Formosa MS FMBTA55 / FMBTA56

Formosa MS
Driver Transistor
FMBTA55 / FMBTA56
List
List................................................................................................. 1
Package outline............................................................................... 2
Features.......................................................................................... 2
Mechanical data............................................................................... 2
Maximum ratings.............................................................................. 2
Electrical Characteristics.................................................................. 3
Rating and characteristic curves........................................................ 4,5
Pinning information........................................................................... 6
Marking........................................................................................... 6
Suggested solder pad layout............................................................. 6
Packing information.......................................................................... 7
Reel packing.................................................................................... 8
Suggested thermal profiles for soldering processes............................. 8
High reliability test capabilities........................................................... 9
http://www.formosams.com/
TEL:886-2-22696661
FAX:886-2-22696141
Page 1
Document ID
Issued Date
DS-231164
2010/11/05
Revised Date
2011/07/21
Revision
B
Page.
9
Formosa MS
Driver Transistor
FMBTA55 / FMBTA56
Driver PNP Transistor
Package outline
.084(2.10)
.068(1.70)
0.110 (2.80)
0.120 (3.04)
Mechanical data
(B)
0.012 (0.30)
standards of MIL-STD-19500 /228
• Suffix "-H" indicates Halogen-free part, ex. FMBTA55-H.
0.020 (0.50)
0.045 (1.15)
• Lead-free parts for green partner, exceeds environmental
0.034 (0.85)
SOT-23
Features
(C)
(A)
0.063 (1.60)
0.027 (0.67)
0.013 (0.32)
0.047 (1.20)
0.108 (2.75)
• Epoxy:UL94-V0 rated flame retardant
• Case : Molded plastic, SOT-23
• Terminals : Solder plated, solderable per
0.051 (1.30)
0.003 (0.09)
0.007 (0.18)
0.083 (2.10)
0.035 (0.89)
MIL-STD-750, Method 2026
• Mounting Position : Any
• Weight : Approximated 0.008 gram
Dimensions in inches and (millimeters)
Maximum ratings (AT T =25 C unless otherwise noted)
o
A
PARAMETER
SYMBOL
FMBTA55
FMBTA56
Collector-Base voltage
V CBO
-60
-80
UNIT
Vdc
Collector-Emitter voltage
V CEO
-60
-80
Vdc
Emitter-Base voltage
V EBO
-4.0
Vdc
Collector Current - continuous
IC
-500
mAdc
Thermal Characteristics
CHARACTERISTIC
CONDITIONS
SYMBOL
Max
Total device dissipation FR-5 board T A = 25 C
(1)
Derate above 25 OC
PD
225
mW
PD
1.8
mW/ OC
Thermal resistance
R θJA
556
PD
300
mW
mW/ OC
O
Junction to ambient
O
Total device dissipation alumina
substrate(2)
T A = 25 C
Derate above 25 C
PD
2.4
Thermal resistance
Junction to ambient
R θJA
417
O
Operating temperature
Storage temperature
UNIT
O
O
TJ
-55 ~ +150
T STG
-65 ~ +150
C/W
C/W
o
1. FR-5 = 1.0 X 0.75 X0.062 in.
2. Alumina = 0.4 X 0.3 X 0.024 in. 99.5% alumina.
http://www.formosams.com/
TEL:886-2-22696661
FAX:886-2-22696141
Page 2
Document ID
Issued Date
DS-231164
2010/11/05
Revised Date
2011/07/21
Revision
B
Page.
9
C
Formosa MS
Driver Transistor
FMBTA55 / FMBTA56
Electrical Characteristics (AT T =25 C unless otherwise noted)
o
A
Off Characteristics
PARAMETER
CONDITIONS
Collector-Base breakdown voltage
I c = -100µAdc, I E = 0
FMBTA55
FMBTA56
Collector-Emitter breakdown voltage(3) I c = -1.0mAdc, I B = 0
FMBTA55
FMBTA56
Emitter-Base breakdown voltage
I E = -100µAdc, I C = 0
SYMBOL
Min.
