Formosa MS FM751V-NL

Formosa MS
SMD Small Signal Schottky Diode
FM751V-NL
List
List................................................................................................. 1
Package outline............................................................................... 2
Features.......................................................................................... 2
Mechanical data............................................................................... 2
Maximum ratings ............................................................................. 2
Rating and characteristic curves........................................................ 3
Pinning information........................................................................... 4
Marking........................................................................................... 4
Suggested solder pad layout............................................................. 4
Packing information.......................................................................... 5
Reel packing.................................................................................... 6
Suggested thermal profiles for soldering processes............................. 6
High reliability test capabilities........................................................... 7
http://www.formosams.com/
TEL:886-2-22696661
FAX:886-2-22696141
Page 1
Document ID
Issued Date
Revised Date
Revision
DS-22160B
2008/02/10
2010/12/10
C
Page.
7
Formosa MS
SMD Small Signal Schottky Diode
FM751V-NL
30mA Surface Mount Small Signal
Schottky Diode- 40V
Package outline
SOD-323F
0.053(1.35)
0.045(1.15)
• Low reverse current and low forward voltage .
• Small surface mounting type SOD-323F.
• High reliability.
• We declare that the material of product compliance
0.016(0.40)
0.010(0.25)
Features
0.071(1.80)
0.063(1.60)
with RoHS requirements
• Suffix "-H" for Halogen-free part, ex. FM751V-NL-H.
Construction
0.039(1.00)
0.031(0.80)
0.003(0.08)
0.016(0.40)
• silicon epitaxial planar
0.106(2.70)
0.091(2.30)
Mechanical data
• Epoxy:UL94-V0 rated flame retardant
• Case : Molded plastic, SOD-323F
• Terminals : Solder plated, solderable per
Dimensions in inches and (millimeters)
MIL-STD-750, Method 2026
• Polarity : Indicated by cathode band
• Mounting Position : Any
• Weight : Approximated 0.005 gram
Maximum ratings (AT T =25 C unless otherwise noted)
o
A
PARAMETER
CONDITIONS
Peak reverse voltage
DC reverse voltage
Mean rectifying current
60Hz for 1cycle
Peak forward surge current
Symbol
Limits
UNIT
V RM
VR
40
30
V
IO
30
mA
I FSM
200
mA
Operating junction temperature range
TJ
Storage temperature range
T STG
V
-40~+125
o
C
-40~+125
o
C
Electrical Characteristics (AT T =25 C unless otherwise noted)
o
A
PARAMETER
CONDITIONS
Symbol
Forward voltage
I F = 1.0 mA
Reverse current
V R = 30 V
IR
Diode capacitance
V R = 10 V, f = 1MHz
CT
http://www.formosams.com/
TEL:886-2-22696661
FAX:886-2-22696141
MIN.
TYP.
VF
Page 2
MAX.
UNIT
0.37
V
0.5
uA
2.0
pF
Document ID
Issued Date
Revised Date
Revision
DS-22160B
2008/02/10
2010/12/10
C
Page.
7
FIG.1-TYPICAL FORWARD
FIG.2 - TYPICAL REVERSE
CHARACTERISTICS
CHARACTERISTICS
100u
REVERSE CURRENT , (A)
INSTANTANEOUS FORWARD CURRENT,(A)
Rating and characteristic curves (FM751V-NL)
10u
1u
FORWARD VOLTAGE,(mV)
REVERSE VOLTAGE , (V)
CAPACITANCE BETWEEN TERMINALS , (pF)
FIG.3-CAPACITANCE BETWEEN TERMINALS
CHARACTERISTICS
REVERSE VOLTAGE ,(V)
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TEL:886-2-22696661
FAX:886-2-22696141
Page 3
Document ID
Issued Date
Revised Date
Revision
DS-22160B
2008/02/10
2010/12/10
C
Page.
7
Formosa MS
SMD Small Signal Schottky Diode
FM751V-NL
Pinning information
Pin
Pin1
Pin2
Simplified outline
cathode
anode
1
Symbol
2
1
2
Marking
Type number
Marking code
JV,5E
FM751V-NL
Suggested solder pad layout
C
A
B
Dimensions in inches and (millimeters)
PACKAGE
A
B
C
SOD-323F
0.033 (0.83)
0.025 (0.63)
0.063 (1.60)
http://www.formosams.com/
TEL:886-2-22696661
FAX:886-2-22696141
Page 4
Document ID
Issued Date
Revised Date
Revision
DS-22160B
2008/02/10
2010/12/10
C
Page.
