CYPRESS W152_02

W152
Spread Aware™, Eight Output Zero Delay Buffer
Features
Output to Output Skew: Between Banks .....................215 ps
• Spread Aware™—designed to work with SSFTG
reference signals
• Two banks of four outputs each
• Configuration options to halve, double, or quadruple
the reference frequency refer to Table 1 to determine
the specific option which meets your multiplication
needs
• Outputs may be three-stated
• Available in 16-pin SOIC package
• Extra strength output drive available (-11/-12 versions)
• Contact factory for availability information on 16-pin
TSSOP
Output to Output Skew: Within Banks
(Refer to Figure 4) ...................................................100 ps
Total Timing Budget Impact: ........................................555 ps
Max. Phase Error Variation:.......................................±225 ps
Tracking Skew: ..........................................................±130 ps
Table 1. Configuration Options
Device
[1]
QA0:3
QB0:3
QA0:3 or QB0:3
REFx1
REFx1
W152-2/12[2]
QA0:3
REFx1
REF/2
[2]
QB0:3
REFx2
REFx1
QA0:3
REFx2
REFx1
W152-1/11
W152-2/12
Key Specifications
Feedback Signal
W152-3
Operating Voltage: ............................................... 3.3V±10%
W152-3
QB0:3
REFx4
REFx2
Operating Range: ................... 15 MHz < fOUTQA < 140 MHz
W152-4
QA0:3 or QB0:3
REFx2
REFx2
Cycle-to-Cycle Jitter: (Refer to Figure 3) .................... 225 ps
Cycle-to-Cycle Jitter: Frequency Range
25 to140 MHz ......................................................... 125 ps
Notes:
1. W152-11 has stronger output drive than the W152-1.
2. W152-12 has stronger output drive than the W152-2.
Block Diagram
Pin Configuration
(present on the -3 and -4 only)
FBIN
REF
÷2
PLL
MUX
QA0
QA1
QA2
SEL0
QA3
÷2
REF
1
16
FBIN
QA0
2
15
QA3
QA1
3
14
QA2
VDD
4
13
VDD
GND
5
12
GND
QB0
6
11
QB3
QB1
7
10
QB2
SEL1
8
9
SEL0
QB0
SEL1
QB1
QB2
(present on the -2, -12, and -3 only)
QB3
Spread Aware is a trademark of Cypress Semiconductor Corporation.
Cypress Semiconductor Corporation
Document #: 38-07148 Rev. *A
•
3901 North First Street
•
San Jose
•
CA 95134 • 408-943-2600
Revised December 14, 02
W152
Pin Definitions
Pin No.
Pin
Type
REF
1
I
Reference Input: The output signals QA0:3 through QB0:3 will be synchronized to
this signal unless the device is programmed to bypass the PLL.
FBIN
16
I
Feedback Input: When programmed to zero delay buffer mode, this input must be
fed by one of the outputs (QA0:3 or QB0:3) to ensure proper functionality. If the trace
between FBIN and the output pin being used for feedback is equal in length to the
traces between the outputs and the signal destinations, then the signals received at
the destinations will be synchronized to the REF signal input.
QA0:3
2, 3, 14, 15
O
Outputs from Bank A: The frequency of the signals provided by these pins is determined by the feedback signal connected to FBIN, and the specific W152 option being
used. See Table 2.
QB0:3
6, 7, 10, 11
O
Outputs from Bank B: The frequency of the signals provided by these pins is determined by the feedback signal connected to FBIN, and the specific W152 option being
used. See Table 2.
VDD
4, 13
P
Power Connections: Connect to 3.3V. Use ferrite beads to help reduce noise for
optimal jitter performance.
GND
5, 12
G
Ground Connections: Connect all grounds to the common system ground plane.
SEL0:1
9, 8
I
Function Select Inputs: Tie to VDD (HIGH, 1) or GND (LOW, 0) as desired per
Table 2.
Pin Name
Pin Description
Overview
Functional Description
The W152 products are eight-output zero delay buffers. A
Phase-Locked Loop (PLL) is used to take a time-varying signal
and provide eight copies of that same signal out. The external
feedback to the PLL provides outputs in phase with the reference inputs.
Logic inputs provide the user the ability to turn off one or both
banks of clocks when not in use, as described in Table 2. Disabling a bank of unused outputs will reduce jitter and power
consumption, and will also reduce the amount of EMI generated by the W152.
Internal dividers exist in some options allowing the user to get
a simple multiple (/2, x2, x4) of the reference input, for details
see Table 1. Because the outputs are separated into two
banks, it is possible to provide some combination of these multiples at the same time.
