YAS530B

YAS530B
MS-3E
Magnetic Field Sensor Type 3E
■ Overview
The YAS530B is a 3-axis geomagnetic sensor device with the following circuits integrated on one
chip: a buffer amplifier, an AD converter, a clock generator circuit, and a serial data interface circuit
(compliant with I2C bus interface).
The YAS530B allows a compact electronic compass with high sensitivity and low power consumption
in mobile phones or mobile GPS systems.
YAS530B Catalog
CATALOG No. LSI-4AS530B20
2011.9
■ Features
■
YAS530B
Features
■
■
■
■
■
■
3-axis magnetic sensors and peripheral circuits integrated on one chip
High sensitivity geomagnetic sensors
Supports the I2C bus interface (100kbps/400kbps, slave mode)
Small footprint with the small-sized package
Automatic power-down control after the acquisition, and low-power consumption
Reduced communication load with a host controller via deferred acquisition and interrupt outputs
Package
Lead-free 10-ball
Size
2mm × 2mm
Core supply voltage (VDD)
Digital interface supply voltage (IOVDD)
Power Supply
Operating
Temperature
WLCSP (YAS530B-PZ)
−40°C to +95°C
Current
4mA (VDD=3.0 V, during the acquisition)
Consumption
48µA (Average consumption in 8Hz)
Magnetic Sensor
2.5V to 3.6V
1.65V to VDD
Manufacturing process
CMOS＋Magnetic Sensor
Maximum Measurable Magnetic Field
1000 μT
Magnetic field sensitivity (X, Y)
0.15 μT/count
Magnetic field sensitivity (Z)
0.3 μT/count
1.5 ms
Acquisition Time
(Magnetic sensor acquisition +
Temperature acquisition)
4AS530B20
2
■ Pin Assignments
■
YAS530B
Pin Assignments
The figure below shows the pin assignment and its description:
9
1
8
7
10
5
2
3
6
4
< 10-pin WLCSP Top View >
Pin No.
Pin Name
I/O
Function
1
INT
O
Interrupt output pin
2
VSS
-
GND
3
TEST1
I
Be sure to connect to VSS.
4
TEST2
I
Be sure to connect to VSS.
5
TEST3
I
Be sure to connect to VSS.
6
VDD
-
Core power supply (Typ. 3V)
7
SDA
I/Od
Serial data
8
SCL
I
Serial clock
9
IOVDD
-
Interface power supply (Typ. 1.8V)
10
RSTN
Is
Device initialization
I
Is
Od
O
4AS530B20
: Digital input
: Schmitt trigger input
: Open-drain output
: Output
3
■ Pin Descriptions
■
YAS530B
Pin Descriptions
● Power supply pins (VDD, IOVDD, VSS)
These are power supply pins:
VDD
: Core power supply (Typ. 3.0V)
IOVDD : Interface power supply (Typ. 1.8V)
VSS
: GND
● Interface pins (SCL, SDA, RSTN, INT)
SCL
: Serial clock input pin
Pull up this pin externally.
SDA
: Serial data input and output pin
Pull up this pin externally.
RSTN : Device initialization pin
A low level releases the I2C bus and resets the internal circuit.
Connect to IOVDD pin when not used.
INT
: Interrupt output pin. An interrupt signal is sent through this output pin when the acquisition
is completed. A high or low level output can be select with the configuration registers. Leave
this pin open when not used.
● Test pins (TEST1, TEST2, TEST3)
These are pins for test.
Be sure to connect to VSS.
4AS530B20
4
■ Block Diagram
■
YAS530B
Block Diagram
Magnetic
Sensor 1
Powerdown
Control
Magnetic
Sensor 2
gain
A/D
Magnetic
Sensor 3
Reset Coils
Test Coils
Clock
Generator
Temperature
Sensor
Serial
Data
Interface
(Registers)
Power-on
Reset
VDD
IOVDD
INT
SCL
SDA
RSTN
VSS
Block Diagram
• Magnetic Sensor
Three magnetic sensors are on the chip.
The supply voltage is supplied only to the sensor corresponding to the axis to be measured.
