SL24-N

WILLAS
FM120-M+
THRU
SL24-N
FM1200-M+
1.5A LOW VF SCHOTTKY BARRIER RECTIFIERS - 40V
1.0A SURFACE MOUNT SCHOTTKY BARRIER RECTIFIERS -20V- 200V
SOD-323-L PACKAGE
Pb Free Product
SOD-123+ PACKAGE
Package outline
Features
• Batch process design, excellent power dissipation offers
better reverse leakage current and thermal resistance.
SOD-123H
• Low profile surface mounted application in order to
Package outline
Features
optimize board space.
process
excellent
power dissipation offers
• Batch
powerdesign,
loss, high
efficiency.
• Low
better
reverse
leakage
current
thermal
resistance.
current
capability,
lowand
forward
voltage
drop.
• High
profile
surface
mounted application in order to
• Low• High
surge
capability.
optimize board space.
• Guardring for overvoltage protection.
• Very tiny plastic SMD package.
• Ultra high-speed switching.
• Low power loss, high efficiency.
• Silicon epitaxial planar chip, metal silicon junction.
• High current capability, very low forward voltage drop.
• Lead-free parts meet environmental standards of
surge capability./228
• HighMIL-STD-19500
for overvoltage
protection.
• Guardring
for packing
code suffix "G"
• RoHS product
high-speed
switching.
• UltraHalogen
free product for packing code suffix "H"
epitaxial planardata
chip, metal silicon junction.
• Silicon
Mechanical
• Moisture Sensitivity Level 1
• Epoxy : UL94-V0 rated flame retardant
• Case : Molded plastic, SOD-123H
,
• Terminals :Plated
terminals, solderable per MIL-STD-750
Mechanical
data
•
•
•
0.146(3.7)
0.130(3.3)
SOD-323-L
0.012(0.3) Typ.
0.106 (2.7)
0.091 (2.3)
0.012(0.3)
Typ.
0.071(1.8)
0.056(1.4)
0.057 (1.45)
0.041 (1.05)
0.040(1.0)
0.024(0.6)
0.031(0.8) Typ.
0.031(0.8) Typ.
0.047 (1.2)
0.031 (0.8)
Method 2026
Epoxy : UL94-V0 rated flame retardant
• Polarity : Indicated by cathode band
Case : Molded plastic, SOD-323-L
• Mounting Position : Any
Terminals :Plated terminals, solderable per MIL-STD-750,
• Weight : Approximated 0.011 gram
Method 2026
0.016(0.4) Typ.
0.016(0.4) Typ.
Dimensions in inches and (millimeters)
Dimensions in inches and (millimeters)
by cathode
bandAND ELECTRICAL CHARACTERISTICS
• Polarity : Indicated
MAXIMUM
RATINGS
• Mounting
Any
Ratings
at 25℃Position
ambient: temperature
unless otherwise specified.
Single
phase: half
wave, 60Hz,0.008
resistive
of inductive load.
• Weight
Approximated
gram
For capacitive load, derate current by 20%
RATINGS
Marking
Code
Maximum
SYMBOL FM120-MH FM130-MH FM140-MH FM150-MH FM160-MH FM180-MH FM1100-MH FM1150-MH FM1200-MH UN
12
13
14 (AT
ratings and Electrical Characteristics
o
16
18
10
T15
A =25 C unless otherwise noted)
50
60
80
100
Maximum Recurrent Peak Reverse Voltage
VRRM
TYP. MAX.
PARAMETER
Symbol MIN.
