ROHM BD8646FV-E2

Single-chip Type with Built-in FET type Switching Regulators
Flexible Step-down
Switching Regulator
with Built-in Power MOSFET
BD8646FV
No.10027EAT44
●Description
The BD8646FV is a synchronous step-down switching regulator that integrates 2 low resistances N-channel MOSFETs.
It achieves 2A continuous output current over a wide input supply range.
Current mode operation provides fast transient response and easy phase compensation.
●Feature
1) Synchronous rectification with built-in FET type DC/DC converter
2) 2.0A output current
3) Range of operation power-supply voltage 4.5V~18V
4) Reference voltage FB 0.8V±1%
5) Programmable frequency 100kHz~600kHz
6) Over current protection function
7) Thermal shutdown function
8) Under voltage protection
9) Soft start time out function / Soft start delay circuit
10) Programmable OFFLATCH time
●Applications
FPD,DVD,HDD Recorder,STB,Amusement,Other
●Absolute maximum rating (Ta=25℃)
Parameter
Input supply voltage
Symbol
Ratings
Unit
VIN
20
V
VBOOT
28
V
EN terminal voltage
VEN
GND-0.3 ~ VIN+0.3
V
Input terminal voltage
VINP
GND-0.3 ~ 7
V
SW terminal voltage
VSW
GND-0.3 ~ VIN+0.3
V
Output current
IOUT
2.5
A
Power dissipation
Pd
1.19*2
W
BOOT terminal voltage
*1
Operating temperature
Topr
-20 ~ 85
℃
Storage temperature
Tstg
-55 ~ 150
℃
*1 VINP Application terminal: SS/DELAY, FB, FC, RT, PSET
*2 (70mm×70mm, thickness 1.6mm, and four layer glass epoxy substrates)When mounting substrate and the package
back exposure part are connected with solder
Operating at higher than Ta=25℃, 9.5mW shall be reduced per 1
●Operating conditions
Parameter
Symbol
Ratings
Min.
Typ.
Max.
Unit
Input supply voltage
VIN
4.5
-
18.0
V
Output current
IOUT
-
-
2.0
A
*
This product is not designed for protection against radioactive rays.
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1/13
2010.09 - Rev.A
Technical Note
BD8646FV
●Electrical characteristic
(Unless otherwise noted Ta=25℃, VIN=12V, VEN = 3V)
Parameter
Symbol
Limits
Min.
Typ.
Max.
UNIT
Condition
VIN supply current (operating)
IQ_active
-
1.5
2.5
mA
VFB = 0.75V
VIN supply current (standby)
IQ_stby
-
0.8
1.2
mA
VEN = 0V
Reference voltage (VREF)
VFB
0.792
0.800
0.808
V
Oscillation frequency
fOSC
270
300
330
kHz
RRT= 56kΩ
High side FET ON resistance
RHFET
-
120
170
mΩ
ISW = -1A
Low side FET ON resistance
RLFET
-
120
170
mΩ
ISW = 1A
UVLO voltage
VUVLO
3.8
4.0
4.2
V
VIN Sweep
SW leak current
ILSW
-
0
5
μA
VEN= 0V
EN terminal H threshold voltage
VENH
1.6
-
-
V
EN terminal L threshold voltage
VENL
-
-
0.4
V
SS/DELAY terminal source current
ISSSO
2.8
4.0
5.2
μA
VSS= 1V
SS/DELAY – FB Offset voltage
VSSFBOST
450
600
750
mV
VSS= 1V
PSET terminal source current
IPSET
3.0
5.0
7.0
μA
VPSET= 2V
PSET terminal threshold voltage
VPSET
0.8
1.0
1.2
V
●
●
FB-FC Short
VFB :FB terminal voltage,VEN :EN terminal voltage,VSS :SS/DELAY terminal voltage, VPSET :PSET terminal voltage, RRT :RT resistor
Current capability should not exceed Pd.