Max.
UNIT
V (BR)CBO
-60
-80
-
Vdc
V (BR)CEO
-60
-80
-
Vdc
V (BR)EBO
-4.0
-
Vdc
Collector Cutoff Current
V CE=-60Vdc, IB=0
I CES
-
-0.1
µAdc
Collector Cutoff current
FMBTA55
FMBTA56
V CB = -60Vdc, I E = 0
V CB = -80Vdc, I E = 0
I CBO
-
-0.1
-0.1
µAdc
On Characteristics
PARAMETER
DC current gain
Collector-Emitter saturation voltage
Base-Emitter saturation voltage
CONDITIONS
SYMBOL
Min.
Max.
100
-
100
-
UNIT
I c = -10mAdc, V CE = -1.0Vdc
I c = -100mAdc, V CE = -1.0Vdc
h FE
I c = -100mAdc, I B = -10mAdc
V CE(sat)
-
-0.25
Vdc
I c = -100mAdc, V CE = -1.0Vdc
V BE(on)
-
-1.2
Vdc
SYMBOL
Min.
Max.
UNIT
fT
50
-
Small Signal Characteristics
PARAMETER
Current Gain Bandwidth Product (4)
CONDITIONS
I c = -100mA, V CE = -1.0Vdc,
f=100MHz
MHz
-
3. Pulse test: pulse width <=300µs, duty cycle<=2.0%
4. f T is defined as the frequency at which |h fe | extrapolates to unity.
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TEL:886-2-22696661
FAX:886-2-22696141
Page 3
Document ID
Issued Date
DS-231164
2010/11/05
Revised Date
2011/07/21
Revision
B
Page.
9
Rating and characteristic curves (FMBTA55/FMBTA56)
FIG.1 Switching Time Test Circuits
TURN-OFF TIME
TURN-ON TIME
*Total Shunt Capacitance of Test Jig and Connectors
For PNP Test Circuits, Reverse All Voltage Polarities
FIG.3 Capacitance
FIG.2 Current-Gain Bandwidth Product
FIG.4 Switching Time
FIG.5 DC Current Gain
=-40V
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TEL:886-2-22696661
FAX:886-2-22696141
Page 4
Document ID
Issued Date
DS-231164
2010/11/05
Revised Date
2011/07/21
Revision
B
Page.
9
Rating and characteristic curves (FMBTA55/FMBTA56)
FIG.6 "On" Voltage
FIG.7 Collectpr Saturation Region
FIG.8 Base-Emitter Temperature Coefficient
RθVΒ
RθVΒ
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TEL:886-2-22696661
FAX:886-2-22696141
Page 5
Document ID
Issued Date
DS-231164
2010/11/05
Revised Date
2011/07/21
Revision
B
Page.
9
Formosa MS
Driver Transistor
FMBTA55 / FMBTA56
Pinning information
Pin
Simplified outline
Symbol
C
PinB
PinC
PinE
C
Base
Collector
Emitter
B
E
B
E
Marking
Type number
Marking code
FMBTA55
FMBTA56
2H
2GM
Suggested solder pad layout
SOT-23
0.037(0.95)
0.037(0.95)
0.079(2.0)
0.035(0.90)
0.031(0.80)
Dimensions in inches and (millimeters)
http://www.formosams.com/
TEL:886-2-22696661
FAX:886-2-22696141
Page 6
Document ID
Issued Date
DS-231164
2010/11/05
Revised Date
2011/07/21
Revision
B
Page.
