Formosa MS SMD Ultra Low Capacitance ESD Protection Array LL054BT36 List List................................................................................................. 1 Package outline............................................................................... 2 Features.......................................................................................... 2 Mechanical data............................................................................... 2 Maximum ratings ............................................................................. 2 Electrical characteristics................................................................... 2 Rating and characteristic curves........................................................ 3 Pinning information........................................................................... 4 Marking........................................................................................... 4 Suggested solder pad layout............................................................. 4 Packing information.......................................................................... 5 Reel packing.................................................................................... 6 Suggested thermal profiles for soldering processes............................. 6 High reliability test capabilities........................................................... 7 http://www.formosams.com/ TEL:886-2-22696661 FAX:886-2-22696141 Document ID Page 1 DS-221852 Issued Date 2012/01/11 Revised Date - Revision Page. A 7 Formosa MS SMD Ultra Low Capacitance ESD Protection Array LL054BT36 4-Channel Ultra Low Capacitance ESD Protection Diodes Array - 5.0V Package outline Features • 4 channels of ESD protection • Provides ESD protection to IEC61000-4-2 level 4 SOT-363 • • • • • • • • .086(2.20) .070(1.80) .012(0.30) .004(0.10) .053(1.35) .045(1.15) Epoxy:UL94-V0 rated flame retardant .026(0.65)Typ. .010(0.25) .003(0.08) .012(0.30) .004(0.10) Mechanical data • • • .086(2.20) .078(2.00) ±15kV air discharge ±8kV contact discharge Channel I/O to GND capacitance: 0.9pF(Max) Channel I/O to I/O capacitance: 0.45pF(Max) Low clamping voltage Low operating voltage Improved zener structure Optimized package for easy high speed data lines PCB layou t RoHS compliant Suffix "-H" indicates Halogen-free parts, ex. LL 054 BT 36-H. .004(0.10) Max. .043(1.10) .031(0.80) Case : Molded plastic, SOT-363 Terminals : Solder plated, solderable per .016(0.40) .012(0.30) MIL-STD-750, Method 2026 • • Mounting Position : Any Dimensions in inches and (millimeters) Weight : Approximated 0.006 gram Applications • HDMI / DVI ports • Display Port interface • 10M / 100M / 1G Ethernet • USB 2.0 interface • VGA interface • Set-top box • Flat panel Monitors / Tvs • PC / Note book Maximum ratings (at T =25 C unless otherwise noted) o A Parameter Symbol Ratings Unit P PP 150 W Ι PP 5 A V ESD ± 15 ±8 Peak Pulse Power(8/20us) Peak Pulse Current(8/20us) ESD per IEC 61000-4-2(Air) ESD per IEC 61000-4-2(Contact) R θJC Typical thermal resistance junction to case Operating Junction Temperature Range Storage Temperature Range kV o 370 C/W T opr -55~+125 °C T stg -55~+150 °C Electrical characteristics (at T =25 C unless otherwise noted) o A Parameter Conditions Symbol Reverse Working Voltage Any I/O pin to GND V RWM Reverse Breakdown Voltage I BV = 1mA, Any I/O pin to GND V BR Reverse Leakage Current V RWM =5V,Any I/O pin to GND IR Positive Clamping Voltage I PP=1A, tp=8/20us,Positive pulse; Any I/O pin to GND I PP=1A, tp=8/20us,Negative pulse; Any I/O pin to GND Negative Clamping Voltage Junction Capacitance Between Channel V R=0V, f=1MHz,Between I/O pins Junction Capacitance Between I/O And GND V R=0V, f=1MHz,Any I/O pin to GND Http://www.formosams.com/ TEL:886-2-22696661 FAX:886-2-22696141 Min. Max. Unit V 5.0 V 6.0 V C1 8.5 V C2 1.8 C J1 0.35 DS-221852 Issued Date 2012/01/11 1.0 uA 12.0 V V C J2 Document ID Page 2 Typ. 0.45 pF 0.9 pF Revised Date - Revision Page. A 7 Rating and characteristic curves (LL054BT36) Fig. 2 - Power Derating Curve % of Rated Power or Ipp Peak Pulse Power, P PP(kW) Fig.1 - Non-Repetitive Peak Pulse Power 10 1 0.1 0.01 0.1 1 10 100 100 80 60 40 20 0 0 1000 25 waveform parameters tr=8us, td=20us Percent of Ipp, % 100 90 80 70 e-t 50 td=Ipp/2 30 20 Clamping Voltage, Vc (Volts) Fig. 3 - Pulse Waveform 110 40 10 0 5 10 15 100 125 150 Fig. 4 - I/O-GND Clamping Voltage vs. Peak