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2/13
2010.09 - Rev.A
Technical Note
BD8646FV
●Reference data
0.820
0.810
0.815
VIN=12V
VFB
and FC [V]
VFBとFC[V]
0.810
Ta=25℃
0.805
VFBとFC[V]
VFB and FC [V]
0.805
0.800
0.795
0.800
0.790
0.795
0.785
0.780
0.790
-20
-5
10
25
40
55
70
85
4
6
8
10
12
Ta [℃]
Fig.1 Reference voltage – temperature characteristic
330
VIN=12V
Ta=25℃
320
310
fsw[kHz]
fsw[kHz]
320
300
290
310
300
290
280
280
270
270
260
260
-20
-5
10
25
40
55
70
85
4
6
8
10
Ta [℃]
5.0
4.8
4.6
4.4
4.2
4.0
3.8
3.6
3.4
3.2
3.0
2.8
2.6
2.4
2.2
2.0
12
14
16
18
VIN[V]
Fig.3 Frequency – temperature characteristic
Fig.4 Frequency – VIN characteristic
5.0
4.5
VIN=12V
4.0
Ta=25℃
3.5
ICC[mA]
ISS[μA]
18
340
330
3.0
2.5
2.0
1.5
1.0
0.5
0.0
-20
-5
10
25
40
55
70
85
4
6
8
10
Ta [℃]
12
14
16
18
VIN[V]
Fig.5 SS/DELAY charge current - temperature characteristic
Fig.6 Circuit Current – VIN characteristic
320
320
280
280
VIN=12V
VIN=12V
240
SW_PGND[mΩ]
240
VIN_SW[mΩ]
16
Fig.2 Reference voltage – VIN characteristic
340
200
160
120
200
160
120
80
80
40
40
0
0
-20
-5
10
25
40
55
70
85
-20
Ta [℃]
10
25
40
55
70
85
Fig.8 Low side FET ON_R - temperature characteristic
320
320
280
280
240
-5
Ta [℃]
Fig.7 Hi side FET ON_R - temperature characteristic
240
Ta=25℃
SW_PGND[mΩ]
VIN_SW[mΩ]
14
VIN[V]
200
160
120
160
120
80
80
40
40
0
Ta=25℃
200
0
4
6
8
10
12
14
16
18
4
VIN[V]
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8
10
12
14
16
18
VIN[V]
Fig.9 Hi side FET ON_R - VIN characteristic
© 2010 ROHM Co., Ltd. All rights reserved.
6
Fig.10 Low side FET ON_R – VIN characteristic
3/13
2010.09 - Rev.A
Technical Note
BD8646FV
●Block diagram
FB
11
GND
10
FC
12
RT
13
PSET
14
EN
15
SS
Softstart/Delay
9
NC
OSC
8
CURRENT
DET
Protect time
5V
BOOT
7
SW
EN
6
PWM
CONTROL
NC
16
SW
5
NC
17
4
VIN
18
3
VIN
19
2
VIN
20
1
VOUT
SW
PGND
PGND
PGND
Fig.11 Block diagram
●Pin assignment
No.
Symbol
Description
No.
Symbol
Description
1
PGND
Power GND terminal
11
FB
Feedback terminal
2
PGND
Power GND terminal
12
FC
Phase amends terminal
3
PGND
13
RT
Frequency adjustment resistance
connection terminal
Power GND terminal
4
SW
Switching output terminal
14
PSET
5
SW
Switching output terminal
15
EN
6
SW
Switching output terminal
16
NC
-
7
BOOT
Boot strap terminal
17
NC
-
8
NC
9
SS/DELAY
10
GND
-
Adjust OFF LATCH time terminal
Enable input
18
VIN
Power supply input terminal
Soft start adjustment capacity
connection terminal
19
VIN
Power supply input terminal
Signal GND terminal
20
VIN
Power supply input terminal
●Package outline dimension
Product number
BD8646
1PIN MARK
Lot No.
SSOP-B20W (Unit: mm)
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4/13
2010.09 - Rev.A
Technical Note
BD8646FV
●Operation description
1 Enable control
The device can be controlled ON/OFF by EN terminal (15 pin) voltage.
An internal circuit starts when VEN reaches 1.4V.
