5.004 0.189 0.197 B 3.810 3.988 0.150 0.157 C 1.346 1.753 0.053 0.069 D 0.330 0.508 0.013 0.020 F 1.194 1.346 0.047 0.053 H 0.170 0.254 0.007 0.010 I 0.050 0.254 0.002 0.010 J 5.791 6.200 0.228 0.244 M 0.400 1.270 0.016 0.050 8-Lead SOP Plastic Package Copyright © 2013 Richtek Technology Corporation. All rights reserved. www.richtek.com 16 is a registered trademark of Richtek Technology Corporation. DS7020-00 October 2013 RT7020 Dimensions In Millimeters Dimensions In Inches Symbol Min Max Min Max A 3.700 4.320 0.146 0.170 A1 0.381 0.710 0.015 0.028 A2 3.200 3.600 0.126 0.142 b 0.360 0.560 0.014 0.022 b1 1.143 1.778 0.045 0.070 D 9.050 9.550 0.356 0.376 E 6.200 6.600 0.244 0.260 E1 7.620 8.255 0.300 0.325 e L 2.540 3.000 0.100 3.600 0.118 0.142 8-Lead DIP Plastic Package Richtek Technology Corporation 14F, No. 8, Tai Yuen 1st Street, Chupei City Hsinchu, Taiwan, R.O.C. Tel: (8863)5526789 Richtek products are sold by description only. Richtek reserves the right to change the circuitry and/or specifications without notice at any time. Customers should obtain the latest relevant information and data sheets before placing orders and should verify that such information is current and complete. Richtek cannot assume responsibility for use of any circuitry other than circuitry entirely embodied in a Richtek product. Information furnished by Richtek is believed to be accurate and reliable. However, no responsibility is assumed by Richtek or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of Richtek or its subsidiaries. DS7020-00 October 2013 www.richtek.com 17