High Efficiency For LED Backlight 2ch LED Driver IC BL0200 Series General Descriptions Package BL0200 series are 2ch output LED driver IC for LED backlight, and it can do dimming to 0.02 % by external PWM signal. This IC realizes a high efficiency by the boost convertor control that absorbs variability on VF. The product easily achieves high cost-performance LED drive system with few external components and enhanced protection functions. SOP18 Not to scale Features and Benefit Boost convertor ● Current-Mode type PWM Control ● PWM frequency is 100 kHz o r 200 kHz ● Maximum On Duty is 90 % Lineup LED current control ● Individual PWM Dimming Control ● Analog Dimming ● High contrast ratio is 1 / 5000 ● Accuracy of Reg output voltage is ± 1.5 % or ± 2 % Protection functions ● Enable Function of IC (BL0202B, BL0202C) ● Error Signal Output (BL0200C) ● Overcurrent Protection for Boost Circuit (OCP) ----------------------------------------------Pulse-by-pulse ● Overcurrent Protection for LED Output (LED_OCP) ----------------------------------------------Pulse-by-pulse ● Overvoltage Protection (OVP) ----------- Auto restart ● Output Open/Short Protection ------------ Auto restart ● Thermal Shutdown (TSD)----------------- Auto restart Products Frequency BL0202C 200 kHz BL0202B 100 kHz BL0200C 200 kHz VREG Accuracy Built-in Function ± 1.5 % Enable Function of IC ±2% Error Signal Output Applications ● LED backlights ● LED lighting etc. Typical Application Circuit BL0200C BL0202B/C VCC VREF DRV1 VCC OC1 PWM1 PWM2 EN REG COMP1 COMP2 GND DRV1 VREF OC1 PWM1 PWM2 SW1 SW1 ER IFB1 IFB1 DRV2 DRV2 OC2 OC2 REG OVP COMP1 SW2 COMP2 GND IFB2 TC_BL0202_1_R1 BL0200-DS Rev.2.3 May. 15, 2014 SANKEN ELECTRIC CO.,LTD. OVP SW2 IFB2 TC_BL0200C_1_R1 1 BL0200 Series CONTENTS Lineup ----------------------------------------------------------------------------------------- 1 Applications ---------------------------------------------------------------------------------- 1 1. Absolute Maximum Ratings --------------------------------------------------------- 3 2. Electrical characteristics ------------------------------------------------------------- 4 3. Functional Block Diagram ----------------------------------------------------------- 6 4. Pin List Table --------------------------------------------------------------------------- 7 5. Typical Application Circuit --------------------------------------------------------- 8 6. Package Diagram ---------------------------------------------------------------------- 9 7. Marking Diagram --------------------------------------------------------------------- 9 8. Functional Description -------------------------------------------------------------- 10 8.1 Startup Operation（BL0200C） -------------------------------------------- 10 8.2 Startup Operation（BL0202B, BL0202C） ------------------------------ 11 8.3 Constant Current Control Operation ----------------------------------- 12 8.4 PWM Dimming Function -------------------------------------------------- 13 8.5 Gate Drive --------------------------------------------------------------------- 13 8.6 Error Signal Output Function (BL0200C) ----------------------------- 14 8.7 Protection Function --------------------------------------------------------- 14 9. Design Notes --------------------------------------------------------------------------- 18 9.1 Peripheral Components ---------------------------------------------------- 18 9.2 Inductor Design Parameters----------------------------------------------- 18 9.3 PCD Trace Layout and Component Placement ----------------------- 19 10. Reference Design of Power Supply ----------------------------------------------- 21 10.1 BL0202B ----------------------------------------------------------------------- 21 10.2 BL0200C ----------------------------------------------------------------------- 23 OPERATING PRECAUTIONS -------------------------------------------------------- 25 IMPORTANT NOTES ------------------------------------------------------------------- 26 BL0200-DS Rev.2.3 May. 15, 2014 SANKEN ELECTRIC CO.,LTD. 2 BL0200 Series 1. Absolute Maximum Ratings The polarity value for current specifies a sink as "+," and a source as "−," referencing the IC. Unless otherwise specified, TA is 25 °C Parameter Symbol Test Conditions Pins Rating Unit REG Pin Source Current IREG 1–9 −1 mA OVP Pin Voltage VOVP 2–9 − 0.3 to 5 V PWM1 Pin Voltage VPWM1 3–9 − 0.3 to 5 V 5–9 − 10 mA Single pulse 5 µs Notes IFB1 Pin Clamp Current IFB1 OC1 Pin Voltage VOC1 6–9 − 0.3 to 5 V DRV1 Pin Voltage VDRV1 7–9 − 0.3 to VCC + 0.3 V SW1 Pin Voltage VSW1 8–9 − 0.3 to VCC + 0.3 V VCC Pin Voltage VCC 10 – 9 − 0.3 to 20 V SW2 Pin Voltage VSW2 11 – 9 − 0.3 to VCC + 0.3 V DRV2 Pin Voltage VDRV2 12 – 9 − 0.3 to VCC + 0.3 V OC2 Pin Voltage VOC2 13 – 9 − 0.3 to 5 V IFB2 Pin Clamp Current IFB2 14 – 9 − 10 mA VPWM2 16 – 9 − 0.3 to 5 V EN Pin Voltage VEN 17 – 9 − 0.3 to 5 V BL0202B BL0202C ER Pin Voltage VER 17 – 9 − 0.3 to VREG V BL0200C VREF Pin Voltage VREF 18 – 9 − 0.3 to 5 V Operating Ambient Temperature Top − − 40 to 85 °C Storage Temperature Tstg − − 40 to 125 °C Junction Temperature Tj − 150 °C PWM2 Pin Voltage BL0200-DS Rev.2.3 May. 15, 2014 Single pulse 5 µs SANKEN ELECTRIC CO.,LTD. 3 BL0200 Series 2. Electrical characteristics The polarity value for current specifies a sink as "+," and a source as "−," referencing the IC. Unless otherwise specified, TA is 25 °C, VCC = 12 V Parameter Symbol Test Conditions Pins Min. Typ. Max. Unit 10 – 9 8.5 9.6 10.5 V 7.8 8.6 9.2 8.0 9.1 10.0 10 – 9 − 5.3 8.0 mA 10 – 9 − 70 200 µA Notes Start / Stop Operation Operation Start Voltage* Operation Stop Voltage Circuit Current in Operation Circuit Current in Non-Operation REG Pin Output Voltage VCC(ON) 10 – 9 VCC(OFF) ICC(ON) ICC(OFF) VCC = 7.5 V 1–9 VREG 4.925 5.000 5.075 4.9 5.0 5.1 95 100 105 V BL0202B BL0202C BL0200C V BL0202B BL0202C BL0200C Oscillation PWM Operation Frequency Maximum ON Duty Minimum ON Time COMP Pin Voltage at Oscillation Start COMP Pin Voltage at Oscillation Stop fPWM1 fPWM2 7–9 12 – 9 DMAX1 DMAX2 tMIN1 tMIN2 7–9 12 – 9 7–9 12 – 9 4–9 15 – 9 4–9 15 – 9 VCOMP1(ON) VCOMP2(ON) VCOMP1(OFF) VCOMP2(OFF) VREF / IFB Pin VREF Pin Minimum Setting VREF(MIN) Voltage VREF Pin Maximum Setting VREF(MAX) Voltage IFB Pin Voltage at COMP VIFB1(COMP1) Charge Switching VIFB2(COMP2) IFB Pin Overcurrent Protection VIFB1(OCH) High Threshold Voltage VIFB2(OCH) IFB Pin Overcurrent Protection VIFB1(OCL) Low Threshold Voltage VIFB2(OCL) IFB Pin Overcurrent Protection VIFB1(OCL-OFF) Release Threshold Voltage VIFB2(OCL-OFF) IFB Pin Voltage at Auto Restart VIFB1(AR) Operation VIFB2(AR) IIFB1(B) IFB Pin Bias Current IIFB2(B) Current Detection Threshold Voltage COMP Pin COMP Pin Maximum Output Voltage VIFB1 VIFB2 BL0202B kHz 190 200 210 85 90 95 % 200 310 400 ns 0.35 0.50 0.65 V 0.10 0.25 0.40 V VREF = 0 V 18 – 9 0.05 0.25 0.45 V VREF = 5 V 18 – 9 1.75 2.00 2.35 V 0.55 0.60 0.65 V 3.8 4.0 4.2 V 1.9 2.0 2.1 V 1.5 1.6 1.7 V 0.45 0.50 0.55 V − − 1 µA 0.98 1.00 1.02 VREF = 1 V VREF = 1 V VREF = 1 V VREF = 1 V VIFB1 = 5 V VIFB2 = 5 V VREF = 1 V VCOMP1(MAX) VIFB1 = 0.7 V