Formosa MS SMD Small Signal Schottky Diode FM551V-NL List List................................................................................................. 1 Package outline............................................................................... 2 Features.......................................................................................... 2 Mechanical data............................................................................... 2 Maximum ratings ............................................................................. 2 Rating and characteristic curves........................................................ 3 Pinning information........................................................................... 4 Marking........................................................................................... 4 Suggested solder pad layout............................................................. 4 Packing information.......................................................................... 5 Reel packing.................................................................................... 6 Suggested thermal profiles for soldering processes............................. 6 High reliability test capabilities........................................................... 7 http://www.formosams.com/ TEL:886-2-22696661 FAX:886-2-22696141 Page 1 Document ID Issued Date Revised Date Revision Page. DS-221663 2008/02/10 2009/05/07 B 7 Formosa MS SMD Small Signal Schottky Diode FM551V-NL 500mA Surface Mount Small Signal Schottky Diode-30V Package Outline Features • Low current rectification and high speed switching • Extremely small surface mount type. • Up to 500mA current capability. • Silicon epitaxial planar chip, metal silicon junction. • Lead-free parts for green partner, exceeds environmental 0.016(0.40) 0.010(0.25) standards of MIL-STD-19500 /228 • Suffix "-H" indicates Halogen free parts, ex. FM551V-ΝL-H. 0.053(1.35) 0.045(1.15) SOD-323F 0.071(1.80) 0.063(1.60) 0.039(1.00) 0.031(0.80) 0.003(0.08) 0.016(0.40) Mechanical data • Epoxy:UL94-V0 rated flame retardant • Case : Molded plastic, SOD-323F • Terminals : Solder plated, solderable per 0.106(2.70) 0.091(2.30) MIL-STD-750, Method 2026 • Polarity : Indicated by cathode band • Mounting Position : Any • Weight : Approximated 0.005 gram Dimensions in inches and (millimeters) Maximum ratings and Electrical Characteristics (AT T =25 C unless otherwise noted) o A PARAMETER CONDITIONS Symbol MIN. TYP. MAX. UNIT Repetitive peak reverse voltage V RM 40 V Continuous reverse voltage VR 30 V Average Rectifier Forward Current I F(AV) 500 mA 2000 mA Forward surge current 60Hz for 1cycle Capacitance between terminals f=1MHz and applied 10V DC reverse voltage Thermal resistance Junction to ambient Junction to case I FSM Operating junction temperature range Storage temperature range CT 20 RθJA RθJC 500 375 -55 +125 o C T STG -55 +125 o C I F = 100 mA I F = 500 mA VF Reverse Breakdown voltage I R = 100 uA V (BR)R Reverse Leakage V R = 20 V 0.36 0.47 V V 30 IR Page 2 C/W o C/W TJ Forward voltage http://www.formosams.com/ TEL:886-2-22696661 FAX:886-2-22696141 pF o 100 uAdc Document ID Issued Date Revised Date Revision Page. DS-221663 2008/02/10 2009/05/07 B 7 Rating and characteristic curves (FM551V-NL) -25 Fig. 2 Reverse characteristics REVERSE CURRENT : (A) FORWARD CURRENT : (A) Fig. 1 Forward characteristics -25 FORWARD VOLTAGE : (V) REVERSE VOLTAGE : (V) Fig. 4 Derating curve CAPACITANCE BETWEEN TERMINALS : (pF) FIG.3-TYPICAL TERMINALS CAPACITANCE I F CURRENT (A) 1.0 0.8 0.6 0.4 0.2 0 0 REVERSE VOLTAGE : V http://www.formosams.com/ TEL:886-2-22696661 FAX:886-2-22696141 25 50 75 100 125 150 AMBIENT TEMPERATURE : T A Page 3 Document ID Issued Date Revised Date Revision Page. DS-221663 2008/02/10 2009/05/07 B 7 Formosa