When standing up of VIN is too steep (1msec or less), a defective start might be caused according to the state of Pascon
between GND substrate pattern and power supply-when the terminal EN is short-circuited to the terminal VIN and it is used.
VEN
EN terminal
VENH
VENL
0
VSS
VSSCLM
SS terminal
VSSTH
0
VO
Output setting voltage
0
tSS
Fig.12 ON/OFF transition wave form in EN controlling
2 Soft start time set function
As for BD8646FV, output can do soft start without overshoot by charging soft start capacity (CSS) connected between
SS/DELAY (9 pin) and GND (10 pin) terminal.
Also, soft start time (tss) can be set by setting soft start capacity (CSS) arbitrarily.
(Refer to 5-2 soft start time setting method)
3 OSC oscillation frequency setting function
The output oscillation frequency can be set by connecting resistance between terminal RT (13 pin) and GND
(range = 100kHz – 600kHz)
The relation between RT terminal resistance and the oscillation frequency follows Fig.13.
10000
SW[kH z]
1000
100
10
1
10
100
1000
RT[kΩ]
Fig.13 Oscillation frequency setting by RT resistance
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5/13
2010.09 - Rev.A
Technical Note
BD8646FV
●Protection function
Protection circuit is effective for destruction prevention due to accident so that avoid using under continuous protection
operation.
1 Low voltage protection function (LVP)
The voltage of the terminal FB (11pin) is compared with internal reference voltage VREF.
If FB terminal voltage falls below VLVP(= VREF -120mV) and the state continues, output changes to low voltage and the
state is fixed.
Table 1 output low voltage protection function
EN terminal
SS terminal
>1.4V(typ)
>VENH
FB terminal
<VLVP
>VLVP
Low voltage
Protection function
Low voltage
Protection operation
ON
Effective
OFF
<1.4V(typ)
-
Invalidity
OFF
-
-
Invalidity
OFF
<VENL
※Low voltage protection function is available when SS terminal voltage becomes more than 1.4V (typ) in the transition to ON control (during soft start).
2 Over voltage protection function (OVP)
The voltage of the terminal FB is compared with internal reference voltage VREF.
If FB terminal voltage is over Vovp (=VREF +120mV) and the state is continues, output changes to low voltage and the
state is fixed.
Table 2 output low voltage protection function
EN terminal
SS terminal
>1.4V(typ)
>VENH
FB terminal
>VOVP
<VOVP
Low voltage
Protection function
Low voltage
Protection operation
ON
Effective
OFF
<1.4V(typ)
-
Invalidity
OFF
-
-
Invalidity
OFF
<VENL
※Over voltage protection function is available when SS terminal voltage becomes more than 1.4V (typ) in the transition to ON control (during soft start).
VFB
VREF+120mV
FB terminal voltage
VREF
VREF-120mV
0
ON
Protection
OFF
LVP
OVP
LVP
Fig.14 Output voltage error detection range
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6/13
2010.09 - Rev.A
Technical Note
BD8646FV
3 Under voltage lock out protection (UVLO)
As for BD8646FV, the power-supply voltage decrease detection protection circuit is built in.
It the input voltage decrease below the UVLO voltage (4.0V typ), the device state changes to the standby mode (Moreover,
to prevent the chattering of the output) hysteresis width of 300mV(typ) has been installed in the UVLO cancel voltage.
4 RT terminal open/short protection function (RTO/RTS)
RT terminal opening/short protection function prevent the clock from abnormal oscillation.
If RT terminal open/short protection function is detected, output voltage changes to low level and is fixed.
5 Soft start time-out function
If VSS doesn't exceed VSSTH within 64msec (typ) since a soft start began, BD8646FV controls an off latch.
Vo is fixed in a low level.
VSSTH
SS terminal
0V
about 64msec(typ)
Fig.15 Soft start time-out
6 Thermal shut down function
Thermal shut down circuit (TSD circuit) is built into BD8646FV. When the temperature of the chip exceeds Tjmax=175, the
DC/DC converter is fixed in a low voltage.
TSD function is aimed to shut down IC from thermal reckless driving under an abnormal state to exceed Tjmax=175.