•
Buffer Amplifier
The buffer amplifier, operating only when measuring the magnetic field, amplifies the magnetic
sensor output.
• Temperature Sensor
The temperature sensor, operating only when measuring the temperature, can be used to compensate
for the temperature characteristics of the sensor.
• A/D Converter (ADC)
The ADC, operating only when measuring the magnetic field, transforms the magnetic sensor output
amplified with the buffer amplifier or the temperature sensor output, to the digital form.
4AS530B20
5
■ Block Diagram
YAS530B
• Clock Generator
The clock generator, operating only when measuring the magnetic field or the temperature, supplies
clocks to the ADC and the digital circuits.
• Power-on Reset Circuit
The power-on reset circuit detects the ramp-up of the core supply voltage and resets the internal
circuit.
• Reset Coils
The Reset coils are used to restore the function of a damaged magnetic sensor because of the high
magnetic field received.
Generating magnetic field with the reset coils restores the magnetic sensor characteristics.
• Serial Data Interface
The YAS530B serial data interface is compliant with I2C bus interface and operates in slave mode.
Data are transferred via the following pins:
SCL— Serial clock input pin
SDA— Serial data input and output pin
4AS530B20
6
■ Electrical Characteristics
■
YAS530B
Electrical Characteristics
● Absolute Maximum Ratings
Item
Symbol
Min.
Max.
Unit
VDD
-0.3
4.2
V
Interface Supply Voltage
IOVDD
-0.3
4.2
V
Digital Input Pin Voltage
(SCL, SDA, RSTN)
VIND
-0.3
IOVDD+0.3
V
Tstg
-50
125
°C
500
mT
Core Supply Voltage
Storage Temperature
Maximum Applicable Magnetic Field
Typ.
Hmax
● Recommended Operating Conditions
Item
Symbol
Min.
Typ.
Max.
Unit
VDD
2.5
3.0
3.6
V
IOVDD
1.65
1.8
VDD
V
Top
-40
25
95
°C
Typ.
Max.
Unit
1
μA
10
μA
Core Supply Voltage
Interface Supply Voltage
Operating Ambient Temperature
● Current Consumption
Item
Min.
Standby Current (TOP=25°C,
SCL=SDA= IOVDD=VDD=3.6V,RSTN=VDD）
Standby Current (TOP=95°C,
SCL=SDA= IOVDD=VDD=3.6V,RSTN=VDD）
IOVDD Current Consumption during communication
VDD Current Consumption during magnetic field
acquisition * See Note.
VDD Current Consumption during temperature
acquisition * See Note.
VDD Current Consumption (reset coil is ON)
1
μA
4.0
mA
2.0
mA
50
mA
Note: After the acquisition the device automatically powers down to enter the standby state.
4AS530B20
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■ Electrical Characteristics
YAS530B
● Magnetic Sensor Characteristics
(Conditions: TOP = 25ºC, VDD = 3.0 V)
Item
Min.
Typ.
Max.
Unit
Maximum Measurable Magnetic Field
800
μT
Maximum Measurable Magnetic Field
1000 (*1)
μT
Magnetic Field Sensitivity (X,Y)
0.15
μT/count
Magnetic Field Sensitivity (Z)
0.3
μT/count
Sensitivity Axis Deviation
±5
deg
(*1) When using dynamic sensitivity compensation function of yamaha driver
Note: Y and Z sensitivities are for Y1-Y2 and Y1+Y2, respectively. And, the sensitivity axis deviation is for the
value corrected with CAL register values. For details, see the application manual.
● Temperature Sensor Characteristics
(Conditions: VDD = 3.0 V)
Item
Min.
Temperature Acquisition Range
Typ.
-40
Temperature Resolution
Max.
Unit
95
°C
0.45
°C/count
● Acquisition Time
(Conditions: see “Recommended Operating Conditions”)
Item
Min.
Acquisition Time
4AS530B20
8
Typ.
Max.
Unit
1.5
2
ms
■ Electrical Characteristics
YAS530B
● DC Characteristics
Serial Data Interface: SCL, SDA
(Conditions: see “Recommended Operating Conditions”)
Item
Symbol
Min.
