SPP2309 P-Channel Enhancement Mode

SPP2309
P-Channel Enhancement Mode MOSFET
DESCRIPTION
The SPP2309 is the P-Channel logic enhancement mode
power field effect transistors are produced using high cell
density , DMOS trench technology.
This high density process is especially tailored to
minimize on-state resistance.
These devices are particularly suited for low voltage
application such as cellular phone and notebook
computer power management and other battery powered
circuits, and low in-line power loss are needed in a very
small outline surface mount package.
APPLICATIONS
z Power Management in Note book
z Portable Equipment
z Battery Powered System
z DC/DC Converter
z Load Switch
z DSC
z LCD Display inverter
FEATURES
‹
P-Channel
-20V/2.5A,RDS(ON)= 0.35Ω@VGS=-4.5V
-20V/1.5A,RDS(ON)= 0.48Ω@VGS=-2.5V
-20V/0.7A,RDS(ON)= 0.75Ω@VGS=-1.8V
‹
Super high density cell design for extremely low
RDS (ON)
‹
Exceptional on-resistance and maximum DC
current capability
‹
SOT-23-3L package design
PIN CONFIGURATION(SOT-23-3L)
PART MARKING
2008/01/08 Ver.1
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SPP2309
P-Channel Enhancement Mode MOSFET
PIN DESCRIPTION
Pin
Symbol
Description
1
G
Gate
2
S
Source
3
D
Drain
ORDERING INFORMATION
Part Number
Package
SPP2309S23RG
SOT-23-3L
Part
Marking
09YW
※ Week Code : A ~ Z( 1 ~ 26 ) ; a ~ z( 27 ~ 52 )
※ SPP2309S23RG : Tape Reel ; Pb – Free
ABSOULTE MAXIMUM RATINGS
(TA=25℃ Unless otherwise noted)
Parameter
Symbol
Typical
Unit
Drain-Source Voltage
VDSS
-20
V
Gate –Source Voltage
VGSS
±12
V
Continuous Drain Current(TJ=150℃)
TA=25℃
TA=70℃
Pulsed Drain Current
Continuous Source Current(Diode Conduction)
Power Dissipation
Operating Junction Temperature
TA=25℃
TA=70℃
ID
-2.5
-1.8
A
IDM
-10
A
IS
-2.0
A
PD
1.25
0.8
W
TJ
150
℃
Storage Temperature Range
TSTG
-55/150
℃
Thermal Resistance-Junction to Ambient
RθJA
120
℃/W
2008/01/08 Ver.1
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SPP2309
P-Channel Enhancement Mode MOSFET
ELECTRICAL CHARACTERISTICS
(TA=25℃ Unless otherwise noted)
Parameter
Symbol
Conditions
Min.
Typ
Max.
Unit
Static
Drain-Source Breakdown Voltage
Gate Threshold Voltage
V(BR)DSS VGS=0V,ID=-250uA
VGS(th) VDS=VGS,ID=-250uA
Gate Leakage Current
IGSS
Zero Gate Voltage Drain Current
IDSS
On-State Drain Current
ID(on)
VDS≤ -4.5V,VGS =-5V
Forward Transconductance
gfs
Diode Forward Voltage
VSD
IS=-0.5A,VGS=0V
RDS(on)
-0.35
-0.8
VDS=0V,VGS=±12V
VDS=-20V,VGS=0V
VDS=-20V,VGS=0V
TJ=55℃
VGS=-4.5V,ID=-2.5A
VGS=-2.5V,ID=-1.5A
VGS=-1.8V,ID=-0.7A
VDS=-10V,ID=-1.2A
Drain-Source On-Resistance
-20
±100
-1
-5
-2.0
V
nA
uA
A
0.29
0.40
0.52
0.4
0.35
0.48
0.75
-0.8
-1.2
1.5
2.0
Ω
S
V
Dynamic
Total Gate Charge
Qg
Gate-Source Charge
Qgs
Gate-Drain Charge
Qgd
0.35
td(on)
5
10
15
25
8
15
1.4
1.8
Turn-On Time
Turn-Off Time
2008/01/08 Ver.1
tr
td(off)
tf
VDS=-10V,VGS=-4.5V ,ID
≡-0.7A
VDD=-10V,RL=10Ω ,
ID≡-1.0A
VGEN=-4.5V ,RG=6Ω
nC
0.3
Page 3
ns
SPP2309
P-Channel Enhancement Mode MOSFET
TYPICAL CHARACTERISTICS
2008/01/08 Ver.1
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SPP2309
P-Channel Enhancement Mode MOSFET
TYPICAL CHARACTERISTICS
2008/01/08 Ver.1
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SPP2309
P-Channel Enhancement Mode MOSFET
TYPICAL CHARACTERISTICS
2008/01/08 Ver.1
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SPP2309
P-Channel Enhancement Mode MOSFET
SOT-23-3L PACKAGE OUTLINE
2008/01/08 Ver.1
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SPP2309
P-Channel Enhancement Mode MOSFET
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SYNC Power Corporation
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Phone: 886-2-2655-8178
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2008/01/08 Ver.1
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