Formosa MS SMD Switching Diode MMBD4148W List List................................................................................................. 1 Package outline............................................................................... 2 Features.......................................................................................... 2 Mechanical data............................................................................... 2 Maximum ratings ............................................................................. 2 Rating and characteristic curves........................................................ 3 Pinning information........................................................................... 4 Marking........................................................................................... 4 Suggested solder pad layout............................................................. 4 Packing information.......................................................................... 5 Reel packing.................................................................................... 6 Suggested thermal profiles for soldering processes............................. 6 High reliability test capabilities........................................................... 7 http://www.formosams.com/ TEL:886-2-22696661 FAX:886-2-22696141 Page 1 Document ID Issued Date Revised Date Revision Page. DS-221940 2009/08/10 2010/03/10 B 7 Formosa MS SMD Switching Diode MMBD4148W 200mW Surface Mount Switching Diode-100V Package Outline 0.012 (0.30) (B) 0.016 (0.40) 0.026 (0.65)Max .056(1.40) .048(1.20) • standards of MIL-STD-19500 /228 Suffix "-H" indicates Halogen-free part, ex.MMBD4148W-H. SOT-323 0.072 (1.80) • Fast switching speed. • Electrically identical to standard JEDEC. • Surface mount package ideally suited for automatic insertion. • Tiny plastic SMD package. • High Conductance. • Silicon epitaxial planar chip. • Lead-free parts for green partner, exceeds environmental 0.088 (2.20) Features (C) (A) 0.054 (1.35) 0.017 (0.42)Min. 0.046 (1.15) 0.096 (2.40) 0.040 (1.00) 0.004 (0.10) • Epoxy:UL94-V0 rated flame retardant • Case : Molded plastic, SOT-323 • Terminals : Solder plated, solderable per 0.010(0.25) 0.080 (2.00) Mechanical data 0.032 (0.80) MIL-STD-750, Method 2026 • Mounting Position : Any • Weight : Approximated 0.006 gram Dimensions in inches and (millimeters) Maximum ratings and Electrical Characteristics (AT PARAMETER T A=25 oC unless otherwise noted) Symbol MMBD4148W UNIT Reverse voltage VR 75 V Peak reverse voltage V RM 100 V RMS voltage V RMS 53 V Maximum DC blocking voltage V DC 75 V Maximum average forward current at T A = 25 oC Io 150 mA Peak forward surge current, 1.0us 1.0s I FSM 2.0 1.0 A Power Dissipation derate above 25 oC PD 200 mW Maximum forward voltage VF [email protected] [email protected] [email protected] [email protected] V Maximum DC reverse current at rated DC blocking voltage T J = 25 oC IR 0.025@20V 1.0@75V uA Typical Junction capacitance (Notes 1) CD 2.0 pF Maximum reverse recovery time (Notes 2) t rr 4.0 ns Typical thermal resistance junction to ambient R θJA 625 Operating junction temperature range TJ -55 to +150 o C Storage temperature range T STG -55 to +150 o C o C/W Notes : 1. C J at V R = 0V, f = 1MHZ 2. I F = I R = 10mA to I rr = 0.1 x I R, R L = 100ohm http://www.formosams.com/ TEL:886-2-22696661 FAX:886-2-22696141 Page 2 Document ID Issued Date Revised Date Revision Page. DS-221940 2009/08/10 2010/03/10 B 7 Rating and characteristic curves (MMBD4148W) Fig. 1 TYPICAL FORWARD CHARACTERISTICS Fig. 2 TYPICAL LEAKAGE CURRENT VS. JUNCTION TEMPERATURE 10000 REVERSE CURRENT : (nA) FORWARD CURRENT : (mA) 1000 100 10 1.0 0.1 1000 100 10 V R = 20V 0.01 0.2 0.4 0.6 0.8 1.0 1 1.2 100 0 200 O JUNCTION TEMPERATURE : ( C) FORWARD VOLTAGE : (V) Fig. 4 POWER DERATING CURVE FIG.3-TYPICAL JUNCTION CAPACITANCE P D, Power Dissipation (mW) DIODE CAPACITANCE (pF) 0.68 0.64 0.60 0.56 0.52 0 2 4 6 200 