Pulse Current 14 12 I/O-GND forward clamping voltage VC1 10 8 tr=8us td=20us 6 4 I/O-GND reverse clamping voltage VC2 2 0 0.5 0 75 Ambient Temperature, T A (° C) Pulse Duration ,tp (us ) 60 50 20 25 1.5 2.5 3.5 4.5 5.5 Peak Pulse Current , Ipp ( A ) 30 Time, t (us) Fig. 6 - I/O-GND Insertion Loss vs. Frequency 1.5 1.4 1.3 1.2 1.1 1.0 0.9 0.8 0.7 0.6 0.5 0.4 0.3 0.2 0.1 0 21 18 Insertion Loss,( dB) CJ(VR)/CJ(VR=0),( pF) Fig. 5 - Normalized Capacitance vs. Reverse Voltage 1 2 3 4 12 9 6 3 0 -3 -6 -9 -12 -15 -18 f=1MHz 0 15 5 Reverse Voltage, VR (Volts) -21 1 10 100 1000 Frequency (MHz) Fig. 7 - Insertion Loss vs. Frequency 3 S21,( dB) 0 -3dB 2340MHz -3 -6 -9 -12 1 10 100 1000 10000 Frequency (MHz) Http://www.formosams.com/ TEL:886-2-22696661 FAX:886-2-22696141 Document ID Page 3 DS-221852 Issued Date 2012/01/11 Revised Date - Revision Page. A 7 Formosa MS SMD Ultra Low Capacitance ESD Protection Array LL054BT36 Pinning information Pin Configuration I/O3 V REF 6 5 Simplified outline Circuit Diagram I/O4 6 4 5 4 2 3 • 1 3 1 2 I/O1 GND I/O2 Marking Type number Marking code LL054BT36 C96 Suggested solder pad layout SOT-363 0.025(0.65) 0.025(0.65) 0.075(1.9) 0.098(2.5) 0.051(1.3) 0.024(0.60) 0.0165(0.42) Dimensions in inches and (millimeters) http://www.formosams.com/ TEL:886-2-22696661 FAX:886-2-22696141 Document ID Page 4 DS-221852 Issued Date 2012/01/11 Revised Date - Revision Page. A 7 Formosa MS SMD Ultra Low Capacitance ESD Protection Array LL054BT36 Packing information P0 d T P1 E F C96 C W C96 B P A D2 D1 W1 D unit:mm Item Symbol Tolerance SOT-363 Carrier width Carrier length Carrier depth Sprocket hole 13" Reel outside diameter 13" Reel inner diameter 7" Reel outside diameter 7" Reel inner diameter Feed hole diameter Sprocket hole position Punch hole position Punch hole pitch Sprocket hole pitch Embossment center Overall tape thickness Tape width Reel width A B C d D D1 D D1 D2 E F P P0 P1 T W W1 0.1 0.1 0.1 0.1 2.0 min 2.0 min 0.5 0.1 0.1 0.1 0.1 0.1 0.1 0.3 1.0 2.36 2.40 1.20 1.50 178.00 62.00 13.00 1.75 3.50 4.00 4.00 2.00 0.23 8.00 11.40 Note:Devices are packed in accor dance with EIA standar RS-481-A and specifications listed above. http://www.formosams.com/ TEL:886-2-22696661 FAX:886-2-22696141 Document ID Page 5 DS-221852 Issued Date 2012/01/11 Revised Date - Revision Page. A 7 Formosa MS SMD Ultra Low Capacitance ESD Protection Array LL054BT36 Reel packing PACKAGE SOT-363 REEL SIZE 7" REEL (pcs) COMPONENT SPACING (m/m) BOX (pcs) INNER BOX (m/m) REEL DIA, (m/m) 3,000 4.0 30,000 183*183*123 178 CARTON SIZE (m/m) APPROX. GROSS WEIGHT (kg) CARTON (pcs) 382*262*387 9.50 240,000 Suggested thermal profiles for soldering processes 1.Storage environment: Temperature=5 oC ~40 oC Humidity=55%± 25% 2.Reflow soldering of surface-mount devices Critical Zone TL to TP Tp TP Ramp-up TL TL Tsmax Temperature Tsmin tS Preheat Ramp-down 25 t25o C to Peak Time 3.Reflow soldering Profile Feature Soldering Condition Average ramp-up rate(T L to T P ) o <3 C /sec Preheat -Temperature Min(Tsmin) -Temperature Max(Tsmax) -Time(min to max)(t s ) o 150 C o 200 C 60~120sec Tsmax to T L -Ramp-upRate o <3 C /sec Time maintained above: -Temperature(T L ) -Time(t L ) o 217 C 60~260sec o o 255 C- 0/ + 5 C Peak Temperature(T P ) o Time within 5 C of actual Peak Temperature(t P ) 10~30sec Ramp-down Rate <6 C /sec o o Time 25 C to Peak Temperature http://www.formosams.com/ TEL:886-2-22696661 FAX:886-2-22696141 <6minutes Document ID Page 6 DS-221852 Issued Date 2012/01/11 Revised Date - Revision Page. A 7 Formosa MS SMD Ultra Low Capacitance ESD Protection Array LL054BT36 High reliability test capabilities Item Test Conditions Reference O MIL-STD-750D METHOD-2031 O MIL-STD-202F METHOD-208 1. Solder Resistance at 260 ± 5 C for 10 ± 2sec. immerse body into solder 1/16" ± 1/32" 2. Solderability at 245 ± 5 C for 5 sec. 3. High Temperature Reverse Bias V RWM=80% rate at T J=125 C for 168 hrs. 4. Pressure Cooker 15P SIG at T A=121 C for 4 hrs. 5. Temperature Cycling -55 C to +125 C dwelled for 30 min. and transferred for 5min. total 10 cycles. 7. High Temperature Storage Life http://www.formosams.com/ TEL:886-2-22696661 FAX:886-2-22696141 JESD22-A102 O O 6. Humidity MIL-STD-750D METHOD-1038 O MIL-STD-750D METHOD-1051 O MIL-STD-750D METHOD-1021 O at T A=85 C , RH=85% for 1000hrs. MIL-STD-750D METHOD-1031 O at 175 C for 1000 hrs. Document ID Page 7 DS-221852 Issued Date 2012/01/11 Revised Date - Revision Page. A 7