VCOMP2(MAX) VIFB2 = 0.7 V 5–9 14 – 9 5–9 14 – 9 5–9 14 – 9 5–9 14 – 9 5–9 14 – 9 5–9 14 – 9 5–9 14 – 9 4–9 15 – 9 V 0.985 1.000 1.015 4.8 5.0 − BL0200C BL0202C BL0202B BL0202C BL0200C V * VCC(ON) > VCC(OFF) BL0200-DS Rev.2.3 May. 15, 2014 SANKEN ELECTRIC CO.,LTD. 4 BL0200 Series Parameter COMP Pin Minimum Output Voltage Transconductance COMP Pin Source Current COMP Pin Sink Current COMP Pin Charge Current at Startup COMP Pin Reset Current Symbol VCOMP1(MIN) VCOMP2(MIN) gm ICOMP1(SRC) ICOMP2(SRC) ICOMP1(SNK) ICOMP2(SNK) ICOMP1(S) ICOMP2(S) ICOMP1(R) ICOMP2(R) Test Conditions Pins 4–9 15 – 9 − VIFB1 = 0.7 V 4 – 9 VIFB2 = 0.7 V 15 – 9 VIFB1 = 1.5 V 4 – 9 VIFB2 = 1.5 V 15 – 9 VCOMP1 = 0 V 4 – 9 VCOMP2 = 0 V 15 – 9 4–9 15 – 9 VIFB1 = 2.0 V VIFB2 = 2.0 V Min. Typ. Max. Unit − 0 0.2 V − 640 − µS −77 −57 −37 µA 37 57 77 µA −19 −11 −3 µA 200 360 520 µA Notes EN Pin Operation Start EN Pin Voltage VEN(ON) 17 – 9 1.2 2.0 2.6 V Operation Stop EN Pin Voltage VEN(OFF) 17 – 9 0.8 1.4 1.8 V EN Pin Sink Current IEN VEN = 3 V 17 – 9 20 55 120 µA ER Pin ER Pin Sink Current during Non-Alarm IER VER = 1 V 17 – 9 2.5 4.4 6.3 mA VCOMP1 = VCOMP2 = 4.5 V 6–9 13 – 9 0.57 0.60 0.63 V BL0202B BL0202C BL0200C Boost Parts Overcurrent Protection (OCP) OC Pin Overcurrent Protection Threshold Voltage VOCP1 VOCP2 Overvoltage Protection (OVP) OVP Pin Overvoltage Protection Threshold Voltage OVP Pin OVP Release Threshold Voltage VOVP 2–9 2.85 3.00 3.15 V VOVP(OFF) 2–9 2.60 2.75 2.90 V VPWM1(ON) VPWM2(ON) VPWM1(OFF) VPWM2(OFF) RPWM1 RPWM2 3–9 16 – 9 3–9 16 – 9 3–9 16 – 9 1.4 1.5 1.6 V 0.9 1.0 1.1 V 100 200 300 kΩ ISW1(SRC) ISW2(SRC) ISW1(SNK) ISW2(SNK) IDRV1(SRC) IDRV2(SRC) IDRV1(SNK) IDRV2(SNK) 8–9 11 – 9 8–9 11 – 9 7–9 12 – 9 7–9 12 – 9 − −85 − mA − 220 − mA − −0.36 − A − 0.85 − A − 125 − − °C − − 65 − °C − − − 95 °C/W PWM Pin PWM Pin ON Threshold Voltage PWM Pin OFF Threshold Voltage PWM Pin Impedance SW / DRV Pin SW Pin Source Current SW Pin Sink Current DRV Pin Source Current DRV Pin Sink Current Thermal Shutdown Protection (TSD) Thermal Shutdown Activating Tj(TSD) Temperature Hysteresis Temperature of TSD Tj(TSD)HYS Thermal Resistance Thermal Resistance from Junction to Ambient BL0200-DS Rev.2.3 May. 15, 2014 θj-A SANKEN ELECTRIC CO.,LTD. 5 BL0200 Series 3. Functional Block Diagram BL0202B, BL0202C VCC 10 EN 17 PWM1 VCC UVLO REG ON/OFF 3 PWM1 Pulse Detector 16 PWM2 Pulse Detector 1 REG 8 SW1 11 SW2 7 DRV1 12 DRV2 6 OC1 13 OC2 VCC Drive TSD VCC PWM2 Drive PWM OSC Main Logic OVP 2 VREF 18 IFB1 IFB2 VCC Overvoltage Detector Drive VCC Abnormal Detector 5 Feedback1 Control 14 Feedback2 Control Auto Restart Protection Drive OC1 Control Slope Compensation OC2 Control 15 4 COMP2 9 COMP1 GND BD_BL202_R1 BL0200C VCC 10 1 REG 8 SW1 11 SW2 7 DRV1 12 DRV2 17 ER 6 OC1 13 OC2 VCC VCC UVLO REG ON/OFF PWM1 3 PWM2 16 PWM1 Pulse Detector Drive TSD VCC Drive PWM2 Pulse Detector PWM OSC Main Logic OVP 2 VREF 18 Overvoltage Detector VCC Drive VCC IFB1 IFB2 Abnormal Detector 5 Feedback1 Control 14 Feedback2 Control Drive Auto Restart Protection OC1 Control Slope Compensation OC2 Control 15 4 COMP2 BL0200-DS Rev.2.3 May. 15, 2014 COMP1 9 GND SANKEN ELECTRIC CO.,LTD. BD_BL200_R1 6 BL0200 Series 4. Pin List Table Number Name Function REG 1 18 VREF 1 REG Internal regulator output OVP 2 17 EN / ER 2 OVP Overvoltage detection signal input PWM1 3 16 PWM2 3 PWM1 PWM dimming signal input (1) COMP1 4 15 COMP2 4 COMP1 IFB1 5 14 IFB2 5 IFB1 OC1 6 13 OC2 6 OC1 DRV1 7 12 DRV2 7 DRV1 Phase compensation and soft-start setting (1) Feedback signal input of current detection (1) Current mode control signal input (1) and overcurrent protection signal input (1) Boost MOSFET gate drive output (1) SW1 8 11 SW2 8 SW1 Dimming MOSFET gate drive output (1) GND 9 10 VCC 9 GND Ground 10 VCC Power supply voltage input 11 SW2 Dimming MOSFET gate drive output (2) 12 DRV2 13 OC2 14 IFB2 15 COMP2 Boost MOSFET gate drive output (2) Current mode control signal input (2) and overcurrent protection signal input (2) Feedback signal input of current detection (2) Phase compensation and soft-start setting (2) 16 PWM2 EN ER VREF PWM dimming signal input (2) Enable signal input (BL0202B, BL0202C) Error signal output (BL0200C) Detection voltage setting 17 18 BL0200-DS Rev.2.3 May. 15, 2014 SANKEN ELECTRIC CO.,LTD. 7 BL0200 Series 5. Typical Application Circuit LED_OUT2(+) F1 D9 LED_OUT2(-) P_IN L2 D6 LED_OUT1(+) R50 L1 D1 D8 Q4 C21 LED_OUT1(-) C18 R22 D10 R45 Q3 R49 Q2 R63 C1 R47 D3 R17 R61 D7 R44 R1 C2 R2 Q1 R21 R48 R15 D2 R19 R16 R3 R24 R20 R4 P_GND R46 C8 R62 R18 VCC SW2 OC2 IFB2 COMP2 R38 PWM2_IN PWM2 ON/OFF EN R39 VCC_IN VREF R41 C7 S_GND C11 C19 C22 C13 8 12 7 13 14 6 5 15 4 16 3 17 2 18 1 C14 GND SW1 DRV1 OC1 R23 IFB1 COMP1 R27 PWM1 OVP REG C12 C10 R34 C4 R42 R37 C20 R32 R36 11 BL0202 DRV2 9 U1 10 R35 C15 R33 C16 C3 C5 C6 R26 R25 PWM1_IN TC_BL0202_2_R1 Figure 5-1 BL0202B and BL0202C Typical Application Circuit LED_OUT2(+) F1 D9 LED_OUT2(-) P_IN L2 D6 LED_OUT1(+) R50 L1 D1 D8 Q4 C21 R22 D10 R45 Q3 R49 Q2 R63 C1 R47 R1 C2 D3 R17 R61 D7 R44 LED_OUT1(-) C18 R2 Q1 R21 R48 R15 D2 R19 R16 R3 R24 R20 R4 P_GND R46 C8 R62 R18 VCC SW2 OC2 IFB2 PWM2_IN COMP2 R38 PWM2 R39 ER_OUT ER VREF Q5 VCC_IN 9 11 8 12 7 13 14 6 5 15 4 16 3 17 2 18 1 GND SW1 DRV1 OC1 COMP1 R27 PWM1 OVP REG R31 Q6 R30 R36 C11 C19 C22 C13 C4 R42 R41 C7 C20 R32 C9 C12 R40 R29 ON/OFF R23 IFB1 R37 R28 S_GND U1 BL0200C DRV2 10 C14 C10 R34 R35 R33 C15 C16 C3 C5 C6 R26 R25 PWM1_IN TC_BL0202_2_R1 Figure 5-2 BL0200C Typical Application Circuit BL0200-DS Rev.2.3 May. 15, 2014 SANKEN ELECTRIC CO.,LTD. 8 BL0200 Series 6. Package Diagram SOP18 NOTES： 1) Dimension is in millimeters 2) Pb-free. Device composition compliant with the RoHS directive 7. Marking Diagram 18 B L 0 2 0 × × Part Number S K Y M D 1 Lot Number Y is the last digit of the year (0 to 9) M is the month (1 to 9, O, N or D) D is a period of days (1 to 3) : 1 : 1st to 10th 2 : 11th to 20th 3 : 21st to 31st Sanken Control Number BL0200-DS Rev.2.3 May. 15, 2014 SANKEN ELECTRIC CO.,LTD. 9 BL0200 Series 8.1 Startup Operation（BL0200C） Figure 8-1 shows the VCC pin peripheral circuit. The VCC pin is the power supply input for control circuit from the external power supply. When the VCC pin voltage increases to the Operation Start Voltage, VCC(ON) = 9.6 V, the control circuit starts operation. After that, when the PWM pin voltage exceeds the PWM Pin ON Threshold Voltage, VPWM(ON) of 1.5 V (less than absolute maximum voltage of 5 V), the COMP Pin Charge Current at Startup, ICOMP(S) = −11 µA, flows from the COMP pin. This charge current flows to capacitors at the COMP pin. When the COMP pin voltage increases to the COMP Pin Voltage at Oscillation Start, VCOMP(ON) = 0.50 V or more, the control circuit starts switching operation. As shown in Figure 8-2, when the VCC pin voltage decreases to the Operation Stop Voltage, VCC(OFF) = 9.1 V, the control circuit stops operation, by the UVLO (Undervoltage Lockout) circuit, and reverts to the state before startup. PWM1 VCC 3 U1 COMP1 Figure 8-2 VCC versus ICC When the on-duty of the PWM dimming signal is small, the charge current at the COMP pin is controlled