28
35
42
56
70
Maximum RMS Voltage
VRMS
IO
1.5
Forward rectified current
See Fig.2
Maximum DC Blocking Voltage
20
30
40
50
60
80
100
VDC
30
I FSM 1.0
Forward
surge
current
Maximum
Average
Forward
Rectified Current 8.3ms single
IO half sine-wave superimposed on
rate load (JEDEC methode)
Peak Forward
Surge
Current 8.3 ms single half sine-wave
V R = 15VIFSM
T J = 25 OC
I R 30
65
100.0
Reverse
current
20
30
CONDITIONS
14
21
superimposed
on rated
load (JEDEC method)
Thermal
resistance
TypicalDiode
Thermal
Resistance
(Note 2)
junction
capacitance
Storage temperature
TJ
I F = 100mA
Operating Temperature Range
Storage Temperature Range
Junction to ambient
RΘJAapplied 4V DC reverse
f=1MHz and
voltage
CJ
Typical Junction Capacitance (Note 1)
TSTG
Forward voltage
I F = 500mA
CHARACTERISTICS
Maximum Forward Voltage at 1.0A DC
-55 to +125
R θJA
C J 40
120
T STG
-55
- 65 to +175
VF
120
200
Volt
140
Volt
200
Volt
Am
A
uA
O
80
Am
C/W
℃/W
pF
130
+150
-55 to +150
240
250
300
115
150
UNIT
105
A
150
350
O
PF
C
℃
℃
mV
FM1100-MH
FM1150-MH FM1200-MH UNI
I F = 2000mA
SYMBOL FM120-MH FM130-MH FM140-MH FM150-MH FM160-MH FM180-MH 430
450
Vol
0.9
0.92
VF
0.50
0.70
0.85
Maximum Average Reverse Current at @T A=25℃
@T A=125℃
Rated DC Blocking Voltage
40
0.5
IR
10
mAm
NOTES:
1- Measured at 1 MHZ and applied reverse voltage of 4.0 VDC.
Operating
*1
*2
*3
V RMS
SYMBOLS
RRM Junction
2- Thermal
Resistance V
From
to AmbientV R
SL24-N
2012-06
201-
(V)
(V)
(V)
40
28
40
temperature
T J, ( OC)
-55 to +100
*1 Repetitive peak reverse voltage
*2 RMS voltage
*3 Continuous reverse voltage@I R =1mA
WILLAS ELECTRONIC CORP.
WILLAS ELECTRONIC CORP.
WILLAS
FM120-M+
THRU
SL24-N
FM1200-M+
1.5A LOW VF SCHOTTKY BARRIER RECTIFIERS - 40V
1.0A SURFACE MOUNT SCHOTTKY BARRIER RECTIFIERS -20V- 200V
SOD-323-L PACKAGE
Pb Free Product
SOD-123+ PACKAGE
Package outline
Rating and characteristic curves
Features
process design, excellent power dissipation offers
• BatchFIG.1-TYPICAL
FORWARD
better reverse leakage current and thermal resistance.
mounted application in order to
• Low profile surface
CHARACTERISTICS
FIG.2-TYPICAL FORWARD CURRENT
DERATING CURVE
SOD-123H
INSTANTANEOUS FORWARD CURRENT,(A)
•
MIL-STD-19500 /228
RoHS
1.0 product for packing code suffix "G"
Halogen free product for packing code suffix "H"
Mechanical data
AVERAGE FORWARD CURRENT,(A)
optimize board space.
• Low power loss, high efficiency.
50
• High current capability, low forward voltage drop.
• High surge capability.
• Guardring for overvoltage protection.
10
• Ultra high-speed switching.
• Silicon epitaxial planar chip, metal silicon junction.
3.0
parts meet environmental standards of
• Lead-free
0.146(3.7)
0.130(3.3)
1.8
0.012(0.3) Typ.
1.6
1.4
0.071(1.8)
0.056(1.4)
1.2
0.8
0.4
0
0
20
40
TJ=25 C
60
80
100
120
140
160
LEAD TEMPERATURE (°C)
Width 300us
retardant
• Epoxy : UL94-V0 rated flamePulse
1%
Duty Cycle
0.1 : Molded plastic, SOD-123H
• Case
,
• Terminals :Plated terminals, solderable per MIL-STD-750
180
200
0.040(1.0)
0.024(0.6)
0.031(0.8) Typ.
0.031(0.8) Typ.