7
Formosa MS
SMD Small Signal Schottky Diode
FM751V-NL
Packing information
P0
P1
d
E
F
B
A
W
P
D2
D1
T
C
W1
D
unit:mm
Item
Symbol
Tolerance
SOD-323F
Carrier width
Carrier length
Carrier depth
Sprocket hole
13" Reel outside diameter
13" Reel inner diameter
7" Reel outside diameter
7" Reel inner diameter
Feed hole diameter
Sprocket hole position
Punch hole position
Punch hole pitch
Sprocket hole pitch
Embossment center
Overall tape thickness
Tape width
Reel width
A
B
C
d
D
D1
D
D1
D2
E
F
P
P0
P1
T
W
W1
0.1
0.1
0.1
0.1
2.0
min
2.0
min
0.5
0.1
0.1
0.1
0.1
0.1
0.1
0.3
1.0
1.46
2.95
1.25
1.50
178.00
62.00
13.00
1.75
3.50
4.00
4.00
2.00
0.23
8.00
11.40
Note:Devices are packed in accor dance with EIA standar RS-481-A and specifications listed above.
http://www.formosams.com/
TEL:886-2-22696661
FAX:886-2-22696141
Page 5
Document ID
Issued Date
Revised Date
Revision
DS-22160B
2008/02/10
2010/12/10
C
Page.
7
Formosa MS
SMD Small Signal Schottky Diode
FM751V-NL
Reel packing
PACKAGE
REEL SIZE
SOD-323F
7"
REEL
(pcs)
COMPONENT
SPACING
(m/m)
3,000
4.0
BOX
(pcs)
30,000
INNER
BOX
(m/m)
183*183*123
REEL
DIA,
(m/m)
178
CARTON
SIZE
(m/m)
CARTON
(pcs)
APPROX.
GROSS WEIGHT
(kg)
382*262*387
240,000
8.0
Suggested thermal profiles for soldering processes
1.Storage environment: Temperature=5 oC ~40 oC Humidity=55%±25%
2.Reflow soldering of surface-mount devices
Critical Zone
TL to TP
Tp
TP
Ramp-up
TL
TL
Tsmax
Temperature
Tsmin
tS
Preheat
Ramp-down
25
t25o C to Peak
Time
3.Reflow soldering
Profile Feature
Soldering Condition
Average ramp-up rate(T L to T P )
o
<3 C /sec
Preheat
-Temperature Min(Tsmin)
-Temperature Max(Tsmax)
-Time(min to max)(t s )
150 oC
200 oC
60~120sec
Tsmax to T L
-Ramp-upRate
<3 oC/sec
Time maintained above:
-Temperature(T L )
-Time(t L )
217 oC
60~260sec
255 oC-0/+5 oC
Peak Temperature(T P )
Time within 5 oC of actual Peak
Temperature(t P )
10~30sec
Ramp-down Rate
<6 oC/sec
Time 25 oC to Peak Temperature
<6minutes
http://www.formosams.com/
TEL:886-2-22696661
FAX:886-2-22696141
Page 6
Document ID
Issued Date
Revised Date
Revision
DS-22160B
2008/02/10
2010/12/10
C
Page.
7
Formosa MS
SMD Small Signal Schottky Diode
FM751V-NL
High reliability test capabilities
Item Test
Conditions
Reference
O
1. Solder Resistance
at 260 ± 5 C for 10 ± 2sec.
immerse body into solder 1/16"±1/32"
MIL-STD-750D
METHOD-2031
2. Solderability
at 245±5 OC for 5 sec.
MIL-STD-202F
METHOD-208
3. High Temperature Reverse Bias
V R=80% rate at T J=125 OC for 168 hrs.
MIL-STD-750D
METHOD-1038
4. Forward Operation Life
Rated average rectifier current at T A=25 OC for 500hrs.
MIL-STD-750D
METHOD-1027
T A = 25 OC, I F = I O
On state: power on for 5 min.
off state: power off for 5 min.
on and off for 500 cycles.
MIL-STD-750D
METHOD-1036
5. Intermittent Operation Life
6. Pressure Cooker
JESD22-A102
15P SIG at T A=121 OC for 4 hrs.
7. Temperature Cycling
-55 OC to +125 OC dwelled for 30 min.
and transferred for 5min. total 10 cycles.
8. Forward Surge
60Hz for 1cycle
MIL-STD-750D
METHOD-1051
MIL-STD-750D
METHOD-4066-2
at T A=85 OC, RH=85% for 1000hrs.
MIL-STD-750D
METHOD-1021
at 175 OC for 1000 hrs.
MIL-STD-750D
METHOD-1031
9. Humidity
10. High Temperature Storage Life
http://www.formosams.com/
TEL:886-2-22696661
FAX:886-2-22696141
Page 7
Document ID
Issued Date
Revised Date
Revision
DS-22160B
2008/02/10
2010/12/10
C
Page.
7