as follows in order to raise the output current quickly at startup. Figure 8-3 shows the operation waveform with the PWM dimming signal at startup. VCC pin voltage VCC(ON) 0 Constant current control IFB pin voltage VREF pin voltage VIFB(COMP.VR) 0 PWM pin Dimming signal 0 COMP pin charge current 0 ICOMP(S) ICOMP(SRC) COMP pin voltage IC switching status OFF ON 9 R42 C15 Figure 8-1 VCC pin peripheral circuit BL0200-DS Rev.2.3 May. 15, 2014 VCC Figure 8-3 Startup operation during PWM dimming C8 C16 VCC（ON） GND 4 C7 VCC（OFF） VCOMP(ON) 0 External power supply 10 Start All of the parameter values used in these descriptions are typical values, unless they are specified as minimum or maximum. With regard to current direction, "+" indicates sink current (toward the IC) and "–" indicates source current (from the IC). The IC incorporates two boost converter circuits in one package, and can independently control each output current. The operation of control circuit for LED_OUT1 is same operation as the control circuit for LED_OUT2. When the one of output is not used, the control signal input pin (PWM, IFB and OC pin) of unused output should be connected to GND pin. ICC ICC（ON） Stop 8. Functional Description While the IFB pin voltage increases to the IFB Pin Voltage at COMP Charge Switching, VIFB(COMP.VR), a capacitors at the COMP pin are charged by ICOMP(S) = −11 µA. During this period, they are charged by the COMP Pin Source Current, ICOMP(SRC) = −57 µA, when the PWM pin voltage is 1.5 V or more. Thus, the COMP pin voltage increases immediately. When the IFB pin voltage increases to VIFB(CMP1.VR) or more, the COMP pin source current is controlled according to the feedback amount, and the output current is controlled to be constant. The on-duty gradually becomes wide according to the SANKEN ELECTRIC CO.,LTD. 10 BL0200 Series increase of the COMP pin voltage, and the output power increases (Soft start operation). Thus, power stresses on components are reduced. When the VCC pin voltage decreases to the operation stop voltage or less, or the Auto Restart operation (see the Section 8.7 Protection Function) after protection is achieved, then the control circuit stops switching operation, and capacitors at the COMP pin are discharged by the COMP Pin Reset Current, ICOMP(R) = 360 µA simultaneously. The soft start operation is achieved at restart. The IC is operated by Auto Restart 1 at startup operation. See the Section 8.7 Protection Function about the caution of startup operation. VIFB(COMP.VR) is determined by the VREF pin voltage, as shown in Figure 8-4. When VREF pin voltage is 1V, the value of VIFB(COMP.VR) becomes 0.60 V. VIFB(COMP.VR) 1.2V VCC pin voltage decreases to the Operation Stop Voltage, VCC(OFF) = 8.6 V, the control circuit stops operation, by the UVLO (Undervoltage Lockout) circuit, and reverts to the state before startup. The value of R39 connected to EN pin is set as follows; R 39 VEN _ IN VEN( ON ) (max) I EN (max) VEN _ IN 2.6(V) 120(A) (8-1) Where, VEN_IN is EN pin input voltage (less than absolute value of EN pin voltage, 5 V ). VEN(ON)(max) is the maximum rating of EN Pin Operation Start Voltage. IEN(max) is the maximum rating of EN Pin Sink Current. In case VEN_IN = 3.5V, the value of R39 should be set 7.5 kΩ or less. 0.6V External power supply 0.15V 8 1V 2V VREF pin voltage Figure 8-4 VREF pin voltage versus IFB pin voltage at COMP charge switching 8.2 Startup Operation（BL0202B, BL0202C） BL0202B and BL0202C have Enable Function. Figure 8-5 shows the peripheral circuit of VCC pin and EN pin, Figure 8-6 shows the operational waveforms. The VCC pin is the power supply input for control circuit from the external power supply. The EN pin is ON/OFF signal input from the external circuit. When the both VCC pin voltage, VCC, and EN pin voltage, VEN, increase to the each operation voltage or more, the control circuit starts operation (VCC ≥ VCC(ON) = 9.6 V and VEN ≥ VEN(ON) = 2.0 V). After that, when the PWM pin voltage exceeds the PWM Pin ON Threshold Voltage, VPWM(ON) of 1.5 V (less than absolute maximum voltage of 5 V), the COMP Pin Charge Current at Startup, ICOMP(S) = −11 µA, flows from the COMP pin. This charge current flows to capacitors at the COMP pin. When the COMP pin voltage increases to the COMP Pin Voltage at Oscillation Start, VCOMP(ON) = 0.50 V or more, the control circuit starts switching operation. As shown in Figure 8-2, when the EN pin voltage decreases to the Operation Stop Voltage VEN(OFF) = 1.4 V or less, the control circuit stops operation. And when the BL0200-DS Rev.2.3 May. 15, 2014 5 R39 EN COMP1 C8 C7 3 PWM1 ON/OFF 0.25V BL0202B/C VCC GND 4 VEN_IN C22 9 R42 C16 C15 Figure 8-5 The peripheral circuit of VCC pin and EN pin VCC pin voltage VCC(ON) VCC(OFF) 0 EN pin voltage VEN(ON) VEN(OFF) 0 REG pin voltage 0 COMP pin voltage VCOMP(ON) VCOMP(OFF) 0 IC switching status OFF ON OFF ON OFF Figure 8-6 Operational waveforms SANKEN ELECTRIC CO.,LTD. 11 BL0200 Series When the on-duty of the PWM dimming signal is small, the charge current at the COMP pin is controlled as follows in order to raise the output current quickly at startup. Figure 8-7 shows the operation waveform with the PWM dimming signal at startup. VCC pin voltage capacitors at the COMP pin are discharged by the COMP Pin Reset Current, ICOMP(R) = 360 µA. Because the on-duty gradually becomes wide after cycling power to the IC, the soft start operation is achieved at restart. The IC is operated by Auto Restart 1 at startup operation. See the Section 8.7 Protection Function about the caution of startup operation. VIFB(COMP.VR) is determined by the VREF pin voltage as shown in Figure 8-4. VCC(ON) 0 8.3 Constant Current Control Operation EN pin voltage VEN(ON) 0 Constant current control IFB pin voltage VREF pin voltage VIFB1(COMP.VR) 0 PWM pin Dimming signal 0 COMP pin charge current 0 ICOMP(S) Figure 8-8 shows the IFB pin peripheral circuit. When the dimming MOSFET (Q2, Q4) turns on, the LED output current, IOUT(CC), is detected by the current detection resistor, R15 and R61. The IC compares the IFB pin voltage with the VREF pin voltage by the internal error amplifier, and controls the IFB pin voltage so that it gets close to the VREF pin voltage. The reference voltage at the VREF pin is the divided voltage of the REG pin voltage, VREG = 5 V, by R32 to R35, and thus this voltage can be externally adjusted. The setting current, IOUT(CC), of the LED_OUT can be calculated as follows. ICOMP(SRC) I OUT ( CC) COMP pin voltage ON Figure 8-7 Startup operation during PWM dimming U1 10 VCC While the IFB pin voltage increases to the IFB Pin Voltage at COMP Charge Switching, VIFB(COMP.VR), a capacitors at the COMP pin are charged by ICOMP(S) = −11 µA. During this period, they are charged by the COMP Pin Source Current, ICOMP(SRC) = −57 µA, when the PWM pin voltage is 1.5 V or more. Thus, the COMP pin voltage increases immediately. When the IFB pin voltage increases to VIFB(COMP.VR) or more, the COMP pin source current is controlled according to the feedback amount, and the output current is controlled constant. The on-duty gradually