FIG.4-MAXIMUM NON-REPETITIVE FORWARD
SURGE CURRENT
1.5
PEAK FORWARD SURGE CURRENT,(A)
Method 2026
• Polarity : Indicated by cathode band
.01
Position
• Mounting
.1
.3
.5 : Any
.7
.9 1.1 1.3
FORWARD VOLTAGE,(V)
• Weight : Approximated
0.011 gram
8.3ms Single Half
T =25 C in inches and
Dimensions
(millimeters)
J
Sine Wave
JEDEC method
MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS
FIG.3
- TYPICAL REVERSE
RATINGS
Marking Code
SYMBOL FM120-MH FM130-MH FM140-MH FM150-MH FM160-MH FM180-MH FM1100-MH FM1150-MH FM1200-MH UN
VRRM
12
20
13
30
Maximum RMS Voltage
VRMS
14
Maximum DC Blocking Voltage
VDC
20
Maximum Average Forward Rectified Current
IO
IFSM
CHARACTERISTICS
Maximum Recurrent Peak Reverse Voltage
1000
REVERSE LEAKAGE CURRENT, (mA)
100
Peak Forward Surge Current 8.3 ms single half sine-wave
superimposed on rated load (JEDEC method)
RΘJA
Typical Thermal Resistance (Note 2)
Typical Junction Capacitance (Note 1)
CJ
Operating Temperature Range
TJ
10
TJ=75 C
Storage Temperature Range
TSTG
CHARACTERISTICS
T =25 C
VF
Maximum Forward Voltage at 1.0A DC
Maximum Average Reverse Current at @T A=25℃
@T A=125℃
Rated DC Blocking Voltage
IR
NOTES:
0
20
40
60
80
28
30
40
300
PERCENTAGE RATED PEAK REVERSE VOLTAGE
2012-06
16
60
18
80
115
150
120
200
Vol
35 NUMBER
42OF CYCLES
56 AT 60Hz 70
105
140
Vol
50
150
200
Vol
60
10
100
80
100
1.0
FIG.5-TYPICAL JUNCTION
CAPACITANCE
30
-55 to +125
Am
40
120
250
Am
℃/W
PF
-55 to +150
℃
- 65 to +175
200
℃
150
0.50
100
0.70
0.9
0.85
0.5
50
0.92
mAm
10
.01
.05
.1
.5
1
Vol
5
10
50
100
100 120 140
2- Thermal Resistance From Junction to Ambient
201-
21
0
.1
1- Measured at 1 MHZ and applied reverse voltage of 4.0 VDC.
15
50
SYMBOL FM120-MH FM130-MH FM140-MH FM150-MH FM160-MH FM180-MH FM1100-MH FM1150-MH FM1200-MH UN
J
1
14
40
350
JUNCTION CAPACITANCE,(pF)
Ratings at 25℃ ambient temperature unless otherwise specified.
Single phase half wave, 60Hz, resistive of inductive load.
For capacitive load, derate current by 20%
REVERSE VOLTAGE,(V)
WILLAS ELECTRONIC CORP.
WILLAS ELECTRONIC CORP.
WILLAS
FM120-M+
THRU
SL24-N
FM1200-M+
1.5A LOW VF SCHOTTKY BARRIER RECTIFIERS - 40V
1.0A SURFACE MOUNT SCHOTTKY BARRIER
RECTIFIERS
-20V- 200V
SOD-323-L
PACKAGE
Pb Free Product
SOD-123+ PACKAGE
Package outline
Features
Pinning
information
design, excellent power dissipation offers
• Batch process
better reverse leakage current and thermal resistance.
SOD-123H
surface mounted application in order
to
• Low profilePin
Simplified
outline
optimize board space.
• Low power loss, high efficiency.
current
capability, low forward voltage drop.
• High
Pin1
cathode
surge
capability.
• High
1
Pin2 anode
• Guardring for overvoltage protection.
• Ultra high-speed switching.
• Silicon epitaxial planar chip, metal silicon junction.