It aims at neither protection nor the guarantee of the set. Therefore, please do not use this function to protect the set.
7 Over current protection function
The over current protection function has been achieved by limiting the current that flows on high side MOSFET.
The current is controlled in every one cycle of the switching frequency. When an abnormal state continues, the output is
fixed in a low level.
8 Error detection (off latch) release method
BD8646FV enters the state of an off latch when the protection function operates.
To release the off latch state, VIN terminal voltage should be changed to less than UVLO level (=4.0V [typ] ) once time.
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7/13
2010.09 - Rev.A
Technical Note
BD8646FV
●External parts setting method
1 Output voltage setting method
The output voltage can be arbitrarily set by external resistance.
(R1  R2)
Vo 
VREF
R2
Please select the constant of R1 and R2 by this expression.
Please select the current that flows to R1 and R2 to become much smaller than output current.
Vo
R1
FB
R2
VREF=0.8V
Fig.16 Output voltage setting circuit
2 Soft start time setting method
BD8646FV can soft start without overshoot because of a charge current to the soft start capacitance (CSS).
The soft start time can be set by connecting soft start capacity (CSS).
When the EN terminal voltage is set VIN_EN or more, the charge to the capacity between SS/DELAY and GND terminal is
begun. The output voltage becomes soft start in proportion to a SS/DELAY terminal voltage rising. When the SS/DELAY
terminal voltage exceeds VSSTH, the output voltage is fixed in a setting value.
Please set soft start time (tss) in 1msec-52.5msec.
TVO  TW EN(  50μs) 
VOST(  0.6 V )  CSS (VSSTH  VOST )  CSS

ISS(  4μA )
ISS(  4μA )
①
②
③
VENH
EN terminal
0V
①
TWEN
(=50µsec)
SS terminal
Output setting voltage
0V
VSSTH(=1.4V[typ])
VOST(=0.6V[typ])
②
TWENSPEC
Min.
Typ.
Max.
35µsec
50µsec
75µsec
③
0V
TVO
Fig.17 Soft start
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8/13
2010.09 - Rev.A
Technical Note
BD8646FV
3 Selection of inductor (L)
Please select the value of the inductor according to the following expressions.
L
(VIN  VOUT )  VOUT
[H]
⊿IL  VIN  f
(⊿ IL: Output ripple current , f: Switching frequency)
IL
※Please have and select an enough margin so that the
current peak should not exceed the ratings current value
of the inductor.
△IL
Fig.18 Current of output ripple
4 Selection of input capacitor (Cin)
Please use a low ESR input capacitor which can be used with high voltage and ripple current to prevent a big transition
voltage.
※Please put on the input capacitor near side by VIN-PGND.
5 Selection of diode
Please have and set the margin enough to the current rating of the diode for the maximum load current.
Moreover, please similarly have and set the margin enough to a ratings reverse-voltage for the maximum input voltage.
FB
FC
R1
C1
Fig.19 Phase amends part external circuit chart
6 OFFLATCH time setting method
If it continues abnormal state, BD8646FV output become low voltage and state is fixed.
In this case, the OFFLATCH time can be set by connecting capacitor between PSET and GND. Please select the value of
OFFLATCH time according to the following expression. Please set OFFLATCH time in 200usec~5msec.
TTM =
CPSET
IPSET(5µA typ)
[sec]・・・(11)
To release the off latch state, EN or VIN terminal voltage should be changed to low level once time.