becomes wide according to the increase of the COMP pin voltage, and the output power increases (Soft start operation). Thus, power stresses on components are reduced. When the VCC pin voltage or EN pin voltage decreases to the operation stop voltage or less, or the Auto Restart operation (see the Section 8.7 Protection Function) after protection is achieved, then the control circuit stops switching operation, and simultaneously BL0200-DS Rev.2.3 May. 15, 2014 (8-2) Where: VREF is the VREF pin voltage. The value is recommended to be 0.5 V to 2.0 V. RESN is the value of output current detection resistor VCOMP(ON) 0 IC switching status OFF VREF R SEN REG 5V 1 LED_OUT1(+) R34 IOUT(CC) R35 Error Amp. VREF 18 R32 R33 Abnormal Detector LED_OUT1(-) Q2 IFB1 5 Output current detection resistor R15 Figure 8-8 IFB pin peripheral circuit SANKEN ELECTRIC CO.,LTD. 12 BL0200 Series 8.4 PWM Dimming Function 8.5 Gate Drive Figure 8-9 shows the peripheral circuit of PWM pin and SW pin. The PWM pin is used for the PWM dimming signal input. The SW pin drives the gate of external dimming MOSFET (Q2, Q4). The SW pin voltage is turned on / off by PWM signal and thus the dimming of LED is controlled by PWM signal input. As shown in Figure 8-10, when the PWM pin voltage becomes the PWM Pin ON Threshold Voltage, VPWM(ON) = 1.5 V or more, the SW pin voltage becomes VCC. When the PWM pin voltage becomes the PWM Pin OFF Threshold Voltage, VPWM(OFF) = 1.0 V or less, the SW pin voltage becomes 0.1 V or less. The PWM pin has the absolute maximum voltage of −0.3 V to 5 V, and the input impedance, RPWM, of 200 kΩ. The PWM dimming signal should meet these specifications and threshold voltages of VPWM(ON) and VPWM(OFF). 3 PWM_IN U1 PWM1 LED PWM Pulse Detector Drive ● Power MOSFET should be selected so that these VGS(th) threshold voltages are less than VCC enough over entire operating temperature range. ● Peripheral components of Power MOSFET, gate resistors and diode, affect losses of power MOSFET, gate waveform (ringing caused by the printed circuit board trace layout), EMI noise, and so forth, these values should be adjusted based on actual operation in the application. ● The resistors between gate and source (R19, R24, R47 and R63) are used to prevent malfunctions due to steep dv/dt at turn-off of the power MOSFET, and these resistors are connected near each the gate of the power MOSFETs and the ground line side of the current detection resistance. The reference value of them is from 10 kΩ to 100 kΩ. LED_OUT1(−) VCC PWM OSC Main Logic LED_OUT1(+) Figure 8-11 shows the peripheral circuit of DRV pin and SW pin and FSET pin. The DRV pin is for boost MOSFET, Q1 and Q3. The SW pin is for dimming MOSFET, Q2 and Q4. Table 8-1 shows drive voltages and currents of DRV pin and SW pin. SW1 8 Q2 Table 8-1 Drive voltage and current R15 Pins Figure 8-9 The peripheral circuit of PWM pin and SW pin. Drive voltage, VDRV Drive current, IDRV High Low Source Sink DRV VCC ≤ 0.1 V −0.36 A 0.85 A SW VCC ≤ 0.1 V −85 mA 220 mA PWM pin voltage VPWM(ON) D1 LED_OUT1(+) L1 VPWM(OFF) C1 Q1 R17 ０ R22 Time SW pin voltaege R16 VCC 7 ≤ 0.1V C2 U1 VCC Q2 D2 R19 R20 R21 D3 R24 R15 DRV1 Drive ０ Time PWM OSC Main Logoc VCC Drive SW1 8 GND 9 Figure 8-10 The waveform of PWM pin and SW pin Figure 8-11 The peripheral circuit of DRV pin, SW pin and FSET pin BL0200-DS Rev.2.3 May. 15, 2014 SANKEN ELECTRIC CO.,LTD. 13 BL0200 Series 8.6 Error Signal Output Function (BL0200C) When an external circuit such as microcomputer uses the error signal output, configure the peripheral circuit of ER pin using the pull-up resistor, R40 and the protection resistor of ER pin, R39, as shown in Figure 8-12. The ER pin is connected to internal switch. When the protection function is active, the internal switch becomes OFF and ER_OUT becomes REG pin voltage from 0 V. The resistances of R39 and R40 are about 10 kΩ. REG 1 R40 ER ER_OUT 17 Auto restart protection GND 7 R39 C12 Figure 8-12 ER pin peripheral circuit As shown in Table 8-2, the IC performs protection operations according to kind of abnormal state. In all protection functions, when the fault condition is removed, the IC returns to normal operation automatically. The intermitted oscillation operation reduces stress on the power MOSFET, the secondary rectifier diode, and so forth. Table 8-2 Relationship between a kind of abnormal state and protection operations Protection Operations Abnormal States 2 3 4 5 6 7 8 Overcurrent of boost circuit (OCP) Overcurrent of LED output (LED_OCP) Overvoltage of LED_OUT(+) (OVP) Short mode between LED_OUT(−) and GND Short mode of LED current detection resistor (RSEN_Short) Short mode of both ends of LED output Open mode of LED current detection resistor (RSEN_Open) Overtemperature of junction of IC (TSD) BL0200-DS Rev.2.3 May. 15, 2014 Table 8-3 shows the Auto Restart 1 oscillation time, tARS1, tARS2, and the Auto Restart 1 non-oscillation time, tAROFF1, at on-duty = 100 %. Table 8-3 Oscillation time and non-oscillation time (at on-duty = 100 %) 8.7 Protection Function 1 Auto Restart 1: As shown in Figure 8-13, the IC repeats an intermitted oscillation operation, after the detection of any one of abnormal states 1 to 5 in Table 8-2. This intermitted oscillation is determined by tARS1 or tARS2, and tAROFF1. The tARS1 is an oscillation time in the first intermitted oscillation cycle, TAR1. The tARS2 is an oscillation time in the second and subsequent intermitted oscillation cycle, TAR2. The tAROFF1 is a non-oscillation time in all intermitted oscillation cycle. In case PWM dimming frequency is low and the on-duty is small, the startup operation, the restart operation from on-duty = 0 % and the restart operation from intermitted oscillation operation need a long time. Thus the value of tARS1 and tARS2 depend on frequency and on-duty of the PWM dimming signal, as shown in Figure 8-15 and Figure 8-16 for BL020×C, Figure 8-17 and Figure 8-18 for BL0202B. Auto Restart 1 BL0200C BL0202C BL0202B Oscillation time, tARS1 Oscillation time, tARS2 non-oscillation time, tAROFF1 31 ms 20.5 ms About 635 ms 61.4 ms 41.0 ms About 1.3 s Auto Restart 2: As shown in Figure 8-14, the IC stops the switching operation immediately after the detection of abnormal states 6 or 7 in Table 8-2, and repeats an intermitted oscillation operation. In the intermitted oscillation cycle, the tARSW is an oscillation time, the tAROFF1 is a non-oscillation time. The value of tARSW is a few microseconds. The value of tARS2 is derived from Figure 8-18, and tAROFF2 is calculated as follows: t AROFF 2 t ARS 2 t ARSW t AROFF 1 (8-3) In case the on-duty is 100%, the value of tAROFF2 becomes as follows: Auto Restart 2 Auto Restart 3 L0200C、BL0202C： tAROFF2 ≒ 20.5 + 635 = 655.5 (ms) BL0202B： tAROFF2 ≒ 0.041 + 1.3 = 1.341 (s) SANKEN ELECTRIC CO.,LTD. 14 BL0200 Series Auto Restart 3: The IC stops the switching operation immediately after the detection of abnormal states 8 in Table 8-2, and keeps a non-oscillation. SW pin voltage tARS1 tARS2 1500 1000 500 Return to normal operation tARS2 fDM = 100 Hz fDM = 300 Hz 2000 tARS1 (ms) Release Abnormal state