Max.
Unit
“L” level input voltage
VIL
-0.3
0.3×IOVDD
V
“H” level input voltage
VIH
0.7×IOVDD
IOVDD+0.3
V
“L” level output voltage (sink current 3mA)
VOL
0
0.2×IOVDD
V
tof
20+0.1×Cb
250
ns
Ii
-1
1
μA
10
pF
Output Falling Time (from VIHmin to VILmax)
Input leakage Current at the input voltage of 0.1
× IOVDD to 0.9 × IOVDD
Input Capacitance
Ci
Cb: Load capacitance for each bus line (pF)
Reset Circuit RSTN
(Conditions: see “Recommended Operating Conditions”)
Item
Max.
Unit
-0.3
0.2×IOVDD
V
0.8×IOVDD
IOVDD+0.3
V
Symbol
Min.
“L” level input voltage
VIL
“H” level input voltage
VIH
Schmitt Width
VSH
Input Leakage Current
Ii
Input Capacitance
Ci
Interrupt Output
Typ.
0.1×IOVDD
-1
V
1
μA
10
pF
INT
(Conditions: see “Recommended Operating Conditions”)
Item
Symbol
“L” level output voltage (IOL=1mA)
VOL
“H” level output voltage (IOH=-1mA)
VOH
4AS530B20
9
Min.
0.8×IOVDD
Typ.
Max.
Unit
0.2×IOVDD
V
V
■ Electrical Characteristics
YAS530B
● AC Characteristics
The table below shows the rules on the power supply power-on sequence.
(Conditions: see “Recommended Operating Conditions”)
Item
Symbol
Power Supply Ramp Up Time
Min.
TVON
Time from when VDD reaches a half of its
recommended operating voltage (Typ.) till when
IOVDD reaches a half of its recommended
operating voltage (Typ.)
Time from when all the power supplies are
completely powered up till when the device
circuitry is initialized
TVSKW
0
TDOP
1
Max.
Unit
0.5
ms
30
ms
ms
TVON
Lower limit of the recommended operating voltage
VDD
A half of the VDD recommended operating voltage (Typ.)
Lower limit of the recommended operating voltage
IOVDD
A half of the IOVDD recommended operating voltage (Typ.)
TVSKW
SDA
TDOP
Initialization Sequence
4AS530B20
10
■ Electrical Characteristics
YAS530B
Serial Data Interface: SCL, SDA
(Conditions: see “Recommended Operating Conditions”)
Item
Symbol
Min.
Max.
Unit
fSCL
0
400
kHz
tHD;STA
0.6
μs
SCL Clock “L” Time
tLOW
1.3
μs
SCL Clock “H” Time
tHIGH
0.6
μs
Setup Time of the repeat start conditions
tSU;STA
0.6
μs
Data Hold Time
tHD;DAT
0
Data Setup Time
tSU;DAT
0.1
SCL Clock Frequency
Hold Time (repeat) Start Condition
μs
0.9
μs
SDA and SCL signals rise time (input)
tr
300
ns
SDA and SCL signals fall time (input)
tf
300
ns
SDA signal fall time (output)
tof
20+0.1×Cb
300
ns
tSU;STO
0.6
μs
Bus Free Time between stop and start conditions
tBUF
1.3
μs
SDA and SCL Capacitive Load
Cb
Stop Condition Setup Time
400
pF
Cb: Load capacitance for each bus line (pF)
t LOW t r
tf
SCL
tf
t HIGH
t HD;STA
t HD;DAT
t SU;STA
t SU;STO
t HD;STA
t SU;DAT
SDA
tBUF
Start
Repeated
Start
Stop
Serial Data Interface Timing Specification
[Notes]
・ YAS530B serial data interface is compliant to I2C bus as far as described in this document.
・ No schmitt trigger circuits are used.
・ Spike noise with the width of about 50ns can be suppressed.
4AS530B20
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■ Electrical Characteristics
YAS530B
Reset Circuit RSTN
(Conditions: see “Recommended Operating Conditions”)
Item
Symbol
Min.
tRSTW
2.5
Reset “L” pulse width
4AS530B20
12
Max.