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9/13
2010.09 - Rev.A
Technical Note
BD8646FV
●Typical application
【Condition】
VOUT = 1.2V / 2A
fosc = 300kHz
OFFLATCH time = 500µsec
220p
10k
FB
11
GND
10
20k
FC
12
SS/DELAY
Softstart/Delay
9
2200p 11k
0.033µ
RT
13
56k
PSET
14
2000p
EN
15
NC
16
NC
OSC
8
5V
CURRENT
DET
Protect time
BOOT
7
SW
EN
PWM
CONTROL
6
0.1µ
SW
5
6.8µ
VOUT
22µ×2pcs
SW
NC
17
4
VIN
18
3
VIN
19
2
VIN
20
1
PGND
PGND
PGND
22µ
Fig.20 Typical application
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10/13
2010.09 - Rev.A
Technical Note
BD8646FV
●I/O equivalence circuit
4, 5 ,6PIN(SW)
7PIN(BOOT)
9PIN(SS/DELAY)
VIN
VREG5
50kΩ
SS/ DELAY
SW
BOOT
50kΩ
2kΩ
SW
GND
11PIN(FB)
12PIN(FC)
VIN
VIN
13PIN(RT)
VIN
10kΩ
10kΩ
FB
VIN
FC
5kΩ
50kΩ
1kΩ
400Ω
2k Ω
RT
10kΩ
SGND
SGND SGND
GND
GND
PGND
14PIN(PSET)
15PIN(EN)
VIN
VIN
50kΩ
PSET
EN
100kΩ
330kΩ
2kΩ
GND
GND
GND
GND
600kΩ
GND
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11/13
GND
2010.09 - Rev.A
Technical Note
BD8646FV
●Note for use
1. About the absolute maximum rating
Attention is brushed off enough to the quality control, it is likely to destroy when the absolute maximum rating such as
impressed voltages (VCC_IN,DCIN) and ranges (Topr) of the operating temperature as it is exceeded, the mode of
breakings of the short or the opening, etc. cannot be specified, and examine it in this IC to give physical measures for
safety such as fuses when a special mode that exceeds the absolute maximum rating is assumed.
2. GND pin voltage
GND terminal should be connected the lowest voltage, under all conditions. And all terminals except SW should be under
GND terminal voltage under all conditions including transient situations. If a terminal exists under GND,it should be
inserting a bypass route.
3. Power dissipation
If IC is used on condition that the power loss is over the power dissipation, the reliability will become worse by heat up,
such as reduced output current capability. Also, be sure to use this IC within a power dissipation range allowing enough
of margin.
4. Input supply voltage
Input supply pattern layout should be as short as possible.
5. About the short and the miss-installation between terminals
Note the direction and the miss-registration of IC enough when you install it in the set substrate. IC might destroy it as
well as reversely connecting the power supply connector when installing it by mistake. Moreover, there is fear of
destruction when the foreign body enters between terminals, the terminal, the power supply, and grandeur and it is shortcircuited.
6. About operation in strong electromagnetic field
In use in strong electromagnetic field, note that there is a possibility of malfunctioning.
7. About the inspection by the set substrate
It is likely to suffer stress to IC and discharge electricity every one process when you connect the capacitor with the pin
with low impedance when inspecting it in the set substrate. Moreover, detach it after connecting after the power supply is
turned off without fail when detaching it to G in the inspection process, inspecting, and turning off the power supply. n
addition, be give the earth to the assembly process as a static electricity measures, and careful enough when it
transports and you preserve it.
8. About each input terminal
This IC is a monolithic IC which has a P+ isolations and P substrate to isolate elements each other.
This P layer and an N layer in each element form a PN junction to construct various parasitic elements.
For instance, the potential difference operates in resistance as shown in the figure below when resistance and the
transistor connect it with the terminal and the playground (GND) >(terminal B) joint of PN operates as a parasitic diode in
playground (GND) >(terminal A) transistor (NPN). In addition, the NPN transistor of parasitism works with N layer of the
element of the above-mentioned parasitic diode and the neighborhood and others in transistor (NPN). A parasitic element
in IC composition is inevitably formed because of the potential relation.
A parasitic element can operate, the interference with the circuit operation be caused, it malfunction, and, consequently, it
cause destruction. Therefore, do not do the usage that a parasitic element operates as a voltage that is lower than the
playground (GND;P substrate) is impressed to the input terminal enough. Moreover, do not impress the voltage to the
input terminal when you do not impress the power-supply voltage to IC. Give each input terminal to me the voltage below
the power-supply voltage or in the guarantee value of an electric characteristic when you similarly impress the powersupply voltage.
Example of IC of simple structure
9. Earth wiring pattern
If small signal GND and large current GND exist, disperse their pattern. In addition, for voltage change by pattern wiring
impedance and large current not to change voltage of small signal GND, each ground terminal of IC must be connected
at the one point on the set circuit board. As for GND of external parts, it is similar to the above-mentioned.