fDM : PWM dimming frequency 2500 0 0.01 0.1 1 10 100 Duty (%) ０ tAROFF1 TAR1 tAROFF1 tAROFF1 TAR2 TAR2 Time Figure 8-15 PWM dimming on-duty vs. tARS1 (BL020×C) fDM : PWM dimming frequency 1400 fDM = 100 Hz fDM = 300 Hz 1200 Figure 8-13 Auto Restart 1 tARS1 (ms) 1000 Release Abnormal state tARSW SW pin voltage tAROFF2 Return to normal operation tARSW 600 400 200 0 0.01 tAROFF2 tAROFF2 tARS2 tARS2 ０ tAROFF1 800 tAROFF1 Time 0.1 1 Duty (%) 10 100 Figure 8-16 PWM dimming on-duty vs. tARS2 (BL020×C) tAROFF1 fDM : PWM dimming frequency 2500 Figure 8-14 Auto Restart 2 fDM = 100 Hz fDM = 300 Hz tARS1 (ms) 2000 1500 1000 500 0 0.01 0.1 1 Duty (%) 10 100 Figure 8-17 PWM dimming on-duty vs. tARS1 (BL0202B) fDM : PWM dimming frequency 1400 fDM = 100 Hz fDM = 300 Hz 1200 tARS2 (ms) 1000 800 600 400 200 0 0.01 0.1 1 10 100 Duty (%) Figure 8-18 PWM dimming on-duty vs. tARS2 (BL0202B) BL0200-DS Rev.2.3 May. 15, 2014 SANKEN ELECTRIC CO.,LTD. 15 BL0200 Series The operating condition of Auto Restart 1 and 2 is as follows: < The operating condition of Auto Restart 1 > The Auto Restart 1 is operated by the detection signals of the OC pin or IFB pin. ● Operation by the detection signal of OC pin: When the OC pin voltage increase to the OC Pin Overcurrent Protection Threshold Voltage, VOCP = 0.60 V, or more, the operation of the IC switches to Auto Restart 1. When the fault condition is removed and the OC pin voltage decreases to under VOCP, the IC returns to normal operation automatically. ● Operation by the detection signal of IFB pin: As shown in Figure 8-19, IFB pin has two types of threshold voltage. These threshold voltages depend on the VREF pin voltage, as shown in Figure 8-20. IFB pin voltage VIFB(OCL.VR) VIFB(OCL-OFF.VR) VIFB(AR.VR) VIFB(COMP) ０ Return to normal operation SW pin voltage Time ０ Time 1) In case IFB pin voltage increased When the FB pin voltage increase to VIFB(OCL.VR) in Figure 8-20, or more, the operation of the IC switches to Auto Restart 1. When the fault condition is removed and the IFB pin voltage decreases to VIFB(OCL-OFF.VR) in Figure 8-20, or less, the IC returns to normal operation automatically. 2) In case IFB pin voltage decreased When the FB pin voltage decrease to VIFB(AR.VR) in Figure 8-20, or more, the operation of the IC switches to Auto Restart 1. When the fault condition is removed and the IFB pin voltage increases to above VIFB(COMP), the IC returns to normal operation automatically. < The operating condition of Auto Restart 2 > The Auto Restart 2 is operated by the detection signal of the IFB pin. As shown in Figure 8-21, when the FB pin voltage increase to the IFB Pin Overcurrent Protection High Threshold Voltage, VIFB(OCH) = 4.0 V, or more, the operation of the IC switches to Auto Restart 2, and the IC stops switching operation immediately. When the fault condition is removed and the IFB pin voltage decreases to under VIFB(OCH), the operation of the IC switches to Auto Restart 1. IFB pin voltage VIFB(OCH) VIFB(OCL-OFF.VR) Auto Restart 1 ０ Figure 8-19 IIFB pin threshold voltage and Auto Restart 1 operation IFB pin threshold voltages (V) VIFB(OCL.VR) : IFB Pin Overcurrent Protection Low Threshold Voltage VIFB(OCL-OFF.VR) :IFB Pin Overcurrent Protection Release Threshold Voltage VIFB(AR.VR) :IFB Pin Auto Restart Operation Threshold Voltage 10.0 VIFB(OCL.VR) 4.0V 3.2V VIFB(OCL.VR) VIFB(AR.VR) 1.0V 1.0 0.5V 0.4V 0.125V 0.1 0.1 Return to normal operation SW pin voltage ０ Time Auto Restart 2 Auto Restart 1 Figure 8-21 IFB pin threshold voltage and Auto Restart 2 operation < Caution of startup operation > When the LED current is low and the IFB pin voltage is less than VIFB(AR.BR), during startup for example, the IC is operated by Auto Restart 1. If the startup time is too long, the IC operation becomes the intermitted oscillation by the Auto Restart 1. It becomes cause of the fault startup operation, thus the startup time should be set less than tARS1 in Figure 8-13. 1.0 0.25V VREF pin voltage (V) Figure 8-20 VREF pin voltage versus IFB pin threshold voltages BL0200-DS Rev.2.3 May. 15, 2014 SANKEN ELECTRIC CO.,LTD. 16 BL0200 Series The protection operation according to the abnormal states in Table 8-2 is described in detail as follows: (2) When IFB pin voltage becomes VIFB(OCL.VR) or more (see Figure 8-20), the IC switches to Auto Restart 1. 8.7.1 Overcurrent of Boost Converter Part (OCP) (3) The LED current increases further and when the IFB pin voltage increases to the IFB Pin Overcurrent Protection High Threshold Voltage, VIFB(OCH) = 4.0 V or more, the IC switches to Auto Restart 2. When the OC pin detects the overcurrent of boost circuit, the IC switches to Auto Restart 1. Figure 8-22 shows the peripheral circuit of OC pin. When the boost MOSFET (Q1, Q3) turns on, the current flowing to L1 is detected by the current detection resistor (R20, R48), and the voltage on R4 is input to the OC pin. When the OC pin voltage increases to the OC Pin Overcurrent Protection Threshold Voltage, VOCP = 0.60 V or more, the on-duty becomes narrow by pulse-by-pulse basis, and the output power is limited. U1 LED_OUT1(+) IFB1 5 Feed back1 control COMP1 4 LED_OUT1(-) C15 L1 Q2 R42 C16 OC1 control R15 Output current detection resistor LED_OUT1(+) D1 IL(ON) LED_OUT1(-) Q1 C2 R18 R20 Q2 Figure 8-23 The peripheral circuit of IFB pin and COMP pin R15 8.7.3 Overvoltage of LED_OUT (+) (OVP) U1 OC1 6 C3 GND 9 Figure 8-22 OC pin peripheral circuit 8.7.2 Overcurrent of LED Output (LED_OCP) Figure 8-23 shows the peripheral circuit of IFB pin and COMP pin. When the dimming MOSFET (Q2, Q4) turns on, the output current is detected by the detection resistor (R15, R61). When the boost operation cannot be done by failure such as short circuits in LED string, the IFB pin voltage is increased by the increase of LED current. There are three types of operation modes in LED_OCP state. The OVP pin detects LED_OUT (+) voltage as shown in Figure 8-24. When the LED_OUT (+) or the IFB pin is open and the OVP pin voltage increases to the OVP Pin Overvoltage Protection Threshold Voltage, VOVP = 3.00 V, the IC immediately stops switching operation. When the OVP pin voltage decreases to the OVP Pin Overvoltage Protection Release Threshold Voltage, VOVP(OFF) = 2.75 V or the IFB pin voltage decreases to VIFB(AR.VR) in Figure 8-20, then the IC switches to Auto Restart 1. LED_OUT2(+) D6 C18 LED_OUT1(+) Q4 D1 D9 D8 R61 C2 R1 R2 (1) When the IFB pin voltage is increased by the increase of LED current, COMP pin voltage is decreases. In addition, when the COMP pin voltage decreases to the COMP Pin Voltage at Oscillation Stop, VCOMP(OFF) = 0.25 V or less, the IC stops switching operation, and limits the increase of the output current. When IFB pin voltage is decreased by the decrease of LED current, COMP pin voltage increases. When COMP pin voltage becomes VCOMP(ON) = 0.50 V or more, the IC restarts switching operation. BL0200-DS Rev.2.3 May. 15, 2014 U1 R3 OVP C5 Q2 R15 R4 GND Figure 8-24 OVP pin peripheral circuit SANKEN ELECTRIC CO.,LTD. 17 BL0200 Series 8.7.4 Short Mode between LED_OUT(−) and GND When the LED_OUT (–) and the GND are shorted, and the IFB pin voltage decreases to VIFB(AR.VR) in Figure 8-20, then the IC switches to Auto Restart 1. 