Lead-free
parts meet environmental standards of
•
Reel
packing
MIL-STD-19500 /228
"G"
• RoHS product for packing code suffix
COMPONENT
PACKAGE
SIZE forREEL
SPACING
HalogenREEL
free product
packing code
suffix "H" BOX
(pcs)
Mechanical data
(m/m)
(pcs)
4.0
7" rated3,000
SOD-323-L
flame retardant
• Epoxy : UL94-V0
30,000
0.146(3.7)
0.130(3.3)
2
0.012(0.3) Typ.
1
2
0.071(1.8)
0.056(1.4)
REEL
DIA,
(m/m)
INNER
BOX
(m/m)
CARTON
SIZE
(m/m)
178
183*183*123
• Case : Molded plastic, SOD-123H
,
• Terminals :Plated terminals, solderable per MIL-STD-750
Marking
Symbol
CARTON
(pcs)
382*262*387
APPROX.
GROSS WEIGHT
(kg)
0.040(1.0)
8.0
0.024(0.6)
240,000
0.031(0.8) Typ.
0.031(0.8) Typ.
Method 2026
• PolarityType
: Indicated by cathode band
number
Marking code
• Mounting Position : Any
• Weight : Approximated
0.011 gram
SL24-N-TH
L4
Dimensions in inches and (millimeters)
MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS
Note: N: Package code, SOD-323-L
Ratings at 25℃ ambient temperature unless otherwise specified.
-T:60Hz,
Taping
Reel
Single phase half wave,
resistive
of inductive load.
For capacitive load, derate current by 20%
Pb-Free package is available
SYMBOL FM120-MH FM130-MH FM140-MH FM150-MH FM160-MH FM180-MH FM1100-MH FM1150-MH FM1200-MH UNIT
RATINGS
Marking Code RoHS product for packing code suffix
12 ”G”
13
14
15
16
18
10
115
120
50
60
80
100
150
200
Volts
Maximum RMS Voltage
20
30
40
VRRM
Halogen free product for packing
code
suffix
“H”
VRMS
14
21
28
35
42
56
70
105
140
Volts
Maximum DC Blocking Voltage
VDC
20
30
40
50
60
80
100
150
200
Volts
Maximum Recurrent Peak Reverse Voltage
IO
solder
pad
layoutIFSM
PeakSuggested
Forward Surge Current
8.3 ms single
half sine-wave
1.0
30
Maximum Average Forward Rectified Current
superimposed on rated load (JEDEC method)
RΘJA
Typical Thermal Resistance (Note 2)
C
CJ
Typical Junction Capacitance (Note 1)
Storage Temperature Range
40
120
-55 to +125
TJ
Operating Temperature Range
Amps
℃/W
PF
-55 to +150
℃
- 65 to +175
TSTG
Amps
℃
A
CHARACTERISTICS
SYMBOL FM120-MH FM130-MH FM140-MH FM150-MH FM160-MH FM180-MH FM1100-MH FM1150-MH FM1200-MH UNIT
VF
Maximum Forward Voltage at 1.0A DC
Maximum Average Reverse Current at @T A=25℃
Rated DC Blocking Voltage
IR
@T A=125℃
0.50
0.70
0.85
0.5
B
0.9
0.92
Volts
10
mAmp
NOTES:
1- Measured at 1 MHZ and applied reverse voltage of 4.0 VDC.
2- Thermal Resistance From Junction to Ambient
Dimensions in inches and (millimeters)
2012-06
201-
PACKAGE
A
B
C
SOD-323-L
0.059 (1.50)
0.039 (1.00)
0.051 (1.30)
WILLAS ELECTRONIC CORP.
WILLAS ELECTRONIC CORP.
WILLAS
FM120-M+
THRU
SL24-N
FM1200-M+
1.5A LOW VF SCHOTTKY BARRIER RECTIFIERS - 40V
1.0A SURFACE MOUNT SCHOTTKY BARRIER
RECTIFIERS
-20V- 200V
SOD-323-L
PACKAGE
Pb Free Product
SOD-123+ PACKAGE
Package outline
Packing
information
Features
• Batch process design, excellent power dissipation offers
better reverse leakage current and thermal resistance.