10. About each output terminal
We recommend to put Diode for protection purpose in case of output pin connected with large load of impedance or
reserve current occurred at initial and output off.
11. Thermal Shut Down Circuit
A temperature control is built in the IC to prevent the damage due to overheat. Therefore, the outputs are turned off when
the thermal circuit works.
12. Over Output Current Protection
SW Output terminal has over current protection circuit of 4A, with prevents IC from being damage by short circuit at over
current. However, It is recommend not to use that continuously operates the protection circuit (For instance, always the
load that greatly exceeds the output current ability is connected or the output is short-circuited, etc.) in these protection
circuits by an effective one to the destruction prevention due to broken accident.
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12/13
2010.09 - Rev.A
Technical Note
BD8646FV
●Ordering part number
B
D
8
Part No.
6
4
6
F
Part No.
V
-
Package
F: SSOP-B20W
E
2
Packaging and forming specification
E2: Embossed tape and reel
SSOP-B20W
<Tape and Reel information>
6.5 ± 0.2
Embossed carrier tape
Quantity
2000pcs
0.3Min.
Direction
of feed
1
E2
The direction is the 1pin of product is at the upper left when you hold
( reel on the left hand and you pull out the tape on the right hand
)
10
0.15 ± 0.1
0.11
1.7 ± 0.2
Tape
11
6.1 ± 0.2
8.1 ± 0.3
20
0.1
0.65
0.22 ± 0.1
1pin
Reel
(Unit : mm)
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Direction of feed
∗ Order quantity needs to be multiple of the minimum quantity.
2010.09 - Rev.A
Notice
Notes
No copying or reproduction of this document, in part or in whole, is permitted without the
consent of ROHM Co.,Ltd.
The content specified herein is subject to change for improvement without notice.
The content specified herein is for the purpose of introducing ROHM's products (hereinafter
"Products"). If you wish to use any such Product, please be sure to refer to the specifications,
which can be obtained from ROHM upon request.
Examples of application circuits, circuit constants and any other information contained herein
illustrate the standard usage and operations of the Products. The peripheral conditions must
be taken into account when designing circuits for mass production.
Great care was taken in ensuring the accuracy of the information specified in this document.
However, should you incur any damage arising from any inaccuracy or misprint of such
information, ROHM shall bear no responsibility for such damage.
The technical information specified herein is intended only to show the typical functions of and
examples of application circuits for the Products. ROHM does not grant you, explicitly or
implicitly, any license to use or exercise intellectual property or other rights held by ROHM and
other parties. ROHM shall bear no responsibility whatsoever for any dispute arising from the
use of such technical information.
The Products specified in this document are intended to be used with general-use electronic
equipment or devices (such as audio visual equipment, office-automation equipment, communication devices, electronic appliances and amusement devices).
The Products specified in this document are not designed to be radiation tolerant.
While ROHM always makes efforts to enhance the quality and reliability of its Products, a
Product may fail or malfunction for a variety of reasons.
Please be sure to implement in your equipment using the Products safety measures to guard
against the possibility of physical injury, fire or any other damage caused in the event of the
failure of any Product, such as derating, redundancy, fire control and fail-safe designs. ROHM
shall bear no responsibility whatsoever for your use of any Product outside of the prescribed
scope or not in accordance with the instruction manual.
The Products are not designed or manufactured to be used with any equipment, device or
system which requires an extremely high level of reliability the failure or malfunction of which
may result in a direct threat to human life or create a risk of human injury (such as a medical
instrument, transportation equipment, aerospace machinery, nuclear-reactor controller, fuelcontroller or other safety device). ROHM shall bear no responsibility in any way for use of any
of the Products for the above special purposes. If a Product is intended to be used for any
such special purpose, please contact a ROHM sales representative before purchasing.
If you intend to export or ship overseas any Product or technology specified herein that may
be controlled under the Foreign Exchange and the Foreign Trade Law, you will be required to
obtain a license or permit under the Law.
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