8.7.5 Short Mode of LED Current Detection Resistor (RSEN_Short) When the output current detection resistor (R15, R61), is shorted, the IFB pin voltage decreases. When the IFB pin voltage decreases to VIFB(AR.VR) in Figure 8-20, then the IC switches to Auto Restart 1. 8.7.6 Short Mode of LED Output Both Ends When the LED_OUT (+) and LED_OUT (–) are shorted, the short current flows through the output current detection resistor (R15, R61), while the dimming MOSFET (Q2, Q4) turns on. The IFB pin detects the voltage rise of the detection resistor. When the IFB pin voltage increases to the IFB Pin Overcurrent Protection High Threshold Voltage, VIFB(OCH) = 4.0 V or more, the IC switches to Auto Restart 2. 8.7.7 Open Mode of LED Current Detection Resistor (RSEN_Open) When the output current detection resistor (R15, R61), is open, the IFB pin voltage increases. When the IFB pin voltage increases to the IFB Pin Overcurrent Protection High Threshold Voltage, VIFB(OCH) = 4.0 V or more, the IC switches to Auto Restart 2. 8.7.8 Overtemperature of junction of IC (TSD) When the temperature of the IC increases to Tj(TSD) = 125 °C (min) or more, the TSD is activated, and the IC stops switching operation. When the junction temperature decreases by Tj(TSD) − Tj(TSD)HYS after the fault condition is removed, the IC returns to normal operation automatically. 9. Design Notes 9.1 Peripheral Components Take care to use the proper rating and proper type of components. Input and output electrolytic capacitors, C1, C2, C18 and C21 ▫ Apply proper design margin to accommodate ripple current, voltage, and temperature rise. ▫ Use of high ripple current and low impedance types, designed for switch-mode power supplies, is recommended, depending on their purposes. Inductor, L1, L2 ▫ Apply proper design margin to temperature rise by core loss and copper loss. ▫ Apply proper design margin to core saturation. Current detection resistors, R15, R20, R48 and R61 Choose a type of low internal inductance because a high frequency switching current flows to the current detection resistor, and of properly allowable dissipation. 9.2 Inductor Design Parameters The CRM* or DCM* mode of boost converter with PWM dimming can improve the output current rise during PWM dimming. * CRM is the critical conduction mode, DCM is the discontinuous conduction mode. (1) On-duty Setting The output voltage of boost converter is more than the input voltage. The on-duty, DON can be calculated using following equation. The equality of the equation means the condition of CRM mode operation and the inequality means that of DCM mode operation. D ON VOUT VIN VOUT (9-1) where: VIN is the minimum input voltage, VOUT is the maximum forward voltage drop of LED string. DON is selected by the above equation applied to CRM or DCM mode. In case fPWM = 100 kHz, the range of DON should be 3.1 % to 90 %. In case fPWM = 200 kHz, the range of DON should be 6 % to 90 %. (The minimum value results from the condition of tMIN, and fPWM. The maximum value is DMAX). BL0200-DS Rev.2.3 May. 15, 2014 SANKEN ELECTRIC CO.,LTD. 18 BL0200 Series (2) Inductance value, L The inductance value, L, for DCM or CRM mode can be calculated as follow: L VIN DON 2 2 I OUT f PWM VO UT VIN (9-2) where: IOUT is the maximum output current, fPWM is the maximum operation frequency of PWM (3) Peak inductor current, ILP I LP VIN D ON L f PWM (9-3) (4) Inductor selection The inductor should be applied the value of inductance, L, from equation (9-2) and the DC superimposition characteristics being higher than the peak inductor current, ILP, from equation (9-3). 9.3 PCD Trace Layout and Component Placement Since the PCB circuit trace design and the component layout significantly affects operation, EMI noise, and power dissipation, the high frequency PCB trace as shown in Figure 9-1 should be low impedance with small loop and wide trace. L1 D1 C1 C2 Q1 L2 C21 Q3 (1) Main Circuit Trace Layout This is the main trace containing switching currents, and thus it should be as wide trace and small loop as possible. C1 and C18 should be connected near the inductors, L1and L2, in order to reduce impedance of the high frequency current loop. (2) Control Ground Trace Layout Since the operation of IC may be affected from the large current of the main trace that flows in control ground trace, the control ground trace should be connected at a single point grounding of point A with a dedicated trace. (3) Current Detection Resistor Trace Layout R15, R20, R48 and R61 are current detection resistors. The trace from the base of current detection resistor should be connected to the pin of IC with a dedicated trace. (4) COMP pin Trace Layout for Compensation Component The components connected to COMP pin are compensation components. The trace of the compensation component should be connected as close as possible to COMP pin, to reduce the influence of noise. (5) Bypass Capacitor Trace Layout on VCC , REG, and VREF pins C8, C12 and C10 of bypass capacitors, connected to VCC, REG, and VREF pins respectively, should be connected as close as possible to the pin of IC, to reduce the influence of noise. D1 C18 Figure 9-1 High-frequency current loops (hatched areas) BL0200-DS Rev.2.3 May. 15, 2014 In addition, the ground traces affect radiated EMI noise, and wide, short traces should be taken into account. Figure 9-2 shows the circuit design example of BL0200C. (6) Power MOSFET Gate Trace Layout The resistor between gate and source, R19, R24, R47 and R63, should be connected near each the gate of the power MOSFETs and the ground line side of the current detection resistance. Peripheral components of MOSFET, gate resistors and diodes, should be connected as close as possible between each the gate of the power MOSFETs and the pin of IC. SANKEN ELECTRIC CO.,LTD. 19 BL0200 Series (6) Power MOSFET Gate Trace Layout Gate-Source resistor should be connected near gate of power MOSFET and ground line side of Current detection resistor. Gate resistors and diodes should be connected as close as possible between the gate of power MOSFET and the pin of IC. (1) Main circuit trace Should be as wide trace and small loop. LED_OUT2(+) LED_OUT2(-) P_IN D9 L2 F1 D6 LED_OUT1(+) L1 C21 Q3 R45 Q4 Q1 Q2 C2 D10 D7 R44 R22 R17 C1 A R47 D2 R61 R49 R19 (2) Control ground trace layout should be connected at a single point grounding of point A with a dedicated trace R24 R20 R4 R15 R21 C8 R46 (3) Current detection resistance should be connected to the pin of IC with a dedicated trace. R62 R18 VCC SW2 OC2 IFB2 COMP2 R38 PWM2 ON/OFF EN R39 VCC_IN VREF 9 U1 10 11 8 12 7 13 14 BL0202 DRV2 6 5 15 4 16 3 17 2 18 1 GND SW1 DRV1 OC1 R23 IFB1 COMP1 R27 PWM1 OVP REG C12 R41 C7 R37 C20 R32 R34 R36 S_GND R1 D3 R16 PWM2_IN R2 R3 R63 R48 LED_OUT1(-) D8 R50 C18 D1 C11 C19 C22 C13 C14 C10 C4 R42 R35 R33 C15 C16 C3 C5 C6 R26 R25 PWM1_IN (5)Bypass capacitor（C8,C10,C12）should be connected as close as possible to the pin of IC. (4) COMP pin peripheral components should be connected as close as possible to the pin of IC. Figure 9-2 Peripheral circuit example around the IC (BL0200C) BL0200-DS Rev.2.3 May. 15, 2014 SANKEN ELECTRIC CO.,LTD. 20 BL0200 Series 10.Reference Design of Power Supply As an example, the following show a power supply specification of BL0200C and BL0202B, circuit schematic, bill of materials, and transformer specification. This reference design is the example of the value of parts, and should be adjusted based on actual operation in the application. 