These same inputs allow the user to bypass the PLL entirely
if so desired. When this is done, the device no longer acts as
a zero delay buffer, it simply reverts to a standard eight-output
clock driver.
Spread Aware
Many systems being designed now utilize a technology called
Spread Spectrum Frequency Timing Generation. Cypress has
been one of the pioneers of SSFTG development, and we designed this product so as not to filter off the Spread Spectrum
feature of the Reference input, assuming it exists. When a
zero delay buffer is not designed to pass the SS feature
through, the result is a significant amount of tracking skew
which may cause problems in systems requiring synchronization.
For more details on Spread Spectrum timing technology,
please see the Cypress application note titled, “EMI Suppression Techniques with Spread Spectrum Frequency Timing
Generator (SSFTG) ICs.”
Document #: 38-07148 Rev. *A
The W152 PLL enters an auto power-down mode when there
are no rising edges on the REF input. In this mode, all outputs
are three-stated and the PLL is turned off.
Table 2. Input Logic
SEL1
SEL0
QA0:3
QB0:3
0
0
0
1
Active
Three-State
Active, Utilized
1
0
Active
Active
Shutdown,
Bypassed
1
1
Active
Active
Active, Utilized
Three-State Three-State
PLL
Shutdown
Page 2 of 8
W152
VDD
0.1µF
VDD or GND (for desired operation mode)
1
Ref In
FB In
16
2
QA0
QA3
15
3
QA1
QA2
14
4
Power
Power
13
5 Ground
Ground
12
6
QB0
QB3
11
7
QB1
QB2
10
8
SEL1
SEL0
9
See Note 3
VDD
Ferrite
Bead
3.3V
Supply
0.1µF 10µF
VDD or GND (for desired operation mo
Figure 1. Schematic[4]
Note:
3. Pin 16 needs to be connected to one of the outputs from either bank A or bank B, it should not be connected to both. Pins 2 and 10 are shown here as
examples. None of the outputs should be considered as preferred for the feedback path.
How to Implement Zero Delay
Typically, zero delay buffers (ZDBs) are used because a designer wants to provide multiple copies of a clock signal in
phase with each other. The whole concept behind ZDBs is that
the signals at the destination chips are all going HIGH at the
same time as the input to the ZDB. In order to achieve this,
layout must compensate for trace length between the ZDB and
the target devices. The method of compensation is described
below.
External feedback is the trait that allows for this compensation.
The PLL on the ZDB will cause the feedback signal to be in
phase with the reference signal. When laying out the board,
match the trace lengths between the output being used for
feedback and the FBIN input to the PLL.
If it is desirable to either add a little delay, or slightly precede
the input signal, this may also be affected by either making the
trace to the FBIN pin a little shorter or a little longer than the
traces to the devices being clocked.
some other device. This implementation can be applied to any
device (ASIC, multiple output clock buffer/driver, etc.) which is
put into the feedback path.
Referring to Figure 2, if the traces between the ASIC/buffer
and the destination of the clock signal(s) (A) are equal in length
to the trace between the buffer and the FBIN pin, the signals
at the destination(s) device will be driven HIGH at the same
time the Reference clock provided to the ZDB goes HIGH.
Synchronizing the other outputs of the ZDB to the outputs form
the ASIC/Buffer is more complex however, as any propagation
delay in the ASIC/Buffer must be accounted for.
Reference
Signal
Feedback
Input
Zero
Delay
Buffer
ASIC/
Buffer
A
Inserting Other Devices in Feedback Path
Another nice feature available due to the external feedback is
the ability to synchronize signals up to the signal coming from
Document #: 38-07148 Rev. *A
Figure 2. 6 Output Buffer in the Feedback Path
Page 3 of 8
W152
Absolute Maximum Ratings[3]
Stresses greater than those listed in this table may cause permanent damage to the device. These represent a stress rating
only. Operation of the device at these or any other conditions
above those specified in the operating sections of this specification is not implied. Maximum conditions for extended periods may affect reliability.
.
Parameter
Description
Rating
Unit
V
VDD, VIN
Voltage on any pin with respect to GND
–0.5 to +7.0
–65 to +150
°C
0 to +70
°C
–55 to +125
°C
0.5
W
TSTG
Storage Temperature
TA
Operating Temperature
TB
Ambient Temperature under Bias
PD
Power Dissipation
DC Electrical Characteristics: TA =0°C to 70°C, VDD = 3.3V ±10%
Parameter
Description
Test Condition
Min.
Typ.
Unloaded, 100 MHz
Max.