SOD-123H
• Low profile surface mounted application in order to
P0
optimize board space.
• Low power loss, high efficiency.
P1
• High current capability, low forward voltage drop.
d
• High surge capability.
•EGuardring for overvoltage protection.
• Ultra high-speed switching.
F• Silicon epitaxial planar chip, metal silicon junction.
• Lead-free parts meet environmental standards of
•
0.146(3.7)
0.130(3.3)
0.012(0.3) Typ.
0.071(1.8)
0.056(1.4)
W
B
MIL-STD-19500 /228
RoHS product for packing code suffix "G"
Halogen free product for packing code suffix "H"
Mechanical data
0.040(1.0)
0.024(0.6)
rated flame retardant
• Epoxy : UL94-V0
A
P
• Case : Molded plastic, SOD-123H
,
• Terminals :Plated terminals, solderable per MIL-STD-750
0.031(0.8) Typ.
0.031(0.8) Typ.
Method 2026
• Polarity : Indicated by cathode band
• Mounting Position : Any
• Weight : Approximated 0.011 gram
Dimensions in inches and (millimeters)
D2
MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS
D1
T
Ratings at 25℃ ambient temperature unless otherwise specified.
Single phase half wave, 60Hz, resistive of inductive load.
For capacitive load, derate current by 20%
RATINGS
C
W1
D FM160-MH FM180-MH FM1100-MH FM1150-MH FM1200-MH UNI
SYMBOL FM120-MH FM130-MH FM140-MH FM150-MH
Marking Code
Maximum Recurrent Peak Reverse Voltage
VRRM
12
20
13
30
14
40
15
50
16
60
Maximum RMS Voltage
VRMS
14
21
28
35
42
Maximum DC Blocking Voltage
VDC
20
30
40
50
Maximum Average Forward Rectified Current
Item
Peak Forward Surge Current 8.3 ms single half sine-wave
superimposed on rated load (JEDEC method)
IO
IFSM
Symbol
Tolerance
18
80
56
unit:mm
60
80
1.0
SOD-323-L
30
115
150
120
200
Volt
70
105
140
Volts
100
150
200
Volts
Amp
Amp
1.47
Carrier width
A
0.1
40
RΘJA
Carrier length
B
0.1
2.95
120
Typical Junction Capacitance (Note 1)
CJ
Carrier depth
C -55 to +1250.1
1.15
-55 to +150
Operating Temperature Range
TJ
1.50
Sprocket hole
d
0.1
- 65 to +175
Storage Temperature Range
TSTG
13" Reel outside diameter
D
2.0
13" Reel inner diameter
D1
min
CHARACTERISTICS
SYMBOL FM120-MH FM130-MH FM140-MH FM150-MH FM160-MH FM180-MH FM1100-MH FM1150-MH FM1200-MH
178.00
7" Reel outside diameter
D
2.0
0.9
Maximum Forward Voltage at 1.0A DC
0.92
VF
0.50
0.70
0.85
62.00
7" Reel inner diameter
D1
min
0.5
Maximum Average Reverse CurrentFeed
at @T
A=25℃
13.00
hole
diameter IR
0.5
D2
10
@T A=125℃
Rated DC Blocking Voltage
1.75
Sprocket
hole position
E
0.1
3.50
Punch hole position
F
0.1
NOTES:
4.00
Punch hole pitch
P
0.1
1- Measured at 1 MHZ and applied reverse voltage of 4.0 VDC.
4.00
P0
0.1
Sprocket hole pitch
2- Thermal Resistance From Junction to Ambient
2.00
0.1
Embossment center
P1
0.23
Overall tape thickness
T
0.1
8.00
W
0.3
Tape width
11.40
Reel width
W1
1.0
Typical Thermal Resistance (Note 2)
10
100
℃/W
PF
℃
℃
UNIT
Volt
mAm
Note:Devices are packed in accor dance with EIA standar RS-481-A and specifications listed above.
2012-06
201-
WILLAS ELECTRONIC CORP.
WILLAS ELECTRONIC CORP.