10.1 BL0202B BL0202B Features - DRV pin oscillation frequency is 100 kHz - Enable function Power Supply Specification IC Input voltage Maximum output power Output voltage Output current BL0202B DC 24 V 40 W (max.) 50 V 400 mA × 2 Circuit OUT2 F1 D9 P_IN L2 D6 OUT1 R50 L1 D1 D8 Q4 C21 C18 R22 D10 R45 Q3 R49 Q2 R63 C1 R51 R52 R53 R54 R55 C2 R47 D3 R17 D7 R44 R1 R2 Q1 R21 R48 R61 R56 R57 R58 R59 R60 R16 D2 R19 R3 R5 R6 R7 R8 R9 R24 R15 R20 R4 P_GND R46 R10 R11 R12 R13 R14 C8 R62 R18 OC2 IFB2 PWM2_IN COMP2 R38 PWM2 ON/OFF EN R39 VREF 9 11 8 12 7 13 14 15 6 5 4 16 3 17 2 18 1 R37 VCC_IN C19 C7 R41 C11 GND SW1 DRV1 OC1 R23 IFB1 COMP1 R27 PWM1 OVP REG C12 C22 R42 R36 R34 C13 C14 C16 R35 C3 C4 C5 C6 R26 R32 C20 C10 S_GND BL0202B SW2 DRV2 10 U1 VCC R33 C15 R25 PWM1_IN BL0200-DS Rev.2.3 May. 15, 2014 TC_BL0202_3_R1 SANKEN ELECTRIC CO.,LTD. 21 BL0200 Series Bill of Materials Symbol Part type Ratings(1) F1 L1 L2 D1 D2 D3 D6 D7 D8 D10 Fuse Inductor Inductor Fast recovery Schottky Schottky Fast recovery Schottky Q1 Power MOSFET Q2 Power MOSFET Q3 Power MOSFET Q4 Power MOSFET C1 C2 C3 C4 C5 C6 C7 Electrolytic Electrolytic Ceramic, chip, 2012 Ceramic, chip, 2012 Ceramic, chip, 2012 Ceramic, chip, 2012 Electrolytic 3A 50 μH, 3 A 50 μH, 3 A 200 V, 1.5 A 30 V, 1 A 30 V, 1 A 200 V, 1.5 A 30 V, 1 A 200 V, 1 A 30 V, 1 A 200 V, 45 mΩ (typ.) 100 V, 1 Ω (typ.) 200 V, 45 mΩ (typ.) 100 V, 1 Ω (typ.) 50 V, 22 μF 100 V, 100 μF 100 pF 100 pF 10 nF 470 pF 50 V, 100 μF C8 Ceramic, chip, 2012 50 V, 0.1 μF C9 C10 C11 C12 C13 C14 C15 C16 C18 C19 C20 C21 C22 R1 R2 R3 Ceramic, chip, 2012 Ceramic, chip, 2012 Ceramic, chip, 2012 Ceramic, chip, 2012 Ceramic, chip, 2012 Ceramic, chip, 2012 Ceramic, chip, 2012 Ceramic, chip, 2012 Electrolytic Ceramic, chip, 2012 Ceramic, chip, 2012 Electrolytic Ceramic, chip, 2012 General, chip, 2012 General, chip, 2012 General, chip, 2012 50 V, 0.1 μF 0.1 μF 470 pF 0.1 μF 0.047 μF 2200 pF 0.047 μF 2200 pF 100 V, 100 μF 100 pF 100 pF 50 V, 22 μF 0.1 μF 110 kΩ 110 kΩ 0Ω Schottky (2) (2) (2) (2) (2) (2) (2) (2) (3) (3) (3) Recommended Sanken Parts Symbol Part type Ratings(1) EL 1Z SJPA-D3 SJPA-D3 EL 1Z SJPA-D3 AL01Z SJPA-D3 R4 R5-R14 R15 R16 R17 R18 R19 R20 R21 R22 SKP202 R23 General, chip, 2012 1.5 kΩ R24 General, chip, 2012 10 kΩ R25 General, chip, 2012 1 kΩ R26 General, chip, 2012 33 kΩ R27 R32 R33 R34 R35 R37 R38 General, chip, 2012 General, chip, 2012 General, chip, 2012 General, chip, 2012 General, chip, 2012 General, chip, 2012 General, chip, 2012 10 kΩ 10 kΩ 0Ω 82 kΩ 560 Ω 10 kΩ 1 kΩ 5 kΩ (VEN = 3.5 V) 10 kΩ 22 kΩ 22 kΩ 10 Ω 100 Ω 100 Ω 10 kΩ 0.22 Ω, 2 W 470 Ω 1.5 kΩ Open 1.35 Ω, 1 W 1.5 kΩ 10 kΩ SKP202 (2) (2) R39 R40 R41 R42 R44 R45 R46 R47 R48 R49 R50 R51-R60 R61 R62 R63 U1 General, chip, 2012 General, chip, 2012 General General, chip, 2012 General, chip, 2012 General, chip, 2012 General, chip, 2012 General General, chip, 2012 General, chip, 2012 11 kΩ Open 1.35 Ω, 1 W 10 Ω 100 Ω 100 Ω 10 kΩ 0.22 Ω, 2 W 470 Ω 1.5 kΩ General, chip, 2012 (2) (2) (2) General, chip, 2012 General, chip, 2012 General, chip, 2012 General, chip, 2012 General, chip, 2012 General, chip, 2012 General, chip, 2012 General General, chip, 2012 General, chip, 2012 General, chip, 2012 General General, chip, 2012 General, chip, 2012 IC Recommended Sanken Parts BL0202B (1) Unless otherwise specified, the voltage rating of capacitor is 50V or less, and the power rating of resistor is 1/8W or less. It is necessary to be adjusted based on actual operation in the application. (3) Resistors applied high DC voltage and of high resistance are recommended to select resistors designed against electromigration or use combinations of resistors in series for that to reduce each applied voltage, according to the requirement of the application. (2) BL0200-DS Rev.2.3 May. 15, 2014 SANKEN ELECTRIC CO.,LTD. 22 BL0200 Series 10.2 BL0200C BL0200C Features - DRV pin oscillation frequency is 200 kHz - Error signal output Power Supply Specification IC Input voltage Maximum output power Output voltage Output current BL0200C DC 24 V 40 W (max.) 50 V 400 mA × 2 Circuit Schematic OUT2 F1 D9 P_IN L2 D6 OUT1 R50 L1 D1 D8 Q4 C21 C18 R22 D10 R45 Q3 R49 Q2 R63 C1 R51 R52 R53 R54 R55 C2 R47 D3 R17 D7 R44 R1 R2 Q1 R21 R48 R61 R56 R57 R58 R59 R60 R16 D2 R19 R3 R5 R6 R7 R8 R9 R24 R15 R20 R4 P_GND R46 R10 R11 R12 R13 R14 C8 R62 R18 OC2 IFB2 PWM2_IN COMP2 R38 PWM2 ER_OUT ER R39 VREF Q5 VCC_IN R28 C9 S_GND Q6 R30 8 12 7 13 14 15 6 5 4 16 3 17 2 18 1 GND SW1 DRV1 OC1 R23 IFB1 COMP1 R27 PWM1 OVP REG C12 R40 R41 R42 R29 C7 R31 11 R37 C19 ON/OFF 9 BL0200C SW2 DRV2 10 U1 VCC C11 R36 R34 C13 C14 C16 R35 C3 C4 C5 C6 R26 R32 C20 C10 R33 C15 R25 PWM1_IN BL0200-DS Rev.2.3 May. 15, 2014 TC_BL0200C_3_R1 SANKEN ELECTRIC CO.,LTD. 23 BL0200 Series Bill of Materials Symbol Part type F1 L1 L2 D1 D2 D3 D6 D7 D8 D9 D10 Fuse Inductor Inductor Fast recovery Schottky Schottky Fast recovery Schottky Q1 Power MOSFET Q2 Power MOSFET Q3 Power MOSFET Q4 Power MOSFET Q5 Q6 C1 C2 C3 C4 C5 C6 C7 C8 C9 C10 C11 C12 C13 C14 C15 C16 C18 C19 C20 C21 R1 R2 R3 R4 PNP Transistor NPN Transistor Electrolytic Electrolytic Ceramic, chip, 2012 Ceramic, chip, 2012 Ceramic, chip, 2012 Ceramic, chip, 2012 Electrolytic Ceramic, chip, 2012 Ceramic, chip, 2012 Ceramic, chip, 2012 Ceramic, chip, 2012 Ceramic, chip, 2012 Ceramic, chip, 2012 Ceramic, chip, 2012 Ceramic, chip, 2012 Ceramic, chip, 2012 Electrolytic Ceramic, chip, 2012 Ceramic, chip, 2012 Electrolytic General, chip, 2012 General, chip, 2012 General, chip, 2012 General, chip, 2012 Schottky (2) (2) (2) (2) (2) (2) (2) (2) (3) (3) (3) Ratings(1) 3A 25 μH, 3 A 25 μH, 3 A 200 V, 1.5 A 30 V, 1 A 30 V, 1 A 200 V, 1.5 A 30 V, 1 A 200 V, 1 A 200 V, 1 A 30 V, 1 A 200 V, 45 mΩ (typ.) 100 V, 1 Ω (typ.) 200 V, 45 mΩ (typ.) 100 V, 1 Ω (typ.) −50 V, 0.1 A 50 V, 0.1 A 50 V, 22 μF 100 V, 47 μF 100 pF 100 pF 10 nF 470 pF 50 V, 100 μF 50 V, 0.1 μF 50 V, 0.1 μF 0.1 μF 470 pF 0.1 μF 0.047 μF 2200 pF 0.047 μF 2200 pF 100 V, 47 μF 100 pF 100 pF 50 V, 22 μF 110 kΩ 110 kΩ 0Ω 11 kΩ Recommended Sanken Parts Symbol Part type Ratings(1) EL 1Z SJPA-D3 SJPA-D3 EL 1Z SJPA-D3 AL01Z AL01Z SJPA-D3 R5-R14 R15 R16 R17 R18 R19 R20 R21 R22 R23 R24 SKP202 R25 General, chip, 2012 1 kΩ R26 General, chip, 2012 33 kΩ R27 General, chip, 2012 10 kΩ R28 General, chip, 2012 10 kΩ R29 R30 R31 R32 R33 R34 R35 R36 R37 R38 R39 R40 R41 R42 R44 R45 R46 R47 R48 R49 R50 R51-R60 R61 R62 R63 U1 General, chip, 2012 General, chip, 2012 General, chip, 2012 General, chip, 2012 General, chip, 2012 General, chip, 2012 General, chip, 2012 General, chip, 2012 General, chip, 2012 General, chip, 2012 General, chip, 2012 General, chip, 2012 