150 100 50 0 0 8 REVERSE VOLTAGE : (V) http://www.formosams.com/ TEL:886-2-22696661 FAX:886-2-22696141 250 25 50 75 100 125 150 o AMBIENT TEMPERATURE ( C ) Page 3 Document ID Issued Date Revised Date Revision Page. DS-221940 2009/08/10 2010/03/10 B 7 Formosa MS SMD Switching Diode MMBD4148W Pinning information Type number Simplified outline Marking code (A) MMBD4148W Symbol (B) A B A2 (C) C Suggested solder pad layout SOT-323 0.025(0.65) 0.025(0.65) 0.063(1.6) 0.031(0.80) 0.075(1.90) Dimensions in inches and (millimeters) http://www.formosams.com/ TEL:886-2-22696661 FAX:886-2-22696141 Page 4 Document ID Issued Date Revised Date Revision Page. DS-221940 2009/08/10 2010/03/10 B 7 Formosa MS SMD Switching Diode MMBD4148W Packing information P0 P1 d E F B A W P D2 D1 T C W1 D unit:mm Item Symbol Tolerance SOT-323 Carrier width Carrier length Carrier depth Sprocket hole 13" Reel outside diameter 13" Reel inner diameter 7" Reel outside diameter 7" Reel inner diameter Feed hole diameter Sprocket hole position Punch hole position Punch hole pitch Sprocket hole pitch Embossment center Overall tape thickness Tape width Reel width A B C d D D1 D D1 D2 E F P P0 P1 T W W1 0.1 0.1 0.1 0.1 2.0 min 2.0 min 0.5 0.1 0.1 0.1 0.1 0.1 0.1 0.3 1.0 2.36 2.40 1.20 1.50 178.00 62.00 13.00 1.75 3.50 4.00 4.00 2.00 0.23 8.00 11.40 Note:Devices are packed in accor dance with EIA standar RS-481-A and specifications listed above. http://www.formosams.com/ TEL:886-2-22696661 FAX:886-2-22696141 Page 5 Document ID Issued Date Revised Date Revision Page. DS-221940 2009/08/10 2010/03/10 B 7 Formosa MS SMD Switching Diode MMBD4148W Reel packing PACKAGE SOT-323 REEL SIZE 7" REEL (pcs) COMPONENT SPACING (m/m) BOX (pcs) INNER BOX (m/m) REEL DIA, (m/m) 3,000 4.0 30,000 183*183*123 178 CARTON SIZE (m/m) 382*262*387 CARTON (pcs) APPROX. GROSS WEIGHT (kg) 240,000 9.5 Suggested thermal profiles for soldering processes 1.Storage environment: Temperature=5 oC ~40 oC Humidity=55%±25% 2.Reflow soldering of surface-mount devices Critical Zone TL to TP Tp TP Ramp-up TL TL Tsmax Temperature Tsmin tS Preheat Ramp-down 25 t25o C to Peak Time 3.Reflow soldering Profile Feature Soldering Condition Average ramp-up rate(T L to T P ) o <3 C /sec Preheat -Temperature Min(Tsmin) -Temperature Max(Tsmax) -Time(min to max)(t s ) 150 oC 200 oC 60~120sec Tsmax to T L -Ramp-upRate <3 oC/sec Time maintained above: -Temperature(T L ) -Time(t L ) 217 oC 60~260sec 255 oC-0/+5 oC Peak Temperature(T P ) Time within 5 oC of actual Peak Temperature(t P ) 10~30sec Ramp-down Rate <6 oC/sec Time 25 oC to Peak Temperature <6minutes http://www.formosams.com/ TEL:886-2-22696661 FAX:886-2-22696141 Page 6 Document ID Issued Date Revised Date Revision Page. DS-221940 2009/08/10 2010/03/10 B 7 Formosa MS SMD Switching Diode MMBD4148W High reliability test capabilities Item Test Conditions Reference O 1. Solder Resistance at 260 ± 5 C for 10 ± 2sec. immerse body into solder 1/16"±1/32" MIL-STD-750D METHOD-2031 2. Solderability at 245±5 OC for 5 sec. MIL-STD-202F METHOD-208 3. High Temperature Reverse Bias V R=80% rate at T J=150 OC for 168 hrs. MIL-STD-750D METHOD-1038 4. Forward Operation Life Rated average rectifier current at T A=25 OC for 500hrs. MIL-STD-750D METHOD-1027 T A = 25 OC, I F = I O On state: power on for 5 min. off state: power off for 5 min. on and off for 500 cycles. MIL-STD-750D METHOD-1036 5. Intermittent Operation Life 6. Pressure Cooker JESD22-A102 15P SIG at T A=121 OC for 4 hrs. MIL-STD-750D METHOD-1051 7. Temperature Cycling -55 OC to +125 OC dwelled for 30 min. and transferred for 5min. total 10 cycles. 8. Forward Surge Peak Forward Surge Current MIL-STD-750D METHOD-4066-2 9. Humidity at T A=85 OC, RH=85% for 1000hrs. MIL-STD-750D METHOD-1021 10. High Temperature Storage Life at 175 OC for 1000 hrs. MIL-STD-750D METHOD-1031 http://www.formosams.com/ TEL:886-2-22696661 FAX:886-2-22696141 Page 7 Document ID Issued Date Revised Date Revision Page. DS-221940 2009/08/10 2010/03/10 B 7