Unit
μs
■ System Configuration Examples
■
YAS530B
System Configuration Examples
The figure below shows an example of the application.
Connect the RSTN pin to the IOVDD when not used.
Leave the INT pin open (N.C.) when not used.
* For a geomagnetic sensor to deliver its performance, its placement on the board needs to be carefully designed.
Contact Yamaha sales staff for details.
1.8V
3V
VDD
GND
VSS
1.8V
IOVDD
INT
YAS530B
Host
CPU
(I2C master)
SCL
SDA
RSTN
I2C Device
I2C Device
Example 1 (RSTN and INT pins used)
3V
VDD
GND
VSS
1.8V
IOVDD
INT
YAS530B
N.C.
SCL
SDA
RSTN
Example 2 (RSTN and INT pins not used)
4AS530B20
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■ Package Information
■
YAS530B
Package Information
Caution
The product of the WLCSP package should be used under light-shielded conditions.
Since the WLCSP package has a structure that a silicon wafer is exposed, if light (such as sunlight) hits the wafer,
the device may malfunction (leak current increase etc.) due to electric charge internally generated by the photoelectric
effect.
注）
1. 表面実装LSIは、保管条件、および、半田付けについての特別な配慮が必要です。
2. 組立工場により、寸法や形状などが異なる場合があります。
詳しくはヤマハ代理店までお問い合わせください。
Note:　1. Special attention needs to be paid to the storage conditions and soldering method of the
surface mount IC.
2. Dimension, form, etc. may differ depending on assembly plants.
For details, please contact your local Yamaha agent.
4AS530B20
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■ Cautions for use of the surface mount package
■
YAS530B
Cautions for use of the surface mount package
Ｕ－Ｆ－２６０Ｃ０－０３
使用上の注意 / Precaution for soldering
WLCSP パッケージ下面の半田端子(ボール)を溶融して、半田付け実装してください。また、製品耐熱性
を考慮して、パッケージ本体の表面温度管理を行ってください。具体的な使用条件は下記をご参照くだ
さい。
Dissolve the solder terminal (ball) of WLCSP package undersurface and carry out solder mounting. Moreover,
control the
temperature of package surface in consideration of product heat resistance. Refer to the
following for the concrete handlingcondition.
1．実装までの保管 / Storage before soldering
吸湿及び端子の酸化を避けるため、実装するまでは出来るだけ乾燥した雰囲気中に保管してください。
推奨条件は下記のとおりです。
Store the products in the environment which is as dry as possible to prevent moisture absorption and oxidation of
terminal, until soldering. We recommend the following conditions.
温度 / Temperature
5～30°C /5°C to 30°C
湿度 / Humidity
70%RH.以下 /Less than 70% RH.
２．防湿梱包開封後の取り扱い / Handling after the dry packing bag is opened
開封後は吸湿および端子底面の酸化を避けるため、上記環境条件下にて保管し、リフロー半田付け実装して
ください。
開封後に再保管される場合、シリカゲルを入れ再度密封の上、上記環境条件下で保管くださるか、またはド
ライボックスで保管ください。（耐湿レベルは J-STD-020A LEVEL1 を有しております。）
Store in accordance with the condition described above to avoid moisture absorption and the oxidation of terminal after
opening the dry packing, and carry out reflow soldering. If stored again after opening, insert silica gel and seal it once
more and store under the conditions described above, or in a dry box. (J-STD-020A : MSL LEVEL1)
4AS530B20
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■ Cautions for use of the surface mount package
YAS530B
３．半田付け条件 / Soldering conditions
(1)フローソルダリング
Wave soldering
(2)リフローソルダリング
Reflow soldering
Device surface temp. [℃]
デバイス表面温度
(3)手半田付け
Manual soldering
当該パッケージはフロー半田（ディップ）法に適応していません。
(This package is not suitable for wave soldering. (Dipping) )
推奨温度プロファイル例（fig.1）参照願います。
＊デバイス表面温度は Max.260°C でリフロー回数は 3 回までとしてくだ
さい。
(Refer to Fig1 for an example of recommended temperature profile.