Unit
40
mA
0.8
V
IDD
Supply Current
VIL
Input Low Voltage
VIH
Input High Voltage
VOL
Output Low Voltage
IOL = 12 mA (-11, -12)
IOL = 8 mA (-1, -2, -3, -4)
VOH
Output High Voltage
IOH = 12 mA (-11, -12)
IOH = 8 mA (-1, -2, -3, -4)
IIL
Input Low Current
VIN = 0V
50
µA
IIH
Input High Current
VIN = VDD
50
µA
Max.
Unit
2.0
V
0.4
2.4
V
V
AC Electrical Characteristics: TA = 0°C to +70°C, VDD = 3.3V ±10%
Parameter
Description
Test Condition
Min.
Typ.
fIN
Input Frequency
Note 4
15
140
MHz
fOUT
Output Frequency
15-pF load[9]
15
140
MHz
tR
Output Rise Time (-1, -2, -3, -4)
0.8V to 0.8V, 15-pF load
2.5
ns
Output Rise Time (-11, -12)
0.8V to 0.8V, 15-pF load
1.5
ns
tF
tICLKR
tICLKF
Output Fall Time (-1, -2, -3, -4)
2.0V to 0.8V, 15-pF load
Output Rise Time (-11, -12)
2.0V to 0.8V, 20-pF load
2
2
Input Clock Rise Time[5]
Input Clock Fall Time
[5]
[6, 7]
tPD
FBIN to REF Skew
tSK
Output to Output Skew
All outputs loaded equally[11]
[8, 9]
45
50
2.5
ns
1.5
ns
4.5
ns
4.5
ns
350
ps
215
ps
55
%
tD
Duty Cycle
15-pF load
tLOCK
PLL Lock Time
Power supply stable
1.0
ms
tJC
Jitter, Cycle-to-Cycle
Note 10
225
ps
Notes:
3. Multiple Supplies: The voltage on any input or I/O pin cannot exceed the power pin during power-up. Power supply sequencing is NOT required.
4. Input frequency is limited by output frequency range and input to output frequency multiplication factor (which is determined by circuit configuration). See
Table 1.
5. Longer input rise and fall time will degrade skew and jitter performance.
6. All AC specifications are measured with a 50Ω transmission line.
7. Skew is measured at VDD/2 on rising edges.
8. Duty cycle is measured at VDD/2.
9. For the higher drive -11 and -12, the load is 20 pF.
10. For frequencies above 25 MHz CY - CY = 125 ps.
11. Measured across all outputs. Maximum skew between outputs in the same bank is 100 ps.
Document #: 38-07148 Rev. *A
Page 4 of 8
W152
ps
W152 -01 CYCLE - CYCLE JITTER @ 15 pF
1000
900
800
700
600
500
400
300
200
100
0
0
20
40
60
80
100
120
140
160
FREQUENCY in MHz
07/21/99 W152-a1
Figure 3. Cycle to Cycle Jitter at 15 pF
W152 -01 PIN- PIN SKEW @ 15 pF
300
200
ps
100
0
A1
A2
A3
A4
B1
B2
B3
B4
-100
-200
OUTPUT #
PIN A1 = REF
O7/21/99 a3
Figure 4. Pin to Pin Skew at 15 pF
Ordering Information
Ordering Code
W152
Package
Name
Option
-1, -11, -2, -12,
-3, -4
Document #: 38-07148 Rev. *A
G
X
Package Type
16-pin SOIC (150 mil)
16-pin TSSOP (4.4 mm)
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W152
Package Diagrams
16-Pin Small Outline Integrated Circuit (SOIC, 150 mils)
Document #: 38-07148 Rev. *A
Page 6 of 8
W152
Package Diagrams (continued)
16-Pin Thin Shrink Small Outline Package (TSSOP, 4.4 mm)
Document #: 38-07148 Rev. *A
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© Cypress Semiconductor Corporation, 2001. The information contained herein is subject to change without notice. Cypress Semiconductor Corporation assumes no responsibility for the use
of any circuitry other than circuitry embodied in a Cypress Semiconductor product. Nor does it convey or imply any license under patent or other rights. Cypress Semiconductor does not authorize
its products for use as critical components in life-support systems where a malfunction or failure may reasonably be expected to result in significant injury to the user. The inclusion of Cypress
Semiconductor products in life-support systems application implies that the manufacturer assumes all risk of such use and in doing so indemnifies Cypress Semiconductor against all charges.
W152
Document Title: W152 Spread Aware™, Eight Output Zero Delay Buffer
Document Number: 38-07148
ECN NO.
Issue
Date
Orig. of
Change
**
110257
12/15/01
SZV
Change from Spec number: 38-00786 to 38-07148
*A
122797
12/14/02
RBI
Add Power up Requirements to Operating Conditions Information
REV.
Document #: 38-07148 Rev. *A
Description of Change
Page 8 of 8