MS SMD Small Signal Schottky Diode FM551V-NL Pinning information Pin Pin1 Pin2 Simplified outline cathode anode 1 Symbol 2 1 2 Marking Type number Marking code FM551V-NL D, 2V, K Suggested solder pad layout C A B Dimensions in inches and (millimeters) PACKAGE A B C SOD-323F 0.033 (0.83) 0.025 (0.63) 0.063 (1.60) http://www.formosams.com/ TEL:886-2-22696661 FAX:886-2-22696141 Page 4 Document ID Issued Date Revised Date Revision Page. DS-221663 2008/02/10 2009/05/07 B 7 Formosa MS SMD Small Signal Schottky Diode FM551V-NL Packing information P0 P1 d E F B A W P D2 D1 T C W1 D unit:mm Item Symbol Tolerance SOD-323F Carrier width Carrier length Carrier depth Sprocket hole 13" Reel outside diameter 13" Reel inner diameter 7" Reel outside diameter 7" Reel inner diameter Feed hole diameter Sprocket hole position Punch hole position Punch hole pitch Sprocket hole pitch Embossment center Overall tape thickness Tape width Reel width A B C d D D1 D D1 D2 E F P P0 P1 T W W1 0.1 0.1 0.1 0.1 2.0 min 2.0 min 0.5 0.1 0.1 0.1 0.1 0.1 0.1 0.3 1.0 1.46 2.95 1.25 1.50 178.00 62.00 13.00 1.75 3.50 4.00 4.00 2.00 0.23 8.00 11.40 Note:Devices are packed in accor dance with EIA standar RS-481-A and specifications listed above. http://www.formosams.com/ TEL:886-2-22696661 FAX:886-2-22696141 Page 5 Document ID Issued Date Revised Date Revision Page. DS-221663 2008/02/10 2009/05/07 B 7 Formosa MS SMD Small Signal Schottky Diode FM551V-NL Reel packing PACKAGE REEL SIZE SOD-323F 7" REEL (pcs) COMPONENT SPACING (m/m) 3,000 4.0 BOX (pcs) 30,000 INNER BOX (m/m) 183*183*123 REEL DIA, (m/m) 178 CARTON SIZE (m/m) CARTON (pcs) 382*262*387 240,000 APPROX. GROSS WEIGHT (kg) 8.0 Suggested thermal profiles for soldering processes 1.Storage environment: Temperature=5 oC ~40 oC Humidity=55%±25% 2.Reflow soldering of surface-mount devices Critical Zone TL to TP Tp TP Ramp-up TL TL Tsmax Temperature Tsmin tS Preheat Ramp-down 25 t25o C to Peak Time 3.Reflow soldering Profile Feature Soldering Condition Average ramp-up rate(T L to T P ) o <3 C /sec Preheat -Temperature Min(Tsmin) -Temperature Max(Tsmax) -Time(min to max)(t s ) 150 oC 200 oC 60~120sec Tsmax to T L -Ramp-upRate <3 oC/sec Time maintained above: -Temperature(T L ) -Time(t L ) 217 oC 60~260sec 255 oC-0/+5 oC Peak Temperature(T P ) Time within 5 oC of actual Peak Temperature(t P ) 10~30sec Ramp-down Rate <6 oC/sec Time 25 oC to Peak Temperature <6minutes http://www.formosams.com/ TEL:886-2-22696661 FAX:886-2-22696141 Page 6 Document ID Issued Date Revised Date Revision Page. DS-221663 2008/02/10 2009/05/07 B 7 Formosa MS SMD Small Signal Schottky Diode FM551V-NL High reliability test capabilities Item Test Conditions Reference O 1. Solder Resistance at 260 ± 5 C for 10 ± 2sec. immerse body into solder 1/16"±1/32" MIL-STD-750D METHOD-2031 2. Solderability at 245±5 OC for 5 sec. MIL-STD-202F METHOD-208 3. High Temperature Reverse Bias V R=80% rate at T J=125 OC for 168 hrs. MIL-STD-750D METHOD-1038 4. Forward Operation Life Rated average rectifier current at T A=25 OC for 500hrs. MIL-STD-750D METHOD-1027 T A = 25 OC, I F = I O On state: power on for 5 min. off state: power off for 5 min. on and off for 500 cycles. MIL-STD-750D METHOD-1036 5. Intermittent Operation Life 6. Pressure Cooker 15P SIG at T A=121 OC for 4 hrs. JESD22-A102 7. Temperature Cycling -55 OC to +125 OC dwelled for 30 min. and transferred for 5min. total 10 cycles. MIL-STD-750D METHOD-1051 8. Forward Surge Peak Forward Surge Current at 60Hz for 1cycle MIL-STD-750D METHOD-4066-2 at T A=85 OC, RH=85% for 1000hrs. MIL-STD-750D METHOD-1021 at 175 OC for 1000 hrs. MIL-STD-750D METHOD-1031 9. Humidity 10. High Temperature Storage Life http://www.formosams.com/ TEL:886-2-22696661 FAX:886-2-22696141 Page 7 Document ID Issued Date Revised Date Revision Page. DS-221663 2008/02/10 2009/05/07 B 7