*Device surface temp. is allowed Max.260°C and 3 times. )
当該製品は手半田付けに適応していません。
高温な半田ごてが近づくと特性に影響を与える可能性があります。
(This product is not suitable for manual soldering. Since hot solder iron is close
to this product, the performance may change. )
2～5℃/s
Max.260℃
150～190℃
250℃
90±30s
2～5℃/s
Max.10s
(2～5℃/s)
time(s)
Fig.1 Reflow soldering recommended temperature profile
４．アンダーフィル / Underfill
アンダーフィルを行うと温度補正が正常に行われない可能性がありますのでアンダーフィル無しで実
装してください。
Since temperature compensation may not be performed normally when under-fill is made while mounting WLCSP
on a board, please mount it without under-fill.
4AS530B20
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YAS530B
PRECAUTIONS AND INSTRUCTIONS FOR SAFETY
WARNING
Prohibited
Prohibited
Prohibited
Instructions
Do not use the device under stresses beyond those listed in Absolute Maximum Ratings.
Such stresses may become causes of breakdown, damages, or deterioration, causing explosion
or ignition, and this may lead to fire or personal injury.
Do not mount the device reversely or improperly and also do not connect a supply voltage in
wrong polarity. Otherwise, this may cause current and/or power-consumption to exceed the
absolute maximum ratings, causing personal injury due to explosion or ignition as well as causing
breakdown, damages, or deterioration.
And, do not use the device again that has been improperly mounted and powered once.
Do not short between pins.
In particular, when different power supply pins, such as between high-voltage and low-voltage
pins, are shorted, smoke, fire, or explosion may take place.
As to devices capable of generating sound from its speaker outputs, please design with safety of
your products and system in mind, such as the consequences of unusual speaker output due to a
malfunction or failure. A speaker dissipates heat in a voice-coil by air flow accompanying
vibration of a diaphragm. When a DC signal (several Hz or less) is input due to device failure,
heat dissipation characteristics degrade rapidly, thereby leading to voice-coil burnout, smoking or
ignition of the speaker even if it is used within the rated input value.
CAUTION
Prohibited
Instructions
Instructions
Instructions
Instructions
Instructions
Instructions
Instructions
Do not use Yamaha products in close proximity to burning materials, combustible substances, or
inflammable materials, in order to prevent the spread of the fire caused by Yamaha products, and
to prevent the smoke or fire of Yamaha products due to peripheral components.
Generally, semiconductor products may malfunction and break down due to aging, degradation,
etc. It is the responsibility of the designer to take actions such as safety design of products and
the entire system and also fail-safe design according to applications, so as not to cause property
damage and/or bodily injury due to malfunction and/or failure of semiconductor products.
The built-in DSP may output the maximum amplitude waveform suddenly due to malfunction from
disturbances etc. and this may cause damage to headphones, external amplifiers, and human
body (the ear). Please pay attention to safety measures for device malfunction and failure both in
product and system design.
As semiconductor devices are not nonflammable, overcurrent or failure may cause smoke or fire.
Therefore, products should be designed with safety in mind such as using overcurrent protection
circuits to control the amount of current during operation and to shut off on failure.
Products should be designed with fail safe in mind in case of malfunction of the built-in protection
circuits. Note that the built-in protection circuits such as overcurrent protection circuit and
high-temperature protection circuit do not always protect the internal circuits. In some cases,
depending on usage or situations, such protection circuit may not work properly or the device
itself may break down before the protection circuit kicks in.
Use a robust power supply.
The use of an unrobust power supply may lead to malfunctions of the protection circuit, causing
device breakdown, personal injury due to explosion, or smoke or fire.
Product's housing should be designed with the considerations of short-circuiting between pins of
the mounted device due to foreign conductive substances (such as metal pins etc.). Moreover,
the housing should be designed with spatter prevention etc. due to explosion or burning.
Otherwise, the spattered substance may cause bodily injury.
The device may be heated to a high temperature due to internal heat generation during
operation. Therefore, please take care not to touch an operating device directly.
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4AS530B20
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YAS530B
eC02