9
Formosa MS
Driver Transistor
FMBTA55 / FMBTA56
Packing information
P0
P1
d
E
F
B
A
W
P
D2
D1
T
C
W1
D
unit:mm
Item
Symbol
Tolerance
SOT-23
Carrier width
Carrier length
Carrier depth
Sprocket hole
13" Reel outside diameter
13" Reel inner diameter
7" Reel outside diameter
7" Reel inner diameter
Feed hole diameter
Sprocket hole position
Punch hole position
Punch hole pitch
Sprocket hole pitch
Embossment center
Overall tape thickness
Tape width
Reel width
A
B
C
d
D
D1
D
D1
D2
E
F
P
P0
P1
T
W
W1
0.1
0.1
0.1
0.1
2.0
min
2.0
min
0.5
0.1
0.1
0.1
0.1
0.1
0.1
0.3
1.0
3.15
2.77
1.22
1.50
178.00
55.00
13.00
1.75
3.50
4.00
4.00
2.00
0.23
8.00
12.0
Note:Devices are packed in accor dance with EIA standar RS-481-A and specifications listed above.
http://www.formosams.com/
TEL:886-2-22696661
FAX:886-2-22696141
Page 7
Document ID
Issued Date
DS-231164
2010/11/05
Revised Date
2011/07/21
Revision
B
Page.
9
Formosa MS
Driver Transistor
FMBTA55 / FMBTA56
Reel packing
PACKAGE
REEL SIZE
SOT-23
7"
REEL
(pcs)
COMPONENT
SPACING
(m/m)
BOX
(pcs)
3,000
4.0
30,000
REEL
DIA,
(m/m)
INNER
BOX
(m/m)
183*183*123
CARTON
SIZE
(m/m)
178
382*262*387
CARTON
(pcs)
APPROX.
GROSS WEIGHT
(kg)
11.6
240,000
Suggested thermal profiles for soldering processes
1.Storage environment: Temperature=5 oC ~40 oC Humidity=55%±25%
2.Reflow soldering of surface-mount devices
Critical Zone
TL to TP
Tp
TP
Ramp-up
TL
TL
Tsmax
Temperature
Tsmin
tS
Preheat
Ramp-down
25
t25o C to Peak
Time
3.Reflow soldering
Profile Feature
Soldering Condition
Average ramp-up rate(T L to T P )
o
<3 C /sec
Preheat
-Temperature Min(Tsmin)
-Temperature Max(Tsmax)
-Time(min to max)(t s )
150 oC
200 oC
60~120sec
Tsmax to T L
-Ramp-upRate
<3 oC/sec
Time maintained above:
-Temperature(T L )
-Time(t L )
217 oC
60~260sec
255 oC-0/+5 oC
Peak Temperature(T P )
Time within 5 oC of actual Peak
Temperature(t P )
10~30sec
Ramp-down Rate
<6 oC/sec
Time 25 oC to Peak Temperature
<6minutes
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TEL:886-2-22696661
FAX:886-2-22696141
Page 8
Document ID
Issued Date
DS-231164
2010/11/05
Revised Date
2011/07/21
Revision
B
Page.
9
Formosa MS
Driver Transistor
FMBTA55 / FMBTA56
High reliability test capabilities
Item Test
Conditions
1. Steady State Operating Life
TA=25°C P D=225mW Test Duration:1000hrs
2. High Temperature Reverse Bias
Tj= 150℃,V CE=80% related volage, Test Duration: 1000hrs
3. Temperature Cycle
4. Autoclave
-55℃( 15min) to 150℃( 15min)Air to Air Transition Time< 20sec Test Cycles:1000cycle
P=2atm Ta=121℃ RH=100% Test Duration:96hrs
5. High Temperature Storage Life
Ta=150℃ Test Duration:1000hrs
6. Solderability
245℃,Test Duration:5sec
7. High Temperature High Humidity Reverse
Bias
Ta=85℃, 85%RH, V CE= 80% related volage,Test Duration: 1000hrs
8. Resistance to Soldering Heat
260℃, Test Duration: 10sec
http://www.formosams.com/
TEL:886-2-22696661
FAX:886-2-22696141
Page 9
Document ID
Issued Date
DS-231164
2010/11/05
Revised Date
2011/07/21
Revision
B
Page.
9