General, chip, 2012 General, chip, 2012 General, chip, 2012 General, chip, 2012 General, chip, 2012 General, chip, 2012 General General, chip, 2012 General, chip, 2012 General, chip, 2012 General General, chip, 2012 General, chip, 2012 IC 12 kΩ 10 kΩ 15 kΩ 10 kΩ 0Ω 82 kΩ 560 Ω 33 kΩ 10 kΩ 1 kΩ 10 kΩ 10 kΩ 22 kΩ 22 kΩ 10 Ω 100 Ω 100 Ω 10 kΩ 0.22 Ω, 2 W 470 Ω 1.5 kΩ Open 1.35 Ω, 1 W 1.5 kΩ 10 kΩ SKP202 (2) (2) (2) (2) General, chip, 2012 General General, chip, 2012 General, chip, 2012 General, chip, 2012 General, chip, 2012 General General, chip, 2012 General, chip, 2012 General, chip, 2012 General, chip, 2012 Open 1.35 Ω, 1 W 10 Ω 100 Ω 100 Ω 10 kΩ 0.22 Ω, 2 W 470 Ω 1.5 kΩ 1.5 kΩ 10 kΩ Recommended Sanken Parts BL0200C (1) Unless otherwise specified, the voltage rating of capacitor is 50V or less, and the power rating of resistor is 1/8W or less. It is necessary to be adjusted based on actual operation in the application. (3) Resistors applied high DC voltage and of high resistance are recommended to select resistors designed against electromigration or use combinations of resistors in series for that to reduce each applied voltage, according to the requirement of the application. (2) BL0200-DS Rev.2.3 May. 15, 2014 SANKEN ELECTRIC CO.,LTD. 24 BL0200 Series OPERATING PRECAUTIONS In the case that you use Sanken products or design your products by using Sanken products, the reliability largely depends on the degree of derating to be made to the rated values. Derating may be interpreted as a case that an operation range is set by derating the load from each rated value or surge voltage or noise is considered for derating in order to assure or improve the reliability. In general, derating factors include electric stresses such as electric voltage, electric current, electric power etc., environmental stresses such as ambient temperature, humidity etc. and thermal stress caused due to self-heating of semiconductor products. For these stresses, instantaneous values, maximum values and minimum values must be taken into consideration. In addition, it should be noted that since power devices or IC’s including power devices have large self-heating value, the degree of derating of junction temperature affects the reliability significantly. Because reliability can be affected adversely by improper storage environments and handling methods, please observe the following cautions. Cautions for Storage Ensure that storage conditions comply with the standard temperature (5 to 35°C) and the standard relative humidity (around 40 to 75%); avoid storage locations that experience extreme changes in temperature or humidity. Avoid locations where dust or harmful gases are present and avoid direct sunlight. Reinspect for rust on leads and solderability of the products that have been stored for a long time. Cautions for Testing and Handling When tests are carried out during inspection testing and other standard test periods, protect the products from power surges from the testing device, shorts between the product pins, and wrong connections. Ensure all test parameters are within the ratings specified by Sanken for the products. Soldering When soldering the products, please be sure to minimize the working time, within the following limits: • 260 ± 5 °C 10 ± 1 s (Flow, 2 times) • 380 ± 10 °C 3.5 ± 0.5 s (Soldering iron, 1 time) Electrostatic Discharge When handling the products, the operator must be grounded. Grounded wrist straps worn should have at least 1MΩ of resistance from the operator to ground to prevent shock hazard, and it should be placed near the operator. Workbenches where the products are handled should be grounded and be provided with conductive table and floor mats. When using measuring equipment such as a curve tracer, the equipment should be grounded. When soldering the products, the head of soldering irons or the solder bath must be grounded in order to prevent leak voltages generated by them from being applied to the products. The products should always be stored and transported in Sanken shipping containers or conductive containers, or be wrapped in aluminum foil. BL0200-DS Rev.2.3 May. 15, 2014 SANKEN ELECTRIC CO.,LTD. 25 BL0200 Series IMPORTANT NOTES The contents in this document are subject to changes, for improvement and other purposes, without notice. Make sure that this is the latest revision of the document before use. Application and operation examples described in this document are quoted for the sole purpose of reference for the use of the products herein and Sanken can assume no responsibility for any infringement of industrial property rights, intellectual property rights or any other rights of Sanken or any third party which may result from its use. Unless otherwise agreed in writing by Sanken, Sanken makes no warranties of any kind, whether express or implied, as to the products, including product merchantability, and fitness for a particular purpose and special environment, and the information, including its accuracy, usefulness, and reliability, included in this document. Although Sanken undertakes to enhance the quality and reliability of its products, the occurrence of failure and defect of semiconductor products at a certain rate is inevitable. Users of Sanken products are requested to take, at their own risk, preventative measures including safety design of the equipment or systems against any possible injury, death, fires or damages to the society due to device failure or malfunction. Sanken products listed in this document are designed and intended for the use as components in general purpose electronic equipment or apparatus (home appliances, office equipment, telecommunication equipment, measuring equipment, etc.). When considering the use of Sanken products in the applications where higher reliability is required (transportation equipment and its control systems, traffic signal control systems or equipment, fire/crime alarm systems, various safety devices, etc.), and whenever long life expectancy is required even in general purpose electronic equipment or apparatus, please contact your nearest Sanken sales representative to discuss, prior to the use of the products herein. The use of Sanken products without the written consent of Sanken in the applications where extremely high reliability is required (aerospace equipment, nuclear power control systems, life support systems, etc.) is strictly prohibited. When using the products specified herein by either (i) combining other products or materials therewith or (ii) physically, chemically or otherwise processing or treating the products, please duly consider all possible risks that may result from all such uses in advance and proceed therewith at your own responsibility. Anti radioactive ray design is not considered for the products listed herein. Sanken assumes no responsibility for any troubles, such as dropping products caused during transportation out of Sanken’s distribution network. The contents in this document must not be transcribed or copied without Sanken’s written consent. BL0200-DS Rev.2.3 May. 15, 2014 SANKEN ELECTRIC CO.,LTD. 26